BGB717L7ESD SiGe:C Low Noise Amplifier MMIC for FM Radio Applications Data Sheet Revision 3.3, 2010-06-24 RF & Protection Devices Edition 2010-06-24 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGB717L7ESD Revision History Page / Item Subjects (major changes since last revisions) Revision 3.3, 2010-06-24 Converted to the new IFX Template. Revision 3.2 Supply Voltage limited to 4.0 V Trademarks of Infineon Technologies AG BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™, PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SensoNor™, SIEGET™, SINDRION™, SMARTi™, SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-03-22 Data Sheet 3 Revision 3.3, 2010-06-24 BGB717L7ESD Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 Product Brief . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Operation Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 6.1 6.2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Data Sheet 4 Revision 3.3, 2010-06-24 BGB717L7ESD List of Figures List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Data Sheet Pinning of BGB717L7ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Total Power Dissipation Ptot = f (Ts) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 FM Radio Testing Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Package Outline TSLP-7-1 (bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Footprint TSLP-7-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Marking of TSLP-7-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Tape of TSLP-7-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 Revision 3.3, 2010-06-24 BGB717L7ESD List of Tables List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Data Sheet Pinning Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Maximum Ratings at TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Operation Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 DC Characteristics at TA = 25 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC Characteristics in the FM Radio LNA Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Revision 3.3, 2010-06-24 SiGe:C Low Noise Amplifier MMIC for FM Radio Applications 1 BGB717L7ESD Features Main features: • • • • • • • • • • • • • High performance FM radio LNA with integrated biasing Worldwide FM band support (76 MHz to 108 MHz) Integrated ESD protection for all pins (3 kV for RF input vs. GND, 2 kV for all other pin combinations, HBM) Very high gain at low current consumption High input compression point High input impedance Excellent noise figure from latest SiGe:C technology Integrated active biasing circuit enables stable operation point against temperature- and processing-variations Minimum external components Operation voltage: 1.8 V to 4.0 V Power-off function Very small and leadless package TSLP-7-1, 2.0 x 1.3 x 0.4 mm Pb-free (RoHS compliant) and halogen-free (WEEE compliant) package Applications • • • • Active FM antenna systems Portable FM radio Personal headphone radio ISM applications Product Name Package Marking BGB717L7ESD TSLP-7-1 AX Data Sheet 7 Revision 3.3, 2010-06-24 BGB717L7ESD Product Brief 2 Product Brief The BGB717L7ESD is an advanced low noise amplifier MMIC with integrated ESD protection and active biasing specifically designed for FM antenna systems requiring high gain, reduced power consumption and very low distortion. The external components determine the gain of the FM amplifier and can also be modified to extend the operating frequency. The device is based upon Infineon Technologies cost effective SiGe:C technology and comes in a low profile TSLP-7-1 leadless green package. 6 5 4 7 1 Figure 1 Pinning of BGB717L7ESD Table 1 Pinning Table Pin Function 1 GND 2 RF-In 3 Bias-Out 4 Ctrl On/Off 5 RF-Out 6 VCC 7 GND Data Sheet 2 3 8 Revision 3.3, 2010-06-24 BGB717L7ESD Maximum Ratings 3 Maximum Ratings Table 2 Maximum Ratings at TA = 25°C Parameter Symbol VCC Supply voltage Value Min. Typ. Max. – – 4.0 – 3.5 TA = -55°C Unit Note / Test Condition V – Supply current at VCC pin ICC – – 25 mA – IDC current at RF-In Pin IB – – 3 mA – Control On / Off voltage Vctrl – – 4.0 V – Ptot – – 100 mW – Operation junction temperature TJOp -55 – 150 °C – Storage temperature TStg -55 – 150 °C – Human Body Model JESD22-A114-B – – – 2000 V – Machine Model JESD22-A115-A – – 100 V – 1500 V – Total power