ATMEL AT34C02D Permanent and reversible software write protection Datasheet

AT34C02D
I2C-Compatible Serial Presence Detect (SPD) EEPROM
with Permanent and Reversible Software Write Protection
2-Kbit (256 x 8)
DATASHEET
Features

Single 1.7V to 5.5V VCC supply voltage
JEDEC EE1002 and EE1002A Serial Presence Detect (SPD) compliant

I2C-compatible (2-wire) serial interface

̶
̶
EEPROM specification for use in DDR, DDR2, and DDR3 DIMM modules

400kHz (1.7V, 2.5V) and 1MHz (5.0V) compatibility
Multiple EEPROM data protection schemes
̶
Permanent and reversible software write protection for the lower 128 bytes
Hardware write protection for the entire array
̶


Schmitt Trigger filtered inputs for noise suppression
16-byte page write modes
̶


Partial page writes are allowed
Self-timed write cycle (5ms maximum)
High-reliability
̶
̶


Endurance: 1,000,000 write cycles
Data retention: 100 years
8-pad 2x3mm UDFN, 8-lead TSSOP, 8-lead JEDEC SOIC, and
8-ball VFBGA packages
Die sales: wafer form, tape and reel, and bumped wafers are available
Description
The Atmel® AT34C02D is designed to support the JEDEC EE1002 and EE1002A
Serial Presence Detect (SPD) function used in DDR, DDR2, and DDR3 Dual Inline
Memory Modules (DIMM). The AT34C02D provides 2,048 bits of Serial
Electrically-Erasable and Programmable Read Only Memory (EEPROM) organized
as 256 words of 8 bits each. The device also incorporates a permanent and
reversible software write protection feature for the lower 128 bytes of the EEPROM.
Once the permanent software write protection is enabled, it cannot be reversed.
However, the reversible software write protection can be enabled or disabled by
sending a specific command and protocol sequence. A hardware write protection
function is also available and is controlled by the WP pin state. It can be used to
protect the entire EEPROM contents regardless of whether or not the software write
protection has been enabled. The software and hardware write protection features
allow the user the flexibility to protect none, lower-half, or the entire memory array
depending on the specific needs of the application. The device is optimized for use
in many industrial and commercial applications where low-power and low-voltage
operations are essential. The AT34C02D is available in space saving 8-pad 2x3mm
UDFN, 8-lead TSSOP, 8-lead JEDEC SOIC, and 8-ball VFBGA packages and is
accessed via an I2C-compatible 2-wire serial interface. The AT34C02D operates
over a wide VCC range, from 1.7V to 5.5V.
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
1.
Pin Configurations and Pinouts
Figure 1-1.
Pin Configurations
Pin
Function
A0 – A2
Address Inputs
GND
Ground
SDA
Serial Data
SCL
Serial Clock Input
WP
Write Protect
VCC
Power Supply
8-lead TSSOP
8-pad UDFN
A0
A1
A2
GND
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
A0
A1
A2
GND
Top View
8-lead SOIC
8-ball VFBGA
A0
1
8
VCC
A0
1
8
VCC
A1
2
7
WP
A1
2
7
WP
A2
3
6
SCL
A2
3
6
SCL
GND
4
5
SDA
GND
4
5
SDA
Note:
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
8
7
6
5
Top View
Top View
2
1
2
3
4
Drawings are not to scale.
Top View
VCC
WP
SCL
SDA
2.
Memory Organization
2.1
AT34C02D, 2K Serial EEPROM:
The AT34C02D is internally organized with 16 pages of 16 bytes of EEPROM each. Random word addressing
requires a 8-bit data word address.
Block Diagram
Figure 3-1.
Block Diagram
VCC
GND
WP
Start
Stop
Logic
SCL
SDA
Serial
Control
Logic
Write Protect
Circuitry
EN
H.V. Pump/Timing
LOAD
Device
Address
Comparator
A2
A1
A0
R/W
COMP
LOAD
Data Word
ADDR/Counter
Data Recovery
Software Write
Protected Area
(00H - 7FH)
INC
X DEC
3.
EEPROM
Y DEC
DIN
SERIAL MUX
DOUT/ACK
Logic
DOUT
AT34C02D [DATASHEET]
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3
4.
