LV88551 Motor Driver, Single-Phase, PWM, Full-Wave, BLDC Motor Overview www.onsemi.com The LV88551JA/R is the pre−driver for a single−phase BLDC motor, which has the closed loop controller for motor rotation speed. This is available to control a motor with low vibration and the low noise. In addition, lead−angle adjustment is possible by external pins. Lead−angle value and lead−angle slant can be adjusted independently. Thus, the device can be driven by high efficiency and low noise with various motors. Motor speed setting curve is adjustable for many variety using external resistor only. As a method of the rotary speed control of the motor, direct−PWM pulse input. MARKING DIAGRAMS ON XXXXXXX ALYWG SSOP20J CASE 565AP (LV88551JA) Features • Single−phase Full Wave Drive Pre−driver Include Closed Loop • • • • • • • • • Speed Control Speed Control Function by PWM Duty Input (25 Hz to 100 kHz) Soft Start−up Function and PWM Soft Switching Phase Transition Soft PWM Duty Cycle Transitions Built−in Current Limit Circuit and Thermal Protection Circuit Built−in Locked Rotor Protection and Auto Recovery Circuit FG Signal Output Dynamic Lead Angle Adjustment with Respect to Rotational Speed Lead−angle Control Parameters can be Configured These are Pb−Free Devices Typical Applications • PC & Computing Equipment • Refrigerator • Games XXXXX ALYW VCT20 CASE 601AB (LV88551R) XX A L YW G = Specific Device Code = Assembly Site (OSPI Tarlac Site Code: MP) = Wafer Lot Number = Assembly Start Week = Pb−Free Package ORDERING INFORMATION Device Package Shipping† LV88551JA−AH SSOP20J (Pb−Free / Halogen Free) 2000 / Tape & Reel LV88551RTXG VCT20 (Pb−Free / Halogen Free) 2000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2016 April, 2018 − Rev. 3 1 Publication Order Number: LV88551/D LV88551 BLOCK DIAGRAM 20 O2H O1L 1 Pre Driver O1H 2 19 O2L Current Limiter Level Shift 18 RF VCC 3 REG 4 5V Regulator OSC 17 GND VDD 5 Duty counter PIX 6 16 PWM 15 LAI Drive Control Logic A−D converter PIZ 7 14 LAG A−D converter RSA 8 13 SFS RSB 9 12 IN2 FG 10 Lock Detection TSD Figure 1. LV88551JA Block Diagram www.onsemi.com 2 11 IN1 LV88551 APPLICATION CIRCUIT DIAGRAM Power supply R20 R18 C6 C4 MP1 R14 MP2 R16 MN1 R15 M MN2 C5 R17 C7 R21 R19 R0 Power supply 1 O1L O2H 20 2 O1H O2L 19 3 VCC RF 18 4 REG GND 17 5 VDD PWM 16 6 PIX LAI 15 7 PIZ LAG 14 8 RSA SFS 13 9 RSB IN2 12 10 FG IN1 11 C0 R13 C3 C1 R1 R4 R2 R5 R3 R6 Control signal input (Pulse) R10 R11 R12 R7 Rotational signal output R8 C8 H R9 Figure 2. Single−phase BLDC Motor Drive with LV88551JA www.onsemi.com 3 LV88551 Table 1. EXAMPLE COMPONENT VALUE Device Value Device Value MP1+MN1 FW4604 R14 100 W MP2+MN2 FW4604 R15 100 W R16 100 W R0 0.051 W // 0.051 W R17 100 W R1 0 to 50 kW R18 * R2 0 to 50 kW R19 * R3 0 to 50 kW R20 * R4 0 to 50 kW R21 * R5 0 to 50 kW R6 0 to 50 kW C0 4.7 mF −10 mF R7 0 to 50 kW C1 0.1 mF − 1 mF R8 0 to 50 kW C3 ** R9 2.2 kW C4 0 to 1500 pF R10 0 to 50 kW C5 0 to 1500 pF R11 0 to 50 kW C6 0 to 1500 pF R12 0 to 50 kW C7 0 to 1500 pF R13 0W C8 0 to 0.1 mF *lt depends on the user’s circuit, MP1, MP2, MN1 and MN2. **It depends on the user’s environment. Table 2. TRUTH TABLE Operating state Rotation − drive mode Rotation – regeneration mode Lock protector IN1 IN2 Inner−PWM State* O1H O1L O2H O2L FG L H On H H L L OFF H L L L H H L L H H H H H OFF H L H H H H L L H H L H L OFF H L H L H L L Off − *Inner PWM state means the OUTPUT active period decided by inner control logic. Don’t match PWM−pin input signal. www.onsemi.com 4 LV88551 PIN ASSIGNMENT SSOP20J (225 mil) O1L 1 20 O2H O1H 2 19 O2L VCC 3 18 RF REG 4 17 GND VDD 5 PIX 6 15 LAI PIZ 7 14 LAG RSA 8 13 SFS RSB 9 12 IN2 FG 10 11 16 PWM (Top View) IN1 Figure 3. LV88551JA Pin Assignment VCT20 3x3 O1H O1L O2H O2L RF 20 19 18 17 16 VCC 1 15 GND REG 2 14 PWM VDD 3 13 LAI PIX 4 12 LAG PIZ 5 11 SFS (Top View) 6 RSA 7 RSB 8 9 FG IN1 10 IN2 Figure 4. LV88551R Pin Assignment www.onsemi.com 5 LV88551 Table 3. PIN FUNCTION DESCRIPTION (Pin No. – SSOP20J Version) Pin No. Pin name Function 1 19 O1L O2L Output pins of the low−side gate−drive signal. (See “Truth table” on page 4 for the polarity) 2 20 O1H O2H Output pins of the high−side gate−drive signal. (See “Truth table” on page 4 for the polarity) 3 VCC Power supply pin. The input voltage to this pin must be stabilized without the influence of the noise, ripple, and etc. Therefore, it is necessary to connect the capacitor near VCC pin and GND pin as much as possible. It must be over 1 mF about the value of this capacitor. Not to detach it. 4 REG The output pin of the regulated voltage (5.0 V). It is necessary to connect the capacitor near this pin and GND pin for stabilizing this regulated voltage. 