dissipation TS ≤ 112 °C2) 1) ESD Capability – Charge Device Model JESD22– – – C101-C 1) TS measured at the GND pin (7) at soldering point to the PCB 2) TS soldering point temperature Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Data Sheet 9 Revision 3.3, 2010-06-24 BGB717L7ESD Thermal Characteristics 4 Thermal Characteristics Table 3 Thermal Resistance Parameter Symbol Values Min. Typ. Unit Note / Test Condition K/W – Max. 1) Junction - soldering point RthJS – 375 – 1) For calculation of RthJA please refer to Application Note Thermal Resistance 120 100 Ptot [mW] 80 60 40 20 0 0 50 100 150 Ts [°C] Figure 2 Total Power Dissipation Ptot = f (Ts) 5 Operation Conditions Table 4 Operation Conditions Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. 1.8 3.0 4.0 V – Voltage Ctrl On/Off pin in On mode Vctrl-on 1.2 3.0 4.0 V – Voltage Ctrl On/Off pin in Off mode Vctrl-off -0.3 0 0.3 V – Supply voltage Data Sheet VCC 10 Revision 3.3, 2010-06-24 BGB717L7ESD Electrical Characteristics 6 Electrical Characteristics 6.1 DC Characteristics Table 5 DC Characteristics at TA = 25 °C Parameter Symbol ICC Supply current Values Min. Typ. Max. 2.4 3.0 3.6 Unit Note / Test Condition mA VCC = 3 V Vctrl = 3 V Small signal operation ICC-off – 1 6 μA VCC = 4.0 V Vctrl = 0 V Current into Ctrl On/Off pin in On mode Ictrl-on – 14 20 μA VCC = 3 V Vctrl = 3 V Current into Ctrl On/Off pin in Off mode Ictrl-off – – 0.1 μA VCC = 4.0 V Vctrl = 0 V Supply current in Off mode 6.2 AC Characteristics This section presents the AC characteristics of the BGB717L7ESD as measured in a high-ohmic FM radio application circuit using a PCB and a population as described in the application note AN176. Please consult our website to download the application note: www.infineon.com/rf.appnotes. The application schematic is shown in Figure 3 and the function of each component is explained in Table 6. C3 RFin C1 L1 BGB717ESD VCC GND 1 6 RF-In 2 5 RF-Out Bias-Out 3 4 On /Off 7 C2 VC C R1 R2 C4 RFout VCtrl GND BGB717L7ESD_Application _circuit Figure 3 Data Sheet FM Radio Testing Circuit 11 Revision 3.3, 2010-06-24 BGB717L7ESD Electrical Characteristics Table 6 Bill of Material Component Value Manufacturer / Type Function C1 330 pF Various / 0402 DC blocking C2 47 nF Various / 0402 DC stabilization C3 47 nF Various / 0402 DC stabilization C4 330 pF Various / 0402 DC blocking R1 56 Ω Various / 0402 For biasing, output matching and stabilization R2 10 Ω Various / 0402 For output matching and stabilization L1 470 nH Taiyo Yuden LK1608R47K-T / RF choke 0603 The following table gives an overview on the performance of the FM radio LNA application circuit. All data were measured in a 50 Ω system. Table 7 AC Characteristics in the FM Radio LNA Application1) Parameter Symbol |S21| Insertion power gain Input return loss 2) RLIN 2) Output return loss Noise figure5) 2) Input 1dB gain compression point rd 2 Values Note / Test Condition Min. Typ. Max. 10 12 14 dB – 3 dB – 3) 0 0.5 4) RLOUT 13 16 19 dB – F50Ω – 1.0 1.5 dB Zs = 50 Ω IP-1dB -8.0 -5.5 – dBm – dBm PRFIN = -40 dBm 2) Input 3 Order Intercept Point IIP3 -15.5 -12.5 – 1) As described in AN176, TA = 25°C, VCC = 3 V, Vctrl = 3 V, ICC = 3 mA, f = 100 MHz 2) 3) 4) 5) Unit Verified by random sampling High LNA input impedance leads to power matching with high ohmic antennas Output matching is accomplished by the external resistors R1 and R2 An aggressive low pass filter prevents radio broadcast signals from distorting the NF measurement Data Sheet 12 Revision 3.3, 2010-06-24 BGB717L7ESD Package Information Package Information Top view Bottom view 0.4 +0.1 1.3 ±0.05 0.05 MAX. 1 ±0.05 6 1.7 ±0.05 1.2 ±0.035 1) 7 3 Pin 1 marking 2 1 6 x 0.2 ±0.035 1) 1) Dimension applies to plated terminal TSLP-7-1-PO V04 Package Outline TSLP-7-1 (bottom view) NSM D SMD 0.3 R0.1 0.3 0.2 0.2 0.25 0.25 1.9 0.2 Solder mask 0.2 0.25 1.9 1.9 0.25 0.3 Copper 0.25 0.2 0.2 0.25 0.2 0.2 0.3 0.2 0.2 1.9 0.3 1.4 0.2 1.4 0.2 1.4 0.2 1.4 0.3 Stencil apertures Copper Solder mask 0.2 Figure 4 2 ±0.05 5 6 x 0.2 ±0.035 1) 4 1.1 ±0.035 1) 7 0.25 0.25 R0.1 Stencil apertures TSLP-7-1-FP V01 Figure 5 Footprint TSLP-7-1 AX AX Figure 6 Marking of TSLP-7-1 0.5 8 2.18 4 Pin 1 marking Figure 7 Data Sheet 1.45 TSLP-7-1-TP V03 Tape of TSLP-7-1 13 Revision 3.3, 2010-06-24 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG