BAS116LP3 ULTRA-SMALL SURFACE MOUNT LOW LEAKAGE DIODE Features Mechanical Data Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm) Ultra-Low Profile Package (0.3mm) Very Low Leakage Current Low Capacitance Moisture Sensitivity: Level 1 per J-STD-020 Ideal for Compact Battery Powered Portable Electronics Terminal Connections: Cathode Bar Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Terminals: Finish Matte Tin Finish over Copper Leadframe Halogen and Antimony Free. “Green” Device (Note 3) (Lead Free Plating). Solderable per MIL-STD-202, Method 208 e3 Weight: 0.2mg (Approximate) Case: X3-DFN0603-2 Case Material: Molded Plastic, “Green” Molding Compound. NEW PRODUCT UL Flammability Classification Rating 94V-0 Top View Bottom View Ordering Information (Note 4) Part Number BAS116LP3-7 Notes: Case X3-DFN0603-2 Packaging 10,000/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html. Marking Information BA BAS116LP3 Document number: DS35241 Rev. 6 - 2 BA = Product Type Marking Code Bar Denotes Cathode Side 1 of 4 www.diodes.com April 2013 © Diodes Incorporated BAS116LP3 Maximum Ratings (@TA = +25°C, unless otherwise specified.) Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Characteristic Symbol VRRM VRWM VR RMS Reverse Voltage VR(RMS) 60 V IFM 215 mA IFRM 500 4.0 1.0 0.5 mA Value 250 Unit mW RθJA 500 TJ, TSTG -65 to +150 C/W °C Forward Continuous Current (Note 5) @ t = 1.0µs @ t = 1.0ms @ t = 1.0s Unit 85 V IFSM A Thermal Characteristics Characteristic Power Dissipation (Note 5) Symbol PD Thermal Resistance Junction to Ambient Air (Note 6) Operating and Storage Temperature Range Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Reverse Breakdown Voltage (Note 6) Symbol Min Typ Max Unit V(BR)R 85 V IR = 100µA Test Condition 0.95 1.10 1.20 1.35 V IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA Forward Voltage VF 0.75 0.9 1.0 1.15 Leakage Current (Note 6) IR 10.0 100 500 nA VR = 75V VR = 1V, TJ = +150°C VR = 75V, TJ = +150°C Total Capacitance CT 1.6 3.0 pF VR = 0, f = 1.0MHz Reverse Recovery Time trr 120 3000 ns IF = IR = 10mA, Irr = 0.1 x IR, RL = 100 5. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com. 6. Short duration pulse test used to minimize self-heating effect. 300 1,000 250 200 150 100 50 0 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Figure 1 Power Derating Curve, Total Package BAS116LP3 Document number: DS35241 Rev. 6 - 2 IF, INSTANTANEOUS FORWARD CURRENT (mA) Notes: PD, POWER DISSIPATION (mW) NEW PRODUCT Repetitive Peak Forward Current Non-Repetitive Peak Forward Surge Current Value 2 of 4 www.diodes.com TA = 150ºC 100 TA = 125ºC T A = 25ºC 10 TA = 85ºC 1 TA = -55ºC 0.1 0 0.4 0.8 1.2 1.6 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 2 Typical Forward Characteristics April 2013 © Diodes Incorporated 100 2.0 f = 1MHz TA = 150ºC CT, TOTAL CAPACITANCE (pF) IR, INSTANTANEOUS REVERSE CURRENT (nA) NEW PRODUCT BAS116LP3 T A = 125ºC 10 T A = 85ºC 1 T A = 25ºC 0.1 0 1.6 1.2 0.8 0.4 TA = -55ºC 0 1 10 100 VR, DC REVERSE VOLTAGE (V) Figure 4 Typical Total Capacitance vs. Reverse Voltage 10 20 30 40 50 60 70 80 90 100 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Figure 3 Typical Reverse Characteristics Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. A A1 (2x) D e E b (2x) X3-DFN0603-2 Dim Min Max Typ A 0.27 0.35 0.30 A1 0.00 0.03 0.02 b 0.19 0.29 0.24 D 0.595 0.645 0.62 E 0.295 0.345 0.32 e 0.355 L 0.14 0.24 0.19 All Dimensions in mm L (2x) Bottom View Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. Z C Dimensions C X Y Z Y (2x) Value (in mm) 0.380 0.230 0.300 0.610 X (2x) BAS116LP3 Document number: DS35241 Rev. 6 - 2 3 of 4 www.diodes.com April 2013 © Diodes Incorporated BAS116LP3 IMPORTANT NOTICE NEW PRODUCT DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2013, Diodes Incorporated www.diodes.com BAS116LP3 Document number: DS35241 Rev. 6 - 2 4 of 4 www.diodes.com April 2013 © Diodes Incorporated