OSRAM LR-Y8SF White smt package, colorless clear silicone resin Datasheet

www.osram-os.com
Produktdatenblatt | Version 1.1
LR Y8SF
 LR Y8SF
Micro SIDELED ® 3010
Micro SIDELED is a SMT LED with side emission.
Due to its low package height it is ideal for applications in limited space environments.
Applications
——Electronic Equipment
——White Goods
Features:
——Package: white SMT package, colorless clear silicone resin
——Chip technology: Thinfilm
——Typ. Radiation: 120° (Lambertian emitter)
——Color: λdom = 625 nm (● red)
——Optical efficacy: 53 lm/W
——Corrosion Robustness Class: 1B


1 Version 1.3 | 2018-02-12
LR Y8SF
 Ordering Information
Type
LR Y8SF-U1V2-1


2 Version 1.3 | 2018-02-12
Luminous Intensity 1)
IF = 20 mA
Iv
Ordering Code
450 ... 1120 mcd
Q65110A8972
LR Y8SF
 Maximum Ratings
Parameter
Symbol
Operating Temperature
Top
min.
max.
-40 °C
100 °C
Storage Temperature
Tstg
min.
max.
-40 °C
100 °C
Junction Temperature
Tj
max.
125 °C
Forward current
TS = 25 °C
IF
min.
max.
5 mA
30 mA
Surge Current
t ≤ 10 µs; D = 0.005 ; TS = 25 °C
IFS
max.
100 mA
Reverse voltage 2)
TS = 25 °C
VR
max.
12 V
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD


3 Version 1.3 | 2018-02-12
Values
2kV
LR Y8SF
 Characteristics
IF = 20 mA; TS = 25 °C
Parameter
Symbol
Dominant Wavelength 3)
IF = 20 mA
λdom
min.
typ.
max.
Viewing angle at 50 % IV
2φ
typ.
120 °
Forward Voltage
IF = 20 mA
VF
min.
typ.
max.
1.90 V
2.20 V
2.50 V
Reverse current 2)
VR = 12 V
IR
typ.
max.
0.01 µA
10 µA
Real thermal resistance junction/ambient 5), 6)
RthJA real
max.
630 K / W
Real thermal resistance junction/solderpoint 5)
RthJS real
max.
350 K / W
4)


4 Version 1.3 | 2018-02-12
Values
620 nm
625 nm
632 nm
LR Y8SF
 Brightness Groups
Group
Luminous Intensity 1)
IF = 20 mA
min.
Iv
Luminous Intensity. 1)
IF = 20 mA
max.
Iv
Luminous Flux 7)
IF = 20 mA
typ.
ΦV
U1
450 mcd
560 mcd
1500 mlm
U2
560 mcd
710 mcd
1900 mlm
V1
710 mcd
900 mcd
2400 mlm
V2
900 mcd
1120 mcd
3000 mlm


5 Version 1.3 | 2018-02-12
LR Y8SF
 Group Name on Label
Example: U1-1
Brightness
Wavelength
U1
1


6 Version 1.3 | 2018-02-12
LR Y8SF
 Relative Spectral Emission
7)
Irel = f (λ); IF = 20 mA; TA = 25 °C
OHL03622
100
I rel
%
80
Vλ
60
yellow
red
40
20
0
400
450
500
550
600
650
nm
700
λ
Radiation Characteristics
7)
Irel = f (ϕ); TA = 25 °C
40˚
30˚
20˚
10˚
0˚
ϕ

50˚
OHL01660
1.0
0.8
0.6
60˚
0.4
70˚
0.2
80˚
0
90˚
100˚
0.8

1.0
7 Version 1.3 | 2018-02-12
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
LR Y8SF
 Forward current
Relative Luminous Intensity
7), 8)
IF = f(VF); TA = 25 °C
IF
7), 8)
Iv/Iv(20 mA) = f(IF); TA = 25 °C
OHL03618
10 2
mA
OHL03008
10 1
IV
IV (20 mA)
5
10 0
red
10
yellow
5
1
5
10 -1
5
10 0
1.5
1.7
1.9
2.1
2.3 V 2.5
VF


8 Version 1.3 | 2018-02-12
10 -2 0
10
5
10 1
mA 10 2
IF
LR Y8SF
 Forward Voltage
Relative Luminous Intensity
7)
∆VF = VF - VF(25 °C) = f(Tj); IF = 20 mA
OHL02667
0.25
V
7)
Iv/Iv(25 °C) = f(Tj); IF = 20 mA
OHL03619
2.5
IV
IV (25 ˚C)
∆VF
2.0
0.15
0.1
1.5
0.05
yellow
red
0
1.0
-0.05
-0.1
0.5
-0.15
-0.2
-60 -40 -20 0
20 40 60 ˚C 100
Tj


