SLVS011D − OCTOBER 1982 − REVISED AUGUST 2003 D D D D D D D D PACKAGE (TOP VIEW) 3-Terminal Regulators Output Current Up To 100 mA No External Components Required Internal Thermal-Overload Protection Internal Short-Circuit Current Limiting Direct Replacement for Industry-Standard MC79L00 Series Available in 5% or 10% Selections OUTPUT INPUT† INPUT† NC 1 8 2 7 3 6 4 5 NC INPUT† INPUT† COMMON † Internally connected NC − No internal connection description/ordering information LP PACKAGE (TOP VIEW) This series of fixed negative-voltage OUTPUT integrated-circuit voltage regulators is designed INPUT for a wide range of applications. These include COMMON on-card regulation for elimination of noise and distribution problems associated with single-point regulation. In addition, they can be used to control series pass elements to make high-current voltage-regulator circuits. One of these regulators can deliver up to 100 mA of output current. The internal current-limiting and thermal-shutdown features essentially make the regulators immune to overload. When used as a replacement for a Zener-diode and resistor combination, these devices can provide an effective improvement in output impedance of two orders of magnitude, with lower bias current. ORDERING INFORMATION TJ OUTPUT VOLTAGE TOLERANCE NOMINAL OUTPUT VOLTAGE (V) PACKAGE† SOIC (D) −5 TO-226 / TO-92 (LP) 5% 0°C 0 C to 125 125°C C SOIC (D) −12 TO-226 / TO-92 (LP) −15 10% −12 TO-226 / TO-92 (LP) TO-226 / TO-92 (LP) ORDERABLE PART NUMBER Tube of 75 MC79L05ACD Reel of 2500 MC79L05ACDR Bulk of 1000 MC79L05ACLP Reel of 2000 MC79L05ACLPR Tube of 75 MC79L12ACD Reel of 2500 MC79L12ACDR Bulk of 1000 MC79L12ACLP Reel of 2000 MC79L12ACLPR Bulk of 1000 MC79L15ACLP Ammo of 2000 MC79L15ACLPM Reel of 2000 MC79L15ACLPR Bulk of 1000 MC79L12CLP TOP-SIDE MARKING 79L05A 79L05AC 79L12A 79L12AC 79L15AC 79L12C −15 SOIC (D) Tube of 75 MC79L15CD 79L15C † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated ! "#$ %!& % "! "! '! ! !( ! %% )*& % "!+ %! !!$* $%! !+ $$ "!!& POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLVS011D − OCTOBER 1982 − REVISED AUGUST 2003 equivalent schematic COMMON OUTPUT INPUT absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Input voltage: MC79L05 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 V MC79L12, MC79L15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −35 V Package thermal impedance, θJA (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W LP package . . . . . . . . . . . . . . . . . . . . . . . . . . 140°C/W Operating free-air, case, or virtual junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions VI IO TJ 2 Input voltage MIN MAX MC79L05 −7 −20 MC79L12 −14.5 −27 MC79L15 −17.5 −30 Output current Operating virtual junction temperature 0 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT V 100 mA 125 °C SLVS011D − OCTOBER 1982 − REVISED AUGUST 2003 electrical characteristics at specified virtual junction temperature, VI = −10 V, IO = 40 mA (unless otherwise noted) PARAMETER Output voltage‡ Input regulation Ripple rejection Output regulation VI = −7 V to −20 V, IO = 1 mA to 40 mA VI = −10 V, IO = 1 mA to 70 mA VI = −7 V to −20 V VI = −8 V to −20 V Output noise voltage Dropout voltage IO = 40 mA Bias current VI = −8 V to −20 V IO = 1 mA to 40 mA MC79L05AC TJ MIN TYP MAX MIN TYP MAX 25°C −4.6 −5 −5.4 −4.8 −5 −5.2 0°C to 125°C −4.5 −5.5 −4.75 −5.25 0°C to 125°C −4.5 −5.5 −4.75 −5.25 25°C VI = −8 V to −18 V, f = 120 Hz IO = 1 mA to 100 mA IO = 1 mA to 40 mA f = 10 Hz to 100 kHz Bias current change MC79L05C TEST CONDITIONS† 25°C 40 200 150 150 100 49 25°C 25°C 40 25°C 1.7 41 49 V mV dB 60 60 30 30 mV µV 40 1.7 V 25°C 6 6 125°C 5.5 5.5 1.5 1.5 0.2 0.1 0°C to 125°C UNIT mA mA † All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across the output. Pulse-testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. ‡ This specification applies only for dc power dissipation permitted by absolute maximum ratings. electrical characteristics at specified virtual junction temperature, VI = −19 V, IO = 40 mA (unless otherwise noted) PARAMETER Output voltage‡ Input regulation Ripple rejection Output regulation VI = −14.5 V to −27 V, IO = 1 mA to 40 mA VI = −19 V, IO = 1 mA to 70 mA VI = −14.5 V to −27 V VI = −16 V to −27 V Output noise voltage Dropout voltage IO = 40 mA Bias current VI = −16 V to −27 V IO = 1 mA to 40 mA MC79L12AC TJ MIN TYP MAX MIN TYP MAX 25°C −11.1 −12 −12.9 −11.5 −12 −12.5 0°C to 125°C −10.8 −13.2 −11.4 −12.6 0°C to 125°C −10.8 −13.2 −11.4 −12.6 25°C VI = −15 V to −25 V, f = 120 Hz IO = 1 mA to 100 mA IO = 1 mA to 40 mA f = 10 Hz to 100 kHz Bias current change MC79L12C TEST CONDITIONS† 25°C 36 250 250 200 200 42 25°C 37 42 UNIT V mV dB 100 100 50 50 mV 25°C 80 80 µV 25°C 1.7 1.7 V 25°C 6.5 6.5 125°C 6 6 1.5 1.5 0.2 0.1 0°C to 125°C mA mA † All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across the output. Pulse-testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. ‡ This specification applies only for dc power dissipation permitted by absolute maximum ratings. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SLVS011D − OCTOBER 1982 − REVISED AUGUST 2003 electrical characteristics at specified virtual junction temperature, VI = −23 V, IO = 40 mA (unless otherwise noted) PARAMETER Output voltage‡ Input regulation Ripple rejection Output regulation VI = −17.5 V to −30 V, IO = 1 mA to 40 mA VI = −23 V, IO = 1 mA to 70 mA VI = −17.5 V to −30 V VI = −17.5 V to −30 V VI = −18.5 V to −28.5 V, f = 120 Hz IO = 1 mA to 100 mA Output noise voltage IO = 1 mA to 40 mA f = 10 Hz to 100 kHz Dropout voltage IO = 40 mA Bias current Bias current change MC79L15C TEST CONDITIONS† VI = −20 V to −30 V IO = 1 mA to 40 mA MC79L15AC TJ MIN TYP MAX MIN TYP MAX 25°C −13.8 −15 −16.2 −14.4 −15 −15.6 0°C to 125°C −13.5 −16.5 −14.25 −15.75 0°C to 125°C −13.5 −16.5 −14.25 −15.75 25°C 25°C 33 300 300 250 250 39 25°C 25°C 90 25°C 1.7 34 39 V mV dB 150 150 75 75 mV µV 90 1.7 V 25°C 6.5 6.5 125°C 6 6 1.5 1.5 0.2 0.1 0°C to 125°C UNIT mA mA † All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across the output. Pulse-testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. ‡ This specification applies only for dc power dissipation permitted by absolute maximum ratings. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) MC79L05ACD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 125 79L05A MC79L05ACDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 125 79L05A MC79L05ACDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 125 79L05A MC79L05ACDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 125 79L05A MC79L05ACDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 125 79L05A MC79L05ACDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 125 79L05A MC79L05ACLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L05AC MC79L05ACLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L05AC MC79L05ACLPR ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L05AC MC79L05ACLPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L05AC MC79L12ACD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 125 79L12A MC79L12ACDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 125 79L12A MC79L12ACDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 125 79L12A MC79L12ACDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 125 79L12A MC79L12ACDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 125 79L12A MC79L12ACLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L12AC MC79L12ACLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L12AC Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) MC79L12ACLPR ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L12AC MC79L12ACLPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L12AC MC79L12CLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L12C MC79L15ACLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L15AC MC79L15ACLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L15AC MC79L15ACLPR ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L15AC MC79L15ACLPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 79L15AC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant MC79L05ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 MC79L12ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MC79L05ACDR SOIC D 8 2500 340.5 338.1 20.6 MC79L12ACDR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 PACKAGE OUTLINE LP0003A TO-92 - 5.34 mm max height SCALE 1.200 SCALE 1.200 TO-92 5.21 4.44 EJECTOR PIN OPTIONAL 5.34 4.32 (1.5) TYP SEATING PLANE (2.54) NOTE 3 2X 4 MAX (0.51) TYP 6X 0.076 MAX SEATING PLANE 2X 2.6 0.2 3X 12.7 MIN 3X 3X 0.55 0.38 0.43 0.35 2X 1.27 0.13 FORMED LEAD OPTION STRAIGHT LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION 3X 2.67 2.03 4.19 3.17 3 2 1 3.43 MIN 4215214/B 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. www.ti.com EXAMPLE BOARD LAYOUT LP0003A TO-92 - 5.34 mm max height TO-92 0.05 MAX ALL AROUND TYP FULL R TYP METAL TYP (1.07) 3X ( 0.85) HOLE 2X METAL (1.5) 2X (1.5) 2 1 (R0.05) TYP 3 2X (1.07) (1.27) SOLDER MASK OPENING 2X SOLDER MASK OPENING (2.54) LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 0.05 MAX ALL AROUND TYP ( 1.4) 2X ( 1.4) METAL 3X ( 0.9) HOLE METAL (R0.05) TYP 2 1 (2.6) SOLDER MASK OPENING 3 2X SOLDER MASK OPENING (5.2) LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 4215214/B 04/2017 www.ti.com TAPE SPECIFICATIONS LP0003A TO-92 - 5.34 mm max height TO-92 13.7 11.7 32 23 (2.5) TYP 0.5 MIN 16.5 15.5 11.0 8.5 9.75 8.50 19.0 17.5 6.75 5.95 2.9 TYP 2.4 3.7-4.3 TYP 13.0 12.4 FOR FORMED LEAD OPTION PACKAGE 4215214/B 04/2017 www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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