AMIC A23L9308-20 524,288 x 8 bit cmos mask rom Datasheet

A23L9308 Series
Preliminary
524,288 X 8 BIT CMOS MASK ROM
Document Title
524,288 X 8 BIT CMOS MASK ROM
Revision History
Rev. No.
0.0
PRELIMINARY
History
Issue Date
Remark
Initial issue
October 2, 2001
Preliminary
(October, 2001, Version 0.0)
AMIC Technology, Inc.
A23L9308 Series
Preliminary
524,288 X 8 BIT CMOS MASK ROM
Features
n 524,288 x 8 bit organization
n Wide power supply range: +2.7V to +3.6V
n Access time: 150ns (max.)/3V~3.6V
200ns (max.)/2.7V~3.3V
n Current: Operating: 15mA (max.)/3V~3.6V
10mA (max.)/2.7V~3.3V
Standby: 25ìA (max.)/3V~3.6V
5ìA (max.)/2.7V~3.3V
n Mask Programmed for Chip Enable (power-down)
CE/ CE , Output Enable OE/ OE /NC
n Three-state outputs for wired-OR expansion
n Full static operation
n All inputs and outputs are directly TTL-compatible
n Available in 32-pin DIP, 32-pin SOP, 32-pin PLCC
packages or in DICE FORM.
General Description
The A23L9308 offers an automatic POWER-DOWN
controlled by the Chip Enable CE/ CE input. When
CE/ CE goes low/high, the device will automatically
POWER-DOWN and remain in a low power STANDBY
mode as long as CE/ CE remains low/high. A23L9308
also offers OE/ OE /NC (Active High or Low or No
Connection), which eliminates bus contention in multiple
bus microprocessor systems.
The A23L9308 high-performance Read Only Memory is
configured as 524,288 x 8 bits. It is designed to be
compatible with all microprocessors and similar
applications where high-performance, large-bit storage,
and
simple
interfacing
are
important
design
considerations. This device is designed for use with
operating voltage from 2.7V to 3.6V.
Pin Configurations
A12
A15
A16
NC
VCC
A18
A17
3
2
1
32
31
30
n PLCC
4
n P-DIP / SOP
1
32
VCC
2
31
A18
A15
3
30
A17
A12
4
29
A14
A7
5
29
A14
A7
5
28
A13
A6
6
28
A13
A6
6
27
A8
A5
7
27
A8
A5
7
26
A9
A4
8
26
A9
A3
9
A10
22
CE/CE
O0
13
21
O7
12
21
O7
O0
13
20
O6
O1
14
19
O5
O2
15
18
O4
GND
16
17
O3
(October, 2001, Version 0.0)
1
20
12
O6
CE/CE
19
23
22
18
11
A0
O5
A1
O4
A10
17
OE/OE/NC
23
O3
24
A0
PRELIMINARY
OE/OE/NC
16
11
24
15
A1
A11
10
A2
O2
10
A11
GND
9
A2
25
25
14
8
A3
A23L9308
O1
A4
A23L9308
NC
A16
AMIC Technology, Inc.
A23L9308 Series
Block Diagram
ROW
MEMORY CELL
DECODER
ARRAY
DRIVER
524,288 X 8
A0 - A18
ADDRESS
INPUTS
COLUMN
DECODER
COLUMN SELECTOR CIRCUITRY
DRIVER
O0
O1
CE/CE
OE/OE/NC
O2
POWER-DOWN
OR
OUTPUT
ENABLE
CIRCUITRY
O3
O4
O5
O6
O7
PRELIMINARY
(October, 2001, Version 0.0)
2
AMIC Technology, Inc.
A23L9308 Series
Pin Descriptions
Pin No.
