ON NCV8518BPDR2G Low dropout linear regulator with watchdog, wake up, reset, and enable Datasheet

NCV8518B
Low Dropout Linear
Regulator with Watchdog,
Wake Up, RESET, and
ENABLE
The NCV8518B device is a precision micropower voltage regulator.
It has a fixed output voltage of 5.0 V and regulates within ±2%. It is
suitable for use in all automotive environments and contains all the
required functions to control a microprocessor. This device has low
dropout voltage and low quiescent current. It includes a watchdog
timer, adjustable reset, wake up and enable function. Also
encompassed in this device are safety features such as thermal
shutdown and short circuit protection. It is capable of handling up to
45 V transients.
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MARKING
DIAGRAMS
8
SOIC−8
EXPOSED PAD
CASE 751AC
8
1
8518B
AYWW
G
1
Features
•
•
•
•
•
•
•
•
•
•
•
•
Output Voltage of 5.0 V
±2% Output Voltage Tolerance
Output Current up to 250 mA
Micropower Compatible Control Functions:
− ENABLE
− Watchdog
− RESET
− Wake Up
NCV Prefix for Automotive and Other Applications Requiring Site
and Change Control
Low Dropout Voltage
Low Quiescent Current of 100 mA
Protection Features:
− Thermal Shutdown
− Short Circuit
Low Sleep Mode Current less than 1.0 mA
AEC Qualified
PPAP Capable
These are Pb−Free Devices
Applications
• Tire Pressure Monitor
• Battery Powered Consumer Electronics
© Semiconductor Components Industries, LLC, 2010
June, 2010 − Rev. 1
1
16
SOIC−16 LEAD
WIDE BODY
EXPOSED PAD
CASE 751AG
16
NCV8518B
AWLYYWWG
1
1
A
WL
YY, Y
WW
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
NCV8518BPDR2G SOIC−8*
Shipping†
2500 / Tape & Reel
NCV8518BPWR2G SOIC−16* 1000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
Publication Order Number:
NCV8518B/D
NCV8518B
PIN CONNECTIONS
Wake Up
1
SOIC−8 EP
8
GND
Delay
SOIC−16 EP
RESET
NC
NC
GND
NC
Delay
NC
NC
VOUT
WDI
ENABLE
VIN
VOUT
1
16
Wake Up
RESET
NC
WDI
NC
ENABLE
NC
VIN
PIN FUNCTION DESCRIPTION
Pin
SOIC−8 EP
SOIC−16 EP
Symbol
Description
4
8
VOUT
5
9
VIN
Input supply voltage.
7
13
WDI
CMOS compatible Watchdog input. The watchdog function monitors the falling edge of
the incoming signal.
2
3
GND
Ground connection.
6
11
ENABLE
ENABLE control for the IC. Positive logic. If ENABLE control will not be used, connect
this pin to VIN via a 20k current limiting resistor. Internal ESD protection structures will
clamp the maximum ENABLE voltage to approximately 21 V.
8
15
RESET
CMOS compatible output RESET goes low whenever VOUT drops by more than 7.0%
from nominal, or during the absence of a correct watchdog signal.
3
5
Delay
−
1, 2, 4, 6, 7,
10, 12, 14
NC
1
16
Wake Up
EPAD
EPAD
EPAD
Regulated output voltage.
Buffered reference voltage used to create timing current for RESET and Watchdog
threshold frequency from RDelay.
No Connection.
Continuously generated signal that interrupts the microprocessor from sleep mode.
Connect to Ground potential or leave unconnected.
