TI ADC082S101 Adc102s021 2 channel, 50 ksps to 200 ksps, 10-bit a/d converter Datasheet

ADC102S021
www.ti.com
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
ADC102S021 2 Channel, 50 ksps to 200 ksps, 10-Bit A/D Converter
Check for Samples: ADC102S021
FEATURES
DESCRIPTION
•
•
•
•
The ADC102S021 is a low-power, two-channel
CMOS 10-bit analog-to-digital converter with a highspeed serial interface. Unlike the conventional
practice of specifying performance at a single sample
rate only, the ADC102S021 is fully specified over a
sample rate range of 50 ksps to 200 ksps. The
converter is based on a successive-approximation
register architecture with an internal track-and-hold
circuit. It can be configured to accept one or two input
signals at inputs IN1 and IN2.
1
2
Specified Over a Range of Sample Rates.
Two Input Channels
Variable Power Management
Single Power Supply with 2.7V - 5.25V Range
APPLICATIONS
•
•
•
Portable Systems
Remote Data Acquisition
Instrumentation and Control Systems
The output serial data is straight binary, and is
compatible with several standards, such as SPI™,
QSPI™, MICROWIRE, and many common DSP
serial interfaces.
KEY SPECIFICATIONS
•
•
•
•
DNL: ± 0.13 LSB (typ)
INL: ± 0.13 LSB (typ)
SNR: 61.8 dB (typ)
Power Consumption
– 3V Supply: 1.94mW (typ)
– 5V Supply: 6.9 mW (typ)
The ADC102S021 operates with a single supply that
can range from +2.7V to +5.25V. Normal power
consumption using a +3V or +5V supply is 1.94 mW
and 6.9 mW, respectively. The power-down feature
reduces the power consumption to just 0.12 µW using
a +3V supply, or 0.47 µW using a +5V supply.
The ADC102S021 is packaged in an 8-lead VSSOP
package. Operation is specified over the industrial
temperature range of −40°C to +85°C.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Table 1. Pin-Compatible Alternatives by Resolution and Speed (1)
Resolution
(1)
Specified for Sample Rates of:
50 to 200 ksps
200 to 500 ksps
500 ksps to 1Msps
12-bit
ADC122S021
ADC122S051
ADC122S101
10-bit
ADC102S021
ADC102S051
ADC102S101
8-bit
ADC082S021
ADC082S051
ADC082S101
All devices are fully pin and function compatible.
Connection Diagram
8
SCLK
7
DOUT
3
6
DIN
4
5
IN1
CS
1
VA
2
GND
IN2
ADC102S021
Figure 1. VSSOP Package
See Package Number DGK0008A
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated
ADC102S021
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
www.ti.com
Block Diagram
IN1
MUX
T/H
IN2
10-BIT
SUCCESSIVE
APPROXIMATION
ADC
VA
CONTROL
LOGIC
CS
GND
GND
SCLK
DIN
DOUT
Figure 2.
Table 2. Pin Descriptions and Equivalent Circuits
Pin No.
Name
Description
ANALOG I/O
5,4
IN1 and IN2
Analog inputs. These signals can range from 0V to VA.
DIGITAL I/O
8
SCLK
Digital clock input. This clock directly controls the conversion and readout processes.
7
DOUT
Digital data output. The output samples are clocked out of this pin on falling edges of the SCLK pin.
6
DIN
Digital data input. The ADC102S021's Control Register is loaded through this pin on rising edges of
the SCLK pin.
1
CS
Chip select. On the falling edge of CS, a conversion process begins. Conversions continue as long
as CS is held low.
2
VA
Positive supply pin. This pin should be connected to a quiet +2.7V to +5.25V source and bypassed to
GND with a 1 µF capacitor and a 0.1 µF monolithic capacitor located within 1 cm of the power pin.
3
GND
POWER SUPPLY
2
The ground return for the die.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
ADC102S021
www.ti.com
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
Absolute Maximum Ratings (1) (2) (3)
−0.3V to 6.5V
Analog Supply Voltage VA
Voltage on Any Pin to GND
−0.3V to VA +0.3V
(4)
±10 mA
Input Current at Any Pin
Package Input Current
(4)
±20 mA
Power Consumption at TA = 25°C
See
(5)
(6)
ESD Susceptibility
Human Body Model
Machine Model
2500V
250V
Junction Temperature
+150°C
Storage Temperature
−65°C to +150°C
(1)
(2)
(3)
(4)
(5)
(6)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
All voltages are measured with respect to GND = 0V, unless otherwise specified.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
When the input voltage at any pin exceeds the power supply (that is, VIN < GND or VIN > VA), the current at that pin should be limited to
10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an
input current of 10 mA to two. The Absolute Maximum Rating specification does not apply to the VA pin. The current into the VA pin is
limited by the Analog Supply Voltage specification.
