ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 12/10/8-Bit, 2MSPS, Dual-Channel, Unipolar, Pseudo-Differential, Ultralow-Power SAR Analog-to-Digital Converters Check for Samples: ADS7947 , ADS7948, ADS7949 FEATURES DESCRIPTION • • • The ADS7947/8/9 are 12-bit, 10-bit, and 8-bit 2MSPS analog-to-digital converters (ADCs), respectively. Devices operate at 2MSPS sample rate with a standard 16 clock data frame. In addition, it is possible to operate the ADS7947 (12-bit) at 2.1MSPS, the ADS7948 (10-bit) at 2.57MSPS, and the ADS7949 (8-bit) at 3MSPS with a short data frame optimized for the number of clocks sufficient for conversion with no drop in performance. The devices feature both outstanding dc precision and excellent dynamic performance, this family of pin-compatible devices includes a two-channel input multiplexer and a low-power successive approximation register (SAR) ADC with an inherent sample-and-hold (S/H) input stage. 1 23 • • • • • Sample Rate: 2MSPS Pin-Compatible Family: 12/10/8-Bit Outstanding Performance: – No Missing Codes – INL: 1LSB (max) – SNR: 72dB (min) Low Power: – 7.5mW at 2MSPS Operation – Auto Power-Down at Lower Speeds: – 3.8mW at 500kSPS – 0.8mW at 100kSPS – 0.16mW at 20kSPS Wide Supply Range: – Analog: 2.7V to 5.5V – Digital: 1.65V to AVDD Simple Serial Interface (SPI) Fully Specified from –40°C to +125°C Tiny Footprint: 3mm × 3mm QFN The ADS7947/8/9 support a wide analog supply range that allows the full-scale input range to extend to 5V. A simple SPI™, with a digital supply that can operate as low as 1.65V, allows for easy interfacing to a wide variety of digital controllers. Automatic power-down can be enabled when operating at slower speeds to dramatically reduce power consumption. APPLICATIONS • • • • • Offered in a tiny 3mm × 3mm QFN package, the ADS7947/8/9 are fully specified over the extended temperature range of –40°C to +125°C and are suitable for a wide variety of data acquisition applications where high performance, low power, and small size are key. Communication Systems Optical Networking Medical Instrumentation Battery-Powered Equipment Data Acquisition Systems AVDD REF REFGND DVDD PDEN AIN0P AIN0N CS MUX S/H SAR ADC SPI SCLK SDO AIN1P AIN1N CH SEL GND 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SPI is a trademark of Motorola. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. FAMILY AND ORDERING INFORMATION (1) (1) PRODUCT RESOLUTION (Bits) INPUT SAMPLE RATE (MSPS) ADS7947 12 Unipolar, pseudo-differential 2 ADS7948 10 Unipolar, pseudo-differential 2 ADS7949 8 Unipolar, pseudo-differential 2 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. ADS7947, ADS7948, ADS7949 MIN MAX AINxP to GND or AINxN to GND –0.3 AVDD + 0.3 V AVDD to GND or DVDD to GND –0.3 +7 V Digital input voltage to GND –0.3 DVDD + 0.3 V Digital output to GND –0.3 DVDD + 0.3 V Operating temperature range –40 +125 °C Storage temperature range –65 +150 °C (1) UNIT Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under electrical characteristics is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION ADS7947/48/49 THERMAL METRIC (1) RTE UNITS 16 PINS qJA Junction-to-ambient thermal resistance 54.3 qJCtop Junction-to-case (top) thermal resistance 53.7 qJB Junction-to-board thermal resistance 19.2 yJT Junction-to-top characterization parameter 0.3 yJB Junction-to-board characterization parameter 14.5 qJCbot Junction-to-case (bottom) thermal resistance 5.2 (1) 2 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 ELECTRICAL CHARACTERISTICS: ADS7947 (12-Bit) Minimum/maximum specifications at AVDD = 2.7V to 5.5V, DVDD = 1.65V to AVDD, TA = –40°C to +125°C, and fSAMPLE = 2MSPS, unless otherwise noted. Typical specifications at AVDD = 3V, DVDD = 1.8V, TA = +25°C, and fSAMPLE = 2MSPS. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS ANALOG INPUT Full-scale input span (1) AINxP – AINxN Absolute input range 0 VREF V AIN0P, AIN1P –0.2 AVDD + 0.2 V AIN0N, AIN1N –0.2 Input capacitance (2) Input leakage current At +125°C 0.2 V 32 pF 1.5 nA 12 Bits SYSTEM PERFORMANCE Resolution No missing codes 12 Integral linearity –1 ±0.3 1 LSB (3) Bits Differential linearity –1 ±0.3 1 LSB Offset error (4) –1 ±0.3 1 LSB Gain error –1 ±0.3 1 LSB 25 µVRMS Transition noise Power-supply rejection 60 dB SAMPLING DYNAMICS Conversion time Acquisition time 13.5 SCLK 2 MSPS 2.1 MSPS 80 Maximum sample rate (throughput rate) ns 34MHz SCLK with a 16-clock frame 34MHz SCLK and CS low for 13.5 clocks Aperture delay 5 ns Aperture jitter 10 ps Step response 80 ns Overvoltage recovery 80 ns –85 dB DYNAMIC CHARACTERISTICS Total harmonic distortion (THD) (5) 100kHz Signal-to-noise ratio (SNR) 100kHz 73 dB Signal-to-noise and distorion ratio (SINAD) 100kHz 72.75 dB Spurious-free dynamic range (SFDR) 100kHz 86 dB Full-power bandwidth At –3dB 15 MHz 72 DIGITAL INPUT/OUTPUT Logic family CMOS VIH Logic level Input leakage current 0.7DVDD VIL 0.3DVDD VOH ISOURCE = 200µA VOL ISINK = 200µA IIH, IIL 0 < VIN < DVDD DVDD – 0.2 External reference (1) (2) (3) (4) (5) V V 0.4 V ±20 2.5 V nA AVDD V Ideal input span; does not include gain or offset error. Refer to Figure 39 for sampling circuit details. LSB means Least Significant Bit. Measured relative to an ideal full-scale input. Calculated on the first nine harmonics of the input frequency. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 3 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS: ADS7947 (12-Bit) (continued) Minimum/maximum specifications at AVDD = 2.7V to 5.5V, DVDD = 1.65V to AVDD, TA = –40°C to +125°C, and fSAMPLE = 2MSPS, unless otherwise noted. Typical specifications at AVDD = 3V, DVDD = 1.8V, TA = +25°C, and fSAMPLE = 2MSPS. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS AVDD 2.7 3.3 5.5 V DVDD 1.65 3.3 AVDD V POWER-SUPPLY REQUIREMENTS IDYNAMIC AVDD supply current ISTATIC DVDD supply current (6) Power-down state AVDD supply current AVDD = 3.3V, fSAMPLE = 2MSPS 2.5 AVDD = 5V, fSAMPLE = 2MSPS mA 3 AVDD = 3.3V, SCLK off 3.5 1.8 AVDD = 5V, SCLK off 1.9 DVDD = 3.3V, SCLK = 34MHz, SDO load 20pF 500 mA mA 2.5 mA µA IPD-DYNAMIC SCLK = 34MHz 550 µA IPD-STATIC SCLK off 2.5 µA 1 µs +125 °C Power-up time TEMPERATURE RANGE Specified performance (6) 4 –40 DVDD consumes only dynamic current. IDVDD = CLOAD × DVDD × number of 0→1 transitions in SDO × fSAMPLE. This is a load-dependent current and there is no DVDD current when the output is not toggling. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 ELECTRICAL CHARACTERISTICS: ADS7948 (10-Bit) Minimum/maximum specifications at AVDD = 2.7V to 5.5V, DVDD = 1.65V to AVDD, TA = –40°C to +125°C, and fSAMPLE = 2MSPS, unless otherwise noted. Typical specifications at AVDD = 3V, DVDD = 1.8V, TA = +25°C, and fSAMPLE = 2MSPS. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS ANALOG INPUT Full-scale input span (1) AINxP – AINxN Absolute input range 0 VREF V AIN0P, AIN1P –0.2 AVDD + 0.2 V AIN0N, AIN1N –0.2 Input capacitance (2) Input leakage current At +125°C 0.2 V 32 pF 1.5 nA 10 Bits SYSTEM PERFORMANCE Resolution No missing codes 10 Bits Integral linearity –0.5 ±0.15 0.5 LSB (3) Differential linearity –0.5 ±0.15 0.5 LSB Offset error (4) –0.5 ±0.15 0.5 LSB Gain error –0.5 ±0.15 0.5 LSB 25 µVRMS Transition noise Power-supply rejection 60 dB SAMPLING DYNAMICS Conversion time Acquisition time 10.5 SCLK 2 MSPS 2.57 MSPS 80 Maximum sample rate (throughput rate) ns 34MHz SCLK in 16-clock frame 34MHz SCLK and CS low for 10.5 clocks Aperture delay 5 ns Aperture jitter 10 ps Step response 80 ns Overvoltage recovery 80 ns –80 dB DYNAMIC CHARACTERISTICS Total harmonic distortion (THD) (5) 100kHz Signal-to-noise ratio (SNR) 100kHz Signal-to-noise and distortion ratio (SINAD) 100kHz 61 Spurious-free dynamic range (SFDR) 100kHz 81 dB Full-power bandwidth At –3dB 15 MHz 61 dB dB DIGITAL INPUT/OUTPUT Logic family CMOS VIH Logic level Input leakage current 0.7DVDD VIL 0.3DVDD VOH ISOURCE = 200µA VOL ISINK = 200µA IIH, IIL 0 < VIN < DVDD DVDD – 0.2 External reference (1) (2) (3) (4) (5) V V 0.4 V ±20 2.5 V nA AVDD V Ideal input span; does not include gain or offset error. Refer to Figure 39 for sampling circuit details. LSB means Least Significant Bit. Measured relative to an ideal full-scale input. Calculated on the first nine harmonics of the input frequency. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 5 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS: ADS7948 (10-Bit) (continued) Minimum/maximum specifications at AVDD = 2.7V to 5.5V, DVDD = 1.65V to AVDD, TA = –40°C to +125°C, and fSAMPLE = 2MSPS, unless otherwise noted. Typical specifications at AVDD = 3V, DVDD = 1.8V, TA = +25°C, and fSAMPLE = 2MSPS. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS AVDD 2.7 3.3 5.5 V DVDD 1.65 3.3 AVDD V POWER-SUPPLY REQUIREMENTS IDYNAMIC AVDD supply current ISTATIC DVDD supply current (6) Power-down state AVDD supply current AVDD = 3.3V, fSAMPLE = 2MSPS 2.5 AVDD = 5V, fSAMPLE = 2MSPS mA 3 AVDD = 3.3V, SCLK off 3.5 1.8 AVDD = 5V, SCLK off 1.9 DVDD = 3.3V, SCLK = 34MHz, SDO load 20pF 500 mA mA 2.5 mA µA IPD-DYNAMIC SCLK = 34MHz 550 µA IPD-STATIC SCLK off 2.5 µA 1 µs +125 °C Power-up time TEMPERATURE RANGE Specified performance (6) 6 –40 DVDD consumes only dynamic current. IDVDD = CLOAD × DVDD × number of 0→1 transitions in SDO × fSAMPLE. This is a load-dependent current and there is no DVDD current when the output is not toggling. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 ELECTRICAL CHARACTERISTICS: ADS7949 (8-Bit) Minimum/maximum specifications at AVDD = 2.7V to 5.5V, DVDD = 1.65V to AVDD, TA = –40°C to +125°C, and fSAMPLE = 2MSPS, unless otherwise noted. Typical specifications at AVDD = 3V, DVDD = 1.8V, TA = +25°C, and fSAMPLE = 2MSPS. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS ANALOG INPUT Full-scale input span (1) AINxP – AINxN Absolute input range 0 VREF V AIN0P, AIN1P –0.2 AVDD + 0.2 V AIN0N, AIN1N –0.2 Input capacitance (2) Input leakage current At +125°C 0.2 V 32 pF 1.5 nA 8 Bits SYSTEM PERFORMANCE Resolution No missing codes 8 Bits Integral linearity –0.3 ±0.06 0.3 LSB (3) Differential linearity –0.3 ±0.06 0.3 LSB Offset error (4) –0.3 ±0.06 0.3 LSB Gain error –0.3 ±0.06 0.3 LSB 25 µVRMS Transition noise Power-supply rejection 60 dB SAMPLING DYNAMICS Conversion time 8.5 SCLK 34MHz SCLK in 16-clock frame 2 MSPS 34MHz SCLK and CS low for 8.5 clocks 3 MSPS 5 ns Acquisition time 80 Maximum sample rate (throughput rate) ns Aperture delay Aperture jitter 10 ps Step response 80 ns Overvoltage recovery 80 ns –80 dB DYNAMIC CHARACTERISTICS Total harmonic distortion (THD) (5) 100kHz Signal-to-noise ratio (SNR) 100kHz Signal-to-noise and distortion ratio (SINAD) 100kHz 49 Spurious-free dynamic range (SFDR) 100kHz 81 dB Full-power bandwidth At –3dB 15 MHz 49 dB dB DIGITAL INPUT/OUTPUT Logic family CMOS VIH Logic level Input leakage current 0.7DVDD VIL 0.3DVDD VOH ISOURCE = 200µA VOL ISINK = 200µA IIH, IIL 0 <VIN < DVDD DVDD – 0.2 External reference (1) (2) (3) (4) (5) V V 0.4 V ±20 2.5 V nA AVDD V Ideal input span; does not include gain or offset error. Refer to Figure 39 for sampling circuit details. LSB means Least Significant Bit. Measured relative to an ideal full-scale input. Calculated on the first nine harmonics of the input frequency. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 7 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS: ADS7949 (8-Bit) (continued) Minimum/maximum specifications at AVDD = 2.7V to 5.5V, DVDD = 1.65V to AVDD, TA = –40°C to +125°C, and fSAMPLE = 2MSPS, unless otherwise noted. Typical specifications at AVDD = 3V, DVDD = 1.8V, TA = +25°C, and fSAMPLE = 2MSPS. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS AVDD 2.7 3.3 5.5 V DVDD 1.65 3.3 AVDD V POWER-SUPPLY REQUIREMENTS IDYNAMIC AVDD supply current ISTATIC DVDD supply current (6) Power-down state AVDD supply current AVDD = 3.3V, fSAMPLE = 2MSPS 2.5 AVDD = 5V, fSAMPLE = 2MSPS mA 3 AVDD = 3.3V, SCLK off 3.5 1.8 AVDD = 5V, SCLK off 1.9 DVDD = 3.3V, SCLK = 34MHz, SDO load 20pF 500 mA mA 2.5 mA µA IPD-DYNAMIC SCLK = 34MHz 550 µA IPD-STATIC SCLK off 2.5 µA 1 µs +125 °C Power-up time TEMPERATURE RANGE Specified performance (6) 8 –40 DVDD consumes only dynamic current. IDVDD = CLOAD × DVDD × number of 0→1 transitions in SDO × fSAMPLE. This is a load-dependent current and there is no DVDD current when the output is not toggling. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 TIMING DIAGRAM Sample N Sample N+1 1/fSAMPLE tACQ tCONV CS tSU1 SCLK 1 tWH 2 3 tD1 SDO D11 4 5 6 7 D9 8 9 10 tW1 tD4 11 12 13 14 15 16 tD3 tD2 tH1 D10 tWL D8 D7 D6 D5 D4 D3 D2 D1 D0 Data from Sample N-1 TIMING REQUIREMENTS All specifications at DVDD = 1.65V to AVDD and TA = –40°C to +125°C, unless otherwise noted. TEST CONDITIONS (1) PARAMETER tCONV tACQ Conversion time MAX UNIT ADS7947 (12-bit) 13.5 SCLK ADS7948 (10-bit) 10.5 SCLK ADS7949 (8-bit) 8.5 SCLK Acquisition time fSAMPLE Sample rate (throughput rate) SCLK = 34MHz 2.1 MSPS SCLK = 34MHz 2.57 MSPS ADS7949 (8-bit) SCLK = 34MHz 3 MSPS 25 ns DVDD = 1.8V 14.5 ns DVDD = 3V 12.5 ns DVDD = 5V 8.5 ns DVDD = 1.8V 3.5 ns DVDD = 3V 3.5 ns DVDD = 5V 3.5 ns DVDD = 1.8V tH1 Delay time, SCLK falling to SDO Hold time, SCLK falling to data valid 11 ns DVDD = 3V 9 ns DVDD = 5V 7.1 ns DVDD = 1.8V 4 ns DVDD = 3V 3 ns DVDD = 5V 2 ns DVDD = 1.8V tD3 Delay time, CS high to SDO 3-state 15 ns DVDD = 3V 12.5 ns DVDD = 5V 8.5 ns tD4 Delay time CS rising edge from conversion end (refer to the tCONV specification for conversion time) 10 tWH Pulse duration, SCLK high 11 tW1 Pulse duration, SCLK low 11 SCLK frequency 0.4 tPDSU Setup time, PDEN high to CS rising edge (refer to Figure 50 and Figure 51) tPDH Hold time, CS rising edge to PDEN falling edge (refer to Figure 50) (1) (2) MSPS ADS7948 (10-bit) Setup time, CS low to first rising edge of SCLK tD2 (2) 2 ADS7947 (12-bit) Delay time, CS low to first data (D0-15) out tSU1 ns SCLK = 34MHz, 16 clock frame Pulse width CS high tD1 TYP 80 fSAMPLE MAX = 1/( tCONV MAX + tACQ MIN) tW1 MIN ns ns ns 34 40 2 20 MHz ns ns 1.8V specifications apply from 1.65V to 2V; 3V specifications apply form 2.7V to 3.6V; 5V specifications apply from 4.75V to 5.25V. With 50pF load. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 9 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com PIN CONFIGURATION DVDD SDO SCLK CS 16 15 14 13 RTE PACKAGE QFN-16 (TOP VIEW) REF 3 10 NC REFGND 4 9 NC 8 CH SEL AIN1P 11 7 2 AIN1N AVDD 6 PDEN AIN0N 12 5 1 AIN0P GND PIN FUNCTIONS PIN NO. PIN NAME FUNCTION 1 GND Analog/digital 2 AVDD Analog ADC power supply 3 REF Analog ADC positive reference input; decouple this pin with REFGND 4 REFGND Analog Reference return; short to analog ground plane 5 AIN0P Analog input Positive analog input, channel 0 6 AIN0N Analog input Negative analog input, channel 0. Note that the allowable signal swing on this pin is ±0.2V; this pin can be grounded. 7 AIN1N Analog input Negative analog input, channel 1. Note that the allowable signal swing on this pin is ±0.2V; this pin can be grounded. 8 AIN1P Analog input Positive analog input, channel 1 9 NC — Not connected internally, it is recommended to externally short this pin to GND 10 NC — Not connected internally, it is recommended to externally short this pin to GND 10 DESCRIPTION Power supply ground; all analog and digital signals are referred with respect to this pin 11 CH SEL Digital input This pin selects the analog input channel. Low = channel 0, high = channel 1. It is recommended to change the channel within a window of one clock; from half a clock after the CS falling edge. This change ensures the settling on the multiplexer output before the sample start. 12 PDEN Digital input This pin enables a power-down feature if it is high at the CS rising edge 13 CS Digital input Chip select signal; active low 14 SCLK Digital input Serial SPI clock 15 SDO Digital output Serial data out 16 DVDD Digital Submit Documentation Feedback Digital I/O supply Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 TYPICAL CHARACTERISTICS: ADS7947, ADS7948, ADS7949 At TA = +25°C, DVDD = 1.8V, VREF = 2.5V, and fSAMPLE = 2MSPS, unless otherwise noted. SUPPLY CURRENT vs ANALOG SUPPLY VOLTAGE SUPPLY CURRENT vs TEMPERATURE 3.2 2.4 AVDD = 3V 2.38 Supply Current (mA) Supply Current (mA) 3 2.8 2.6 2.4 2.36 2.34 2.32 2.2 2 2.3 2.7 3.2 3.7 4.2 4.7 5.7 5.2 -40 -25 -10 20 5 AVDD, Analog Supply Voltage (V) 35 50 65 80 95 110 125 Free-Air Temperature (°C) Figure 1. Figure 2. STATIC CURRENT vs ANALOG SUPPLY VOLTAGE STATIC CURRENT vs FREE-AIR TEMPERATURE 1.9 1.77 1.88 1.765 AVDD = 3V Static Current (mA) Static Current (mA) 1.86 1.84 1.82 1.8 1.78 1.76 1.76 1.755 1.75 1.745 1.74 1.74 1.735 1.72 1.73 1.7 2.7 3.2 3.7 4.2 4.7 5.7 5.2 -40 -25 -10 AVDD, Analog Supply Voltage (V) 20 5 35 50 65 80 95 110 125 Free-Air Temperature (°C) Figure 3. Figure 4. SUPPLY CURRENT vs THROUGHPUT 2.5 PDEN Pin High Supply Current (mA) 2 1.5 AVDD = 5V 1 AVDD = 3V 0.5 0 0 100 200 300 400 500 600 700 Throughput (kSPS) Figure 5. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 11 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS: ADS7947 (12-Bit) At TA = +25°C, DVDD = 1.8V, VREF = 2.5V, and fSAMPLE = 2MSPS, unless otherwise noted. INTEGRAL LINEARITY vs ANALOG SUPPLY VOLTAGE 1 1 0.8 0.8 0.6 0.6 0.4 Integral Linearity (LSBs) Differential Linearity (LSBs) DIFFERENTIAL LINEARITY vs ANALOG SUPPLY VOLTAGE Maximum DNL 0.2 0 -0.2 Minimum DNL -0.4 -0.6 -0.8 -1 Maximum INL 0.4 0.2 0 -0.2 Minimum INL -0.4 -0.6 -0.8 2.7 3.2 3.7 4.2 4.7 -1 5.7 5.2 2.7 3.2 3.7 AVDD, Analog Supply Voltage (V) 4.2 Figure 6. DIFFERENTIAL LINEARITY vs TEMPERATURE INTEGRAL LINEARITY vs TEMPERATURE 1 0.8 0.6 Integral Linearity (LSBs) Differential Linearity (LSBs) AVDD = 3V AVDD = 3V 0.8 0.4 Maximum DNL 0.2 0 -0.2 Minimum DNL -0.4 -0.6 -0.8 0.6 0.4 0.2 Maximum INL 0 -0.2 Minimum INL -0.4 -0.6 -0.8 -1 -40 -25 -10 5 20 35 50 65 80 95 -1 110 125 -40 -25 -10 5 Free-Air Temperature (°C) 35 50 65 80 95 110 125 Figure 9. DIFFERENTIAL LINEARITY vs REFERENCE VOLTAGE INTEGRAL LINEARITY vs REFERENCE VOLTAGE 1 1 AVDD = 5V AVDD = 5V 0.8 0.6 0.6 Integral Linearity (LSBs) 0.8 0.4 Maximum DNL 0.2 0 -0.2 Minimum DNL -0.4 -0.6 -0.8 -1 20 Free-Air Temperature (°C) Figure 8. Differential Linearity (LSBs) 5.7 5.2 Figure 7. 1 0.4 Maximum INL 0.2 0 -0.2 Minimum INL -0.4 -0.6 -0.8 2.5 3 3.5 4 4.5 5 -1 2.5 3.5 3 Reference Voltage (V) Submit Documentation Feedback 4 4.5 5 Reference Voltage (V) Figure 10. 12 4.7 AVDD, Analog Supply Voltage (V) Figure 11. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 TYPICAL CHARACTERISTICS: ADS7947 (12-Bit) (continued) At TA = +25°C, DVDD = 1.8V, VREF = 2.5V, and fSAMPLE = 2MSPS, unless otherwise noted. OFFSET ERROR vs TEMPERATURE 1 0.8 0.8 0.6 0.6 Offset Error (LSBs) Offset Error (LSBs) OFFSET ERROR vs ANALOG SUPPLY VOLTAGE 1 0.4 0.2 0 -0.2 -0.4 0.4 0.2 0 -0.2 -0.4 -0.6 -0.6 -0.8 -0.8 -1 2.7 3.2 3.7 4.2 4.7 -1 5.7 5.2 AVDD = 3V -40 -25 -10 5 AVDD, Analog Supply Voltage (V) 20 35 50 65 80 95 110 125 Free-Air Temperature (°C) Figure 12. Figure 13. OFFSET ERROR vs REFERENCE VOLTAGE GAIN ERROR vs ANALOG SUPPLY VOLTAGE 1 1 0.8 0.6 0.6 Gain Error (LSBs) Offset Error (LSBs) AVDD = 5V 0.8 0.4 0.2 0 -0.2 -0.4 0.4 0.2 0 -0.2 -0.4 -0.6 -0.6 -0.8 -0.8 -1 2.5 3.5 3 4.5 4 -1 5 2.7 3.2 3.7 Reference Voltage (V) Figure 14. 4.7 5.2 5.7 Figure 15. GAIN ERROR vs TEMPERATURE GAIN ERROR vs REFERENCE VOLTAGE 1 1 AVDD = 5V AVDD = 3V 0.8 0.8 0.6 0.6 Gain Error (LSBs) Gain Error (LSBs) 4.2 AVDD, Analog Supply Voltage (V) 0.4 0.2 0 -0.2 -0.4 0.4 0.2 0 -0.2 -0.4 -0.6 -0.6 -0.8 -0.8 -1 -40 -25 -10 5 20 35 50 65 80 95 110 125 -1 2.5 3 Free-Air Temperature (°C) Figure 16. 3.5 4 4.5 5 Reference Voltage (V) Figure 17. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 13 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS: ADS7947 (12-Bit) (continued) At TA = +25°C, DVDD = 1.8V, VREF = 2.5V, and fSAMPLE = 2MSPS, unless otherwise noted. SNR vs ANALOG SUPPLY VOLTAGE fIN = 2kHz AVDD = 3V fIN = 2kHz 73.8 Signal-to-Noise Ratio (dB) 73.8 Signal-to-Noise Ratio (dB) SNR vs TEMPERATURE 74 74 73.6 73.4 73.2 73 72.8 72.6 72.4 73.6 73.4 73.2 73 72.8 72.6 72.4 72.2 72.2 72 72 2.7 3.2 3.7 4.7 4.2 5.2 5.7 -40 -25 -10 5 20 AVDD, Analog Supply Voltage (V) Figure 18. SNR vs REFERENCE VOLTAGE AVDD = 5V fIN = 2kHz 95 110 125 AVDD = 3V Throughput = 2MSPS 73.8 Signal-to-Noise Ratio (dB) Signal-to-Noise Ratio (dB) 80 SNR vs INPUT FREQUENCY 73.6 73.4 73.2 73 72.8 72.6 72.4 72.2 73.6 73.4 73.2 73 72.8 72.6 72.4 72.2 72 72 2.5 3.5 3 4.5 4 0 5 20 40 Reference Voltage (V) 60 80 100 120 Frequency (kHz) Figure 20. Figure 21. SINAD vs ANALOG SUPPLY VOLTAGE SINAD vs TEMPERATURE 74 74 fIN = 2kHz Signal-to-Noise and Distortion (dB) Signal-to-Noise and Distortion (dB) 65 74 73.8 73.6 73.4 73.2 73 72.8 72.6 72.4 72.2 73.8 AVDD = 3V fIN = 2kHz 73.6 73.4 73.2 73 72.8 72.6 72.4 72.2 72 72 2.7 3.2 3.7 4.2 4.7 5.2 5.7 -40 -25 -10 5 Figure 22. Submit Documentation Feedback 20 35 50 65 80 95 110 125 Free-Air Temperature (°C) AVDD, Analog Supply Voltage (V) 14 50 Figure 19. 74 73.8 35 Free-Air Temperature (°C) Figure 23. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 TYPICAL CHARACTERISTICS: ADS7947 (12-Bit) (continued) At TA = +25°C, DVDD = 1.8V, VREF = 2.5V, and fSAMPLE = 2MSPS, unless otherwise noted. SINAD vs REFERENCE VOLTAGE SINAD vs INPUT FREQUENCY 74 AVDD = 5V fIN = 2kHz 73.8 Signal-to-Noise and Distortion (dB) Signal-to-Noise and Distortion (dB) 74 73.6 73.4 73.2 73 72.8 72.6 72.4 72.2 72 AVDD = 3V Throughput = 2MSPS 73.8 73.6 73.4 73.2 73 72.8 72.6 72.4 72.2 72 2.5 3.5 3 4.5 4 0 5 20 40 Reference Voltage (V) Figure 24. SFDR vs AVDD 120 100 SFDR vs TEMPERATURE 91.9 fIN = 2kHz Spurious-Free Dynamic Range (dB) Spurious-Free Dynamic Range (dB) 80 Figure 25. 92.5 92 91.5 91 90.5 90 89.5 89 91.85 91.8 91.75 91.7 AVDD = 3V fIN = 2kHz 91.65 2.7 3.7 3.2 4.2 4.7 5.2 5.7 -40 -25 -10 AVDD, Analog Supply Voltage (V) 5 20 50 65 80 95 110 125 Figure 27. SFDR vs REFERENCE VOLTAGE SFDR vs INPUT FREQUENCY 94 90.35 AVDD = 5V fIN = 2kHz Spurious-Free Dynamic Range (dB) 90.3 35 Free-Air Temperature (°C) Figure 26. Spurious-Free Dynamic Range (dB) 60 Frequency (kHz) 90.25 90.2 90.15 90.1 90.05 AVDD = 3V 93.5 93 92.5 92 91.5 91 90.5 90 90 2.5 3 3.5 4 4.5 5 0 20 Measured Reference, VREF (V) Figure 28. 40 60 80 100 120 Input Frequency (kHz) Figure 29. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 15 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS: ADS7947 (12-Bit) (continued) At TA = +25°C, DVDD = 1.8V, VREF = 2.5V, and fSAMPLE = 2MSPS, unless otherwise noted. SFDR vs AVDD SFDR vs TEMPERATURE -87.75 fIN = 2kHz -87 Total Harmonic Distortion (dB) Total Harmonic Distortion (dB) -86.8 -87.2 -87.4 -87.6 -87.8 -88 -88.2 AVDD = 3V fIN = 2kHz -87.8 -87.85 -87.9 -87.95 -88 -88.05 -88.1 -88.4 2.7 3.7 3.2 4.2 4.7 5.2 5.7 20 5 -40 -25 -10 AVDD, Analog Supply Voltage (V) Figure 30. 80 95 110 125 THD vs INPUT FREQUENCY AVDD = 5V fIN = 2kHz -86.2 Total Harmonic Distortion (dB) Total Harmonic Distortion (dB) 65 -86 -86.4 -86.6 -86.8 -87 -87.2 -86.5 -87 -87.5 -88 -88.5 -89 -89.5 -90 -87.4 2.5 3 3.5 4.5 4 0 5 20 40 0 60 80 100 120 Input Frequency (kHz) Reference, VREF (V) Figure 32. Figure 33. CROSSTALK vs INPUT FREQUENCY(1) SPECTRAL RESPONSE (8192-Point FFT) 0 AVDD = 3V SNR = 73.1dB THD = -87.5dB SINAD = 72.9dB SFDR = 90.6 fIN = 100kHz -20 -20 -40 -40 Amplitude (dB) Crosstalk (dB) 50 Figure 31. THD vs REFERENCE VOLTAGE -86 -60 -80 Memory Crosstalk -100 -60 -80 -100 -120 -120 -140 Isolation Crosstalk -140 -160 0 50 100 150 200 250 300 350 0 100k 200k 300k 400k 500k 600k 700k 800k 900k 1M Frequency (Hz) Input Frequency (kHz) (1) Memory crosstalk is the effect of the last converted channel on the current converted channel data. Isolation crosstalk is the effect on the channel being converted that is coming from the signal on the channel that is off. Figure 34. 16 35 Free-Air Temperature (°C) Submit Documentation Feedback Figure 35. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 TYPICAL CHARACTERISTICS: ADS7947 (12-Bit) (continued) At TA = +25°C, DVDD = 1.8V, VREF = 2.5V, and fSAMPLE = 2MSPS, unless otherwise noted. TYPICAL DNL 1 0.6 0.6 DNL (LSBs) INL (LSBs) TYPICAL INL 1 0.2 -0.2 -0.6 -1 0.2 -0.2 -0.6 0 512 1024 1536 2048 2560 3072 3584 4096 -1 0 512 1024 1536 2048 2560 Output Code Output Code Figure 36. Figure 37. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 3072 3584 4096 Submit Documentation Feedback 17 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com OVERVIEW The ADS7947 is 12-bit, miniature, dual-channel, low-power SAR ADC. The ADS7948 and ADS7949 are 10-bit and 8-bit devices, respectively, from the same product family. These devices feature very low power consumption at rated speed. The PDEN pin enables an auto power-down mode that further reduces power consumption at lower speeds. MULTIPLEXER AND ADC INPUT The devices feature pseudo-differential inputs with a double-pole, double-throw multiplexer. The negative inputs (AINxN) can accept swings of ±0.2V; the positive inputs (AINxP) allow signals in the range of 0V to VREF over the negative input. The ADC converts the difference in voltage: VAINxP – VAINxN. This feature can be used in multiple ways. Two signals can be connected from different sensors with unequal ground potentials (within ±0.2V) to a single ADC. The pseudo-differential ADC rejects common-mode offset and noise. This feature also allows the use of a single-supply op amp. The signal and the AINxN input can be offset by +0.2V, which provides the ground clearance needed for a single-supply op amp. Figure 38 shows the electrostatic discharge (ESD) diodes to supply and ground at every analog input. Make sure that these diodes do not turn on by keeping the supply voltage within the specified input range. AVDD AIN0P GND AVDD AIN0N GND SAR ADC AVDD AIN1P GND AVDD AIN1N GND Figure 38. Analog Inputs 18 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 Figure 39 shows an equivalent circuit of the multiplexer and ADC sampling stage. The positive and negative inputs are separately sampled on 32pF sampling capacitorss. The multiplexer and sampling switches are represented by an ideal switch in series with a 12Ω resistance. During sampling, the devices connect the 32pF sampling capacitor to the ADC driver. This connection creates a glitch at the device input. It is recommended to connect a capacitor across the AINxP and AINxN terminals to reduce this glitch. A driving circuit must have sufficient bandwidth to settle this glitch within the acquisition time. 12W AIN0P 32pF 12W AIN1P 12W AIN0N 32pF 12W AIN1N Figure 39. Input Sampling Stage Equivalent Circuit (See the Application Information section for details on the driving circuit.) Figure 40 shows a timing diagram for the ADC analog input channel selection. As shown in Figure 40, the CH SEL signal selects the analog input channel to the ADC. CH SEL = 0 selects channel 0 ( AIN0P – AIN0N) and CH SEL = 1 selects channel 1 ( AIN1P – AIN1N). It is recommended not to toggle the CH SEL signal during an ADC acquisition phase until the device sees the first valid SCLK rising edge after the device samples the analog input. If CH SEL is toggled during this period, it can cause erroneous output code as the device might see unsettled analog input. CH SEL can be toggled at any time during the window specified in Figure 40; however, it is recommended to select the desired channel after the first SCLK rising edge and before the second SCLK rising edge. This timing ensures that the multiplexer output is settled before the ADC starts acquisition of the analog input. Sample N (AIN0) Sample N+1 (AIN1) tCONV Conversion of Sample N tACQ Acquisition of AIN1 Sample N+2 (AIN0) tCONV Conversion of Sample N+1 tACQ Acquisition of AIN0 CS SCLK 1 2 3 N (1) 1 2 3 N (1) CH SEL Window for CH SEL Toggle Do Not Toggle CH SEL in This Window (1) N indicates the 14th SCLK rising edge for the ADS7947 (12-bit) , the 11th rising edge for the ADS7948 (10-bit), and the ninth rising edge for the ADS7949 (8-bit). Figure 40. ADC Analog Input Channel Selection Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 19 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com REFERENCE The ADS7947/8/9 use an external reference voltage during the conversion of a sampled signal. The devices switch the capacitors used in the conversion process to the reference terminal during conversion. The switching frequency is the same as the SCLK frequency. It is necessary to decouple the REF terminal to REFGND with a 1µF ceramic capacitor in order to get the best noise performance from the device. The capacitor must be placed closest to these pins. The reference input can be driven with the REF50xx series precision references from TI. Figure 41 shows a typical reference driving circuit. Sometimes it is convenient to use AVDD as a reference. The ADS794x allow reference ranges up to AVDD. However, make sure that AVDD is well-bypassed and that there is a separate bypass capacitor between REF and REFGND. AVDD AVDD REF50xx (1) REF 1mF Ceramic ADS7947 ADS7948 ADS7949 REFGND AGND GND (1) Select the appropriate device as described by the required reference value. For example, select the REF5040 for a 4V reference, the REF5030 for a 3V reference, and the REF5025 for a 2.5V reference. Ensure that (AVDD – REF) > 0.2V so that the REF50xx functions properly. Figure 41. Typical Reference Driving Circuit CLOCK The ADS794x use SCLK for conversions (typically 34MHz). A lower frequency SCLK can be used for applications requiring sample rates less than 2MSPS. However, it is better to use a 34MHz SCLK and slow down the device speed by choosing a lower frequency for CS, which allows more acquisition time. This configuration relaxes constraints on the output impedance of the driving circuit. Refer to the Application Information section for calculation of the driving circuit output impedance. 