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2
NCV8518B
VIN
VOUT
Ilimit
OSCH
ENABLE
TSD
Enable
FB
Rail
Reference
VBG
OSCL
+ -
+ UVLO
WDI
Watchdog +
Wakeup
Logic
Buffer
Iref
Delay
+
-
Reset
Driver
RESET
OSCH OSCL
Timing
Circuit
Wakeup
Driver
Figure 1. Block Diagram
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3
Wake Up
NCV8518B
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 to 45
V
VENABLE
−0.3 to 16
V
Output Voltage
VOUT
−0.3 to +7.0
V
RESET Voltage
VRESET
0 V to VOUT
V
RESET Current
(RESET may be incidentally shorted either to VOUT or to GND without damage)
IRESET
Internally
Limited
mA
ESD Susceptibility (Human Body Model)
−
2.0
kV
Logic Inputs/Outputs (Reset, WDI, Wake Up, Delay)
−
−0.3 to +7.0
V
Operating Junction Temperature
TJ
−40 to150
°C
Storage Temperature Range
TS
−55 to +150
°C
Moisture Sensitivity Level
SOIC−16 EP (Case 751R)
SOIC−8 EP (Case 751AC)
MSL
Input Voltage
ENABLE Voltage
(ENABLE may be connected to VIN through an external 20k resistor without damage)
Lead Temperature Soldering: Reflow
Leaded Part
60−150 sec above 183°C, 30 sec max at peak
Lead−Free Part
60−150 sec above 217°C, 40 sec max at peak
−
−
1
3
240 peak
265 peak
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Parameter
Board/Mounting Conditions Typical Value
Unit
SO−8 Exposed Pad Package
100 sq. mm spreader board (Note 1)
1 sq. inch spreader board (Note 2)
Junction to case top (YJT)
14
14
°C/W
Junction to lead1 (YJL1)
36
26
°C/W
Junction to board (YJB) (Note 3)
15
14
°C/W
Junction to ambient (qJA)
126
80
°C/W
100 sq. mm spreader board (Note 1)
1 sq. inch spreader board (Note 2)
Junction to case top (YJT)
20
20
°C/W
Junction to lead1 (YJL1)
41
26
°C/W
Junction to board (YJB) (Note 3)
12
12
°C/W
Junction to ambient (qJA)
113
70
°C/W
SO−16 Exposed Pad Package
Specific notes on thermal characterization conditions:
All boards are 0.062” thick FR4, 3” square, with varying amounts of copper heat spreader, in still air (free convection) conditions. Numerical
values are derived from an axisymmetric finite−element model where active die area, total die area, flag area, pad area, and board area are
equated to the actual corresponding areas.
1. 1 oz copper, 100 mm2 (0.155 in2) spreader area (includes exposed pad).
2. 1 oz copper, 645 mm2 (1 in2) spreader area (includes exposed pad).
3. “board” is defined as center of exposed pad soldered to board; this is the recommended number to be used for thermal calculations, as it
best represents the primary heat flow path and is least sensitive to board and ambient properties.
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4
NCV8518B
ELECTRICAL CHARACTERISTICS (−40°C ≤ TJ ≤ 150°C; 6.0 V ≤ VIN ≤ 28 V, 100 mA ≤ IOUT ≤ 150 mA, C2 = 1.0 mF, RDelay = 60 k;
unless otherwise specified.)
Symbol
Min
Typ
Max
Unit
Output Voltage
VOUT
4.9
−2%
5.00
5.10
+2%
V
Dropout Voltage (VIN − VOUT, IOUT = 150 mA) (Note 4)
VDO
−
425
750
mV
Load Regulation
(VIN = 13.5 V, 100 mA ≤ IOUT ≤ 150 mA)
Regload
−
5.0
30
mV
Line Regulation
(6.0 V ≤ VIN ≤ 28 V, IOUT = 5.0 mA)
Regline
−
5.0
20
mV
Ilim
255
400
−
mA
TJmax
150
180
210
°C
−
−
100
−
150
1.0
−
4.50
4.65
4.75
V
Output Low
(RLOAD = 10 k to VOUT, VOUT = 1.0 V)
−
−
0.2
0.4
V
Output High (RLOAD = 10 k to GND)
−
VOUT − 0.4
VOUT − 0.2
−
V
Power On Reset Delay Time
(VIN = 13.5 V, RDelay = 60 k, IOUT = 5.0 mA)
(VIN = 13.5 V, RDelay = 120 k, IOUT = 5.0 mA)
VIN = 13.5 V, RDelay = 500 k, IOUT = 5.0 mA)
tD
2.0
−
−
3.0
6.0
25
4.0
−
−
Reset Reaction Time
Trr
−
20
−
ms
dV/dt
1.0
−
−
V/ms
WDIhigh
30
50
70
%VOUT
WDIhys
25
100
−
mV
Input Current (WDI = 6.0 V)
−
−
0.1
2.0
mA
Wake Up Rising Edge to WDI Falling Edge Delay
−
5.0
−
−
ms
−
2.0
−
−
0.8
−
−
3.0
10
Characteristic
Output
Current Limit
Thermal Shutdown (Guaranteed by Design)
Quiescent Current
(VIN = 13.5 V, IOUT = 100 mA, 150 mA, ENABLE = 2.0 V)
(ENABLE = 0 V, TA = +125°C)
IQ
mA
RESET
Threshold Voltage
Input and ENABLE Transient Rejection (Note 6)
ms
Watchdog Input
Threshold
Hysteresis (Guaranteed by design)
Wake Up
WDI
ENABLE (Note 5)
Vth(EN)
Input Threshold
Logic Low
Logic High
Input Current (ENABLE = 2.0 V)
−
4. Measured when the output voltage has dropped 2% from the nominal value.
5. If ENABLE is connected to VIN, a 20 kW resistor must be placed in series.
6. Slew rates in excess of this limit may cause RESET to change state.
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5
V
mA
NCV8518B
ELECTRICAL CHARACTERISTICS (continued) (−40°C ≤ TJ ≤ 150°C; 6.0 V ≤ VIN ≤ 28 V, 100 mA ≤ IOUT ≤ 150 mA,
C2 = 1.0 mF, RDelay = 60 k; unless otherwise specified.)