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula
PDMAX = (TJmax − TA)/θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in
a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is
reversed). Obviously, such conditions should always be avoided.
Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through zero ohms
Operating Ratings (1) (2)
−40°C ≤ TA ≤ +85°C
Operating Temperature Range
VA Supply Voltage
+2.7V to +5.25V
−0.3V to VA
Digital Input Pins Voltage Range
Clock Frequency
50 kHz to 16 MHz
Analog Input Voltage
(1)
(2)
0V to VA
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
All voltages are measured with respect to GND = 0V, unless otherwise specified.
Package Thermal Resistance (1) (2)
(1)
(2)
Package
θJA
8-lead VSSOP
250°C / W
Soldering process must comply with Texas Instruments Reflow Temperature Profile specifications.
Reflow temperature profiles are different for lead-free and non-lead-free packages.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
3
ADC102S021
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
www.ti.com
ADC102S021 Converter Electrical Characteristics (1)
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, CL = 50 pF, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50
ksps to 200 ksps, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C.
Parameter
Test Conditions
Typ
Limits (1)
Units
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes
10
Bits
+0.3
LSB (max)
INL
Integral Non-Linearity
±0.13
−0.4
LSB (min)
DNL
Differential Non-Linearity
±0.13
±0.4
LSB (max)
VOFF
Offset Error
+0.1
±0.4
LSB (max)
OEM
Channel to Channel Offset Error Match
±0.02
±0.5
LSB (max)
FSE
Full-Scale Error
−0.11
±0.7
LSB (max)
FSEM
Channel to Channel Full-Scale Error
Match
+0.02
±0.5
LSB (max)
DYNAMIC CONVERTER CHARACTERISTICS
SINAD
Signal-to-Noise Plus Distortion Ratio
VA = +2.7 to 5.25V
fIN = 39.9 kHz, −0.02 dBFS
61.8
61
dB (min)
SNR
Signal-to-Noise Ratio
VA = +2.7 to 5.25V
fIN = 39.9 kHz, −0.02 dBFS
61.8
61.3
dB (min)
THD
Total Harmonic Distortion
VA = +2.7 to 5.25V
fIN = 39.9 kHz, −0.02 dBFS
−86
−72
dB (max)
SFDR
Spurious-Free Dynamic Range
VA = +2.7 to 5.25V
fIN = 39.9 kHz, −0.02 dBFS
82
75
dB (min)
ENOB
Effective Number of Bits
VA = +2.7 to 5.25V
fIN = 39.9 kHz, −0.02 dBFS
9.9
9.8
Bits (min)
Channel-to-Channel Crosstalk
VA = +5.25V
fIN = 39.9 kHz
−87
dB
Intermodulation Distortion, Second
Order Terms
VA = +5.25V
fa = 40.161 kHz, fb = 41.015 kHz
−82
dB
Intermodulation Distortion, Third Order
Terms
VA = +5.25V
fa = 40.161 kHz, fb = 41.015 kHz
−81
dB
VA = +5V
11
MHz
VA = +3V
8
MHz
IMD
FPBW
-3 dB Full Power Bandwidth
ANALOG INPUT CHARACTERISTICS
VIN
Input Range
IDCL
DC Leakage Current
CINA
Input Capacitance
0 to VA
V
±1
µA (max)
Track Mode
33
pF
Hold Mode
3
pF
DIGITAL INPUT CHARACTERISTICS
VIH
Input High Voltage
VIL
Input Low Voltage
IIN
Input Current
CIND
Digital Input Capacitance
(1)
4
VA = +5.25V
2.4
VA = +3.6V
2.1
V (min)
0.8
V (max)
±0.1
±10
µA (max)
2
4
pF (max)
VIN = 0V or VA
V (min)
The min/max specification limits are specified by design, test, or statistical analysis.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
ADC102S021
www.ti.com
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
ADC102S021 Converter Electrical Characteristics(1) (continued)
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, CL = 50 pF, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50
ksps to 200 ksps, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C.