20 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 ADC TRANSFER FUNCTION The ADS7947 (12-bit), ADS7948 (10-bit), and ADS7949 (8-bit) devices are unipolar, pseudo-differential input. The ADC output is in straight binary format. Figure 42 shows ideal characteristics for this family of devices. Here, FSR is the full-scale range for the ADC input (AINxP – AINxN) and is equal to the reference input voltage to the ADC (VREF). 1LSB is equal to (VREF/2N) where N is the resolution of the ADC (for example, N = 12 for the ADS7947). ADC Code 111¼111 100¼000 000¼001 1LSB FSR/2 FSR - 1LSB Analog Input Figure 42. ADS7947/8/9 Transfer Characteristics Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 21 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com DEVICE OPERATION The ADS7947/8/9 are typically operated with either a 16-clock frame or 32-clock frame for ease of interfacing with the host processor. 16-CLOCK FRAME Figure 43 through Figure 45 show the devices operating in 16-clock mode. This mode is the fastest mode for device operation. In this mode, the devices output data from previous conversions while converting the recently sampled signal. As shown in Figure 43, the ADS7947 starts acquisition of the analog input from the 14th rising edge of SCLK. The device samples the input signal on the CS falling edge. SDO comes out of 3-state and the device outputs the MSB on the CS falling edge. The device outputs the next lower SDO bits on every SCLK falling edge after it has first seen the SCLK rising edge. The data correspond to the sample and conversion completed in the previous frame. During a CS low period, the device converts the recently sampled signal. It uses SCLK for conversions. The number of clocks needed for a conversion for 12-bit and 8-bit devices are different. For the ADS7947, conversion is complete on the 14th SCLK rising edge. CS can be high at any time after the 14th SCLK rising edge. The CS rising edge after the 14th SCLK rising edge and before the 29th SCLK falling edge keeps the device in the 16-clock data frame. The device output goes to 3-state with CS high. Sample N Sample N+1 tACQ tCONV CS SCLK SDO 1 D11 2 3 4 5 6 7 8 9 10 11 12 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 13 14 15 16 Data from Sample N-1 Figure 43. ADS7947 Operating in 16-Clock Mode without Power-Down (PDEN = 0) It is also permissible to stop SCLK after device has seen the 14th SCLK rising edge. 22 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 Figure 44 and Figure 45 show the 16-clock mode operation for the ADS7948 and ADS7949, respectively. The operation for these 10-bit and 8-bit devices is identical to the ADS7947 except that the conversion ends on different edges of SCLK. For the ADS7948, the conversion ends and acquisition starts on the 11th SCLK rising edge. For the ADS7949, the device uses the ninth SCLK rising edge for the conversion end and acquisition start. Similar to the ADS7947, CS can go high and SCLK may be stopped once the device enters acquisition. Sample N Sample N+1 tACQ tCONV CS SCLK 1 2 3 4 5 6 7 8 9 10 SDO D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 11 12 13 14 15 16 Data from Sample N-1 Figure 44. ADS7948 Operating in 16-Clock Mode without Power-Down (PDEN = 0) Sample N Sample N+1 tACQ tCONV CS SCLK 1 2 3 4 5 6 7 8 SDO D7 D6 D5 D4 D3 D2 D1 D0 9 10 11 12 13 14 15 16 Data from Sample N-1 Figure 45. ADS7949 Operating in 16-Clock Mode without Power-Down (PDEN = 0) Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 23 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com 32-CLOCK FRAME Figure 46 through Figure 48 show the devices operating in 32-clock mode. In this mode, the devices convert and output the data from the most recent sample before taking the next sample. Sample N Sample N+1 tACQ tCONV CS 1 SCLK 2 14 15 16 17 D11 SDO 18 23 24 25 26 27 28 D10 D5 D4 D3 D2 D1 D0 29 30 31 32 Data from Sample N Figure 46. ADS7947 Operation in 32-Clock Frame without Power-Down (PDEN = 0) Sample N Sample N+1 tACQ tCONV CS 1 SCLK 2 11 12 16 SDO 17 18 23 24 25 26 D9 D8 D3 D2 D1 D0 27 28 29 30 31 32 Data from Sample N Figure 47. ADS7948 Operating in 32-Clock Frame without Power-Down (PDEN = 0) Sample N Sample N+1 tACQ tCONV CS SCLK 1 2 9 SDO 10 16 17 18 23 24 D7 D6 D1 D0 25 26 27 28 29 30 31 32 Data from Sample N Figure 48. ADS7949 Operating in 32-Clock Frame without Power-Down (PDEN = 0) 24 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 CS can be held low past the 16th falling edge of SCLK. The device continues to output recently converted data starting with the 16th SCLK falling edge. If CS is held low until the 30th SCLK falling edge, then the device detects 32-clock mode. Note that the device data from recent conversions are already out with no latency before the 30th SCLK falling edge. Once 32-clock mode is detected, the device outputs 16 zeros during the next conversion (in fact, for the first 16 clocks), unlike 16-clock mode where the device outputs the previous conversion result. SCLK can be stopped after the device has seen the 30th falling edge with CS low. POWER-DOWN The ADS7947/8/9 family of devices offer an easy-to-use power-down feature available through a dedicated PDEN pin (pin 12). A high level on PDEN at the CS rising edge enables the power-down mode for that particular cycle. Figure 49 to Figure 51 illustrate device operation with power-down in both 32-clock and 16-clock mode. Many applications must slow device operation. For speeds below approximately 500kSPS, it is convenient to use 32-clock mode with power-down. This results in considerable power savings. As shown in Figure 49, PDEN is held at a logic '1' level. Note that the device looks at the PDEN status only at the CS rising edge; however, for continuous low-speed operation, it