Symbol
Characteristic
Min
Typ
Max
18
−
−
25
50
208
32
−
−
45
50
55
9.0
−
−
12.5
25
104
16
−
−
Unit
Wake Up Output (VIN = 14 V, IOUT = 5.0 mA)
Wake Up Period
(RDELAY = 60 k)
(RDELAY = 120 k)
(RDELAY = 500 k)
−
Wake Up Duty Cycle Nominal
−
RESET HIGH to Wake Up Rising Delay Time
(RDELAY = 60 k) 50% RESET Rising Edge to
50% Wake Up Edge (RDELAY = 120 k)
(RDELAY = 500 k)
−
Wake Up Response to Watchdog Input
50% WDI Falling Edge to
50% Wake Up Falling Edge
−
−
0.1
5.0
ms
Wake Up Response to RESET
50% RESET Falling Edge to
50% Wake Up Falling Edge
(VOUT = 5.0 V→ 4.5 V)
−
−
0.1
5.0
ms
Output Low (RLOAD = 10 k)
−
−
0.2
0.4
V
Output High (RLOAD = 10 k)
−
VOUT − 0.5
VOUT − 0.25
−
V
−
−
0.48
−
V
ms
%
ms
Delay
Output Voltage (RDELAY = 60 k, 120 k, 500 k)
DEFINITION OF TERMS
Dropout Voltage: The input−to−output voltage differential at which the circuit ceases to regulate against further reduction in
input voltage. Measured when the output voltage has dropped 100 mV from the nominal value obtained at 14 V input, dropout
voltage is dependent upon load current and junction temperature.
Input Voltage: The DC voltage applied to the input terminals with respect to ground.
Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made under conditions
of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected.
Load Regulation: The change in output voltage for a change in load current at constant chip temperature.
Quiescent Current: The part of the positive input current that does not contribute to the positive load current. The regulator
ground lead current with no load.
Current Limit: Peak current that can be delivered to the output.
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6
NCV8518B
TIMING DIAGRAMS
VIN, ENABLE
RESET
Wake Up
Duty Cycle = 50%
Wake Up
RESET High
to Wake Up
Delay Time
Wake Up Duty Cycle will be 50% when the WDI
pulse occurs at the low state of the Wake Up Signal.
WDI
VOUT
POR
Power Up
Min WDI falling
edge delay after
Wake Up rising
edge
Microprocessor
Sleep Mode
Normal Operation with Varying Watchdog Signal
Figure 2. Power Up, Sleep Mode and Normal Operation
VIN, ENABLE
RESET Delay Time
RESET
Wake Up
RESET High
to Wake Up
Delay Time
WDI
VOUT
POR
Wake Up Period
Figure 3. Error Condition: Watchdog Remains Low and a RESET is Issued
RESET
Wake Up
Wake Up
Period
Wake Up
Response to Reset
WDI
VIN, ENABLE
RESET Threshold
VOUT
POR
VOUT Decreasing
Power Down
POR
Wake Up
Response to
WDI
Figure 4. Power Down, Restart Sequence, and Wake Up Response to WDI
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7
NCV8518B
TYPICAL PERFORMANCE CHARACTERISTICS
5.01
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
5.1
5 mA Load
5.0
4.9
−50
0
50
100
TJ, TEMPERATURE (°C)
25°C
5.00
4.99
150
5
Figure 5. Output Voltage vs. Temperature
10
15
20
INPUT VOLTAGE (V)
25
30
Figure 6. Output Voltage vs. Input Voltage
3.3
6.4
3.2
POR DELAY (ms)
POR DELAY (ms)
6.2
3.1
60 kW Rdelay
3.0
2.9
120 kW Rdelay
6.0
5.8
2.8
2.7
−50
0
50
100
TJ, TEMPERATURE (°C)
5.6
−50
150
Figure 7. POR Delay vs. Temperature, 60 kW Rdelay
27
WAKEUP PERIOD (ms)
ESR (W)
150
UNSTABLE
REGION
0.1 − 10 mF
100
100 mF
10
50
100
TJ, TEMPERATURE (°C)
Figure 8. POR Delay vs. Temperature, 120 kW Rdelay
10000
1000
0
STABLE REGION,
ALL CAP VALUES
1
26
60 kW Rdelay
25
24
0.1 mF UNSTABLE
0.1
0
25
50
75
OUTPUT CURRENT (mA)
100
23
−50
Figure 9. Stability Region of Capacitive ESR vs.