Typ
Limits (1)
Units
ISOURCE = 200 µA
VA − 0.03
VA − 0.5
V (min)
ISOURCE = 1 mA
VA − 0.1
ISINK = 200 µA
0.03
0.4
V (max)
ISINK = 1 mA
0.1
Parameter
Test Conditions
DIGITAL OUTPUT CHARACTERISTICS
VOH
Output High Voltage
VOL
Output Low Voltage
IOZH, IOZL TRI-STATE Leakage Current
COUT
TRI-STATE Output Capacitance
V
V
±0.01
±1
µA (max)
2
4
pF (max)
Output Coding
Straight (Natural) Binary
POWER SUPPLY CHARACTERISTICS (CL = 10 pF)
VA
Supply Voltage
Supply Current, Normal Mode
(Operational, CS low)
IA
Supply Current, Shutdown (CS high)
2.7
V (min)
5.25
V (max)
VA = +5.25V,
fSAMPLE = 200 ksps, fIN = 40 kHz
1.3
1.8
mA (max)
VA = +3.6V,
fSAMPLE = 200 ksps, fIN = 40 kHz
0.55
0.7
mA (max)
VA = +5.25V,
fSAMPLE = 0 ksps
90
nA
VA = +3.6V,
fSAMPLE = 0 ksps
32
nA
Power Consumption, Normal Mode
(Operational, CS low)
VA = +5.25V
6.9
9.5
mW (max)
VA = +3.6V
1.94
2.5
mW (max)
Power Consumption, Shutdown (CS
high)
VA = +5.25V
0.47
µW
VA = +3.6V
0.12
µW
PD
AC ELECTRICAL CHARACTERISTICS
fSCLK
Clock Frequency
See (2)
See (2)
fS
Sample Rate
tCONV
Conversion Time
DC
SCLK Duty Cycle
fCLK = 3.2 MHz
tACQ
Track/Hold Acquisition Time
Throughput Time
(2)
0.8
MHz (min)
3.2
MHz (max)
50
ksps (min)
200
ksps (max)
13
SCLK cycles
30
% (min)
70
% (max)
Full-Scale Step Input
3
SCLK cycles
Acquisition Time + Conversion Time
16
SCLK cycles
50
This is the frequency range over which the electrical performance is specified. The device is functional over a wider range which is
specified under Operating Ratings.
ADC102S021 Timing Specifications
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, CL = 50 pF, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50
ksps to 200 ksps, Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C.
Parameter
(1)
(2)
Test Conditions
tCSU
Setup Time SCLK High to CS Falling Edge
See (2)
tCLH
Hold time SCLK Low to CS Falling Edge
See (2)
Typ
VA = +3.0V
−3.5
VA = +5.0V
−0.5
VA = +3.0V
+4.5
VA = +5.0V
+1.5
Limits (1)
Units
10
ns (min)
10
ns (min)
Tested limits are specified to Texas Instrument's AOQL (Average Outgoing Quality Level).
Clock may be either high or low when CS is asserted as long as setup and hold times tCSU and tCLH are strictly observed.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
5
ADC102S021
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
www.ti.com
ADC102S021 Timing Specifications (continued)
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, CL = 50 pF, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50
ksps to 200 ksps, Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C.
Parameter
Test Conditions
tEN
Delay from CS Until DOUT active
tACC
Data Access Time after SCLK Falling Edge
tSU
Data Setup Time Prior to SCLK Rising Edge
Limits (1)
Units
30
ns (max)
30
ns (max)
+3
10
ns (min)
+3
10
ns (min)
Typ
VA = +3.0V
+4
VA = +5.0V
+2
VA = +3.0V
+16.5
VA = +5.0V
+15
tH
Data Valid SCLK Hold Time
tCH
SCLK High Pulse Width
0.5 x tSCLK 0.3 x tSCLK
ns (min)
tCL
SCLK Low Pulse Width
0.5 x tSCLK 0.3 x tSCLK
ns (min)
Output Falling
tDIS
CS Rising Edge to DOUT High-Impedance
Output Rising
VA = +3.0V
1.7
VA = +5.0V
1.2
VA = +3.0V
1.0
VA = +5.0V
1.0
20
ns (max)
Timing Diagrams
Power Down
Power Up
Track
Power Up
Hold
Track
Hold
CS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
9
8
10
SCLK
Control register
Control register
DIN
DOUT
b7
b6
b5
b4
b3
b2
b1
DB9
DB8 DB7
b0
DB6
b7
DB5
DB4
DB3
DB2
DB1
b6
b5
DB0
b4
b3
b2
b1
b0
DB9
DB8
DB7
DB6
DB5
Figure 3. ADC102S021 Operational Timing Diagram
Figure 4. Timing Test Circuit
6
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
ADC102S021
www.ti.com
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
Figure 5. ADC102S021 Serial Timing Diagram
CS
tCSU
SCLK
tCLH
SCLK
Figure 6. SCLK and CS Timing Parameters
Specification Definitions
ACQUISITION TIME is the time required to acquire the input voltage. That is, it is time required for the hold
capacitor to charge up to the input voltage.
