AVX NB21 Ntc smd thermistors with nickel barrier termination nb 21 Datasheet

NTC SMD Thermistors
With Nickel Barrier Termination NB 21
Chip thermistors are high quality and low cost devices
especially developed for surface mounting applications. They
are widely used for temperature compensation but can also
achieve temperature control of printed circuits.
A nickel barrier metallization provides outstanding qualities of
solderability and enables this chip to meet the requirements
of the most severe soldering processes.
NB 21
IEC SIZE : 0603
Types
1.6 (.063) 0.2 (.008)
0.8 (.031)
±0.2 (.008)
DIMENSIONS:
millimeters (inches)
0.8 (.031)
±0.2 (.008)
0.2 (.008) min
0.2 (.008) min
Terminations
Nickel Barrier
Marking
On packaging only
Climatic category
40/125/56
Operating temperature
-55°C to +150°C
Tolerance on Rn (25°C)
±5%, ±10%, ±20%
Maximum dissipation at 25°C
0.07 W
Thermal dissipation factor
1 mW/°C
Thermal time constant
4s
Resistance - Temperature characteristics: pages 36 to 40.
APPLICATIONS
•
•
•
•
•
•
•
•
•
LCD compensation
Battery packs
Mobile phones
CD players
Heating systems
Air-conditioning systems
Temperature control of Switch Mode Power Supplies
Compensation of pressure sensors
Protection of power transistors in various electronic circuits
HOW TO ORDER
14
NB 21
K0
0103
M
BB
Type
Material Code
K
(See tables page 15)
Resistance
10,000 Ω
Tolerance
M (±20%)
J (±5%)
K (±10%)
Suffix: Packaging
– –: Bulk
BB: Cardboard tape
(180mm diam. reel)
BF: Cardboard tape (1/2 reel)
BD: Cardboard tape
(330mm diam. reel)
NTC SMD Thermistors
With Nickel Barrier Termination NB 21
TABLE OF VALUES
NB 21
IEC SIZE : 0603
Types
Rn at 25°C
(Ω)
Material
Code
B (K)
(⌬B/B
(1) ± 5%
(2) ± 3%
)
␣ at 25°C
(%/°C)
NB 21 KC 0 470
NB 21 KC 0 101
NB 21 KC 0 471
47
100
470
KC
3470 ± 5%
– 3.9
NB 21 MC 0 102
1,000
MC
3910 ± 3%
– 4.4
NB 21 J 0 0472
4,700
J
3480 ± 3%
– 3.9
NB 21 J 5 0682
NB 21 J 5 0103
6,800
10,000
J5
3480 ± 3%
3480 ± 3%
– 3.9
– 3.9
NB 21 K 0 0103
NB 21 K 0 0153
10,000
15,000
K
3630 ± 3%
– 4.0
NB 21 L 0 0223
22,000
L
3790 ± 3%
– 4.2
NB 21 M 0 0333
NB 21 M 0 0473
33,000
47,000
M
3950 ± 3%
– 4.4
NB 21 L 2 0683
68,000
L2
3805 ± 3%
– 4.1
NB 21 N 0 0683
68,000
N
4080 ± 3%
– 4.6
NB 21 N 5 0104
100,000
N5
4160 ± 3%
– 4.7
NB 21 P 0 0154
150,000
P
4220 ± 3%
– 4.7
NB 21 Q 0 0334
NB 21 Q 0 0474
330,000
470,000
Q
4300 ± 3%
– 4.7
15
Packaging for Automatic Insertion
NTC Chip Thermistors / NC/NB Series
AUTOMATIC INSERTION
(.008)
Hole ⭋1 (.039) +0.2
-0
Cover Tape
Max
3°
The mechanical and dimensional reel characteristics are in
accordance with the IEC publication 286-3.
5.5 (.217)
±0.2 (.008)
Max
3°
30μ ± 5μ
T
K
Designation
Tape width
Tape thickness
Pitch of the sprocket holes
Diameter of the sprocket holes
Symbol
W
T
P0
D0
Distance
Distance (center to center)
Distance (center to center)
Sizes of the
NC 12 (0805)
cavities
E
F
P2
A0
B0
K
Value
8
0.4 max.
4
1.5
-0
1.75
3.5
2
1.5
2.4
1.4 max.
NC 20 (1206)
A0
B0
K
1.95
3.55
1.5 max.
A1
B1
B0
F
R = 0.3 (.012) Max.
Super 8 Plastic Tape Packaging:
D0
P2
E
P0
Max
3°
Max
3°
A0
Direction of
unreeling
Tolerance
±0.2
±0.1
±0.1
±0.1
±0.05
±0.1
±0.1
±0.1
K ±0.1
(size is adjustable)
(K = t1 +0.2)
±0.1
±0.1
K ±0.1
(size is adjustable)
(K = t1 +0.2)
+0
ø180 (7.09) - 2 (.079)
+ 0.15 (.006)
Reel
ø 62 (2.44)
± 1.5 (.059)
Direction of unreeling
ø 12.75 (.502) - 0
Reel
according to
ISO/DIS 3639-2
8.4 (.331)
14.4 (.567)
max.