Output Current
0
50
100
TJ, TEMPERATURE (°C)
150
Figure 10. Wakeup Period vs. Temperature
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8
NCV8518B
TYPICAL PERFORMANCE CHARACTERISTICS
30
25
200
POR DELAY (ms)
WAKEUP PERIOD (ms)
250
150
100
50
0
20
15
10
5
0
100
200
300
400
0
500
0
100
200
300
400
RDelay (kW)
RDelay (kW)
Figure 11. Wakeup Period vs. RDelay
Figure 12. POR Delay vs. RDelay
6
60
5
50
500
VOUT TRANSIENT (mV)
OUTPUT VOLTAGE (V)
4.7 mF, 0.32 ESR
4
3
2
1
0
40
22 mF, 0.20 ESR
30
20
100 mF, 0.12 ESR
10
0
1
4
2
3
INPUT VOLTAGE (V)
5
0
6
0
Figure 13. Output Voltage vs. Input Voltage,
5 mA Load
600
25°C
400
300
−40°C
200
100
0
0
50
100
LOAD CURRENT (mA)
250
104
125°C
500
100
150
200
SWITCHING CURRENT (mA)
Figure 14. Load Transient Response
QUIESCENT CURRENT (mA)
DROPOUT VOLTAGE (mV)
700
50
Figure 15. Dropout Voltage vs. Output Current
25°C
100
98
96
150
−40°C
102
125°C
0
50
100
LOAD CURRENT (mA)
150
Figure 16. Quiescent Current vs. Output Current
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NCV8518B
OPERATING DESCRIPTION
General
RESET
The NCV8518B is a precision micropower voltage
regulator featuring low quiescent current (100 mA typical at
250 mA load) and low dropout voltage (450 mV typical at
150 mA). Integrated microprocessor control functions
include Watchdog, Wakeup and RESET. An Enable input is
provided for logic level control of the regulator state. The
combination of low quiescent current and comprehensive
microprocessor interface functions make the NCV8518B
ideal for use in both battery operated and automotive
applications.
The NCV8518B is internally protected against short
circuit and thermal runaway conditions. No external
components are required to engage these protective
mechanisms. The device continues to operate through 45
volt input transients, an important consideration in
automotive environments.
As output voltage falls, the RESET output will maintain
its current state down to VOUT = 1 V. A Reset signal (active
low) is asserted for any of four conditions:
1. During power up, RESET is held low until the
output voltage is in regulation.
2. During operation, if the output voltage falls below
the Reset threshold, RESET switches low, and will
remain low until both the output voltage has
recovered and the Reset delay timer cycle has
completed following that recovery.
3. RESET will switch low if the regulator does not
receive a Watchdog input signal within a Wakeup
period.
4. Regardless of output voltage, RESET will switch
low if the regulator input voltage VIN, falls below
a level required to sustain the internal control
circuits. The specific voltage is temperature
dependent, and is approximately 4.75 V at 20°C.
The Wakeup output is pulled low during a RESET
regardless of the cause of the RESET. After the RESET
returns high, the Wakeup cycle begins again (see Figure 4).
The RESET Delay Time, Wakeup signal frequency and
RESET high to Wakeup delay time are all set by one external
resistor, RDelay, according to the following equations:
Wakeup and Watchdog
To reduce battery drain, a microprocessor or
microcontroller can transition to a low current consumption
(“sleep”) mode when code execution is suspended or
complete. The NCV8518B Wakeup signal is generated and
output periodically to interrupt sleep mode. The nominal
Wakeup output is a 5 volt square wave (generated from
VOUT) with a duty cycle of 50%, at a frequency determined
by external timing resistor RDELAY. In response to the rising
edge of the Wakeup signal, the microprocessor will
subsequently output a Watchdog pulse and check its inputs
to decide if it should resume normal operation or remain in
sleep mode.
The NCV8518B responds to the falling edge of the
Watchdog signal, which it expects at least once during each
Wakeup period. When the correct Watchdog signal is
received, the Wakeup output is forced low. Other Watchdog
pulses received within the same cycle are ignored. The
Watchdog circuitry continuously monitors the input
Watchdog signal (WDI) from the microprocessor. The
absence of a falling edge on the Watchdog input during one
Wakeup cycle will cause a Reset pulse to be output at the end
of the Wakeup cycle (see Figure 4).