Pin Description
Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative
edge clock data out of each device.
Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may
be wire-ORed with any number of other open-drain or open collector devices.
Device Addresses (A2, A1, and A0): The A2, A1, and A0 pins are device address inputs that are hardwired
(directly to GND or to Vcc) for compatibility with other Atmel AT24Cxx devices. When the pins are hardwired, as
many as eight 2K devices may be addressed on a single bus system. See Section 7. “Device Addressing” on
page 9 for more details. A device is selected when a corresponding hardware and software match is true. If
these pins are left floating, the A2, A1, and A0 pins will be internally pulled down to GND. However, due to
capacitive coupling that may appear during customer applications, Atmel recommends always connecting the
address pins to a known state. When using a pull-up resistor, Atmel recommends using 10k or less.
Write Protect (WP): The write protect input, when connected to GND, allows normal write operations. When
WP is connected directly to VCC, all write operations to the memory are inhibited. If the pin is left floating, the WP
pin will be internally pulled down to GND. However, due to capacitive coupling that may appear during customer
applications, Atmel recommends always connecting the WP pins to a known state. When using a pull-up
resistor, Atmel recommends using 10k or less.
Table 4-1.
4
AT34C02D Write Protection Modes
WP Pin
Status
Permanent Write Protect
Register
Reversible Write Protect
Register
Part of the Array
Write Protected
VCC
—
—
Full Array
(00h – FFh)
GND or Floating
Programmed
—
Lower-half of Array
(00h – 7Fh)
GND or Floating
—
Programmed
Lower-half of Array
(00h – 7Fh)
GND or Floating
Not Programmed
Not Programmed
None,
Normal Read/Write
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
5.
Electrical Characteristics
5.1
Absolute Maximum Ratings*
Operating Temperature . . . . . . . . . . –55°C to +125°C
Storage Temperature . . . . . . . . . . . . –65°C to +150°C
Voltage on any pin
with respect to ground . . . . . . . . . . . . . –1.0V to +7.0V
Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . .5.0mA
5.2
*Notice: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage
to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Pin Capacitance
Applicable over recommended operating range from TA = 25C, f = 400kHz, VCC = 1.7V to 5.5V.
Symbol
Test Condition
CI/O(1)
CIN(1)
Note:
5.3
1.
Max
Units
Conditions
Input/Output Capacitance (SDA)
8
pF
VI/O = 0V
Input Capacitance (A0, A1, A2, SCL)
6
pF
VIN = 0V
This parameter is characterized and is not 100% tested.
DC Characteristics
Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = 1.7V to 5.5V,
(unless otherwise noted).
Symbol
Parameter
Max
Units
VCC
Supply Voltage
5.5
V
ICC1
Supply Current VCC = 5.0V
Read at 400kHz
1.0
2.0
mA
ICC2
Supply Current VCC = 5.0V
Write at 400kHz
2.0
3.0
mA
ISB1
Standby Current VCC = 1.7V
VIN = VCC or VSS
1.0
μA
ISB2
Standby Current VCC = 3.6V
VIN = VCC or VSS
3.0
μA
ISB3
Standby Current VCC = 5.5V
VIN = VCC or VSS, A0 = VSS
6.0
μA
ILI
Input Leakage Current
VIN = VCC or VSS
0.10
3.0
μA
ILO
Output Leakage Current
VOUT = VCC or VSS
0.05
3.0
μA
VIL
Input Low Level(1)
–0.6
VCC x 0.3
V
VIH
Input High Level(1)
VCC x 0.7
VCC + 0.5
V
VOL2
Output Low Level VCC = 3.0V
IOL = 2.1mA
0.4
V
VOL1
Output Low Level VCC = 1.7V
IOL = 0.15mA
0.2
V
Note:
1.
Test Condition
Min
Typ
1.7
VIL min and VIH max are reference only and are not tested.
AT34C02D [DATASHEET]
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5
5.4
AC Characteristics
Applicable over recommended operating range from: TAI = -40°C to +85°C (unless otherwise noted).