Symbol
Description
32L DIP/SOP
32L PLCC
2 - 12, 23,
25 - 31
2 - 12, 23,
25 - 31
A0 - A18
Address Inputs
22
22
CE/ CE
Chip Enable Input (Note 1)
24
24
OE/ OE /NC
13 - 15,
17 - 21
13 - 15,
17 - 21
O0 - O7
Data Outputs
32
32
VCC
Power Supply
16
16
GND
Ground
1
1
NC
Output Enable (Note 1)
No Connection (Note 2)
Notes:
1. This pin is user-definable as active high or active low.
2. NC indicates "No Connection."
Recommended DC Operating Conditions
(TA = 0°C to + 70°C)
Symbol
Parameter
Min.
Max.
Unit
VCC
Supply Voltage
2.7
3.6
V
GND
Ground
0
0
V
VIH
Input High Voltage
0.7* VCC
VCC+0.3
V
VIL
Input Low Voltage
- 0.5
0.8
V
PRELIMINARY
(October, 2001, Version 0.0)
3
AMIC Technology, Inc.
A23L9308 Series
Absolute Maximum Ratings*
*Comments
Ambient Operating Temperature . . . . . . . -10°C to + 80°C
Storage Temperature . . . . . . . . . . . . . . -65°C to + 150°C
Supply Voltage to Ground Potential . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to + 7.0V
Output Voltage . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V
Input Voltage . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . 400mW
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may affect
device reliability.
DC Electrical Characteristics (TA = 0°C to + 70°C, GND = 0V)
Symbol
Parameter
3V~3.6V
Min.
Max.
VOH
Output High Voltage
VOL
Output Low Voltage
VlH
Input High Voltage
0.7*VCC
VCC+0.5
VlL
Input Low Voltage
-0.5
0.6
lLI
Input Leakage Current
lLO
Min.
Unit
Conditions
Note
Max.
V
IOH = -0.4mA (3V)
0.4
V
IOL = 1.6mA (3V)
0.7*VCC
VCC+0.5
V
-0.5
0.6
V
+5
+5
µA
VCC = max.
VIN = VCC to GND
Output Leakage Current
+5
+5
µA
VCC = max.
VOUT = VCC to GND
1
ICC
Operating Supply Current
15
10
mA
tCYC = min.
2
ISB
Standby Supply Current (TTL)
0.5
0.3
mA
CE = VIH, CE = VIL
ISB1
Standby Supply Current (CMOS)
25
5
µA
CE = VCC - 0.2V,
CE = 0.2V
PRELIMINARY
(October, 2001, Version 0.0)
2.15
2.7V~3.3V
2.15
0.4
4
AMIC Technology, Inc.
A23L9308 Series
Capacitance
Symbol
Parameter
Min.
Max.
Unit
CI
Input Capacitance
10
pF
CO
Output Capacitance
10
pF
AC Characteristics
Test Conditions
Note
TA = 25°C
f = 1.0MHz
3
(TA = 0°C to +70°C, VCC=3.0V~3.6V for -15, VCC=2.7V~3.3V for -20, GND = 0V)
Symbol
Parameter
A23L9308-15
Min.
Max.
150
A23L9308-20
Min.
Unit
Note
Max.
tCYC
Cycle Time
200
tAA
Address Access Time
150
200
ns
tACE
Chip Enable Access Time
150
200
ns
tAOE
Output Enable Access Time
90
160
ns
tOH
Output Hold after Address Change
10
10
ns
tLZ
Output Low Z Delay
10
10
ns
4, 6
tHZ
Output High Z Delay*
ns
5, 6
70
ns
70
* tHZ is specified from either OE / OE or CE / CE going disabled, whichever occurs first.
Notes:
1. OE/CE = VIL, OE / CE = VIH (Output is unloaded)
2. VIN = VIH/VIL, but OE/CE = VIH, OE / CE = VIL (Output is unloaded)
3. This parameter is periodically sampled and is not 100% tested. All pins, except pins under test, are tied to AC ground.