5 VDD Logic circuit power supply pin. This pin should be shorted to REG pin. 6 7 PIX PIZ The pin to adjust the value of PWM input duty for the point of maximum or minimum rotation speed. 8 9 RSA RSB The pin to adjust the target value of maximum or minimum rotation speed. 10 FG The output pin of the rotational signal. When not using it, this pin should be opened [not connected]. 11 12 IN1 IN2 Input pins of hall signals. 13 SFS The pin to adjust the soft start state and dead time. 14 LAG The pin to adjust the gradient of lead angle for PWM input duty. 15 LAI The pin to adjust the initial lead angle in minimum rotation speed. 16 PWM The input pin of the speed control signal as the rectangular wave. 17 GND GND pin. 18 RF The pin to detect the output current. When the voltage level at this pin exceeds the internal set detection level, outputs turn to the regenerating mode. www.onsemi.com 6 LV88551 Table 4. MAXIMUM RATINGS Symbol Conditions Ratings Unit Maximum supply voltage Parameter VCCmax VCC pin 20 V Maximum output voltage VOUTmax O1H/O1L/ O2H/O2L pin 20 V Maximum output current IOUTmax O1H/O1L/ O2H/O2L pin 50 mA Maximum output peak current (Note 1) IOUTpeak O1H/O1L/ O2H/O2L pin 150 mA REG pin maximum output current IREGmax REG pin 20 mA RSA/RSB/PIX/PIZ/LAI/LAG/SFS/IN1/IN2/RF pin maximum input voltage VIN max RSA/RSB/PIX/PIZ/ LAI/LAG/IN1/IN2/ SFS/RF pin 5.5 V VPWMmax PWM pin 5.5 V FG pin withstanding voltage VFGmax FG pin 20 V FG pin maximum output current IFGmax FG pin 10 mA Allowable power dissipation (Note 2) Pdmax LV88551JA 0.8 W Allowable power dissipation (Note 3) Pdmax LV88551R 1.0 W Topr −40 to +105 °C Tstg −55 to +150 °C Tjmax 150 °C PWM pin maximum input voltage Operating temperature Storage temperature Maximum junction temperature Moisture Sensitivity Level (MSL) (Note 4) MSL LV88551JA 3 − Moisture Sensitivity Level (MSL) (Note 4) MSL LV88551R 1 − Lead Temperature Soldering Pb−Free Versions (30s or less) (Note 5) TSLD 255 °C ±2000 V ESD Human body Model: HBM (Note 6) ESDHBM Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IOUTpeak is the peak value of the motor supply current with duty_cycle < 5%. 2. Specified circuit board : 114.3 mm x 76.1 mm x 1.6 mm, glass epoxy single layer board. It has 1 oz internal power and ground planes and 1/2 oz copper traces. Please refer to Thermal Test Conditions on page 23. 3. Specified circuit board : 50.0 mm x 40.0 mm x 0.8 mm, glass epoxy 4−layer board. It has 1 oz internal power and ground planes and 1/2 oz copper traces on top and bottom of the board. Please refer to Thermal Test Conditions on page 23. 4. Moisture Sensitivity Level (MSL): IPC/JEDEC standard: J−STD−020A. 5. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D http://www.onsemi.com/pub_link/Collateral/SOLDERRM−D.PDF. 6. ESD Human Body Model is based on JEDEC standard: JESD22−A114. Table 5. THERMAL CHARACTERISTICS Parameter Symbol Value Unit Thermal Resistance, Junction−to−Ambient (Note 7) LV88551JA RqJA 156 °C/W Thermal Resistance, Junction−to−Ambient (Note 8) LV88551R RqJA 125 °C/W 7. Specified circuit board : 114.3 mm x 76.1 mm x 1.6 mm, glass epoxy single layer board. It has 1 oz internal power and ground planes and 1/2 oz copper traces . Please refer to Thermal Test Conditions on page 23. 