APERTURE DELAY is the time between the fourth falling SCLK edge of a conversion and the time when the
input signal is acquired or held for conversion.
CONVERSION TIME is the time required, after the input voltage is acquired, for the ADC to convert the input
voltage to a digital word.
CROSSTALK is the coupling of energy from one channel into the other channel, or the amount of signal energy
from one analog input that appears at the measured analog input.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB.
DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The
specification here refers to the SCLK.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise
and Distortion or SINAD. ENOB is defined as (SINAD − 1.76) / 6.02 and says that the converter is
equivalent to a perfect ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental
drops 3 dB below its low frequency value for a full scale input.
FULL SCALE ERROR (FSE) is a measure of how far the last code transition is from the ideal 1½ LSB below
VREF+ and is defined as:
VFSE = Vmax + 1.5 LSB – VREF+
(1)
where Vmax is the voltage at which the transition to the maximum code occurs. FSE can be
expressed in Volts, LSB or percent of full scale range.
GAIN ERROR is the deviation of the last code transition (111...110) to (111...111) from the ideal (VREF − 1.5
LSB), after adjusting for offset error.
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from
negative full scale (½ LSB below the first code transition) through positive full scale (½ LSB above the last
code transition). The deviation of any given code from this straight line is measured from the center of that
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
7
ADC102S021
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
www.ti.com
code value.
INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components that are present at
the output and are not present at the input and result from two sinusoidal frequencies being applied to the
ADC input at the same time. It is defined as the ratio of the power in the second and third order
intermodulation products to the sum of the power in both of the original frequencies. IMD is usually
expressed in dB.
MISSING CODES are those output codes that will never appear at the ADC outputs. These codes cannot be
reached with any input value. The ADC102S021 is specified not to have any missing codes.
OFFSET ERROR is the deviation of the first code transition (000...000) to (000...001) from the ideal (i.e. GND +
0.5 LSB).
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal at the
converter output to the rms value of the sum of all other spectral components below one-half the sampling
frequency, not including d.c. or harmonics included in the THD specification.
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of
the input signal to the rms value of all of the other spectral components below half the clock frequency,
including harmonics but excluding d.c.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the
input signal and the peak spurious signal where a spurious signal is any signal present in the output
spectrum that is not present at the input, excluding d.c.
TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dB or dBc, of the rms total of the first five
harmonic components at the output to the rms level of the input signal frequency as seen at the output.
THD is calculated as
THD = 20 ‡ log10
A f 22 +
+ A f 62
A f 12
(2)
where Af1 is the RMS power of the input frequency at the output and Af2 through Af6 are the
RMS power in the first 5 harmonic frequencies. Accurate THD measurement requires a
spectrally pure sine wave (monotone) at the ADC input.
THROUGHPUT TIME is the minimum time required between the start of two successive conversion. It is the
acquisition time plus the conversion and read out times. In the case of the ADC102S021, this is 16 SCLK
periods.
8
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
ADC102S021
www.ti.com
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
Typical Performance Characteristics
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
DNL - VA = 3.0V
INL - VA = 3.0V
Figure 7.
Figure 8.
DNL - VA = 5.0V
INL - VA = 5.0V
Figure 9.
Figure 10.
DNL vs. Supply
INL vs. Supply
Figure 11.
Figure 12.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
9
ADC102S021
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
10
DNL vs. Clock Frequency
INL vs. Clock Frequency
Figure 13.
Figure 14.
DNL vs. Clock Duty Cycle
INL vs. Clock Duty Cycle
Figure 15.
Figure 16.
DNL vs. Temperature
INL vs. Temperature
Figure 17.
Figure 18.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
ADC102S021
www.ti.com
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
SNR vs. Supply
THD vs. Supply
Figure 19.