VCC = 1.7 - 3.6V
Min
Symbol
Parameter
Units
fSCL
Clock Frequency, SCL
1000
kHz
tLOW
Clock Pulse Width Low
4700
—
1300
—
400
—
ns
tHIGH
Clock Pulse Width High
4000
—
600
—
400
—
ns
tR
Inputs Rise Time(1)
—
1000
—
300
—
100
ns
tF
Inputs Fall Time(1)
—
300
—
300
—
100
ns
tSU.DAT
Data in Set-up Time
250
—
100
—
100
—
ns
tHD.DI
Data in Hold Time
0
—
0
—
0
—
ns
tHD.DAT
Data Out Hold Time
200
3450
200
900
50
550
ns
tSU.STA
Start Condition Set-up Time
4700
—
600
—
250
—
ns
tHD.STA
Start Condition Hold Time
4000
—
600
—
250
—
ns
tSU.STO
Stop Condition Set-up Time
4000
—
600
—
250
—
ns
tI
Pulse Width of Spikes Suppressed,
Single Glitch(1)
—
100
—
100
—
50
ns
tBUF
Time the bus must be free before a
new transmission can start(1)
4700
—
1300
—
50
—
ns
tWR
Write Cycle Time
—
5
—
5
—
5
ms
1M
—
1M
—
1M
—
Write
Cycles
100
Endurance(1) 25C, Page Mode, 3.3V
1.
Figure 5-1.
Min
Max
VCC = 3.6V - 5.5V
Max
Note:
Max
VCC = 1.7 - 3.6V
Min
400
This parameter is characterized and is not 100% tested.
AC Timing Waveforms
tHIGH
tF
tR
VIH
SCL
VIL
tSU.STA
tHD.STA
tLOW
tHD.DI
tSU.DAT
tSU.STO
VIH
SDA IN
VIL
tHD.DAT
SDA OUT
6
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
tHD.DAT
tBUF
VIH
VIL
6.
Device Operation
Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin
may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or
Stop condition as defined below.
Figure 6-1.
Data Validity
SDA
SCL
Data Stable
Data Stable
Data
Change
Start Condition: A high-to-low transition of SDA with SCL high is a Start condition which must precede any
other command.
Stop Condition: A low-to-high transition of SDA with SCL high is a Stop condition. After a read sequence, the
Stop command will place the EEPROM in a standby power mode.
Figure 6-2.
Start and Stop Condition
SDA
SCL
Start
Stop
AT34C02D [DATASHEET]
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7
Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words.
The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock
cycle.
Figure 6-3.
Output Acknowledge
1
SCL
8
9
DATA IN
DATA OUT
Start
Acknowledge
Standby Mode: The AT34C02D features a low-power standby mode which is enabled:


6.1
Upon power-up or
After the receipt of the Stop condition and the completion of any internal operations.
Memory Reset:
After an interruption in protocol, power loss or system reset, any 2-wire part can be reset by following these
steps:
1.
2.
3.
Create a Start condition.
Clock nine cycles.
Create another Start condition followed by Stop condition as shown below.
Figure 6-4.
Software Reset
Dummy Clock Cycles
SCL
1
Start
Condition
SDA
8
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
2
3
8
9
Start
Condition
Stop
Condition
7.
Device Addressing
The 2K EEPROM device requires an 8-bit device address word following a start condition to enable the chip for
a read or write operation.
The device address word consists of a mandatory ‘1010’ (Ah) sequence for the first four most-significant bits
for normal read and write operations and ‘0110’ (6h) for writing to the software write protect register.
The next three bits are the A2, A1, and A0 device address bits. These three bits must match their corresponding
hard-wired input pins in order for the part to acknowledge.
The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is
high and a write operation is initiated if this bit is low.
Upon a successful compare of the device address, the EEPROM will acknowledge by outputting a zero. If a
match is not made, the chip will return to a standby state. The device will not acknowledge if the write protect
register has been programmed and the control code is ‘0110’ (6h).
Figure 7-1.
1
0
Device Address
1
0
A2
A1
MSB
8.
A0
R/W
LSB
Write Operations
Byte Write: A write operation requires an 8-bit data word address following the device address word and
acknowledgment. Upon receipt of this address, the EEPROM will again acknowledge or respond with a zero
and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a
zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop
condition. At this time the EEPROM enters an internally-timed write cycle, tWR, to the nonvolatile memory. All
inputs are disabled during this write cycle and the EEPROM will not respond until the write is complete.
The device will acknowledge a write command, but not write the data, if the software or hardware write
protection has been enabled. The write cycle time must be observed even when the write protection is enabled.
Figure 8-1.
Byte Write
S
T
A
R
T
Device
Address
W
R
I
T
E
Word Address
S
T
O
P
Data
SDA LINE
M
S
B
L R AM
S / C S
BW K B
L A
SC
B K
A
C
K
AT34C02D [DATASHEET]
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9
Page Write: The 2K device is capable of 16-byte page write.
A page write is initiated the same as a byte write, but the microcontroller does not send a stop condition after the
first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the
microcontroller can transmit up to fifteen more data words. The EEPROM will respond with a zero after each
data word received. The microcontroller must terminate the page write sequence with a stop condition.
The data word address lower four bits are internally incremented following the receipt of each data word. The
higher data word address bits are not incremented, retaining the memory page row location. When the word
address, internally generated, reaches the page boundary, the following data byte is placed at the beginning of
the same page. If more than sixteen data words are transmitted to the EEPROM, the data word address will “roll
over” and previous data will be overwritten. The address “roll over” during write is from the last byte of the
current page to the first byte of the same page.
The device will acknowledge a write command, but not write the data, if the software or hardware write
protection has been enabled. The write cycle time must be observed even when the write protection is enabled.
Figure 8-2.
Page Write
S
T
A
R
T
W
R
I
T
E
Device
Address
Word
Address (n)
Data (n)
Data (n + 1)
S
T
O
P
Data (n + x)
SDA LINE
M
S
B
Figure 8-3.
L R A
S / C
BW K
A
C
K
A
C
K
A
C
K
A
C
K
Write Cycle Timing
SCL
SDA
8th bit
ACK
WORDN
(1)
tWR
Stop
Condition
Note:
1.
Start
Condition
The write cycle time tWR is the time from a valid Stop condition of a write sequence to the end of the internal
clear/write cycle.
Acknowledge Polling: Once the internally-timed write cycle has started and the EEPROM inputs are disabled,
acknowledge polling can be initiated. This involves sending a start condition followed by the device address
word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed
will the EEPROM respond with a zero allowing the read or write sequence to continue.
10
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
8.1
Write Protection
The software write protection, once enabled, write protects only the lower-half of the array (addresses
0x00 – 0x7F) while the hardware write protection, via the WP pin, is used to protect the entire array.
Permanent Software Write Protection: The permanent software write protection is enabled by sending a
command to the device, similar to a normal write command, which programs the permanent write protect
register. This must be done with the WP pin low. The write protect register is programmed by sending a write
command with the device address of ‘0110’ (6h) instead of ‘1010’ (Ah) with the address and data bit(s)
being don’t cares. Once the permanent software write protection has been enabled, the device will no longer
acknowledge the ‘0110’ (6h) control byte. The permanent software write protection cannot be reversed even
if the device is powered down. The write cycle time must be observed.
Figure 8-4.
Setting Permanent Write Protect Register (PSWP)
S
T
A
R
T
SDA LINE
CONTROL
BYTE
WORD
ADDRESS
S
T
O
P
DATA
0 1 1 0 A2 A1 A0 0
A
C
K
A
C
K
A
C
K
= Don't care
Reversible Software Write Protection: The reversible software write protection is enabled by sending a
command to the device, similar to a normal write command, which programs the reversible write protect
register. This must be done with the WP pin low. The reversible write protect register is programmed by sending
a write command ‘01100010’ (62h) with pins A2 and A1 tied to ground and pin A0 connected to VHV (see
Figure 8-5). The reversible write protection can be reversed by sending a command ‘01100110’ (66h) with
pin A2 tied to ground, pin A1 tied to VCC and pin A0 tied to VHV (see Figure 8-6).
Figure 8-5.
Setting Reversible Write Protect Register (RSWP)
S
T
A
R
T
SDA LINE
CONTROL
BYTE
WORD
ADDRESS
S
T
O
P
DATA
0 1 1 0 0 0 1 0
A
C
K
A
C
K
A
C
K
= Don't care
Figure 8-6.
