ON NUP5150MU 5-line transient voltage suppressor array Datasheet

NUP5150MU
5-Line Transient Voltage
Suppressor Array
This 5-line transient voltage suppressor array is designed for
applications requiring transient voltage protection capability. It is
intended for use in over-transient voltage and ESD sensitive
equipment such as cell phones, portables, computers, printers and
other applications. This device features a monolithic common anode
design which protects five independent lines in a single
UDFN package. This device is ideal for situations where board space
is at a premium.
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UDFN6 5-LINE TRANSIENT
VOLTAGE SUPPRESSOR
Features
PIN ASSIGNMENT
•Protects up to 5 Lines in a Single UDFN Package
•ESD Rating of Class 3B (Exceeding 8 kV) per Human Body Model
•Compliance with IEC 61000-4-2
•This is a Pb-Free Device
1
6
2
5
3
4
Applications
•Hand Held Portable Applications
•Serial and Parallel Ports
•Notebooks, Desktops, Servers
PIN 1.
2.
3.
4.
5.
6.
CATHODE
ANODE
CATHODE
CATHODE
CATHODE
CATHODE
MAXIMUM RATINGS (TJ = 25°C, unless otherwise specified)
Symbol
Rating
Value
Unit
TJ
Operating Junction Temperature Range
-40 to 125
°C
TSTG
Storage Temperature Range
-55 to 150
°C
TL
Lead Solder Temperature – Maximum
(10 seconds)
260
°C
ESD
Human Body Model (HBM)
IEC 61000-4-2 Contact (ESD)
16000
8000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
MARKING
DIAGRAM
UDFN6
CASE 517AA
5M
G
1
5
M
G
= Specific Device Code
= Month Code
= Pb-Free Package
*Specific Device Code orientation may vary
depending upon manufacturing location.
ORDERING INFORMATION
Device
NUP5150MUTBG
Package
Shipping†
UDFN6
3000/Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2007
September, 2007 - Rev. 0
1
Publication Order Number:
NUP5150/D
NUP5150MU
ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified)
Conditions
Parameter
Reverse Working Voltage
(Note 1)
Breakdown Voltage
IT = 1 mA, (Note 2)
Reverse Leakage Current
Capacitance
Symbol
Min
VRWM
VBR
6.2
VRWM = 3 V
IR
-
VR = 0 V, f = 1 MHz (Line to GND)
CJ
-
Typ
Max
Unit
-
5.0
V
6.8
7.2
V
0.1
mA
15
pF
12
1. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC
or continuous peak operating voltage level.
2. VBR is measured at pulse test current IT.
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2
NUP5150MU
100E-9
TA = 25 °C
12
REVERSE CURRENT (A)
TA = 25°C
10
8
6
4
10E-9
TJ = 125 °C
1.0E-9
100E-12
TJ = 25 °C
10E-12
TJ = -40°C
2
0
0
1
2
4
3
5
1.0E-12
1
6
2
3
4
5
BIAS VOLTAGE (V)
REVERSE VOLTAGE (V)
Figure 1. Capacitance
Figure 2. Typical Reverse Current vs. Reverse
Voltage
1.0
TA = 25 °C
FORWARD CURRENT (A)
TYPICAL CAPACITANCE (pF)
1 MHz FREQUENCY
14
TJ = 125 °C
0.1
TJ = 25 °C
0.01
TJ = -40°C
0.001
0.6
0.8
1.0
1.2
1.4
1.6
FORWARD VOLTAGE (V)
1.8
2.0
Figure 3. Typical Forward Current vs. Forward Voltage
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3
6
NUP5150MU
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA-01
ISSUE B
PIN ONE
REFERENCE
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
A3
b
D
E
e
L
L2
TOP VIEW
2X
0.10 C
(A3)
0.10 C
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.40
0.50
A
10X
0.08 C
6X
5X
6X
0.42
C
A1
1
MOUNTING FOOTPRINT*
SEATING
PLANE
SIDE VIEW
0.22
L
3
L2
6X
0.40
PITCH
b
0.10 C A B
0.05 C
6
4
DIMENSIONS: MILLIMETERS
e
NOTE 3
1.07
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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NUP5150/D
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