Accu-L® SMD High-Q RF Inductor 2 10 nH Inductor (Top View) ACCU-L® TECHNOLOGY The Accu-L® SMD Inductor is based on thin-film multilayer technology. This technology provides a level of control on the electrical and physical characteristics of the component which gives consistent characteristics within a lot and lot-to-lot. The original design provides small size, excellent highfrequency performance and rugged construction for reliable automatic assembly. The Accu-L® inductor is particularly suited for the telecommunications industry where there is a continuing trend towards miniaturization and increasing frequencies. The Accu-L® inductor meets both the performance and tolerance requirements of present cellular frequencies 450MHz and 900MHz and of future frequencies, such as 1700MHz, 1900MHz and 2400MHz. FEATURES APPLICATIONS • High Q • RF Power Capability • High SRF • Low DC Resistance • Ultra-Tight Tolerance on Inductance • Standard 0603 and 0805 Chip Size • Low Profile • Rugged Construction • Taped and Reeled DIMENSIONS: millimeters (inches) • Mobile Communications • Satellite TV Receivers • GPS • Vehicle Locations Systems • Filters • Matching Networks 0603 B L W W T T L 28 B 1.6±0.10 (0.063±0.004) 0.81±0.10 (0.032±0.004) 0.61±0.10 (0.024±0.004) top: 0.0 +0.3/-0.0 (0.0+0.012) bottom: 0.35±0.20 (0.014±0.008) 0805 2.11±0.10 (0.083±0.004) 1.5±0.10 (0.059±0.004) 0.91±0.13 (0.036±0.005) 0.25±0.15 (0.010±0.006) Operating/Storage Temp. Range: -55°C to +125°C Accu-L® 0603 and 0805 SMD High-Q RF Inductor HOW TO ORDER L 0805 4R7 D E S TR Product Inductor Size Inductance 0603 0805 Expressed in nH (2 significant digits + number of zeros) Tolerance for L ≤ 4.7nH, Specification Code Termination Code Packaging Code W = Nickel/ solder coated (Sn 63, Pb 37) **S = Nickel/ Lead Free Solder coated (Sn100) TR = Tape and Reel (3,000/reel) for values <10nH, Not RoHS Compliant E = Accu-L® 0805 technology G = Accu-L® 0603 technology B = ±0.1nH C = ±0.2nH D = ±0.5nH letter R denotes decimal point. Example: 22nH = 220 4.7nH = 4R7 4.7nH<L<10nH, C = ±0.2nH D = ±0.5nH 2 **RoHS compliant L ≥ 10nH, G = ±2% J = ±5% Engineering Kits Available see pages 90-91 LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L® 0603 450 MHz Test Frequency Available 900 MHz Test Frequency Inductance L (nH) Inductance Tolerance Q Typical 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12.0 15.0 ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2, ±0.5nH ±0.1, ±0.2, ±0.5nH ±0.1, ±0.2, ±0.5nH ±0.2, ±0.5nH ±0.2, ±0.5nH ±0.2, ±0.5nH ±2%, ±5% ±2%, ±5% ±2%, ±5% 49 26 20 20 21 24 25 23 26 23 23 28 28 28 L (nH) 1900 MHz Test Frequency 2400 MHz Test Frequency Q Typical L (nH) Q Typical L (nH) Q Typical 70 39 30 30 30 35 57 32 36 33 31 39 38 38 1.2 1.52 1.73 2.24 2.75 3.39 4.06 4.92 5.94 7.3 10 11.8 14.1 25.9 134 63 50 49 48 56 60 46 54 47 35 47 30 30 1.2 1.52 1.72 2.24 2.79 3.47 4.21 5.2 6.23 8.1 12.1 14.1 17.2 49.8 170 76 59 56 54 64 69 49 60 39 31 41 20 15 1.2 1.54 1.74 2.2 2.7 3.33 3.9 4.68 5.65 6.9 8.4 10 13.2 16.2 (1) IDC measured for 15°C rise at 25°C ambient temperature when soldered to FR-4 board. SRF min (MHz) RDC max (Ω) 10000 10000 10000 10000 9000 8400 6500 5500 5000 4500 3800 3500 3000 2500 0.04 0.06 0.07 0.08 0.08 0.08 0.12 0.15 0.25 0.30 0.35 0.45 0.50 0.60 IDC max (mA) (1) 1000 1000 1000 1000 750 750 500 500 300 300 300 300 300 300 Inductance and Q measured on Agilent 4291B / 4287 using the 16196A test fixture. ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L® 0805 450 MHz Test Frequency Available 900 MHz 1700 MHz 2400 MHz Test Frequency Test Frequency Test Frequency Inductance L (nH) Inductance Tolerance Q Typical L (nH) Q Typical L (nH) Q Typical L (nH) Q Typical 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 ±0.1nH, ±0.2nH, ±0.5nH ±0.1nH, ±0.2nH, ±0.5nH ±0.1nH, ±0.2nH, ±0.5nH ±0.1nH, ±0.2nH, ±0.5nH ±0.1nH, ±0.2nH, ±0.5nH ±0.1nH, ±0.2nH, ±0.5nH ±0.1nH, ±0.2nH, ±0.5nH ±0.1nH, ±0.2nH, ±0.5nH ±0.5nH ±0.5nH ±0.5nH ±2%, ±5% ±2%, ±5% ±2%, ±5% ±2%, ±5% ±2%, ±5% 60 50 50 42 42 38 27 43 50 43 43 46 40 36 30 36 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.8 5.7 7.0 8.5 10.6 12.9 16.7 21.9 27.5 92 74 72 62 62 46 36 62 68 62 56 60 50 46 27 33 1.2 1.5 1.8 2.2 2.8 3.4 4.0 5.3 6.3 7.7 10.0 13.4 17.3 27 – – 122 102 88 82 80 48 38 76 73 71 55 52 40 23 – – 1.2 1.5 1.9 2.3 2.9 3.5 4.1 5.8 7.6 9.4 15.2 – – – – – 92 84 73 72 70 57 42 60 62 50 32 – – – – – (1) IDC measured for 15°C rise at 25°C ambient temperature (2) IDC measured for 70°C rise at 25°C ambient temperature SRF min (MHz) 10000 10000 10000 10000 10000 10000 10000 5500 4600 4500 3500 2500 2400 2200 1700 1400 IDC max (mA) RDC max ΔT = 15°C ΔT = 70°C (Ω) 0.05 0.05 0.06 0.07 0.08 0.11 0.20 0.10 0.10 0.11 0.12 0.13 0.20 0.20 0.35 0.40 (1) (2) 1000 1000 1000 1000 1000 750 750 750 750 750 750 750 750 750 500 500 2000 2000 2000 2000 2000 1500 1500 1500 1500 1500 1500 1500 1500 1000 1000 1000 L, Q, SRF measured on HP 4291A, Boonton 34A and Wiltron 360 Vector Analyzer, RDC measured on Keithley 580 micro-ohmmeter. 29 Accu-L® 0603 and 0805 SMD High-Q RF Inductor L0603 2 Typical Inductance vs. Frequency L0603 100 1.2nH 15nH L (nH) 180 160 140 120 Q 100 80 60 40 20 0 Typical Q vs. Frequency L0603 1.5nH 5.6nH 10 8.2nH 15nH 0 1 2 3 1 Frequency (GHz) 0 2 1 1.5 Frequency (GHz) 0.5 8.2nH 6.8nH 4.7nH 3.3nH 2.2nH 1.8nH 1.2nH 2.5 Measured on AGILENT 4291B/4287 using the 16196A test fixture Measured on AGILENT 4291B/4287 using the 16196A test fixture Typical Q vs. Frequency L0805 Typical Inductance vs. Frequency L0805 3 L0805 140 100 120 1.2nH 100 Inductance (nH) 1.5nH 80 Q 1.8nH 5.6nH 60 10nH 22nH 15nH 10nH 10 5.6nH 40 15nH 20 1.8nH 22nH 1 0 0.1 1 0.01 0.1 Frequency (GHz) Frequency (GHz) Measured on HP4291A and Boonton 34A Coaxial Line Measured on HP4291A and Wiltron 360 Vector Analyzer Maximum Temperature Rise at 25°C ambient temperature (on FR-4) L0805 200 15nH 10nH 6.8nH 4.7nH 2.7nH ΔT (°C) 100 10 1 0 0.5 1 1.5 2 Current (A) 2.5 3 Temperature rise will typically be no higher than shown by the graph 30 1 10 3.5 10 Accu-L® 0603 and 0805 SMD High-Q RF Inductor FINAL QUALITY INSPECTION Finished parts are tested for electrical parameters and visual/ mechanical characteristics. Parts are 100% tested for inductance at 450MHz. Parts are 100% tested for RDC. Each production lot is evaluated on a sample basis for: • Q at test frequency • Static Humidity Resistance: 85°C, 85% RH, 160 hours • Endurance: 125°C, IR, 4 hours 2 ENVIRONMENTAL CHARACTERISTICS TEST Solderability Leach Resistance Storage Shear Rapid Change of Temperature Bend Strength CONDITIONS Components completely immersed in a solder bath at 235 ± 5°C for 2 secs. Components completely immersed in a solder bath at 260 ±5°C for 60 secs. 12 months minimum with components stored in “as received” packaging. Components mounted to a substrate. A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Components mounted to a substrate. 