Clearing Reversible Write Protect Register (RSWP)
S
T
A
R
T
SDA LINE
CONTROL
BYTE
WORD
ADDRESS
S
T
O
P
DATA
0 1 1 0 0 1 1 0
A
C
K
A
C
K
A
C
K
= Don't care
AT34C02D [DATASHEET]
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11
Hardware Write Protection: The WP pin can be connected to VCC, GND, or left floating. Connecting the WP
pin to VCC will write protect the entire array, regardless of whether or not the software write protection has been
enabled or invoked. The software write protection register cannot be programmed when the WP pin is
connected to VCC. If the WP pin is connected to GND or left floating, the write protection mode is determined by
the status of the software write protect register.
Table 8-1.
Write Protection
Pin State/Voltage
R/W
Command
A2
A1
A0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Set PSWP
A2
A1
A0
0
1
1
0
A2
A1
A0
0
Set RSWP
0
0
VHV
0
1
1
0
0
0
1
0
Clear RSWP
0
VCC
VHV
0
1
1
0
0
1
1
0
Table 8-2.
VHV
Min
Max
Units
7
10
V
VHV
Note:
12
Preamble
VHV - VCC > 4.8V
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
Table 8-3.
Device Response, WP Connected to GND or Floating
WP Connected to GND or Floating
Device
Acknowledgement
Command
Operation
Permanent
Write Protect
Register PSWP
Reversible
Write Protect
Register RSWP
Command/
Address
Byte
Data
Byte
1010
Read
X
X
ACK
X
1010
Write to
Upper
128 Bytes
Programmed
X
ACK
ACK
Can write to upper-half (80h – FFh) only.
1010
Write to
Upper
128 Bytes
X
Programmed
ACK
ACK
Can write to upper-half (80h – FFh) only.
1010
Write to
Lower
128 Bytes
Programmed
X
ACK
No ACK
Lower half is permanently write protected.
No writing occurs.
1010
Write to
Lower
128 Bytes
X
Programmed
ACK
No ACK
Lower half is write protected with the
reversible protection features. No writing
occurs.
1010
Write
Not
Programmed
Not
Programmed
ACK
ACK
Read
PSWP
Read
Programmed
X
No ACK
X
STOP — Indicates permanent write
protect register is programmed.
Read
PSWP
Read
Not
Programmed
X
ACK
X
Read out data undefined. Indicates
PSWP register is not programmed
Set PSWP
Write
Programmed
X
No ACK
No ACK
STOP — Indicates permanent write
protect register is programmed.
Set PSWP
Write
Not
Programmed
X
ACK
ACK
Read
RSWP
Read
X
Programmed
No ACK
X
STOP — Indicates reversible write
protect register is programmed.
Read
RSWP
Read
X
Not
Programmed
ACK
X
Read out data undefined. Indicates
RSWP register is not programmed
Set RSWP
Write
Not
Programmed
Programmed
No ACK
No ACK
STOP — Indicates reversible write
protect register is programmed.
Set RSWP
Write
Not
Programmed
Not
Programmed
ACK
ACK
Set RSWP
Write
Programmed
X
No ACK
No ACK
STOP — Indicates permanent write
protect register is programmed.
Clear
RSWP
Write
Programmed
X
No ACK
No ACK
STOP — Indicates permanent write
protect register is programmed.
Clear
RSWP
Write
Not
Programmed
X
ACK
ACK
Action from Device
Read Array
Can write to Full Array.
Program permanent write protect register
(irreversible).
Program reversible write protect register
(reversible).
Clear (unprogram) reversible write protect
register (reversible).
AT34C02D [DATASHEET]
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13
Table 8-4.
Device Response, WP Connected to VCC
WP connected to VCC
Device
Acknowledgement
14
Command
Read /
Write Bit
Permanent
Write Protect
Register PSWP
Reversible
Write Protect
Register RSWP
Command/
Address
Byte
Data
Byte
1010
Read
X
X
ACK
X
1010
Write
X
X
ACK
No ACK
Read
PSWP
Read
Programmed
X
No ACK
X
STOP — Indicates permanent write
protect register is programmed.
Read
PSWP
Read
Not
Programmed
X
ACK
X
Read out data undefined. Indicates PSWP
register is not programmed.
Set PSWP
Write
Programmed
X
No ACK
No ACK
STOP — Indicates permanent write
protect register is programmed.
Set PSWP
Write
Not
Programmed
X
ACK
No ACK
Cannot program write protect registers.
