4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm Product Features: Applications: Low Cost SMD Package Low ESR Compatible with Leadfree Processing Frequency ILCX07 Series Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 5.0 4 3 1 2 3.2 8 MHz to 150 MHz 1.3 Max. ESR (Equivalent Series Resistance) 8.0 MHz – 9.9 MHz 10.0 MHz – 11.9 MHz 12.0 MHz – 15.9 MHz 16.0 MHz – 19.9 MHz 20.0 MHz – 23.9 MHz 24.0 MHz – 50.0 MHz rd 40.0 MHz – 150.0 MHz (3 O.T.) 100 Max. 80 Max. 60 Max. 50 Max. 40 Max. 30 Max. 80 Max. Shunt Capacitance (C0) 5 pF Max. 1 2 4 3 0.9 1.2 Connection Diagram Frequency Stability over Temperature 30 ppm Standard (see Part Number Guide for more options) 50 ppm Standard (see Part Number Guide for more options) Crystal Cut AT Cut Load Capacitance 18 pF Standard (see Part Number Guide for more options) Drive Level 500 uW Max. Aging 5 ppm Max. / Year Standard Frequency Tolerance @ 25 C 4 3 1 2 Recommended pad layout 2.0 4 3 1 2 1.2 2.2 Temperature 0 C to +70 C Standard (see Part Number Guide for more options) Operating Storage ILCX07 - Dimension Units: mm -40 C to +85 C Standard Part Number Guide Package 3.7 Sample Part Number: ILCX07 - FB1F18 - 20.000 Tolerance (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range Mode (overtone) B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C F = Fundamental F = ±30 ppm F = ±30 ppm 1 = 0°C to +70°C 3 = 3rd overtone G = ±25 ppm G = ±25 ppm 2 = -10°C to +60°C H = ±20 ppm H = ±20 ppm 3 = -20°C to +70°C I = ±15 ppm I = ±15 ppm** 5 = -40°C to +85°C J = ±10 ppm* J = ±10 ppm** Load Capacitance (pF) 18 pF Standard Or Specify 9 = -10°C to +50°C D = -10°C to +105°C* E = -40°C to +105°C* * Not available at all frequencies. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 04/10/12_B Specifications subject to change without notice Page 1 Frequency - 20.000 MHz 4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm ILCX07 Series Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 12 +/-.3 8 +/-.2 5.5 +/-.2 13.5 +/-1 or 12 +/-3 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Date Code (yww) Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 04/10/12_B Specifications subject to change without notice Page 2