Surface Mount PTC FSMD Series FUZETEC Application: All high-density boards Product Features: Small surface mount, Solid state Faster time to trip than standard SMD devices Lower resistance than standard SMD devices Operation Current: 140mA~1.6A Maximum Voltage: 6V~60V Temperature Range: -40 to 85 Agency Approvals: UL(E211981), C-ULTUV pending Electrical Characteristics(23) Part Number FSMD014 FSMD020 FSMD035 FSMD050 FSMD075 FSMD110 FSMD160 Hold Trip Rated Max Typical Max Time to Trip Current Current Voltage Current Power Current Time IH,A 0.14 0.20 0.35 0.50 0.75 1.10 1.60 IT,A 0.30 0.40 0.70 1.00 1.50 2.20 3.20 VMAX,Vdc IMAX, A Pd, W 60 10 0.8 30 10 0.8 16 40 0.8 16 40 0.8 16 40 0.8 6 40 0.8 6 40 0.8 Amp 8.0 8.0 8.0 8.0 8.0 8.0 8.0 Sec 0.02 0.02 0.10 0.15 0.02 0.30 0.5 Resistance Tolerance RMIN R1MAX Ω 1.50 0.80 0.32 0.15 0.11 0.04 0.03 Ω 6.50 5.00 1.50 1.00 0.45 0.21 0.10 IH=Hold current-maximum current at which the device will not trip at 23still air. IT=Trip current-minimum current at which the device will always trip at 23 still air. V MAX=Maximum voltage device can withstand without damage at it rated current.(I max) I MAX= Maximum fault current device can withstand without damage at rated voltage (V max). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23 still air environment. RMIN=Minimum device resistance at 23 prior to tripping. R1MAX=Maximum device resistance at 23 measured 1 hour post trip. Termination pad characteristics Termination pad materials : solder-plated copper 1 DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2 Surface Mount PTC FSMD Series FUZETEC FSMD Product Dimensions (Millimeters) PART NUMBER FSMD014 FSMD020 FSMD035 FSMD050 FSMD075 FSMD110 FSMD160 A Min 4.37 4.37 4.37 4.37 4.37 4.37 4.37 B Max 4.73 4.73 4.73 4.73 4.73 4.73 4.73 Min 3.07 3.07 3.07 3.07 3.07 3.07 3.07 C Max 3.41 3.41 3.41 3.41 3.41 3.41 3.41 Min 0.7 0.4 0.4 0.4 0.4 0.4 0.4 Max 1.0 0.7 0.7 0.7 0.7 0.7 0.7 D Min 0.35 0.35 0.35 0.35 0.35 0.35 0.35 Thermal Derating Curve Thermal Derating Curve, FSMD Series Percent of Rated Hold and Trip Current 200% 150% 100% 50% A= FSMD 075, 100 &160 B= FSMD 014, 020, 035 0% & 050 -40 -20 0 20 40 60 80 Ambient Temperature (C) 2 DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2 Surface Mount PTC FSMD Series FUZETEC Typical Time-To-Trip at 23 A =FSMD014 B =FSMD020 C =FSMD035 D =FSMD050 E =FSMD075 F =FSMD110 G =FSMD160 A B C DE F G 100 Time-to-trip (S) 10 1 0.1 0.01 0.001 0.1 1 10 100 Fault current (A) Part Numbering System Part Marking System FSMD F110 F Part Identification Current rating Example Fuzetec Logo Standard Package P/N Pcs /Bag Reel/Tape FSMD014 -------- 2K FSMD020 -------- 2K FSMD035 -------- 2K FSMD050 -------- 2K P/N Pcs /Bag Reel/Tape FSMD075 -------- 2K FSMD110 -------- 2K FSMD160 -------- 2K 3 DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2 Surface Mount PTC FSMD Series FUZETEC Pad LayoutsSolder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each FSMD device Pad dimensions(millimeters) Device FSMD014 FSMD020 FSMD035 FSMD050 FSMD075 FSMD110 FSMD160 A Nominal 3.45 3.45 3.45 3.45 3.45 3.45 3.45 B Nominal 1.78 1.78 1.78 1.78 1.78 1.78 1.78 C Nominal 3.15 3.15 3.15 3.15 3.15 3.15 3.15 Solder reflow 1Recommended reflow methods; IR , vapor phase oven, hot air oven. 2The FSMD014FSMD020 FSMD035 FSMD050 FSMD075FSMD110 and FSMD160 devices are suitable for use with wave-solder application methods. 3Recommended maximum paste thickness is 0.25mm. 4Devices can be cleaned using standard industry methods and solvents. CAUTION: If reflow temperatures exceed the recommended Profile, devices may not meet the performance requirements. Rework: Use standard industry practices. 4 DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2