Figure 20.
SNR vs. Clock Frequency
THD vs. Clock Frequency
Figure 21.
Figure 22.
SNR vs. Clock Duty Cycle
THD vs. Clock Duty Cycle
Figure 23.
Figure 24.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
11
ADC102S021
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
12
SNR vs. Input Frequency
THD vs. Input Frequency
Figure 25.
Figure 26.
SNR vs. Temperature
THD vs. Temperature
Figure 27.
Figure 28.
SFDR vs. Supply
SINAD vs. Supply
Figure 29.
Figure 30.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
ADC102S021
www.ti.com
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
SFDR vs. Clock Frequency
SINAD vs. Clock Frequency
Figure 31.
Figure 32.
SFDR vs. Clock Duty Cycle
SINAD vs. Clock Duty Cycle
Figure 33.
Figure 34.
SFDR vs. Input Frequency
SINAD vs. Input Frequency
Figure 35.
Figure 36.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
13
ADC102S021
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
14
SFDR vs. Temperature
SINAD vs. Temperature
Figure 37.
Figure 38.
ENOB vs. Supply
ENOB vs. Clock Frequency
Figure 39.
Figure 40.
ENOB vs. Clock Duty Cycle
ENOB vs. Input Frequency
Figure 41.
Figure 42.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
ADC102S021
www.ti.com
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
ENOB vs. Temperature
Spectral Response - 3V, 200 ksps
Figure 43.
Figure 44.
Spectral Response - 5V, 200 ksps
Power Consumption vs. Throughput
Figure 45.
Figure 46.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
15
ADC102S021
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
www.ti.com
APPLICATIONS INFORMATION
ADC102S021 OPERATION
The ADC102S021 is a successive-approximation analog-to-digital converter designed around a chargeredistribution digital-to-analog converter. Simplified schematics of the ADC102S021 in both track and hold modes
are shown in Figure 47 and Figure 48, respectively. In Figure 47, the ADC102S021 is in track mode: switch SW1
connects the sampling capacitor to one of two analog input channels through the multiplexer, and SW2 balances
the comparator inputs. The ADC102S021 is in this state for the first three SCLK cycles after CS is brought low.
Figure 48 shows the ADC102S021 in hold mode: switch SW1 connects the sampling capacitor to ground,
maintaining the sampled voltage, and switch SW2 unbalances the comparator. The control logic then instructs
the charge-redistribution DAC to add fixed amounts of charge to the sampling capacitor until the comparator is
balanced. When the comparator is balanced, the digital word supplied to the DAC is the digital representation of
the analog input voltage. The ADC102S021 is in this state for the fourth through sixteenth SCLK cycles after CS
is brought low.
The time when CS is low is considered a serial frame. Each of these frames should contain an integer multiple of
16 SCLK cycles, during which time a conversion is performed and clocked out at the DOUT pin and data is
clocked into the DIN pin to indicate the multiplexer address for the next conversion.
CHARGE
REDISTRIBUTION
DAC
IN1
MUX
SAMPLING
CAPACITOR
IN2
SW1
+
SW2
GND
-
CONTROL
LOGIC
VA
2
Figure 47. ADC102S021 in Track Mode
CHARGE
REDISTRIBUTION
DAC
IN1
MUX
SAMPLING
CAPACITOR
IN2
SW1
+
SW2
GND
-
CONTROL
LOGIC
VA
2
Figure 48. ADC102S021 in Hold Mode
USING THE ADC102S021
An ADC102S021 timing diagram and a serial interface timing diagram for the ADC102S021 are shown in the
Timing Diagrams section. CS is chip select, which initiates conversions and frames the serial data transfers.
SCLK (serial clock) controls both the conversion process and the timing of serial data. DOUT is the serial data
output pin, where a conversion result is sent as a serial data stream, MSB first. Data to be written to the
ADC102S021's Control Register is placed at DIN, the serial data input pin. New data is written to DIN with each
conversion.
A serial frame is initiated on the falling edge of CS and ends on the rising edge of CS. Each frame must contain
an integer multiple of 16 rising SCLK edges. The ADC output data (DOUT) is in a high impedance state when
CS is high and is active when CS is low. Thus, CS acts as an output enable. Additionally, the device goes into a
power down state when CS is high and also between continuous conversion cycles.