8. Specified circuit board : 50.0 mm x 40.0 mm x 0.8 mm, glass epoxy 4−layer board. It has 1 oz internal power and ground planes and 1/2 oz copper traces on top and bottom of the board. Please refer to Thermal Test Conditions on page 23. www.onsemi.com 7 LV88551 LV88551JA LV88551R 1.2 Allowable dissipation Pdmax(W) Board Mounted (114.3 mm x 76.1 mm x 1.6 mm) glass epoxy 0.8 0.6 0.4 0.29 0.2 Allowable dissipation Pdmax(W) 1.0 0.0 Board Mounted (50.0 mm x 40.0 mm x 0.8 mm) glass epoxy 1.0 0.8 0.6 0.36 0.4 0.2 0.0 −40 10 60 −40 110 TA, TEMPERATURE (°C) 10 60 110 TA, TEMPERATURE (°C) Figure 5. Power Dissipation vs Ambient Temperature Characteristic Table 6. RECOMMENDED OPERATING RANGES (Note 9) Parameter Symbol Conditions Ratings Unit VCC supply voltage VCCtyp VCC pin 12 V VCC operating supply voltage range1 VCCop1 VCC pin 6.0 to 16 V VCC operating supply voltage range2 (Note 10) VCCop2 VCC pin 3.9 to 6.0 V Fpwm PWM pin 25 to 100k Hz PWM input frequency range PWM minimum input low/high pulse width Twpwm PWM pin 100 ns IN1 input voltage range Vin1 IN1 pin 0 to VREG V IN2 input voltage range Vin2 IN2 pin 0.3 to 0.55*VREG V Control input voltage range Vcnth RSA/RSB/PIX/ PIZ/LAI/LAG/SFS pin 0 to VREG V 9. Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 10. When the VCC voltage below 6.0 V, motor rotation function keep to normally until to 3.9 V. But there are possibility that the ELECTRICAL CHARACTERISTICS is varied. www.onsemi.com 8 LV88551 Table 7. ELECTRICAL CHARACTERISTICS at TA = 25°C, VCCOP = 12 V unless otherwise noted. (Note 11) Ratings Symbol Parameter Circuit current Conditions Min ICC Typ Max Unit 9 16 mA O1H/O1L/O2H/O2L High−side on−resistance ROHon IO = 10 mA 30 80 W O1H/O1L/O2H/O2L Low−side on−resistance ROLon IO = 10 mA 30 80 W O1H/O1L/O2H/O2L PWM output frequency fpwmo 45.6 48 50.4 kHz PWM pin low level input voltage Vpwml 0 0.7 V PWM pin high level input voltage Vpwmh 2.8 PWM input resolution Dpwm FG pin low level output voltage Vfgl IFG = 5 mA FG pin leak current Ifglk VCC = 16 V VFG = 16 V REG pin output voltage VREG Lock−detection time1 (Note 12) Lock−detection time2 (Note 13) Lock−Stop release time1 from 1st to 4th off time Lock−Restart on time Lock−Restart time ratio1 Lock−Stop release time2(Note 14) as from off time mA 4.7 5.0 5.3 V 0.33 S Tld2 Start−up 0.63 0.7 0.77 S Tlroff1 3.1 3.5 3.9 S Tlron 0.63 0.7 0.77 S Tlroff1/Tlron Tlroff2 5 12.5 Thermal protection detection temperature Tthp (Design target) DTthp (Design target) Current limit detection voltage VTHCLM RF−GND REG pin output voltage load regulation DVregld Ihin Control input bias current 1 0.3 Tlroff2/Tlron Hall input sensitivity V 0.27 Rlr2 Hall input bias current 0.3 Under rotation Lock−Restart time ratio2(Note 14) as from 5th off time Thermal protection detection hysteresis 0.2 V Bit Tld1 Rlr1 5th 5.5 8 150 14 − 15.5 S 20 − 180 °C 40 °C 0.10 0.11 V IREG = −10 mA 20 50 mV IN1, IN2 = 0 V 0 1 mA DVhin 0.09 40 mV 0 1 mA 14 28 42 mA VCC voltage 3.1 3.4 3.6 V VCC voltage 3.3 3.6 3.9 V 0.1 0.2 0.4 V Ictlin PIX, PIZ, RSA, RSB, SFS, LAG, LAI = 0 V PWM input bias current Ipwmin VDD = 5.5 V, PWM = 0 V UVLO detection voltage Vuvdet UVLO release voltage Vuvrls UVLO hysteresis voltage DVuv 11. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 12. When the motor rotate state, and the motor rotation speed reach to below 50 rpm (phase change period over 0.3s), lock protection function work. 13. When the motor start−up timing, the motor can’t rotate until 0.7s, lock protection function work. 14. When the locked rotor state is continued to long time, lock stop period change as from 5th off time. www.onsemi.com 9 LV88551 TYPICAL CHARACTERISTICS Figure 6. www.onsemi.com 10 LV88551 EQUIVALENT CIRCUIT VCC VCC REG ( VCC-5V ) O1L O1H VDD O2L O2H GND Figure 8. REG Equivalent Circuit GND Figure 7. O1L, O1H, O2L and O2H Equivalent Circuit VDD VCC GND GND Figure 9. VCC Equivalent Circuit Figure 10. VDD Equivalent Circuit VDD IN1 SFS LAG GND GND Figure 11. IN1, IN2 Equivalent Circuit Figure 12. SFS, LAG Equivalent Circuit PIX GND GND Figure 13. LAI Equivalent Circuit Figure 14. PIX, PIZ Equivalent Circuit www.onsemi.com 11 LV88551 VCC RSA FG GND Figure 15. RSA, RSB Equivalent Circuit Figure 16. FG Equivalent Circuit VDD VDD RF PWM GND GND Figure 18. RF Equivalent Circuit Figure 17. PWM Equivalent Circuit www.onsemi.com 12 LV88551 STATE DIAGRAM Figure 19. State Diagram www.onsemi.com 13 LV88551 FUNCTIONAL DESCRIPTION Current