BVDSS = 600 V RDS(on) typ ȍ HFW12N60S ID = 12 A 600V N-Channel MOSFET D2-PAK D FEATURES G Originative New Design S Superior Avalanche Rugged Technology Robust Gate Oxide Technology 1.Gate 2. Drain 3. Source Very Low Intrinsic Capacitances Excellent Switching Characteristics Unrivalled Gate Charge : 38 nC (Typ.) Extended Safe Operating Area Lower RDS(ON) ȍ 7\S #9GS=10V 100% Avalanche Tested Absolute Maximum Ratings Symbol TC=25 unless otherwise specified Parameter Value Units 600 V VDSS Drain-Source Voltage ID Drain Current – Continuous (TC = 25) 12 A Drain Current – Continuous (TC = 100) 7.4 A IDM Drain Current – Pulsed 48 A VGS Gate-Source Voltage ρ30 V EAS Single Pulsed Avalanche Energy (Note 2) 870 mJ IAR Avalanche Current (Note 1) 12 A EAR Repetitive Avalanche Energy (Note 1) 22.5 mJ dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns PD Power Dissipation (TA = 25) * 3.13 W Power Dissipation (TC = 25) - Derate above 25 225 W 1.78 W/ -55 to +150 300 (Note 1) TJ, TSTG Operating and Storage Temperature Range TL Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds Thermal Resistance Characteristics Symbol Parameter Typ. Max. RșJC Junction-to-Case -- 0.56 RșJA Junction-to-Ambient* -- 40 RșJA Junction-to-Ambient -- 62.5 Units /W * When mounted on the minimum pad size recommended (PCB Mount) క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͢͝ͻΦΝΪ͑ͣͧ͑͢͡ HFW12N60S July 2016 Symbol Parameter unless otherwise specified Test Conditions Min Typ Max Units On Characteristics VGS RDS(ON) Gate Threshold Voltage VDS = VGS, ID = 250 Ꮃ͑ 2.0 -- 4.0 V Static Drain-Source On-Resistance VGS = 10 V, ID = 6.0 A -- 0.53 0.65 VGS = 0 V, ID = 250 ᒺ 600 -- -- V ID = 250 ᒺ, Referenced to 25 -- 0.5 -- V/ VDS = 600 V, VGS = 0 V -- -- 1 ᒺ VDS = 480 V, TC = 125 -- -- 10 ᒺ Off Characteristics BVDSS Drain-Source Breakdown Voltage ԩBVDSS Breakdown Voltage Temperature Coefficient /ԩTJ IDSS Zero Gate Voltage Drain Current IGSSF Gate-Body Leakage Current, Forward VGS = 30 V, VDS = 0 V -- -- 100 ᒹ IGSSR Gate-Body Leakage Current, Reverse VGS = -30 V, VDS = 0 V -- -- -100 ᒹ -- 1835 2385 ᓂ -- 185 240 ᓂ -- 16 21 ᓂ -- 30 70 ᓩ -- 85 180 ᓩ -- 140 280 ᓩ -- 90 190 ᓩ -- 38 49 nC -- 8 -- nC -- 13 -- nC Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz Switching Characteristics td(on) Turn-On Time tr Turn-On Rise Time td(off) Turn-Off Delay Time tf Turn-Off Fall Time Qg Total Gate Charge Qgs Gate-Source Charge Qgd VDS = 300 V, ID = 12 A, RG = 25 (Note 4,5) VDS = 480V, ID = 12 A, VGS = 10 V (Note 4,5) Gate-Drain Charge Source-Drain Diode Maximum Ratings and Characteristics IS Continuous Source-Drain Diode Forward Current -- -- 12 ISM Pulsed Source-Drain Diode Forward Current -- -- 48 VSD Source-Drain Diode Forward Voltage IS = 12.0 A, VGS = 0 V -- -- 1.4 V trr Reverse Recovery Time -- 420 -- ᓩ Qrr Reverse Recovery Charge IS = 12.0 A, VGS = 0 V diF/dt = 100 A/ȝV (Note 4) -- 4.9 -- ȝ& A Notes ; 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L=11mH, IAS=12A, VDD=50V, RG=25:, Starting TJ =25qC 3. ISD$GLGW$ȝV9DD%9DSS , Starting TJ =25 qC 4. Pulse Test : Pulse Width ȝV'XW\&\FOH 5. Essentially Independent of Operating Temperature క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͢͝ͻΦΝΪ͑ͣͧ͑͢͡ HFW12N60S Electrical Characteristics TC=25 qC HFW12N60S ID, Drain Current [A] ID, Drain Current [A] Typical Characteristics VGS, Gate-Source Voltage [V] VDS, Drain-Source Voltage [V] Figure 1. On Region Characteristics RDS(ON)[@ Drain-Source On-Resistance IDR, Reverse Drain Current [A] Figure 2. Transfer Characteristics VSD, Source-Drain Voltage [V] ID, Drain Current [A] Figure 4. Body Diode Forward Voltage Variation with Source Current and Temperature Figure 3. On Resistance Variation vs Drain Current and Gate Voltage 3000 Ciss Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd Capacitances [pF] 2500 2000 Coss 1500 1000 Note ; 1. VGS = 0 V 2. f = 1 MHz Crss 500 12 VDS = 120V VGS, Gate-Source Voltage [V] 3500 10 VDS = 300V VDS = 480V 8 6 4 2 * Note : ID = 12.0A 0 10-1 100 101 0 0 4 8 12 16 20 24 28 32 36 VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC] Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics 40 క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͢͝ͻΦΝΪ͑ͣͧ͑͢͡ HFW12N60S Typical Characteristics (continued) BVDSS, (Normalized) Drain-Source Breakdown Voltage 3.0 RDS(ON), (Normalized) Drain-Source On-Resistance 2.5 2.0 1.5 1.0 * Note: 1. VGS=10V 2. ID=6.0A 0.5 0.0 -100 -50 0 50 100 150 200 TJ, Junction Temperature[oC] TJ, Junction Temperature [oC] Figure 8. On-Resistance Variation vs Temperature Figure 7. Breakdown Voltage Variation vs Temperature 14 Operation in This Area is Limited by R DS(on) 10 Ps 12 101 ID, Drain Current [A] 100 Ps 1 ms 10 ms 100 ms DC 100 10-1 * Notes : 1. TC = 25 oC 10-2 100 10 8 6 4 2 2. TJ = 150 oC 3. Single Pulse 101 102 0 25 103 50 75 100 125 150 TC, Case Temperature [oC] VDS, Drain-Source Voltage [V] Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs Case Temperature 100 ZTJC(t), Thermal Response ID, Drain Current [A] 102 D=0.5 10-1 0.2 * Notes : 1. ZTJC(t) = 0.56 oC/W Max. 2. Duty Factor, D=t1/t2 3. TJM - TC = PDM * ZTJC(t) 0.1 0.05 10-2 0.02 0.01 PDM single pulse t1 10-5 10-4 10-3 10-2 t2 10-1 100 101 t1, Square Wave Pulse Duration [sec] Figure 11. Transient Thermal Response Curve క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͢͝ͻΦΝΪ͑ͣͧ͑͢͡ HFW12N60S Fig 12. Gate Charge Test Circuit & Waveform .ȍ 12V VGS Same Type as DUT Qg 200nF 10V 300nF VDS VGS Qgs Qgd DUT 3mA Charge Fig 13. Resistive Switching Test Circuit & Waveforms RL VDS VDS 90% VDD RG ( 0.5 rated VDS ) Vin DUT 10V 10% tr td(on) td(off) t on tf t off Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms BVDSS 1 EAS = ---- LL IAS2 -------------------2 BVDSS -- VDD L VDS VDD ID BVDSS IAS RG 10V ID (t) DUT VDS (t) VDD tp Time క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͢͝ͻΦΝΪ͑ͣͧ͑͢͡ HFW12N60S Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT + VDS _ IS L Driver RG VGS VGS ( Driver ) Same Type as DUT VDD • dv/dt controlled by RG • IS controlled by pulse period Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current IS ( DUT ) di/dt IRM Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt Vf VDD Body Diode Forward Voltage Drop క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͢͝ͻΦΝΪ͑ͣͧ͑͢͡ HFW12N60S Package Dimension kYTwhrG O{vTY]ZPG క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͢͝ͻΦΝΪ͑ͣͧ͑͢͡