16
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
ADC102S021
www.ti.com
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
During the first 3 cycles of SCLK, the ADC is in the track mode, acquiring the input voltage. For the next 13
SCLK cycles the conversion is accomplished and the data is clocked out, MSB first, starting at the 5th clock. If
there is more than one conversion in a frame, the ADC will re-enter the track mode on the falling edge of SCLK
after the N*16th rising edge of SCLK, and re-enter the hold/convert mode on the N*16+4th falling edge of SCLK,
where "N" is an integer.
When CS is brought high, SCLK is internally gated off. If SCLK is stopped in the low state while CS is high, the
subsequent fall of CS will generate a falling edge of the internal version of SCLK, putting the ADC into the track
mode. This is seen by the ADC as the first falling edge of SCLK. If SCLK is stopped with SCLK high, the ADC
enters the track mode on the first falling edge of SCLK after the falling edge of CS.
During each conversion, data is clocked into the ADC at DIN on the first 8 rising edges of SCLK after the fall of
CS. For each conversion, it is necessary to clock in the data indicating the input that is selected for the
conversion after the current one. See Table 3, Table 4, and Table 5.
If CS and SCLK go low within the times defined by tCSU and tCLH, the rising edge of SCLK that begins clocking
data in at DIN may be one clock cycle later than expected. It is, therefore, best to strictly observe the minimum
tCSU and TCLH times given in the Timing Specifications.
There are no power-up delays or dummy conversions required with the ADC102S021. The ADC is able to
sample and convert an input to full conversion immediately following power up. The first conversion result after
power-up will be that of IN1.
Table 3. Control Register Bits
Bit 7 (MSB)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
DONTC
DONTC
ADD2
ADD1
ADD0
DONTC
DONTC
DONTC
Table 4. Control Register Bit Descriptions
Bit #:
Symbol:
7 - 6, 2 - 0
DONTC
3
ADD0
4
ADD1
5
ADD2
Description
Don't care. The value of these bits do not affect the device.
These bits determine which input channel will be sampled and converted in the next track/hold
cycle. The mapping between codes and channels is shown in Table 5.
Table 5. Input Channel Selection
ADD2
ADD1
ADD0
Input Channel
x
0
0
IN1 (Default)
x
0
1
IN2
x
1
x
Not allowed. The output signal at the DOUT pin is indeterminate if ADD1 is high.
ADC102S021 TRANSFER FUNCTION
The output format of the ADC102S021 is straight binary. Code transitions occur midway between successive
integer LSB values. The LSB width for the ADC102S021 is VA/1024. The ideal transfer characteristic is shown in
Figure 49. The transition from an output code of 00 0000 0000 to a code of 00 0000 0001 is at 1/2 LSB, or a
voltage of VA/2048. Other code transitions occur at steps of one LSB.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
17
ADC102S021
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
www.ti.com
111...111
ADC CODE
111...110
111...000
|
|
1LSB = VA/1024
011...111
000...010
|
000...001
000...000
0V
+VA - 1.5LSB
0.5LSB
ANALOG INPUT
Figure 49. Ideal Transfer Characteristic
TYPICAL APPLICATION CIRCUIT
A typical application of the ADC102S021 is shown in Figure 50. Power is provided, in this example, by the Texas
Instruments LP2950 low-dropout voltage regulator, available in a variety of fixed and adjustable output voltages.
The power supply pin is bypassed with a capacitor network located close to the ADC102S021. Because the
reference for the ADC102S021 is the supply voltage, any noise on the supply will degrade device noise
performance. To keep noise off the supply, use a dedicated linear regulator for this device, or provide sufficient
decoupling from other circuitry to keep noise off the ADC102S021 supply pin. Because of the ADC102S021's low
power requirements, it is also possible to use a precision reference as a power supply to maximize performance.
The four-wire interface is shown connected to a microprocessor or DSP.
LP2950
1 PF
TANT
VA
IN1
ADC102S021
1 PF
0.1 PF
SCLK
CS
DIN
IN2
0.1 PF
5V
MICROPROCESSOR
DSP
DOUT
GND
Figure 50. Typical Application Circuit
ANALOG INPUTS
An equivalent circuit for one of the ADC102S021's input channels is shown in Figure 51. Diodes D1 and D2
provide ESD protection for the analog inputs. At no time should any input go beyond (VA + 300 mV) or (GND −
300 mV), as these ESD diodes will begin conducting, which could result in erratic operation. For this reason, the
ESD diodes should not be used to clamp the input signal.