Read
RSWP
Read
X
Programmed
No ACK
X
STOP — Indicates reversible write protect
register is programmed.
Read
RSWP
Read
X
Not
Programmed
ACK
X
Read out data undefined. Indicates RSWP
register is not programmed.
Set RSWP
Write
Not
Programmed
Programmed
No ACK
No ACK
STOP — Indicates reversible write protect
register is programmed.
Set RSWP
Write
Not
Programmed
Not
Programmed
ACK
No ACK
Cannot program write protect registers.
Set RSWP
Write
Programmed
X
No ACK
No ACK
STOP — Indicates permanent write
protect register is programmed.
Clear
RSWP
Write
Programmed
X
No ACK
No ACK
STOP — Indicates permanent write
protect register is programmed.
Clear
RSWP
Write
Not
Programmed
X
ACK
No ACK
Cannot write to write protect registers.
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
Action from Device
Read Array
Device is Write Protected,
No writing occurs.
9.
Read Operations
Read operations are initiated the same way as write operations with the exception that the read/write select bit
in the device address word is set to one. There are three read operations:



Current Address Read
Random Address Read
Sequential Read
Current Address Read: The internal data word address counter maintains the last address accessed during
the last read or write operation, incremented by one. This address stays valid between operations as long as the
chip power is maintained. The address “roll over” during read is from the last byte of the last memory page to the
first byte of the first page.
Once the device address with the read/write select bit set to one is clocked in and acknowledged by the
EEPROM, the current address data word is serially clocked out. To end the command, the microcontroller does
not respond with a zero but does generate a stop condition in the subsequent clock cycle.
Figure 9-1.
Current Address Read
S
T
A
R
T
R
E
A
D
Device
Address
S
T
O
P
Data
SDA LINE
M
S
B
L R A
S / C
BW K
N
O
A
C
K
Random Read: A random read requires a “dummy” byte write sequence to load in the data word address. Once
the device address word and data word address are clocked in and acknowledged by the EEPROM, the
microcontroller must generate another start condition. The microcontroller now initiates a current address read
by sending a device address with the read/write select bit high. The EEPROM acknowledges the device
address and serially clocks out the data word. To end the command, the microcontroller does not respond with
a zero but does generate a stop condition in the subsequent clock cycle.
Figure 9-2.
Random Read
S
T
A
R
T
Device
Address
W
R
I
T
E
S
T
A
R
T
Word
Address (n)
R
E
A
D
Device
Address
S
T
O
P
Data (n)
SDA LINE
M
S
B
L R AM
S / C S
BW K B
Dummy Write
L A
S C
B K
M
S
B
L
S
B
A
C
K
N
O
A
C
K
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
15
Sequential Read: Sequential Reads are initiated by either a current address read or a random address read.
After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM
receives an acknowledge, it will continue to increment the data word address and serially clock out sequential
data words. When the memory address limit is reached, the data word address will “roll-over” and the sequential
read will continue. The sequential read operation is terminated when the microcontroller does not respond with
a zero but does generate a stop condition in the subsequent clock cycle.
Figure 9-3.
Sequential Read
Device
Address
R
E
A
D
Data (n)
A
C
K
Data (n + 1)
A
C
K
Data (n + 2)
A
C
K
S
T
O
P
Data (n + x)
SDA LINE
R A
/ C
WK
N
O
A
C
K
Permanent Write Protect Register (PSWP) Status: Determining the status of the permanent write protect
register can be accomplished by sending a similar command to the device as was used when programming the
register, except the R/W bit must now be set to a one. If the device returns an acknowledge, the permanent
write protect register has not been programmed. Otherwise, it has been programmed and the lower-half of the
array is permanently write protected.
Reversible Write Protect Register (RSWP) Status: Determining the status of the reversible write protect
register can be accomplished by sending a similar command to the device as was used when programming the
register, except the R/W bit must be set to one. If the device returns an acknowledge, then the reversible write
protect register has been programmed. The lower-half of the array is write protected, but remains reversible.
Table 9-1.
PSWP and RSWP Status
Pin State/Voltage
16
Preamble
R/W
Command
A2
A1
A0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read PSWP
A2
A1
A0
0
1
1
0
A2
A1
A0
1
Read RSWP
0
0
A0
0
1
1
0
0
0
1
1
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
10.
