ON AR0238CSSC12SHRA0-DP 2.1 mp/full hd digital image sensor Datasheet

AR0238
AR0238: 1/2.7-Inch
2.1 Mp/Full HD Digital
Image Sensor
www.onsemi.com
General Description
ON Semiconductor’s AR0238 is a 1/2.7-inch CMOS
digital image sensor with an active−pixel array of
1928Hx1088V. It captures images in either linear or high
dynamic range modes, with a rolling−shutter readout. It
includes sophisticated camera functions such as in−pixel
binning, windowing and both video and single frame modes.
It is designed for both low light and high dynamic range
scene performance. It is programmable through a simple
two−wire serial interface. The AR0238 produces
extraordinarily clear, sharp digital pictures, and its ability to
capture both continuous video and single frames makes it the
perfect choice for a wide range of applications, including
surveillance and HD video.
Table 1. KEY PARAMETERS
Features
Frame
rate
Parameter
• Superior Low−light Performance
• Latest 3.0 mm Pixel with ON Semiconductor DR−Pix
•
•
•
•
•
•
•
•
•
•
•
•
•
Technology with Dual Conversion Gain
Full HD Support at up to 1080P 60 fps for Superior
Video Performance
Linear or High Dynamic Range Capture
Supports Line Interleaved T1/T2 readout to Enable
HDR Processing in ISP Chip
Support for External Mechanical Shutter
On−chip Phase−locked Loop (PLL) Oscillator
Integrated Position−based Color and Lens Shading
Correction
Slave Mode for Precise Frame−rate Control
Stereo/3D Camera Support
Statistics Engine
Data Interfaces: Four−lane Serial High−speed Pixel
Interface (HiSPi) Differential Signaling (SLVS and
HiVCM), or Parallel
Auto Black Level Calibration
High−speed Configurable Context Switching
Temperature Sensor
Typical Value
Optical format
1/2.7−inch (6.6 mm)
Active pixels
1928(H) x 1088(V) (16:9 mode)
Pixel size
3.0 mm x 3.0 mm
Color filter array
RGB Bayer, RGB−IR
Shutter type
Electronic rolling shutter and GRR
Input clock range
6 – 48 MHz
Output clock maximum
148.5 Mp/s (4−lane HiSPi)
74.25 Mp/s (Parallel)
Output
Serial
HiSPi 10−, 12−, 14−, 16−, or 20−bit
Parallel
10−, 12−bit
1080p
60 fps Linear HiSPi
30 fps Linear Parallel
30 fps Line Interleaved HiSPi
15 fps Line Interleaved Parallel
Responsivity
4.0 V/lux−sec
SNRMAX
41 dB
Max Dynamic range
Up to 96 dB
Supply
voltage
I/O
1.8 or 2.8 V
Digital
1.8 V
Analog
2.8 V
HiSPi
0.3 V − 0.6 V (SLVS), 1.7 V − 1.9 V
(HiVcm)
Power consumption
(typical)
Operating temperature
Package options
< 300mW Line interleaved 1080p30
<190mW 1080p30 Linear Mode
−30°C to + 85°C Junction
11.43x11.43 mm 48−pin mPLCC
Recon Die
Applications
• Video Recording and Streaming
• 1080p60 (monitoring) Video Applications
• High Dynamic Range Imaging
© Semiconductor Components Industries, LLC, 2016
October, 2017 − Rev. 5
1
Publication Order Number:
AR0238/D
AR0238
PLCC48 11.43x11.43 (HiSPi)
CASE 776AQ
PLCC48 11.43x11.43 (Parallel)
CASE 776AS
Table 2. ORDERING INFORMATION
Part Number
Product Description
Orderable Product Attribute Description
AR0238CSSC12SHRA0−DR1
RGB Color, 12 Degree CRA, mPLCC, HiSPi
Dry Pack, No Protective film, Low MOQ
AR0238CSSC12SHRA0−DP1
RGB Color, 12 Degree CRA, mPLCC, HiSPi
Dry Pack, with Protective film, Low MOQ
AR0238CSSC12SHRA0−DR
RGB Color, 12 Degree CRA, mPLCC, HiSPi
Without protective film
AR0238CSSC12SHRA0−DP
RGB Color, 12 Degree CRA, mPLCC, HiSPi
With protective film
AR0238CSSC12SPRA0−DR
RGB Color, 12 Degree CRA, mPLCC, Parallel
Without Protective Film
AR0238CSSC12SPRA0−DR1
RGB Color, 12 Degree CRA, mPLCC, Parallel
Dry Pack, No Protective film, Low MOQ
AR0238CSSC12SUD20
RGB Color, 12 Degree CRA, Recon die
RGB Recon die
AR0238IRSH12SUD20
RGB−IR, 12 Degree CRA, Recon die
RGB−IR Recon die
AR0238CSSC12SHRAH3−GEVB
RGB Color, 12 Degree CRA, HiSPi
Evaluation Board
NOTE:
See the ON Semiconductor Device Nomenclature document (TND310/D) for a full description of the naming convention used for
image sensors. For reference documentation, including information on evaluation kits, please visit our web site at
www.onsemi.com.