4. Output LOW impedance delay (tLZ) is measured from CE or OE going active.
5. Output HIGH impedance delay (tHZ) is measured from CE or OE going inactive.
6. This parameter is sampled and not 100% tested.
PRELIMINARY
(October, 2001, Version 0.0)
5
AMIC Technology, Inc.
A23L9308 Series
Timing Waveforms
Propagation Delay from Address (CE/ CE = Active, OE/ OE = Active)
tCYC
ADDRESS
INPUTS
VALID
tAA
tOH
VALID
DATA OUT
Propagation Delay from Chip Enable or Output Enable (Address Valid)
CHIP
ENABLE
VALID
tACE
OUTPUT
ENABLE
VALID
tAOE
tHZ
tLZ
VALID
DATA OUT
tLZ
AC Test Conditions
Applied Voltage
2.7V~3.6V
Input Pulse Levels
0.4V to 2.4V
Input Rise and Fall Time
10 ns
VIN = 1.5V
VOUT = 1.5V
Timing Measurement Reference Level
Output Load
PRELIMINARY
1 TTL gate and CL = 100pF
(October, 2001, Version 0.0)
6
AMIC Technology, Inc.
A23L9308 Series
Function Table
CE/ CE
OE/ OE /NC
O0 - O7
Mode
A
A
Data Out
Read
I
X
Hi - Z
Power-down
A
I
Hi - Z
Output Disable
1. CE/ CE and OE/ OE /NC are mask programmable as either active low, active high, or no connection.
2. "A" means "Active," "I" means "Inactive," and "X" means "Either."
Ordering Information
Part No.
Access Time (ns)
Package
A23L9308-15
150
32L DIP
A23L9308M-15
150
32L SOP
A23L9308L-15
150
32L PLCC
A23L9308H-15
150
DICE FORM
A23L9308-20
200
32L DIP
A23L9308M-20
200
32L SOP
A23L9308L-20
200
32L PLCC
A23L9308H-20
200
DICE FORM
PRELIMINARY
(October, 2001, Version 0.0)
7
AMIC Technology, Inc.
A23L9308 Series
A17
32
31 30
A11
A18
33
29 28
27
26
17 18 19 20
21 22 23
24
25
OE/OE/NC
VCC
1
A9
VCC
2
A10
A16
3
A8
A15
4
CE/CE
A12
5
A13
A7
6
A14
A6
7
O6
A5
8
GND
A4
Pad Configurations
Y
X
O7
O5
O4
GND
O2
O1
A0
13 14 15 16
O0
11 12
A1
10
A2
A3
9
O3
(0,0)
Pad Location
Pad No.
Pad Name
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
VCC
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
GND
GND
PRELIMINARY
Coordinate (um)
X
Y
-73.6
1406.3
-259.9
1419.2
-409.9
1419.2
-532.9
1419.2
-682.9
1419.2
-805.9
1419.2
-955.9
1419.2
-1078.9
1419.2
-1079.3
-1419.7
-956.3
-1419.2
-806.3
-1419.2
-683.3
-1419.2
-529.3
-1419.7
-406.3
-1419.7
-254.8
-1419.7
-131.8
-1419.7
-8.8
-1417.7
(October, 2001, Version 0.0)
8
Pad No.
Pad Name
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
O3
O4
O5
O6
O7
CE/ CE
A10
OE/ OE /NC
A11
A9
A8
A13
A14
A17
A18
VCC
Coordinate (um)
X
Y
138.7
-1419.7
261.7
-1419.7
413.2
-1419.7
536.2
-1419.7
687.7
-1419.7
810.7
-1419.2
960.7
-1419.2
1083.7
-1419.2
1083.3
1419.2
960.3
1419.2
810.3
1419.2
687.3
1419.2
537.3
1419.2
414.3
1419.2
264.3
1419.2
97.1
1417.7
AMIC Technology, Inc.