Sense Resistor Pin (RF) When the pin is not used, it must be connected to ground. The minimum pulse width is 100 ns. RF is current sense input terminal. Voltage across the sense resistor represents the motor current and is compared against the internal VTHOVC (0.10 Vtyp.) for setting the over−current limiter (CLM). Lead−Angle Setting Pin (LAI, LAG) LV88551JA/R provides the dynamic lead angle adjustment. To match the motor characteristics, set two point lead−angel amounts, low speed side (set by LAI pin) and high speed side(set by LAG pin). At middle range of input duty, the lead−angle amounts applied to calculated value for relative relationship. The DC voltage levels applied to these pins are converted to the lead angle parameter. The voltages are fetched right after the power−on−reset. Because the internal conversion circuit works inside REG power rail, it is recommended that the LAI and LAG voltages are made from VREG. VCC and GND Pin (VCC, GND) Since Power FET side ground line has to tolerate surge of current, separate it from the GND pin as far away as possible and connect it point−to−point to the ground side of the capacitor (C0) between VCC and GND. Internal 5.0V Voltage Regulator Pin (REG, VDD) REG is internal 5.0 V voltage regulator. VDD is power supply for internal logic, oscillator, and protection circuits. Please connect REG and VDD. When PIX, PIZ, RSA, RSB, LAI, LAG and SFS are used, it is recommended that application circuits are made using this output. The maximum load current of REG is 20 mA. Warn not to exceed this. Place capacity from 0.1 mF to 1.0 mF in the close this pin. Rotation Speed Setting Pin (RSA, RSB) LV88551JA/R provides the feedback speed control, so this device can set the rotation speed value (RPM) directly. To make the motor speed setting curve, set two point rotation speed value, high speed side and low speed side. The DC voltage levels applied to these pins are converted to the rotation speed parameter. The voltages are fetched right after the power−on−reset. Because the internal conversion circuit works inside REG power rail, it is recommended that the RSA and RSB voltages are made from VREG. Rotational Signal Pin (FG) Frequency of the FG output represents the motor’s electrical rotational speed. It is an open drain output. Recommended pull up resistor value is 1 kW to 100 kW. Leave the pin open when not in use. Rotation Speed Curve Duty Setting Pin (PIX, PIZ) Output Pins for External FET Control (O1H, O1L, O2H, O2L) To make the motor speed setting curve, set two point input duty parameter, high speed side and low speed side. The DC voltage levels applied to these pins are converted to the input duty parameter. The voltages are fetched right after the power−on−reset. Because the internal conversion circuit works inside REG power rail, it is recommended that the PIX and PIZ voltages are made from VREG. These pins are output for external MOSFET. O1H and O2H connect to upper side P−ch FET’s gate−line. O1L and O2L connect to lower side N−ch FET’s gate line. Hall−Sensor Input Pins (IN1, IN2) Differential output signals of the hall sensor are to be interfaced at IN1 and IN2. It is recommended that 0.01 mF capacitor is connected between both pins to filter system noise. When a Hall IC is used, the output of the Hall IC must be connected to the pin IN1. And, the pin IN2 must be kept in the middle level of the Hall IC power supply voltage. Soft−Start and Dead Time Setting Pin (SFS) LV88551JA/R provides synchronous rectification drive for high efficiency drive. External FET size is variable caused by the motor application. So this driver IC is able to choose 2 type dead time. Soft start function pattern is able to choose from 16 types. The DC voltage levels applied to these pins are converted to the soft−start setting and dead time parameter. The voltage is fetched right after the power−on−reset. Because the internal conversion circuit works inside REG power rail, it is recommended that the SFS voltage is made from VREG. Command Input (PWM) This pin reads the duty cycle of the PWM pulse and controls rotational speed. The PWM input signal level is supported from 2.5 V to 5 V. The combination with the rotational speed control by DC voltage, is impossible. www.onsemi.com 14 LV88551 DETAILED DESCRIPTION When the input duty is lower than LSP setting duty, the LV88551JA/R can select “motor stop” or “keep LSP rotation speed”. When the input duty is higher than HSP setting duty, the LV88551JA/R can select “free run” or “keep HSP rotation speed”. Rotation speed of LSP and HSP is set by RSA and RSB pin. The case of RSA > RSB, “motor stop” mode applied. The case of RSA < RSB, “keep LSP rotation speed” mode applied. Input duty of LSP and HSP is set by PIX and PIZ pin. The case of PIX > PIZ, “free run” mode applied. The case of PIX < PIZ, “keep HSP rotation speed” mode applied. So LV88551JA/R can’t set decease speed curve at input duty increase. Figures 21 − 24 show setting curve example. As for all numerical value used in this description, the design value or the typical value is used. Rotation Speed Curve Setting Description The LV88551JA/R can set 2 points speed parameter arbitrarily. Low speed point (LSP) High speed point (HSP) And at middle range of input duty, the rotation speed applied to calculated value for relative relationship. HSP LSP Figure 20. HSP Target speed adjust by RSB pin Target speed adjust by RSA pin LSP Duty adjust by PIX pin Duty adjust by PIZ pin Figure 21. Speed Setting Curve Type Example 1 Minimum Speed Set and Maximum Speed Set www.onsemi.com 15 LV88551 HSP Target speed adjust by RSA pin Target speed adjust by RSB pin LSP Duty adjust by PIX pin Duty adjust by PIZ pin Figure 22. Speed Setting Curve Type Example 2 Motor Stop Mode and Maximum Speed Set HSP Target speed adjust by RSA pin Target speed adjust by RSB pin LSP Duty adjust by PIZ pin Duty adjust by PIX pin Figure 23. Speed Setting Curve Type Example 3 Motor Stop Mode and Free Run Mode HSP Target speed adjust by RSB pin Target speed adjust by RSA pin LSP Duty adjust by PIX pin Duty adjust by PIZ pin Figure 24. Speed Setting Curve Type Example 4 Minimum Speed Set and Free Run Mode www.onsemi.com 16 LV88551 Table 8. ROTATION SPEED SETTING TABLE FOR RSA/RSB PIN A−D code 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 RPM 0 0 0 0 0 0 400 410 420 430 440 450 460 470 480 490 500 510 520 530 540 550 560 570 580 590 600 610 620 630 640 650 660 670 680 690 700 710 720 730 740 750 760 770 780 790 800 810 820 830 840 850 860 870 880 890 900 910 920 930 940 950 960 970 A−D code 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 RPM 980 990 1000 1010 1020 1030 1040 1050 1060 1080 1100 1120 1140 1160 1180 1200 1220 1240 1260 1280 1300 1320 1340 1360 1380 1400 1420 1440 1460 1480 1500 1520 1540 1560 1580 1600 1620 1640 1660 1680 1700 1720 1740 1760 1780 1800 1820 1840 1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 2060 2080 2100 2120 2140 2160 A−D code 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 RPM 2180 2200 2220 2240 2260 2280 2300 2320 2340 2360 2380 2400 2420 2440 2460 2480 2500 2520 2540 2560 2600 2650 2700 2750 2800 2850 2900 2950 3000 3050 3100 3150 3200 3250 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 3850 3900 3950 4000 4050 4100 4150 4200 4250 4300 4350 4400 4450 4500 4550 4600 4650 4700 4750 A−D code 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 209 210 211 212 213 214 215 216 217 218 219 220 221 222 223 224 225 226 227 228 229 230 231 232 233 234 235 236 237 238 239 240 241 242 243 244 245 246 247 248 249 250 251 252 253 254 255 RPM 4800 4850 4900 4950 5000 5050 5100 5150 5200 5300 5400 5500 5600 5700 5800 5900 6000 6100 6200 6300 6400 6500 6600 6700 6800 6900 7000 7100 7200 7300 7400 7500 7600 7700 7800 7900 8000 8100 8200 8300 8400 8500 8600 8700 8800 8900 9000 9100 9200 9300 9400 9500 9600 9700 9800 9900 10000 10100 10200 10300 10400 10500 10600 10700 A−D code 256 257 258 259 260 261 262 263 264 265 266 267 268 269 270 271 272 273 274 275 276 277 278 279 280 281 282 283 284 285 286 287 288 289 290 291 292 293 294 295 296 297 298 299 300 301 302 303 304 305 306 307 308 309 310 311 312 313 314 315 316 317 318 319 RPM 10800 10900 11000 11100 11200 11300 11400 11500 11600 11700 11800 11900 12000 12100 12200 12300 12400 12500 12600 12700 12800 12900 13000 13100 13200 13300 13400 13500 13600 13700 13800 13900 14000 14100 14200 14300 14400 14500 14600 14700 14800 14900 15000 15100 15200 15300 15400 15500 15600 15700 15800 15900 16000 16100 16200 16300 16400 16500 16600 16700 16800 16900 17000 17100 www.onsemi.com 17 A−D code 320 321 322 323 324 325 326 327 328 329 330 331 332 333 334 335 336 337 338 339 340 341 342 343 344 345 346 347 348 349 350 351 352 353 354 355 356 357 358 359 360 361 362 363 364 365 366 367 368 369 370 371 372 373 374 375 376 377 378 379 380 381 382 383 RPM 17200 17300 17400 17500 17600 17700 17800 17900 18000 18100 18200 18300 18400 18500 18600 18700 18800 18900 19000 19100 19200 19300 19400 19500 19600 19700 19800 19900 20000 20100 20200 20300 20400 20500 20600 20700 20800 20900 21000 21100 21200 21300 21400 21500 21600 21700 21800 21900 22000 22100 22200 22300 22400 22500 22600 22700 22800 22900 23000 23100 23200 23300 23400 23500 A−D code 384 385 386 387 388 389 390 391 392 393 394 395 396 397 398 399 400 401 402 403 404 405 406 407 408 409 410 411 412 413 414 415 416 417 418 419 420 421 422 423 424 425 426 427 428 429 430 431 432 433 434 435 436 437 438 439 440 441 442 443 444 445 446 447 RPM 23600 23700 23800 23900 24000 24100 24200 24300 24400 24500 24600 24700 24800 24900 25000 25100 25200 25300 25400 25500 25600 25700 25800 25900 26000 26100 26200 26300 26400 26500 26600 26700 26800 26900 27000 27100 27200 27300 27400 27500 27600 27700 27800 27900 28000 28100 28200 28300 28400 28500 28600 28700 28800 28900 29000 29100 29200 29300 29400 29500 29600 29700 29800 29900 A−D code 448 449 450 451 452 453 454 455 456 457 458 459 460 461 462 463 464 465 466 467 468 469 470 471 472 473 474 475 476 477 478 479 480 481 482 483 484 485 486 487 488 489 490 491 492 493 494 495 496 497 498 499 500 501 502 503 504 505 506 507 508 509 510 511 RPM 30000 30100 30200 30300 30400 30500 30600 30700 30800 30900 31000 31100 31200 31300 31400 31500 31600 31700 31800 31900 32000 32100 32200 32300 32400 32500 32600 32700 32800 32900 33000 33100 33200 33300 33400 33500 33600 33700 33800 33900 34000 34100 34200 34300 34400 34500 34600 34700 34800 34900 35000 35100 35200 35300 35400 35500 35600 35700 35800 35900 36000 36000 36000 36000 LV88551 Figure 25. A−D Code Figure for RSA/RSB Pin Voltage of RSA/RSB is calculated by below formula. VRSA, VRSB[V] + VREG 512 Target RPMȀs A_D code (eq. 1) Figure 26. Input Duty Parameter Setting for PIX/PIZ Pin Voltage of PIX/PIZ is calculated by below formula. VPIX, VPIZ[V] + VREG Lead−Angle Setting Description Target Duty[%] (eq. 2) 100 LSP’s value set by LAI pin HSP’s value set by LAG pin. At middle range of input duty, the lead−angle amounts applied to calculated value for relative relationship. LV88551JA/R provides the dynamic lead angle adjustment. To match the motor characteristics, set two points lead−angel amounts. Settable range is −22.225° to +22.225° (0.175° step). LV88551JA/R can set delay angle setting. Minus value means delay angle. Figure 27. Lead−Angle Parameter Setting for LAI/LAG Pin Voltage of LAI/LAG is calculated by below formula. VLAI, VLAG[V] + VREG ) VREG 2 Target Lead Angle Value [° ] www.onsemi.com 18 44.45 (eq. 3) LV88551 Lead angle amounts of LSP and HSP doesn’t care each relationship of large/small. HSP LSP Figure 28. Figure 29. Lead Angel Image Waveform Soft Start Setting Description When reach to release condition, change to closed− loop speed control mode. If the motor can’t rotation during 0.7s (typ) , lock protection function works. The recommendation of soft−start time is 1.72 s. Hence, it can be set by A−D code “0” and “31” for easy implementation by pin pull−down or pull−up. LV88551JA/R has soft start function. To avoid the motor rush current, when the motor booting timing output PWM duty rise−up from zero slowly. The soft start action release conditions are below − Rotation speed reach to target speed decided by PWM input. − Output duty reach to “Release duty”. www.onsemi.com 19 LV88551 A−D code 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Soft−start time(s) Release duty(%) 1.72 0.03 0.86 2.58 3.44 5.16 8.6 17.2 10 5 3 2 1.5 1 0.5 0.02 0.02 0.5 1 1.5 2 3 5 10 17.2 8.6 5.16 3.44 2.58 0.86 0.03 1.72 86 86 86 86 86 86 86 86 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 86 86 86 86 86 86 86 86 Dead time(us) 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Figure 30. Soft−start and Dead Time Setting Table for SFS Pin Figure 31. A−D code Figure for SFS Pin Voltage of SFS is calculated by below formula. VREG 32 Target SettingȀs A_D Code (eq. 4) DUTY VSFS[V] + Output Waveform LV88551JA/R output PWM frequency is fixed by inner oscillator parameter, 48 kHz (typ) Not concern with input PWM frequency. Driving method of LV88551JA/R using PWM soft switching drive with synchronous rectification. Soft switching width is changed by input PWM duty. When the input duty is HSP setting duty, soft switching width is narrow (S/L = 20.5%) On the other hand when the input duty is LSP setting duty, soft switching width becomes wide (S/L = 46.9%) TIME Figure 32. In this part, the rise/fall time of soft switching waveform is equal. Therefore, the “S” in the figure can be also applied to fall time. www.onsemi.com 20 LV88551 Current Limiter (CLM) At the middle range input duty, the soft switching width is applied to calculated value for relative relationship. When the coil current increases and the voltage of the RF pin rises to 0.1 V (typ), the CLM operates and shut the coil current. CLM current is adjustable by resistor value between RF−GND. The sense resistor value is calculated as follows. Protections LV88551JA/R has some protection function. − Thermal shutdown protection (TSD) − Under voltage lock out (UVLO) − Current limiter (CLM) − Lock protection When the TSD or Lock protection worked, external FETs are all turn off. The other hand, when UVLO or CLM worked, output is PWM off and becomes re−circulation state. Sense Resistor[W] + VTH CLM[V] I CLM[A] (eq. 5) For example, to set the CLM current threshold at 2 A, the sense resistor value is Sense Resistor + 0.10(typ) 2.0 Res + 0.05 [W] Thermal Shutdown Protection (TSD) When this IC’s junction temperature rise to 180°C (typ), O1H/O2H output turn to high, and O1L/O2L output turn to low. External FETs are all turn off and coil current shut off. Next, IC’s junction temperature fall to 150°C (typ), thermal shutdown function is released and motor start to rotate. (eq. 6) Lock Detection and Lock Protection When the motor lock is happened, heat is generated because IC continues to supply electricity to the motor. And IC detects this radiated heat and turns off the electricity to the motor. Under motor rotation state, if this IC does not receive the FG edge for 0.3sec (under 50 rpm),This IC judges “ motor lock” and operates lock protection function. Under Voltage Lock Out (UVLO) UVLO work voltage: VCC 3.4 V (typ) UVLO release voltage: VCC 3.6 V (typ) Motor Re−rotation Motor Lock IN1-IN2 OUT1 OUT2 FG 3.5sec Motor Lock Protection 0.3sec(typ) Stand-by for FG-pulse Figure 33. Soft-Start Re − Start After 5th protection time, the lock protection time becomes 14s and protection−start time ratio is approx. 1:20 (after 5th protection time) It takes 3.5 s for lock protection time (1st to 4th protection time). This equals to the total of lock detection time and lock protection time. The lock detection time − the lock protection time ratio is approx. 1:5 (from 1st to 4th protection time). www.onsemi.com 21 LV88551 Motor Lock 0.7sec(typ) (Stand−by for FG−pulse) OUT1 OUT2 FG 14sec(typ) (Motor Lock Protection) 3.5sec(typ) 1st to 4th (Motor protection time Lock Protection) Figure 34. www.onsemi.com 22 After 5th protection time LV88551 PCB GUIDELINES VCC and Ground Routing alternative use. When the battery line is extended, (20−30 cm to 2−3 m), the battery voltage may overshoot when the power is supplied due to the impact of the routing of the inductance. Make sure that the voltage does not exceed the absolute maximum standard voltage when the power supply turns on. These capacitance values are just for reference, so the confirmation with the actual application is essential to determine the values appropriately Make sure to short−circuit power line externally by a low impedance route on one side of PCB. As high current flows into external FET to GND, connect it to GND through a low impedance route. The capacitance connected between the VCC pin and the opposite ground is to stabilize the battery. Make sure to connect an electrolytic capacitor with capacitance value of about 10 mF (4.7 mF or greater) to eliminate low frequency noise. Also, to eliminate high frequency noise, connect a capacitor of superior frequency characteristics, with capacitance value of about 0.1 mF and make sure that the capacitor is connected as close to the pin as possible. Allow enough room in the design so the impact of PWM drive and kick−back does not affect other components. Especially, when the coil inductance is large and/or the coil resistance is small, current ripple will rise so it is necessary to use a high−capacity capacitor with superior frequency characteristics. Please note that if the battery voltage rises due to the impact of the coil kick−back as a result of the use of diode for preventing the break down caused by reverse connection, it is necessary to either increase the capacitance value or place Zener diode between the battery and the ground so that the voltage does not exceed absolute maximum voltage. When the electrolytic capacitor cannot be used, add the resistor with the value of about 1 W and a ceramic capacitor with the capacitor value of about 10 mF in series for the RF Routing Power current (output current) flows through the RF line. Make sure to short−circuit the line from RF through GND as well as GND. The RF resistance must choose the enough power rating External FET Output Pins Since the pins have to tolerate surge of current, make sure that the wires are thick and short enough when designing the PCB board. Thermal Test Conditions LV88551JA Size: 114.3 mm x 76.1 mm x 1.6 mm Material: Glass epoxy single layer board LV88551R Size: 50.0 mm x 40.0 mm x 0.8 mm Material: Glass epoxy 4−layer board www.onsemi.com 23 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SSOP20J (225mil) CASE 565AP ISSUE A DATE 23 OCT 2013 SOLDERING FOOTPRINT* GENERIC MARKING DIAGRAM* 5.80 (Unit: mm) 1.0 0.32 XXXXXXXXXX YMDDD 0.50 XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data NOTE: The measurements are not to guarantee but for reference only. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: 98AON66067E ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 SSOP20J (225MIL) http://onsemi.com 1 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON66067E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION FROM SANYO ENACT# S−436 TO ON SEMICONDUCTOR. REQ. BY D. TRUHITTE. 30 JAN 2012 A ADDED MARKING AND SOLDER FOOTPRINT INFORMATION. REQUESTED BY D. TRUHITTE. 23 OCT 2013 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2013 October, 2013 − Rev. A Case Outline Number: 565AP MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS VCT20 3x3, 0.5P CASE 601AB ISSUE A DATE 15 NOV 2013 GENERIC MARKING DIAGRAM* XXXXXX YMDDD XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data XXXXXX YDD XXXXX = Specific Device Code Y = Year DD = Additional Traceability Data *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DOCUMENT NUMBER: STATUS: 98AON78679E ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 VCT20 3X3, 0.5P http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 3 VCT20 3x3, 0.5P CASE 601AB ISSUE A DATE 15 NOV 2013 SOLDERING FOOTPRINT* 2.70 2.70 (Unit: mm) 0.70 0.20 0.30 0.50 NOTE: The measurements are not to guarantee but for reference only. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: 98AON78679E ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 VCT20 3X3, 0.5P http://onsemi.com 2 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 2 OFXXX 3 DOCUMENT NUMBER: 98AON78679E PAGE 3 OF 3 ISSUE REVISION DATE O RELEASED FOR PRODUCTION FROM SANYO ENACT# S−387 TO ON SEMICONDUCTOR. REQ. BY D. TRUHITTE. 29 FEB 2012 A ADDED MARKING AND SOLDER FOOTPRINT INFORMATION. REQ. BY D. TRUHITTE. 15 NOV 2013 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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