GENERAL DESCRIPTION
The ON Semiconductor AR0238 can be operated in its
default mode or programmed for frame size, exposure, gain,
and other parameters. The default mode output is a 1080p−
resolution image at 60 frames per second (fps) through the
HiSPi port. In linear mode, it outputs 12−bit or 10−bit
A−Law compressed raw data, using the parallel or serial
(HiSPi) output port. In high dynamic range mode, it outputs
two exposure values that the ISP will combine into an HDR
image. The device may be operated in video (master) mode
or in single frame trigger mode.
FRAME_VALID and LINE_VALID signals are output on
dedicated pins, along with a synchronized pixel clock in
parallel mode.
The AR0238 includes additional features to allow
application−specific tuning: windowing and offset, auto
black level correction, and on−board temperature sensor.
Optional register information and histogram statistic
information can be embedded in the first and last 2 lines of
the image frame.
The AR0238 is designed to operate over a wide
temperature range of −30°C to +85°C junction.
FUNCTIONAL OVERVIEW
The AR0238 is a progressive−scan sensor that generates
a stream of pixel data at a constant frame rate. It uses an
on−chip, phase−locked loop (PLL) that can be optionally
enabled to generate all internal clocks from a single master
input clock running between 6 and 48 MHz. The maximum
output pixel rate is 148.5 Mp/s, corresponding to a clock rate
of 74.25 MHz. Figure 1 shows a block diagram of the sensor
configured in linear mode, and in HDR mode.
www.onsemi.com
2
AR0238
ADC Data
12
Row Noise Correction
Black Level Correction
Test Pattern Generator
Pixel Defect Correction
12
Digital Gain and Pedestal
A−Law Compression
10 bits
12 bits
HiSPi
Parallel
Figure 1. Block Diagram of AR0238
(providing offset correction and gain), and then through an
analog− to−digital converter (ADC). The output from the
ADC is a 12−bit value for each pixel in the array. The ADC
output passes through a digital processing signal chain
(which provides further data path corrections and applies
digital gain). The sensor also offers a high dynamic range
mode of operation where two images and taken using
different exposures. These images are output in from the
sensor and the ISP must combine them into one high
dynamic range image.