Part Markings
AT34C02D: Package Marking Information
8-lead UDFN
8-lead TSSOP
2.0 x 3.0 mm Body
34D
HM@
YXX
ATHYWW
34DM @
AAAAAAA
8-ball VFBGA
8-lead SOIC
1.5 x 2.0 mm Body
ATMLHYWW
34DM
@
AAAAAAAA
34DU
YMXX
PIN 1
Note 1:
designates pin 1
Note 2: Package drawings are not to scale
Catalog Number Truncation
AT34C02D
Truncation Code ###: 34D
Date Codes
Y = Year
4: 2014
5: 2015
6: 2016
7: 2017
Voltages
8: 2018
9: 2019
0: 2020
1: 2021
M = Month
A: January
B: February
...
L: December
WW = Work Week of Assembly
02: Week 2
04: Week 4
...
52: Week 52
Country of Assembly
Lot Number
@ = Country of Assembly
AAA...A = Atmel Wafer Lot Number
Trace Code
M: 1.7V min
Grade/Lead Finish Material
H: Industrial/NiPdAu
U: Industrial/Matte Tin
Atmel Truncation
XX = Trace Code (Atmel Lot Numbers Correspond to Code)
Example: AA, AB.... YZ, ZZ
AT: Atmel
ATM: Atmel
ATML: Atmel
5/12/14
TITLE
Package Mark Contact:
[email protected]
34C02DSM, AT34C02D Package Marking Information
DRAWING NO.
REV.
34C02DSM
D
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
17
11.
Ordering Code Detail
AT3 4 C 0 2 D - M A H M - T
Atmel Designator
Shipping Carrier Option
T = Tape and Reel
B or Blank = Bulk (tubes)
Product Family
34C = 2-wire Serial EEPROM
for SPD Function
Operating Voltage
M
= 1.7V to 5.5V
Package Device Grade or
Wafer/Die Thickness
Device Density
02 = 2 Kilobit
Device Revision
H
= Green, NiPdAu Lead Finish,
Industrial Temperature Range
(-40˚C to +85˚C)
U = Green, Matte Sn Lead Finish,
Industrial Temperature Range
(-40˚C to +85˚C)
11 = 11mil Wafer Thickness
Package Option
MA = 2.0 x 3.0mm UDFN
X = TSSOP
SS = JEDEC SOIC
C = VFBGA
WWU = Wafer Unsawn
18
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
12.
Ordering Information
Atmel Ordering Code
Finish
Package
AT34C02D-MAHM-T(1)
Voltage
Operation Range
1.7V to 5.5V
Industrial Temperature
(-40C to +85C)
8MA2
AT34C02D-XHM-T(1)
8X
AT34C02D-XHM-B(2)
NiPdAu
(Lead-free/Halogen-free)
AT34C02D-SSHM-T(1)
8S1
AT34C02D-SSHM-B(2)
AT34C02D-CUM-T(1)
AT34C02D-WWU11M(3)
Notes:
1.
2.
3.
Matte Tin
(Lead-free/Halogen-free)
8U3-1
—
Wafer Sale
T = Tape and Reel

SOIC = 4,000 per reel

TSSOP, UDFN, and VFBGA = 5,000 per reel
B = Bulk
For Wafer sales, please contact Atmel Sales.
Package Type
8MA2
8-pad, 2.0mm x 3.0mm, 0.6mm body, Ultra Thin Dual Flat No Lead (UDFN)
8X
8-lead, 4.4mm body, Plastic Thin Shrink Small Outline Package (TSSOP)
8S1
8-lead, 0.150" wide body, Plastic Gull Wing Small Outline (JEDEC SOIC)
8U3-1
8-ball, 1.5mm x 2.0mm body, 0.5mm pitch, die Ball Grid Array (VFBGA)
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
19
13.
Packaging Information
13.1
8MA2 — 8-pad UDFN
E
1
8
Pin 1 ID
2
7
3
6
4
5
D
C
TOP VIEW
A2
SIDE VIEW
A
A1
E2
b (8x)
8
1
7
2
Pin#1 ID
D2
6
3
5
4
e (6x)
K
L (8x)
BOTTOM VIEW
Notes:
COMMON DIMENSIONS
(Unit of Measure = mm)
1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
2. The Pin #1 ID is a laser-marked feature on Top View.
3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.