5 cycles -55°C to +125°C. Tested as shown in diagram 1mm deflection 45mm Temperature Coefficient of Inductance (TCL) Component placed in environmental chamber -55°C to +125°C. REQUIREMENT Terminations to be well tinned. No visible damage. Dissolution of termination faces ≤ 15% of area. Dissolution of termination edges ≤ 25% of length. Good solderability No visible damage No visible damage No visible damage 45mm +0 to +125 ppm/°C 6 L2-L1 TCL = • 10 (typical) L1 (T2-T1) T1 = 25°C 31 Accu-L® 0805 Application Notes HANDLING PREHEAT & SOLDERING SMD chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product is the ideal medium for direct presentation to the placement machine. The rate of preheat in production should not exceed 4°C/second. It is recommended not to exceed 2°C/ second. Temperature differential from preheat to soldering should not exceed 150°C. For further specific application or process advice, please consult AVX. HAND SOLDERING & REWORK CIRCUIT BOARD TYPE 2 All flexible types of circuit boards may be used (e.g. FR-4, G-10) and also alumina. For other circuit board materials, please consult factory. COMPONENT PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during soldering. Pad designs are given below for both wave and reflow soldering. The basis of these designs is: a. Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. b. Pad overlap about 0.3mm. c. Pad extension about 0.3mm for reflow. Pad extension about 0.8mm for wave soldering. WAVE SOLDERING DIMENSIONS: millimeters (inches) 1.30 (0.051) 3.1 (0.122) 1.2 (0.047) 0.50 (0.020) 1.4 3.8 (0.150) (0.055) 1.30 (0.051) 0.8 (0.031) 0603 Accu-L® 0805 Accu-L® 1.2 (0.047) DIMENSIONS: millimeters (inches) 0.7 (0.028) 0.50 (0.020) CLEANING RECOMMENDATIONS Care should be taken to ensure that the devices are thoroughly cleaned of flux residues, especially the space beneath the device. Such residues may otherwise become conductive and effectively offer a lossy bypass to the device. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids . . . . . . i-propanol, ethanol, acetylacetone, water, and other standard PCB cleaning liquids. Ultrasonic conditions . . power – 20w/liter max. frequency – 20kHz to 45kHz. Temperature . . . . . . . . . 80°C maximum (if not otherwise limited by chosen solvent system). Time. . . . . . . . . . . . . . . 5 minutes max. 2.8 1.4 (0.110) (0.055) 0.90 (0.035) 0.8 (0.031) 0603 Accu-L® 0805 Accu-L® 0.7 (0.028) 1.5 (0.059) 32 After soldering, the assembly should preferably be allowed to cool naturally. In the event of assisted cooling, similar conditions to those recommended for preheating should be used. Recommended storage conditions for Accu-L® prior to use are as follows: Temperature. . . . . . . . . 15°C to 35°C Humidity . . . . . . . . . . . ≤65% Air Pressure . . . . . . . . . 860mbar to 1060mbar REFLOW SOLDERING 0.90 (0.035) COOLING STORAGE CONDITIONS 1.5 (0.059) 2.3 (0.091) Hand soldering is permissible. Preheat of the PCB to 100°C is required. The most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a temperature controlled model not exceeding 30 watts should be used and set to not more than 260°C. Maximum allowed time at temperature is 1 minute. When hand soldering, the base side (white side) must be soldered to the board. RECOMMENDED SOLDERING PROFILE For recommended soldering profile see page 23