9 Version 1.3 | 2018-02-12
0
-60 -40 -20 0
20 40 60 ˚C 100
Tj
LR Y8SF
 Max. Permissible Forward Current
IF = f(T)
IF
OHL00090
35
mA
30
TS
25
TA
20
15
10
5
0
TS temp. solder point
TA temp. ambient
0
20
40
60
80 ˚C 100
T
Permissible Pulse Handling Capability
Permissible Pulse Handling Capability
IF = f(tp); D: Duty cycle; TA = 25 °C
IF = f(tp); D: Duty cycle; TA = 85 °C
OHL00687
0.6
IF
A
0.5
0.4
0.3
0.2
t
D = TP
tP
IF

IF
A
T
0.25
D=
0.20
0.005
0.01
0.02
0.05
0.1
0.2
0.5
1
0.15
0.10
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp

t
D = TP
tP
IF
T
D=
0.005
0.01
0.02
0.05
0.1
0.2
0.5
1
0.05
0.1
10 Version 1.3 | 2018-02-12
OHL00688
0.30
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp
LR Y8SF
 Dimensional Drawing
9)
0.25 (0.010)
0.20 (0.008)
0 ... 0.1 (0 ... 0.004)
(0.6 (0.024))
(0.4 (0.016))
0.5 (0.020)
1.2 (0.047)
1.0 (0.039)
(15˚)
2.1 (0.083)
0.7 (0.028)
2.3 (0.091)
Cathode
0.3 (0.012)
0.5 (0.020)
2.9 (0.114)
3.1 (0.122)
A
Light emitting area
typ. 1.7 × 0.7
1.3 (0.051)
C
1.1 (0.043)
GPLY6058
Approximate Weight:
6.0 mg
Corrosion test:
Class: 1B
Test condition: 25°C / 75 % RH / 200ppb SO2, 200ppb NO2, 10ppb H2S,
10ppb Cl2 / 21 days (EN 60068-2-60 (Method 4))


11 Version 1.3 | 2018-02-12
LR Y8SF
 Recommended Solder Pad
9)
Bauteil positioniert
Component location on pad
A
C
A
C
0.7 (0.028)
2.2 (0.087)
0.8 (0.031)
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for improved
heat dissipation
Lötstopplack
Solder resist
OHPY1315
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not
suitable for ultra sonic cleaning.


12 Version 1.3 | 2018-02-12
LR Y8SF
 Reflow Soldering Profile
Product complies to MSL Level 4 acc. to JEDEC J-STD-020D.01
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
tL
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
Profile Feature
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
Time tS
TSmin to TSmax
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature

tS
60
2
3
100
120
2
3
Unit
K/s
s
K/s
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
3
6
Ramp-down rate*
TP to 100 °C
10
Time
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
13 Version 1.3 | 2018-02-12
°C
480
s
K/s
s
LR Y8SF
 9)
2 (0.079)
3.3 (0.130)
1.25 (0.049)
8.1 (0.319)
2.4 (0.094)
1.5 (0.059)
3.5 (0.138)
4 (0.157)
1.75 (0.069)
Taping
0.9 (0.035)
1.4 (0.055)
0.3 (0.012) max.
OHAY1515


14 Version 1.3 | 2018-02-12
LR Y8SF
 Tape and Reel
10)
Reel dimensions [mm]
A
W
Nmin
W1
W2 max
Pieces per PU
180 mm
8 + 0.3 / - 0.1
60
8.4 + 2
14.4
3000
330 mm
8 + 0.3 / - 0.1
60
8.4 + 2
14.4
10000


15 Version 1.3 | 2018-02-12
LR Y8SF
 Barcode-Product-Label (BPL)
Dry Packing Process and Materials
9)
Moisture-sensitive label or print
Barcode label
L
VE
LE
see
lab
e
If
nk,
bla cod
bar
hu
ve
y
el
.
H)
(R
dit
mi
e
ed ag
%
.
RH
/60
˚C
rar ck
rel
30
N s VE RS
inf pa
%
ainITI TO
of
to ak
90
d
ntNSUC
<
ns
(pe
or
TIO
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,
cte
itio
an bje ing
U g coSEND
˚C
nd
5
˚C su ss
CO
Ais baRE
co
±
ce
y
40 be
TU MI
CThIS
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<
ll pro
tor
SE
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Ho
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urs
Ho
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lab
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eq
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or
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tin en
pro
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co
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un wh
Le ve l
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for
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for >
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po If blathi
life s
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kin Ca
(if
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thi, va p.
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Ye ar ks
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tem ted
Ye ee urs
Sh ter
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low
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>
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W Ho
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Af
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1.
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d
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4
ref
8
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req
JE
2.
bo
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Mo ore
tim
req
16
:
C/
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es dit2b
a)
St
tim
or
is IP
mior
ed
vic
tim e
b)
g e
or
Hu
en
Flo
tim
or
De
2a kin nc
te
Flo
op
a)
or
3.
b) baere
Flo
da
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l 1 2
Flo
If
al
ref
tim ve
l
4.
se
d
l 2a
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Le
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g
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TO
OP