4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.
SYMBOL
MIN
NOM
MAX
A
0.50
0.55
0.60
A1
0.0
0.02
0.05
A2
-
-
0.55
D
1.90
2.00
2.10
D2
1.20
-
1.60
E
2.90
3.00
3.10
E2
1.20
-
1.60
b
0.18
0.25
0.30
C
L
3
1.52 REF
0.30
e
K
NOTE
0.35
0.40
0.50 BSC
0.20
-
-
6/6/14
Package Drawing Contact:
[email protected]
20
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
TITLE
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)
GPC
DRAWING NO.
REV.
YNZ
8MA2
F
13.2
8X — 8-lead TSSOP
C
1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
A
b
A1
e
D
SYMBOL
Side View
Notes:
COMMON DIMENSIONS
(Unit of Measure = mm)
A2
1. This drawing is for general information only.
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
MIN
NOM
MAX
A
-
-
1.20
A1
0.05
-
0.15
A2
0.80
1.00
1.05
D
2.90
3.00
3.10
2, 5
E
NOTE
6.40 BSC
E1
4.30
4.40
4.50
3, 5
b
0.19
0.25
0.30
4
e
L
0.65 BSC
0.45
L1
C
0.60
0.75
1.00 REF
0.09
-
0.20
2/27/14
TITLE
Package Drawing Contact:
[email protected]
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
GPC
TNR
DRAWING NO.
8X
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
REV.
E
21
13.3
8S1 — 8-lead JEDEC SOIC
C
1
E
E1
L
N
Ø
TOP VIEW
END VIEW
e
b
COMMON DIMENSIONS
(Unit of Measure = mm)
A
A1
D
SIDE VIEW
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
SYMBOL MIN
A
1.35
NOM
MAX
–
1.75
A1
0.10
–
0.25
b
0.31
–
0.51
C
0.17
–
0.25
D
4.80
–
5.05
E1
3.81
–
3.99
E
5.79
–
6.20
e
NOTE
1.27 BSC
L
0.40
–
1.27
Ø
0°
–
8°
6/22/11
Package Drawing Contact:
[email protected]
22
TITLE
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
GPC
SWB
DRAWING NO.
REV.
8S1
G
13.4
8U3-1 — 8-ball VFBGA
E
D
2. b
PIN 1 BALL PAD CORNER
A1
A2
TOP VIEW
A
SIDE VIEW
PIN 1 BALL PAD CORNER
3
1
2
4
d
(d1)
8
7
6
5
COMMON DIMENSIONS
(Unit of Measure - mm)
e
(e1)
SYMBOL
MIN
NOM
MAX
BOTTOM VIEW
A
0.73
0.79
0.85
8 SOLDER BALLS
A1
0.09
0.14
0.19
A2
0.40
0.45
0.50
Notes:
b
0.20
0.25
0.30
1. This drawing is for general information only.
D
2. Dimension ‘b’ is measured at maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
NOTE
2
1.50 BSC
E
2.0 BSC
e
0.50 BSC
e1
0.25 REF
d
1.00 BSC
d1
0.25 REF
6/11/13
Package Drawing Contact:
[email protected]
TITLE
GPC
DRAWING NO.
8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA)
GXU
8U3-1
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
REV.
F
23
14.
Revision History
Doc. Rev.
Date
Comments
Updated various language elements for consistency with JEDEC EE1002/1002A.
Updated AC timing terminology for consistency with JEDEC EE1002/1002A.
8781C
07/2014
Added 100kHz timing information for SPD applications using < 2.2V VCC supply.
Miscellaneous formatting changes and text corrections.
Update package drawings.
8781B
06/2012
Correct ordering code:
- AT34C02D-WWU11, Die Sale to AT34C02D-WWU11M, Wafer Sale.
Update template.
8781A
24
03/2012
Initial document release.
AT34C02D [DATASHEET]
Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014
XXXXXX
Atmel Corporation
1600 Technology Drive, San Jose, CA 95110 USA
T: (+1)(408) 441.0311
F: (+1)(408) 436.4200
|
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© 2014 Atmel Corporation. / Rev.: Atmel-8781C-SEEPROM-AT34C02D-Datasheet_072014.
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