Material Content Data Sheet Sales Product Name TLS208D1EJV33 MA# MA001331470 Package PG-DSO-8-27 Issued 9. June 2015 Weight* 84.01 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 1.453 1.73 0.009 0.01 0.036 0.04 433 0.728 0.87 8662 29.548 35.17 36.09 351712 360915 0.253 0.30 0.30 3013 3013 0.100 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.73 17298 17298 108 1190 4.598 5.47 45.283 53.91 59.50 539013 594937 0.695 0.83 0.83 8274 8274 0.725 0.86 0.86 8624 8624 0.146 0.17 0.437 0.52 54734 1735 0.69 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5204 6939 1000000