is convenient to continuously hold PDEN = 1. The devices detect power-down mode on the CS rising edge with PDEN = 1. tACQ tCONV 11th and 9th SCLK rising edge for 10- and 8-bit devices, respectively. CS SCLK tACQ (min)+ 1ms 1 2 14 15 16 D11 SDO 18 27 28 29 D10 D2 D1 D0 17 30 31 32 Data from Sample N Power-Down State (Internal) Active Power-Down Active IDYNAMIC ISTATIC IAVDD Profile IPD-DYNAMIC IPD-STATIC if SCLK is off; otherwise, IPD-DYNAMIC. Figure 49. Operation with a 32-Clock Frame in Power-Down Mode (PDEN = 1) On the CS falling edge, the devices start normal operation as previously described. The devices complete conversions on the 14th SCLK rising edge. (Conversions complete on the 11th and ninth SCLK rising edge for 10-bit and 8-bit devices, respectively.) The devices enter the power-down state immediately after conversions complete. However, the devices can still output data as per the timings described previously. The devices consume dynamic power-down current (IPD-DYNAMIC) during data out operations. It is recommended to stop the clock after the 32nd SCLK falling edge to further save power down to the static power-down current level (IPD-STATIC). The devices power up again on the SCLK rising edge. However, they require an extra 1µs to power up completely. CS must be high for the 1µs + tACQ (min) period. In some applications, data collection is accomplished in burst mode. The system powers down after data collection. 16-clock mode is convenient for these applications. Figure 50 and Figure 51 detail power saving in 16-clock burst mode. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 25 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com tPDSU tPDH PDEN Sample N-1 Dummy Sample Sample N CS SCLK 1 15 2 16 1 2 15 16 1 11 2 12 13 14 15 16 SDO Data from Sample N-2 Data from Sample N-1 Data from Sample N Power-Down State (Internal) Active Power-Down Figure 50. Entry Into Power-Down with 16-Clock Burst Mode As shown in Figure 50, the two frames capturing the N–1 and Nth samples are normal 16-clock frames. Keeping PDEN = 1 prior to the CS rising edge in the next frame ensures that the devices detect the power-down mode. Data from the Nth sample are read during this frame. It is expected that the Nth sample represents the last data of interest in the burst of conversions. The devices enter power-down state after the end of conversions. This is the 14th, 11th, or ninth SCLK rising edge for the 12-, 10-, and 8-bit devices, respectively. The clock may be stopped after the 14th SCLK falling edge; however, it is recommended to stop the clock after the 16th SCLK falling edge. Note that it is mandatory not to have more than 29 SCLK falling edges during the CS low period. This limitation ensures that the devices remain in 16-clock mode. tPDSU PDEN Sample N+1 CS Sample N+3 Sample N+2 tACQ (min) + 1ms 1 SCLK 2 15 16 1 2 15 16 1 2 SDO Invalid Data Power-Down State (Internal) Power-Down Data from Sample N+1 Data from Sample N+2 Active Figure 51. Exit From Power-Down with 16-Clock Burst Mode The devices remain in a power-down state as long as CS is low. A CS rising edge with PDEN = 0 brings the devices out of the power-down state. It is necessary to ensure that the CS high time for the first sample after power up is more than 1µs + tACQ (min). 26 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 APPLICATION INFORMATION The device employs a sample-and-hold stage at the input; see Figure 39 for a typical equivalent circuit of a sample-and-hold stage. The device connects a 32pF sampling capacitor during sampling. This configuration results in a glitch at the input terminals of the device at the start of the sample. The external circuit must be designed in such a way that the input can settle to the required accuracy during the sampling time chosen. Figure 52 shows a typical driving circuit for the analog inputs. 0V to VREF +VA + 5W OPA365 AVDD AINxP 50W 470pF ADS7947 ADS7948 ADS7949 AINxN 5W GND Figure 52. Typical Input Driving Circuit The 470pF capacitor across the AINxP and AINxN terminals decouples the driving op amp from the sampling glitch. It is recommended to split the series resistance of the input filter in two equal values as shown in Figure 52. It is recommended that both input terminals see the same impedance from the external circuit. The low-pass filter at the input limits noise bandwidth of the driving op amp. Select the filter bandwidth so that the full-scale step at the input can settle to the required accuracy during the sampling time. Equation 1, Equation 2, and Equation 3 are useful for filter component selection. Sampling Time Filter Time Constant (tAU) = Settling Resolution ´ ln(2) Where: Settling resolution is the accuracy in LSB to which the input needs to settle. A typical settling resolution for the 12-bit device is 13 or 14. (1) Filter Time Constant (tAU) = R ´ C (2) Filter Bandwidth = 1 2 ´ p ´ tAU (3) Also, make sure the driving op amp bandwidth does not limit the signal bandwidth below filter bandwidth. In many applications, signal bandwidth may be much lower than filter bandwidth. In this case, an additional low-pass filter may be used at the input of the driving op amp. This signal filter bandwidth can be selected in accordance with the input signal bandwidth. Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 27 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com DRIVING AN ADC WITHOUT A DRIVING OP AMP There are some low input signal bandwidth applications, such as battery power monitoring or mains monitoring. For these applications, it is not required to operate an ADC at high sampling rates and it is desirable to avoid using a driving op amp from a cost perspective. In this case, the ADC input sees the impedance of the signal source (such as a battery or mains transformer). This section elaborates the effects of source impedance on sampling frequency. Equation 1 can be rewritten as Equation 4: Sampling Time = Filter Time Constant × Settling Resolution × ln(2) (4) As shown in Figure 53, it is recommended to use a bypass capacitor across the positive and negative ADC input terminals. +VA RSOURCE AVDD AINxP ADS7947 ADS7948 ADS7949 CBYPASS AINxN Signal Source R1 5W GND Figure 53. Driving an ADC Without a Driving Op Amp Source impedance (RSOURCE + R1) with (CBYPASS + CSAMPLE) acts as a low-pass filter with Equation 5: Filter Time Constant = (RSOURCE + R1) × (CBYPASS + CSAMPLE) Where: CSAMPLE is the internal sampling capacitance of the ADC (equal to 32pF). (5) Table 1 lists the recommended bypass capacitor values and the filter time constant for different source resistances. It is recommended to use a 10pF bypass capacitor, at minimum. Table 1. Filter Time Constant versus Source Resistance RSOURCE (Ω) RSOURCE + R1 APPROXIMATE CBYPASS (pF) CBYPASS + CSAMPLE (pF) FILTER TIME CONSTANT (ns) 15 20 370 400 8 25 30 235 267 8 50 55 115 145 8 100 105 44 76 8 180 185 10 43.2 8 250 255 10 42 10.7 1000 1005 10 42 42.2 5000 5005 10 42 210.2 Typically, settling resolution is selected as (ADC resolution + 2). For the ADS7947 (12-bit) the ideal settling resolution is 14. Using equations Equation 2 and Equation 3, the sampling time can be easily determined for a given source impedance. This allows 80ns of sampling time for a 12-bit ADC with 8ns of filter time constant, which matches the ADS7947 specifications. For source impedance above 180Ω, the filter time constant continues to increase beyond the 8ns required for an 80ns sampling time. This increases the minimum permissible sampling time for 12-bit settling and the device must be operated at a lower sampling rate. 28 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 ADS7947 ADS7948 ADS7949 www.ti.com SLAS708 – SEPTEMBER 2010 The device sampling rate can be maximized by using a 34MHz clock even for lower throughputs. Table 2 shows typical calculations for the ADS7947(12-bit). Table 2. Sampling Frequency versus Source Impedance for the ADS7947 (12-Bit) RSOURCE (Ω) CBYPASS (pF) SAMPLING TIME, tACQ (ns) CONVERSION TIME, CYCLE TIME, tACQ + tCONV (ns) tCONV (ns) SAMPLING RATE (MSPS) 180 10 80 397 (with 34MHz clock) 477 2 250 10 107 397 (with 34MHz clock) 504 1.98 1000 10 422 397 (with 34MHz clock) 819 1.2 5000 10 2102 397 (with 34MHz clock) 2499 0.4 It is necessary to allow 1000ns additional sampling time over what is shown in Table 2 if PDEN (pin 12) is set high. PCB LAYOUT/SCHEMATIC GUIDELINES ADCs are mixed-signal devices. For maximum performance, proper decoupling, grounding, and proper termination of digital signals is essential. Figure 54 shows the essential components around the ADC. All capacitors shown are ceramic. These decoupling capacitors must be placed close to the respective signal pins. There is a 47Ω source series termination resistor shown on the SDO signal. This resistor must be placed as close to pin 15 as possible. Series terminations for SCLK and CS must be placed close to the host. Analog Supply 1mF C3 4 5W AIN0P 470pF C2 AIN0N 5W AIN1N 470pF C1 AIN1P GND 1 5 0.1mF C5 16 6 15 ADS7947 ADS7948 ADS7949 U0 7 14 8 13 NC 9 10 11 DVDD 1mF C6 Digital Supply SDO SCLK CS 12 47W R1 Digital Signals from Host 5W Input Signal 2 PDEN Input Signal 3 NC 5W AVDD Common Analog/ Digital Ground Plane REF REFGND 1mF C4 CH SEL Reference Input Figure 54. Recommended ADC Schematic Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 Submit Documentation Feedback 29 ADS7947 ADS7948 ADS7949 SLAS708 – SEPTEMBER 2010 www.ti.com A common ground plane for both analog and digital often gives better results. Typically, the second PCB layer is the ground plane. The ADC ground pins are returned to the ground plane through multiple vias (PTH). It is a good practice to place analog components on one side and digital components on other side of the ADC (or ADCs). All signals must be routed, assuming there is a split ground plane for analog and digital. Furthermore, it is better to split the ground initially during layout. Route all analog and digital traces so that the traces see the respective ground all along the second layer. Then short both grounds to form a common ground plane. Figure 55 shows a typical layout around the ADC. Figure 55. Recommended ADC Layout (Only top layer is shown, second layer is common ground for analog and digital.) 30 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS7947 ADS7948 ADS7949 PACKAGE OPTION ADDENDUM www.ti.com 20-Sep-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) ADS7947SRTER ACTIVE WQFN RTE 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples ADS7947SRTET ACTIVE WQFN RTE 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples ADS7948SRTER ACTIVE WQFN RTE 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples ADS7948SRTET ACTIVE WQFN RTE 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples ADS7949SRTER ACTIVE WQFN RTE 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples ADS7949SRTET ACTIVE WQFN RTE 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 20-Sep-2010 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing ADS7947SRTER WQFN RTE 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 ADS7947SRTET WQFN RTE 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 ADS7948SRTER WQFN RTE 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 ADS7948SRTET WQFN RTE 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 ADS7949SRTER WQFN RTE 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 ADS7949SRTET WQFN RTE 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS7947SRTER WQFN RTE 16 3000 367.0 367.0 35.0 ADS7947SRTET WQFN RTE 16 250 210.0 185.0 35.0 ADS7948SRTER WQFN RTE 16 3000 367.0 367.0 35.0 ADS7948SRTET WQFN RTE 16 250 210.0 185.0 35.0 ADS7949SRTER WQFN RTE 16 3000 367.0 367.0 35.0 ADS7949SRTET WQFN RTE 16 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: ADS7947SRTER ADS7947SRTET ADS7948SRTER ADS7948SRTET ADS7949SRTER ADS7949SRTET