A23L9308 Series
Package Information
P-DIP 32L Outline Dimensions
unit: inches/mm
D
17
1
16
E
32
A1
A2
Base Plane
L
A
C
E1
Seating Plane
B
Symbol
θ
e
B1
Dimensions in inches
Min
Nom
Max
EA
Dimensions in mm
Min
Nom
Max
A
-
-
0.210
-
-
5.334
A1
0.015
-
-
0.381
-
-
A2
0.149
0.154
0.159
3.785
3.912
4.039
B
-
0.018
-
-
0.457
-
B1
-
0.050
-
-
1.270
-
C
D
1.645
0.010
1.650
1.655
41.783
0.254
41.91
42.037
E
0.537
0.542
0.547
13.64
13.767
13.894
E1
0.590
0.600
0.610
14.986
15.240
15.494
EA
0.630
0.650
0.670
16.002
16.510
17.018
e
-
0.100
-
-
2.540
-
L
0.120
0.130
0.140
3.048
3.302
3.556
θ
0°
-
15°
0°
-
15°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
PRELIMINARY
(October, 2001, Version 0.0)
9
AMIC Technology, Inc.
A23L9308 Series
Package Information
SOP (W.B.) 32L Outline Dimensions
unit: inches/mm
HE
17
E
32
θ
L
1
b
16
Detail F
D
Seating Plane
LE
A1
e
S
A
A2
c
D
y
See Detail F
Dimensions in inches
Dimensions in mm
Symbol
Min
Nom
Max
Min
Nom
Max
A
-
-
0.118
-
-
3.00
A1
0.004
-
-
0.10
-
-
A2
0.101
0.106
0.111
2.57
2.69
2.82
b
0.014
0.016
0.020
0.36
0.41
0.51
c
0.006
0.008
0.012
0.15
0.20
0.31
D
-
0.805
0.817
-
20.45
20.75
E
0.440
0.445
0.450
11.18
11.30
11.43
e
0.044
0.050
0.056
1.12
1.27
1.42
HE
0.546
0.556
0.566
13.87
14.12
14.38
0.99
L
0.023
0.031
0.039
0.58
0.79
LE
0.047
0.055
0.063
1.19
1.40
1.60
S
-
-
0.036
-
-
0.91
y
-
-
0.004
-
-
0.10
θ
0°
-
10°
0°
-
10°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(October, 2001, Version 0.0)
10
AMIC Technology, Inc.
A23L9308 Series
Package Information
PLCC 32L Outline Dimension
unit: inches/mm
HD
D
13
5
E
1
HE
4
14
32
20
30
29
c
A1
b
e
L
A
A2
21
b1
D
GE
GD
y
θ
Dimensions in inches
Symbol
Dimensions in mm
Min
Nom
Max
Min
Nom
Max
A
-
-
0.134
-
-
3.40
A1
0.0185
-
-
0.47
-
-
A2
0.105
0.110
0.115
2.67
2.80
2.93
b1
0.026
0.028
0.032
0.66
0.71
0.81
b
0.016
0.018
0.021
0.41
0.46
0.54
C
0.008
0.010
0.014
0.20
0.254
0.35
D
0.547
0.550
0.553
13.89
13.97
14.05
E
0.447
0.450
0.453
11.35
11.43
11.51
e
0.044
0.050
0.056
1.12
1.27
1.42
GD
0.490
0.510
0.530
12.45
12.95
13.46
GE
0.390
0.410
0.430
9.91
10.41
10.92
HD
0.585
0.590
0.595
14.86
14.99
15.11
HE
0.485
0.490
0.495
12.32
12.45
12.57
L
0.075
0.090
0.095
1.91
2.29
2.41
y
-
-
0.003
-
-
0.075
θ
0°
-
10°
0°
-
10°
Notes:
1. Dimensions D and E do not include resin fins.
2. Dimensions GD & GE are for PC Board surface mount pad pitch
design reference only.
PRELIMINARY
(October, 2001, Version 0.0)
11
AMIC Technology, Inc.
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