The capacitor C1 in Figure 51 has a typical value of 3 pF, and is mainly the package pin capacitance. Resistor
R1 is the on resistance of the multiplexer and track / hold switch, and is typically 500 ohms. Capacitor C2 is the
ADC102S021 sampling capacitor and is typically 30 pF. The ADC102S021 will deliver best performance when
driven by a low-impedance source to eliminate distortion caused by the charging of the sampling capacitance.
This is especially important when using the ADC102S021 to sample AC signals. Also important when sampling
dynamic signals is a band-pass or low-pass filter to reduce harmonics and noise, improving dynamic
performance.
18
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
ADC102S021
www.ti.com
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
VA
D1
R1
C2
30 pF
VIN
C1
3 pF
D2
Conversion Phase - Switch Open
Track Phase - Switch Closed
Figure 51. Equivalent Input Circuit
DIGITAL INPUTS AND OUTPUTS
The ADC102S021's digital output DOUT is limited by, and cannot exceed, the supply voltage, VA. The digital
input pins are not prone to latch-up and, and although not recommended, SCLK, CS and DIN may be asserted
before VA without any latchup risk.
POWER SUPPLY CONSIDERATIONS
The ADC102S021 is fully powered-up whenever CS is low, and fully powered-down whenever CS is high, with
one exception: the ADC102S021 automatically enters power-down mode between the 16th falling edge of a
conversion and the 1st falling edge of the subsequent conversion (see Timing Diagrams).
The ADC102S021 can perform multiple conversions back to back; each conversion requires 16 SCLK cycles.
The ADC102S021 will perform conversions continuously as long as CS is held low.
The user may trade off throughput for power consumption by simply performing fewer conversions per unit time.
The Power Consumption vs. Sample Rate curve in the Typical Performace Characteristics section shows the
typical power consumption of the ADC102S021 versus throughput. To calculate the power consumption, simply
multiply the fraction of time spent in the normal mode by the normal mode power consumption , and add the
fraction of time spent in shutdown mode multiplied by the shutdown mode power dissipation.
Power Management
When the ADC102S021 is operated continuously in normal mode, the maximum throughput is fSCLK/16.
Throughput may be traded for power consumption by running fSCLK at its maximum 3.2 MHz and performing
fewer conversions per unit time, putting the ADC102S021 into shutdown mode between conversions. A plot of
typical power consumption versus throughput is shown in the Typical Performance Characteristics section. To
calculate the power consumption for a given throughput, multiply the fraction of time spent in the normal mode by
the normal mode power consumption and add the fraction of time spent in shutdown mode multiplied by the
shutdown mode power consumption. Generally, the user will put the part into normal mode and then put the part
back into shutdown mode. Note that the curve of power consumption vs. throughput is nearly linear. This is
because the power consumption in the shutdown mode is so small that it can be ignored for all practical
purposes.
Power Supply Noise Considerations
The charging of any output load capacitance requires current from the power supply, VA. The current pulses
required from the supply to charge the output capacitance will cause voltage variations on the supply. If these
variations are large enough, they could degrade SNR and SINAD performance of the ADC. Furthermore,
discharging the output capacitance when the digital output goes from a logic high to a logic low will dump current
into the die substrate, which is resistive. Load discharge currents will cause "ground bounce" noise in the
substrate that will degrade noise performance if that current is large enough. The larger is the output
capacitance, the more current flows through the die substrate and the greater is the noise coupled into the
analog channel, degrading noise performance.
To keep noise out of the power supply, keep the output load capacitance as small as practical. If the load
capacitance is greater than 50 pF, use a 100 Ω series resistor at the ADC output, located as close to the ADC
output pin as practical. This will limit the charge and discharge current of the output capacitance and improve
noise performance.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
19
ADC102S021
SNAS281G – FEBRUARY 2005 – REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision F (March 2013) to Revision G
•
20
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 19
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC102S021
PACKAGE OPTION ADDENDUM
www.ti.com
7-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
ADC102S021CIMM/NOPB
ACTIVE
VSSOP
DGK
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
X17C
ADC102S021CIMMX/NOPB
ACTIVE
VSSOP
DGK
8
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
X17C
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ADC102S021CIMM/NOPB VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
ADC102S021CIMMX/NOP VSSOP
B
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADC102S021CIMM/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
VSSOP
DGK
8
3500
367.0
367.0
35.0
ADC102S021CIMMX/NOP
B
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated