FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch Features Description ■ Maximum 1.15Ω On Resistance (RON) for 4.5V Supply The FSA2257 is a high-performance bi-directional dual Single-Pole/Double-Throw (SPDT) analog switch. This switch can be configured as either a multiplexer or a demultiplexer by select pins. The device features ultra-low RON of 1.3Ω maximum at 4.5V VCC and operates over the wide VCC range of 1.65V to 5.5V. The device is fabricated with submicron CMOS technology to achieve fast switching speeds and is designed for break-before-make operation. The select input is TTL-level compatible. ■ 0.3Ω Maximum RON Flatness for +5V Supply ■ Space-Saving Pb-Free MicroPak™ Packaging ■ Broad VCC Operating Range: 1.65V to 5.5V ■ Fast Turn-on / Turn-off Time ■ Break-Before-Make Enable Circuitry ■ Over-Voltage Tolerant TTL-Compatible Control Input Applications ■ Cell Phone ■ PDA ■ Ultra-Portable Ordering Information Order Number FSA2257L10X(1) FSA2257MTCX (1) FSA2257MUX(1) Package Product Code Number Pb-Free Top Mark MAC010A Yes Package Description Packing Method EP 10-Lead MicroPak™, 1.6 x 2.1mm 5000 Units on Tape and Reel 2500 Units on Tape and Reel 4000 Units on Tape and Reel MTC14 Yes FSA2257 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MUA101A Yes FSA 2257 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Note: 1. Lead-free package per JEDEC J-STD-020B. Device available in tape and reel only. 32Ω Earpiece Base Band Voice/Bell Ring Base Band Processors with Melody Ring Generation Amp 8Ω Loud Speaker Select Pin FSA2257 Figure 1. Block Diagram MicroPak™ is a trademark of Fairchild Semiconductor Corporation. © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch January 2007 1A GND 1B0 2A GND 2B0 NC 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 1B0 1S 1A 1B1 1S 9 8 7 6 1B1 VCC 10 GND 5 VCC 2S 2B1 NC Figure 2. Pin Assignments for TSSOP (Top View) 1 2 3 4 2B0 2S 2A 2B1 Figure 3. Pad Assignments for MicroPak (Top View) 2B1 1 10 2B0 2S 2 9 2A VCC 3 8 GND 1A 4 7 1S 1B0 5 6 1B1 Figure 4. Pin Assignments for MSOP (Top View) Analog Symbols Truth Table GND 2B0 1 2S 2A 2B1 10 9 1B0 2 8 1S 3 7 1A 6 4 Control Input(s) Function LOW Logic Level B0 Connected to A HIGH Logic Level B1 Connected to A Pin Descriptions 1B1 5 Pin Names Function A, B0, B1 Data Ports S Control Input VCC (Top Through View) Figure 5. Analog Symbols (Top View) © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com 2 FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch Connection Diagrams Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol VCC VSW VIN IIK Parameter Supply Voltage DC Switch Voltage (2) Min. Max. Unit –0.5 +6.0 V –0.5 VCC +0.5 V (2) –0.5 +6.0 V Input Diode Current –50 Switch Current 200 mA Peak Switch Current (pulsed at 1ms duration, <10% duty cycle) 400 DC Input Voltage +150 °C TJ Maximum Junction Temperature +150 °C TL Lead Temperature (soldering, 10 seconds) +260 °C Human Body Model 8000 V TSTG ESD Storage Temperature Range –65 Note: 2. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol VCC Parameter Supply Voltage Voltage(3) VIN Control Input VSW Switch Input Voltage TA Operating Temperature Min. Max. Unit 1.65 5.5 V 0 VCC V 0 VCC V −40 +85 °C Note: 3. Unused control inputs must be held HIGH or LOW. They may not float. © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com 3 FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch Absolute Maximum Ratings All typical values are at 25°C unless otherwise specified. TA= −40°C to +85°C TA=+25°C Symbol Parameter VCC (V) Min. Typ. Max. Min. Max. Units Conditions 2.7 to 3.6 2.0 4.5 to 5.5 2.4 VIH Input Voltage High VIL Input Voltage Low IIN Control Input Leakage INO(OFF), INC(OFF) OFF-Leakage Current of Port B0 and B1 A = 1V, 4.5V, B0 or B1 = 1V, 4.5V 5.5 –2.0 IA(ON) ON Leakage Current of Port A A = 1V, 4.5V, B0 or B1 = 1V, 4.5V or Floating 5.5 −4.0 RON ΔRON RFLAT(ON) ICC VIN = 0V to VCC V 2.7 to 3.6 0.6 4.5 to 5.5 0.8 2.7 to 3.6 −1.0 1.0 4.5 to 5.5 −1.0 1.0 2.0 −20.0 20.0 nA 4.0 −40.0 40.0 nA Switch ON Resistance IOUT = 100mA, B0 or B1 = 1.5V MicroPak(4) IOUT = 100mA, B0 or B1 = 3.5V 2.7 2.6 4.0 4.3 4.5 0.95 1.15 1.3 Switch ON Resistance IOUT = 100mA, B0 or B1 = 1.5V 2.7 2.8 4.5 MSOP / TSSOP(4) 4.5 1.5 2.3 4.5 0.06 IOUT = 100mA, B0 or B1 = 3.5V ON Resistance Matching 5etween Channels(4) MicroPak IOUT = 100mA, B0 or B1 = 3.5V ON Resistance Matching Between Channels(5) MSOP / TSSOP IOUT = 100mA, B0 or B1 = 3.5V ON Resistance Flatness(6) Quiescent Supply Current V 0.12 μA Ω 0.15 Ω 4.5 0.7 0.3 IOUT = 100mA, B0 or B1 = 0V, 0.75V, 1.5V 2.7 1.4 IOUT = 100mA, B0 or B1 = 0V, 1V, 2V 4.5 0.2 0.3 VIN = 0V or VCC, IOUT = 0V 3.6 0.1 0.5 1.0 5.5 0.1 0.5 1.0 Ω 0.4 μA Notes: 4. On resistance is determined by the voltage drop between A and B pins at the indicated current through the switch. 5. ΔRON = RONmax – RONmin measured at identical VCC, temperature, and voltage. 6. Flatness is defined as the difference between the maximum and minimum value of on resistance over the specified range of conditions. © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com 4 FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch DC Electrical Characteristics All typical values are at 25°C unless otherwise specified. TA =−40°C to +85°C TA =+25°C Symbol tON tOFF tB-M Parameter Turn-On Time Turn-Off Time Break-BeforeMake Time Conditions B0 or B1 = 1.5V, RL = 50Ω, CL = 35pF 2.7 to 3.6 50.0 60.0 B0 or B1 = 3.0V, RL = 50Ω, CL = 35pF 4.5 to 5.5 35.0 40.0 B0 or B1 = 1.5V, RL = 50Ω, CL = 35pF 2.7 to 3.6 20.0 30.0 B0 or B1 = 3.0V, RL = 50Ω, CL = 35pF 4.5 to 5.5 15.0 20.0 B0 or B1 = 1.5V, RL = 50Ω, CL = 35pF 2.7 to 3.6 B0 or B1 = 3.0V, RL = 50Ω, CL = 35pF 4.5 to 5.5 20.0 2.7 to 3.6 20.0 4.5 to 5.5 10.0 Charge Injection CL = 1.0nF, VGEN = 0V, RGEN = 0Ω OIRR Off Isolation f = 1MHz, RL = 50Ω Xtalk Crosstalk f = 1MHz, RL = 50Ω BW −3db Bandwidth RL = 50Ω THD Total Harmonic Distortion RL = 600Ω, VIN = 0.5V P.P, f = 20Hz to 20kHz Q VCC (V) Min. Typ. Max. Min. Max. Units Figure Number ns Figure 6. ns Figure 6. ns Figure 7. pC Figure 9. dB Figure 8. dB Figure 8. MHz Figure 11. % Figure 12. Units Figure Number 1.0 2.7 to 3.6 –70.0 4.5 to 5.5 –70.0 2.7 to 3.6 –75.0 4.5 to 5.5 –75.0 2.7 to 3.6 350 4.5 to 5.5 350 2.7 to 3.6 0.002 4.5 to 5.5 0.002 1.0 Capacitance TA =+25°C Symbol CIN Parameter Conditions VCC (V) Min. Typ. Max. TA= 40 to +85°C Min. Max. Control Pin Input Capacitance f = 1MHz 0.0 3.5 pF Figure 10. COFF B Port Off Capacitance f = 1MHz 4.5 12.0 pF Figure 10. CON A Port On Capacitance f = 1MHz 4.5 40.0 pF Figure 10. © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com 5 FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch AC Electrical Characteristics VCC VB B0 or B1 VCC A Control Input VOUT RL 50Ω S tR = tF = 2.5ns 3V 50% 0V CL 35pF tOFF VOUT GND Switch Output CL Includes Fixture and Stray Capacitance 0.9 x VOUT 0 0.9 x VOUT tON Logic Input Waveforms Inverted for Switches that have the Opposite Logic Sense Figure 6. Turn-On / Turn-Off Timing VCC VBn Control Input VCC B0 VOUT A 3V 50% tR = tF = 2.5ns 0V B1 RL 50Ω S Control Input CL 35pF VOUT 0.9 x VOUT GND TD CL Includes Fixture and Stray Capacitance Figure 7. Break-Before-Make Timing VCC 0 or VCC S VCC 10nF A VIN Network Analyzer 50Ω 50Ω 0dBm OFF-ISOLATION = 20log ON-LOSS = 20log VOUT VIN CROSSTALK = 20log BO B1 50Ω GND VOUT MEAS REF 50Ω VOUT VIN VOUT VIN 50Ω Figure 8. Off Isolation and Crosstalk © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com 6 FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch AC Loading and Waveforms + VGEN A VOUT B0 or B1 GND ΔVOUT VOUT VCC RGEN IN OFF CL ON OFF S Control Input ON OFF IN OFF Q = (ΔVOUT)(CL) Figure 9. Charge Injection 10nF V+ A S Capacitance Meter 0V or VCC B0 or B1 f = 1MHz GND Figure 10. On / Off Capacitance Measurement Setup 10nF Signal Generator 0dBm VCC BN A Analyzer 50Ω S Logic Input 0V or VCC GND Figure 11. Bandwidth 10nF VIN BN Signal Generator VCC A Analyzer RL S Logic Input 0V or VCC GND Figure 12. Harmonic Distortion © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com 7 FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch AC Loading and Waveform (continued) Tape Dimensions for MicroPak 10 Package Designator Tape Section Number Cavities Cavity Status Leader (Start End) 125 (typ) Empty Sealed Carrier 5000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed L10X Cover Tape Status Dimensions are in millimeters unless otherwise specified. Reel Dimensions for MicroPak 10 Dimensions are in inches (millimeters) unless otherwise noted. Tape Size A B C D N W1 W2 W3 (8mm) 7.0 (177.8) 0.059 (1.50) 0.512 (13.00) 0.795 (20.20) 2.165 (55.00) 0.331 +0.059 / –0.000 (8.40 +1.50 / −0.00) 0.567 (14.40) W1 +0.078 / −0.039 (W1 +2.00 / −1.00) © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com 8 FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch Package Specifications FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch Tape Dimensions for MSOP Dimensions are in inches (millimeters) unless otherwise specified. Reel Dimensions for MSOP Dimensions are in inches (millimeters) unless otherwise specified Tape Size A B C D N W1 W2 W3 (12mm) 13 (330) 0.059 (1.5) 0.512 (13) 0.795 (20.2) 7.008 (178) 0.448 (12.4) 0.724 (18.4) 0.468-0.606 (11.9 -15.4) © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com 9 FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch Physical Dimensions Dimensions are in millimeters unless otherwise noted. Figure 13. 10-Lead MicroPak, 1.6 x 2.1mm © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com 10 FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch Physical Dimensions Dimensions are in millimeters unless otherwise noted. Figure 14. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com 11 FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch Physical Dimensions Dimensions are in millimeters unless otherwise noted. Figure 15. 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com 12 FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch © 2006 Fairchild Semiconductor Corporation FSA2257 Rev. 1.0.3 www.fairchildsemi.com 13