Wakeup Period (seconds) = (4.17
RESET Delay Time (seconds) = (5.21
10−7) * RDELAY (W)
10−8) * RDELAY (W)
RESET High to Wakeup Delay Time (seconds) =
(2.08
10−7) * RDELAY (W)
The voltage present at the Delay pin is a buffered bandgap
voltage (~1.25 V) and can be used as a reference for an
external tracking regulator.
Enable
This is a standard TTL and CMOS logic compatible input
that can be used to turn the regulator on or off. Logic high
enables the regulator; logic low disables it (also called
shutdown). In the disabled/shutdown state, the pass
transistor is off and total quiescent current is less than 1 mA.
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10
NCV8518B
C1*
0.1 mF
VOUT
VIN
C2
1.0 mF
WDI
I/O
OK
NCV8518B
Delay
Fault
RESET
RESET
WAKE UP
RDelay
120 k
GND
VDD
I/O
ENABLE
OFF
Microprocessor
VBAT
ON
*C1 required if regulator is located far from power supply filter. If extremely fast input voltage transients are expected
then appropriate input filter must be used. The filter can be composed of several capacitors in parallel.
Figure 17. Application Circuit
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11
NCV8518B
PACKAGE DIMENSIONS
SOIC−8 EP
D SUFFIX
CASE 751AC−01
ISSUE B
2X
D
E1
2X
0.10 C D
EXPOSED
PAD
5
ÉÉÉ
ÉÉÉ
PIN ONE
LOCATION
DETAIL A
D
A
8
1
5
F
8
G
E
h
2X
4
4
0.20 C
e
1
BOTTOM VIEW
8X b
0.25 C A-B D
B
A
0.10 C
A2
8X
b1
GAUGE
PLANE
0.10 C
SEATING
PLANE
SIDE VIEW
A1
ÉÉ
ÉÉ
ÇÇ
ÉÉ
ÇÇ
ÉÉ
c
H
A
A
END VIEW
TOP VIEW
C
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS (ANGLES
IN DEGREES).
3. DIMENSION b DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE
0.08 MM TOTAL IN EXCESS OF THE “b”
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
4. DATUMS A AND B TO BE DETERMINED
AT DATUM PLANE H.
0.10 C A-B
L
0.25
(L1)
DETAIL A
q
c1
(b)
SECTION A−A
SOLDERING FOOTPRINT*
2.72
0.107
1.52
0.060
7.0
0.275
Exposed
Pad
4.0
0.155
2.03
0.08
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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12
DIM
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
L1
F
G
h
q
MILLIMETERS
MIN
MAX
1.35
1.75
0.00
0.10
1.35
1.65
0.31
0.51
0.28
0.48
0.17
0.25
0.17
0.23
4.90 BSC
6.00 BSC
3.90 BSC
1.27 BSC
0.40
1.27
1.04 REF
2.24
3.20
1.55
2.51
0.25
0.50
0_
8_
NCV8518B
PACKAGE DIMENSIONS
SOIC−16 LEAD WIDE BODY, EXPOSED PAD
PDW SUFFIX
CASE 751AG−01
ISSUE A
−U−
A
M
P
0.25 (0.010)
M
W
M
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL BE
0.13 (0.005) TOTAL IN EXCESS OF THE D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
6. 751R-01 OBSOLETE, NEW STANDARD 751R-02.
9
B
1
R x 45_
8
−W−
G
PIN 1 I.D.
14 PL
DETAIL E
TOP SIDE
C
F
−T−
0.10 (0.004) T
K
D 16 PL
0.25 (0.010)
T U
M
SEATING
PLANE
W
S
J
S
DETAIL E
H
EXPOSED PAD
1
SOLDERING FOOTPRINT*
8
0.350
L
16
DIM
A
B
C
D
F
G
H
J
K
L
M
P
R
0.050
BACK SIDE
CL
0.200
INCHES
MIN
MAX
0.400
0.411
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.136
0.144
0.010
0.012
0.000
0.004
0.186
0.194
0_
7_
0.395
0.415
0.010
0.029
Exposed
Pad
0.175
9
MILLIMETERS
MIN
MAX
10.15
10.45
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
3.45
3.66
0.25
0.32
0.00
0.10
4.72
4.93
0_
7_
10.05
10.55
0.25
0.75
0.188
CL
0.376
0.074
0.150
0.024
DIMENSIONS: INCHES
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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