M
RA
OS
Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
Desiccant
AM
OSR
OHA00539

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
16 Version 1.3 | 2018-02-12
LR Y8SF
 Transportation Packing and Materials
9)
DE
R
18
-1
-1
+Q
P
OU
P:
44
01
C:
99
8
D/
20
00
(9
D)
210
021
:
34
O
H
12
(Q
)Q
TY
:
S S
em R
ic AM
o
nd O
uc p
to to
H
rs
NO
TC
BA
3G
5
14
2
(6
P)
NO
: 12
T
11
00
LO
(1
T)
NO
:
OD
M
Y
DE
-1
18
P
-1
+
Q
R
G
RO
UP
:
(G
)
44
01
D/
C:
(9
D)
0
AM
00
TY
:2
)Q
O
SR
34
NO
:
(X
)
PR
O
D
5
14 2
110 0
(Q
A
R
ic
NO
:
O
S
em
S
(1
T)
LO
T
NO
(6
P)
: 12
3G
BA
TC
H
H
12
o M
n O
d
u p
ct to
o
rs
M
Muster
u L
lt S
iT Y
O T6
P 76
L
E Bi
D Bi n1
Bi n2 : P-
n3 : Q 1: -1 20
M
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2a
22 m
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24 0 p ST
Ad 26 0 C R
C
R0 ditio 0 C R
PA 77 na RT
l TE
CK
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R:
(X
)
PR
<
8
2199
2100
GR
L
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(G
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M
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lt S
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O T67
P
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Muster
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see
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lab
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nk,
cod
(R
bla
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If
ty
ba
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RH
m
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0%
e
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ive d
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lat
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30
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<
inf pa
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Ho ururs s
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Fl oo
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Fl
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Fl oo
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Barcode label
E Bi
D n1
Bi
Bi n2 : Pn3 : Q- 1: 1- 20
M
20
2 L
Te
2a
22 m
3
24 0 p ST
Ad 26 0 C R
0 C
R0 dit
ion C R
PA 77 al RT
CK
TE
VA
XT
R:
Barcode label
Packing
Sealing label
Dimensions of transportation box in mm
Width
Length
Height
200 ± 5 mm
195 ± 5 mm
30 ± 5 mm
352 ± 5 mm
352 ± 5 mm
33 ± 5 mm


17 Version 1.3 | 2018-02-12
OHA02044
LR Y8SF
 Type Designation System
Wavelength
(λdom typ.)
B:
470 nm
S:
633 nm
T:
528 nm
Y:
587 nm
R:
625 nm
O:
606 nm
G:
570 nm
CP: 560 nm
L:
Emission Color
blue
super red
true green
yellow
red
orange
green
pure green
Color coordinates according
CIE 1931/Emission color:
W:
white
Package Type
Y:
Micro SIDELED
Light
emitting
diode
L
B
Y
8
´
Lead / Package Properties
1:
2808 height: 0,8 mm
8:
Reflector Standard

Encapsulant Type / Lens Properties
7:
Colorless clear or white volume conversion
(resin encapsulation)
S:
Silicone (with or without diffuser)

Chip Technology:
6:
Standard InGalP
C:
ATON
F:
Thinfilm InGaAlP
G:
ThinGaN (Thinfilm InGaN)
(Subcon: Sapphire)
S:
standard InGaN low current
18 Version 1.3 | 2018-02-12
7
C
LR Y8SF
 Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from
these devices. As a matter of principle, however, it should be mentioned that intense light sources have a
high secondary exposure potential due to their blinding effect. As is also true when viewing other bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize LED exposure to aggressive substances during storage, production, and use. LEDs that showed visible discoloration when tested using the described tests above did
show no performance deviations within failure limits during the stated test duration. Respective failure limits
are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes


19 Version 1.3 | 2018-02-12
LR Y8SF
 Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer.


20 Version 1.3 | 2018-02-12
LR Y8SF
 Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2)
Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed.
3)
Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal reproducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k =
3).
4)
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
5)
Thermal Resistance: Rth max is based on statistic values (6σ).
6)
Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)
7)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data
or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical
data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical
improvements, these typ. data will be changed without any further notice.
8)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single LEDs within one packing unit.
9)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
10)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.


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