Foshan MMBT3906 Silicon pnp transistor in a sot-23 plastic package Datasheet

MMBT3906
Rev.F Apr.-2017
描述
/
DATA SHEET
Descriptions
SOT-23 塑封封装 PNP 半导体三极管。Silicon PNP transistor in a SOT-23 Plastic Package.

特征
/ Features
高 hFE,低 VCE(sat)。
High DC Current Gain, Low Collector to Emitter Saturation Voltage.

用途
/
Applications
用于普通放大及开关。
General purpose amplifier and switching.

内部等效电路
引脚排列
/ Equivalent Circuit
/ Pinning
3
1
2
PIN 1:Base
放大及印章代码
hFE Range
PIN 2:Emitter
PIN 3:Collector
/ hFE Classifications & Marking
100~300
Marking
http://www.fsbrec.com
H2A
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MMBT3906
Rev.F Apr.-2017
极限参数
/
DATA SHEET
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
符号
Symbol
Collector to Base Voltage
VCBO
数值
Rating
-40
Collector to Emitter Voltage
VCEO
-40
V
Emitter to Base Voltage
VEBO
-5.0
V
Collector Current
IC
-200
mA
Collector Power Dissipation
PC
300
mW
Junction Temperature
Tj
150
℃
Tstg
-55~150
℃
Storage Temperature Range
电性能参数
单位
Unit
V
/ Electrical Characteristics(Ta=25℃)
参数
Parameter
Collector to Base Breakdown
Voltage
Collector to Emitter Breakdown
Voltage
Emitter to Base Breakdown
Voltage
符号
Symbol
测试条件
Test Conditions
最小值 典型值 最大值 单位
Min
Typ
Max
Unit
VCBO
IC=-10μA
IE=0
-40
V
VCEO
IC=-1.0mA
IB=0
-40
V
VEBO
IE=-10μA
IC=0
-5.0
V
Collector Cut-Off Current
ICBO
VCB=-30V
IE=0
-0.05
μA
Emitter Cut-Off Current
IEBO
VEB=-3.0V
IC=0
μA
hFE(1)
VCE=-1.0V
IC=-10mA
100
-0.05
300
hFE(2)
VCE=-1.0V
IC=-100mA
30
hFE(3)
VCE=-1.0V
IC=-50mA
60
hFE(4)
VCE= -1.0V
IC=-1.0mA
80
hFE(5)
VCE=-1.0V
IC=-0.1mA
60
VCE(sat) (1)
IC=-10mA
IB=-1.0mA
-0.25
V
VCE(sat) (2)
IC=-50mA
IB=-5.0mA
-0.4
V
VBE(sat) (1)
IC=-10mA
IB=-1.0mA
-0.85
V
VBE(sat) (2)
IC=-50mA
IB=-5.0mA
-0.95
V
fT
VCE=-20V
f=100MHz
IC=-10mA
DC Current Gain
Collector-Emitter Saturation
voltage
Base-Emitter Saturation Voltage
Transition Frequency
http://www.fsbrec.com
-0.65
250
MHz
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MMBT3906
Rev.F Apr.-2017
电性能参数
DATA SHEET
/ Electrical Characteristics(Ta=25℃)
参数
Parameter
Output Capacitance
Storage Time
符号
Symbol
Cob
tstg
Fall Time
tf
Delay Time
td
Rise Time
tr
Input Capacitance
http://www.fsbrec.com
Cib
测试条件
Test Conditions
VCB=-5.0V f=1.0MHz
VCC=-3.0V IC=-10mA
IB1=-IB2=-1.0mA
VCC=-3.0V IC=-10mA
IB1=-IB2=-1.0mA
VCC=-3.0V VBE=-0.5V
IB1=-1.0mA
IC=-10mA
VCC=-3.0V VBE=-0.5V
IB1=-1.0mA
IC=-10mA
f=1.0MHz
VEB=-0.5V
最小值 典型值 最大值 单位
Min
Typ
Max
Unit
4.5
pF
225
ns
75
ns
35
ns
35
ns
10
pF
3/7
MMBT3906
Rev.F Apr.-2017
电参数曲线图
DATA SHEET
/ Electrical Characteristic Curve
http://www.fsbrec.com
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MMBT3906
Rev.F Apr.-2017
外形尺寸图
DATA SHEET
/ Package Dimensions
http://www.fsbrec.com
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MMBT3906
Rev.F Apr.-2017
印章说明
/
DATA SHEET
Marking Instructions
H2A
说明:
H: 
为公司代码
2A: 
为型号代码
Note:
H:
Company Code
2A:
Product Type Code
http://www.fsbrec.com
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MMBT3906
Rev.F Apr.-2017
DATA SHEET
回流焊温度曲线图(无铅)
/
Temperature Profile for IR Reflow Soldering(Pb-Free)
说明:
Note:
1、预热温度 25~150℃,时间 60~90sec;
1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 245±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:245±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件
/
Resistance to Soldering Heat Test Conditions
温度:260±5℃
包装规格
Time:10±1 sec
/ REEL
Package Type
封装形式
使用说明
Temp.:260±5℃
/ Packaging SPEC.
卷盘包装
SOT-23
时间:10±1 sec.
Units 包装数量
Dimension
Units/Reel
只/卷盘
Reels/Inner Box
卷盘/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
3,000
10
30,000
6
180,000
包装尺寸
3
(unit:mm )
Reel
Inner Box 盒
Outer Box 箱
7〞×8
180×120×180
390×385×205
/ Notices
http://www.fsbrec.com
7/7
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