+0.15 (.006)
+ 0.5 (.020)
ø 20.5 (.087) - 0
QUANTITY PER REEL
Type
NC - NB 12
NC 20 - NB 20
16
Suffix
BA
BE
BA
BE
Qty Per Reel
4000
2000
3000
1500
W
Upper side
Bottom side
Packaging for Automatic Insertion
NTC Chip Thermistors / NC/NB Series
AUTOMATIC INSERTION
8mm Paper Tape Packaging:
10 PITCHES CUMULATIVE
TOLERANCE ON TAPE
0.20mm (0.008)
P0
The mechanical and dimensional reel characteristics
are in accordance with the IEC publication 286-3.
BOTTOM
COVER
TAPE
D0
T
P2
E1
TOP
COVER
TAPE
F
W
E2
B0
G
T1
T1
Designation
Tape width
Tape thickness
Pitch of the sprocket holes
Diameter of the sprocket holes
Symbol
W
T
P0
Value
8
1.1 max.
4
1.5
-0/+0.1
1.75
3.5
2
0.10 max.
6.25 min.
0.75 min.
4
2
D0
Distance
Distance (center to center)
Distance (center to center)
Cover tape thickness
Distance
Distance
Component pitch
0805/0603
0402
CAVITY SIZE
SEE NOTE 1
A0
CENTER LINES
OF CAVITY
E1
F
P2
T1
E2
G
P1
P1
User Direction of Feed
Tolerance
-.0.1/+0.3
±0.1
±0.1
±0.1
±0.05
±0.05
±0.1
±0.1
+0
ø180 (7.09) - 2 (.079)
+ 0.15 (.006)
Reel
ø 62 (2.44)
± 1.5 (.059)
Direction of unreeling
ø 12.75 (.502) - 0
Reel
according to
ISO/DIS 3639-2
8.4 (.331)
14.4 (.567)
max.
+0.15 (.006)
Upper side
Bottom side
+ 0.5 (.020)
ø 20.5 (.087) - 0
QUANTITY PER REEL
Type
NB - NC 12
NB 21
Suffix
BB
BF
Qty Per Reel
4000
2000
17
Surface Mounting Guide
Chip Thermistor – Application Notes
Wave
STORAGE
300
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
Preheat
Solder Temp.
SOLDERABILITY / LEACHING
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Terminations will resist leaching for at least the immersion
times and conditions recommendations shown below.
P/N
Termination
Type
AgPdPt
Nickel Barrier
NC
NB
Solder
Tin/Lead
60/40
60/40
Solder
Temp ºC
260 ± 5
260 ± 5
T
200
230ºC
to
250ºC
150
100
50
0
Immersion
Time Seconds
15 max
30 ± 1
NB products are compatible with a wide range of soldering
conditions consistent with good manufacturing practice for
surface mount components. This includes Pb free reflow
processes with peak temperatures up to 270ºC.
Recommended profiles for reflow and wave soldering are
shown below for reference.
NC products are recommended for lead soldering application
or gluing techniques.
Natural
Cooling
250
1 to 2 min
3 sec. max
(Preheat chips before soldering)
T/maximum 150°C
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as bright
as with tin-lead pastes and the fillet may not be as large.
b) Resin color may darken slightly due to the increase in
temperature required for the new pastes.
c) Lead-free solder pastes do not allow the same self alignment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
Reflow
300
D2
RECOMMENDED
SOLDERING PAD
LAYOUT
Natural
Cooling
Preheat
Solder Temp.
250
Dimensions in
mm (inches)
220ºC
to
250ºC
150
100
Case
Size
1min
1min
P/N
0402
NB23
0603
NB21
0805
NB12
1206
NB20
10 sec. max
(Minimize soldering time)
Temperature °C
D5
REFLOW SOLDERING
0
D1
D2
D3
D4
D5
1.70
(.067)
2.30
(.091)
3.00
(.118)
4.00
(.157)
0.60
(.024)
0.80
(.031)
1.00
(.039)
1.00
(.039)
0.50
(.020)
0.70
(.028)
1.00
(.039)
2.00
(.079)
0.60
(.024)
0.80
(0.31)
1.00
(.039)
1.00
(.039)
0.50
(.020)
0.75
(.030)
1.25
(.049)
2.50
(.098)
WAVE SOLDERING
50
100
150
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient: 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
18
D3
D4
200
50
300
250
200
150
100
50
0
0
D1
200
250
Time (s)
300
Case
Size
P/N
0603
NB21
0805
NB12
1206
NB20
D1
D2
D3
D4
D5
3.10
(.122)
4.00
(.157)
5.00
(.197)
1.20
(.047)
1.50
(.059)
1.50
(.059)
0.70
(.028)
1.00
(.039)
2.00
(.079)
1.20
(.047)
1.50
(.059)
1.50
(.059)
0.75
(.030)
1.25
(.049)
1.60
(.063)
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