User interaction with the sensor is through the two−wire
serial bus, which communicates with the array control,
analog signal chain, and digital signal chain. The core of the
sensor is a 2.1 Mp Active− Pixel Sensor array. The timing
and control circuitry sequences through the rows of the
array, resetting and then reading each row in turn. In the time
interval between resetting a row and reading that row, the
pixels in the row integrate incident light. The exposure is
controlled by varying the time interval between reset and
readout. Once a row has been read, the data from the
columns is sequenced through an analog signal chain
www.onsemi.com
3
AR0238
1.5 kW2
1.5 kW2
Digital Digital
Core
I/O
Power1 Power1
VDD_IO
VDD
HiSPi Power
either 0.4 V
(SLVS) or
1.8 V (HiVCM)1
VDD_SLVS
PLL
Analog Analog
Power1 Power1 Power1
VDD_PLL
VAA
VAA_PIX
SLVS0_P
SLVS0_N
Master Clock
(6−48 MHz)
SLVS1_P
EXTCLK
SLVS1_N
SLVS2_P
SADDR
SLVS3_P
SDATA
SCLK
TRIGGER
OE_BAR
From
Controller
To Controller
SLVS2_N
SLVS3_N
SLVSC_P
SLVSC_N
RESET_BAR
FLASH
SHUTTER
TEST
VDD_IO
VDD
DGND
AGND
Digital
Ground
Analog
Ground
VDD_SLVS
VDD_PLL
VAA
VAA_PIX
Notes:
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5 kW, but a greater value may be used for slower two−wire speed.
3. The parallel interface output pads can be left unconnected if the serial output interface is used.
4. ON Semiconductor recommends that 0.1 mF and 10 mF decoupling capacitors for each power supply are mounted as close as possible
to the pad. Actual values and results may vary depending on the layout and design considerations. Refer to the AR0237AT demo
headboard schematics for circuit recommendations.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is
minimized.
6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.
Figure 2. Typical Configuration: Serial Four−Lane
HiSPi Interface
www.onsemi.com
4
1.5 kW2
1.5 kW2
AR0238
Master Clock
(6−48 MHz)
Digital
I/O
Power1
Digital
Core
Power1
PLL
Power1
Analog
Power1
Analog
Power1
VDD_IO
VDD
VDD_PLL
VAA
VAA_PIX
DOUT[11:0]
EXTCLK
PIXCLK
SADDR
SDATA
SCLK
From
Controller
To Controller
LINE_VALID
FRAME_VALID
TRIGGER
OE_BAR
FLASH
SHUTTER
RESET_BAR
TEST
VDD_IO
VDD
DGND
AGND
Digital
Ground
Analog
Ground
VDD_PLL
VAA
VAA_PIX
Notes:
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5 kW, but a greater value may be used for slower two−wire speed.
3. The serial interface output pads can be left unconnected if the parallel output interface is used.
4. ON Semiconductor recommends that 0.1 mF and 10 mF decoupling capacitors for each power supply are mounted as close as possible
to the pad. Actual values and results may vary depending on the layout and design considerations. Refer to the AR0237AT demo
headboard schematics for circuit recommendations.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is
minimized.
6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.
7. The EXTCLK input is limited to 6−48 MHz.
Figure 3. Typical Configuration: Parallel Pixel Data Interface
www.onsemi.com
5
VDD_SLVS
SLVS0_N
SLVS0_P
SLVS1_N
SLVS1_P
SLVSC_N
SLVSC_P
SLVS2_N
SLVS2_P
SLVS3_N
SLVS3_P
VDD
AR0238
6
5
4
3
2
1
48
47
46
45
44
43
VAA
10
39
AGND
AGND
11
38
VAA_PIX
VDD_IO
12
37
VAA
VDD
13
36
ATEST
DGND
14
35
VAA
Reserved
15
34
VAA_PIX
VAA
16
33
AGND
AGND
17
32
DGND
DGND
18
31
VDD
19
20
21
22
23
24
25
26
27
28
29
30
VDD_IO
DGND
SHUTTER
40
TRIGGER
9
OE_BAR
EXTCLK
RESET_BAR
VDD
SCLK
41
SADDR
8
SDATA
VDD_PLL
TEST
VDD_IO
FLASH
42
VDD_IO
7
VDD
DGND
(Top View − Lead Down)
Figure 4. HiSPi 48−Lead mPLCC Package
www.onsemi.com
6
AR0238
Table 3. PIN DESCRIPTIONS, HiSPi 48−Lead mPLCC
DS Name
mPLCC Pin
Type
Description
SLVSC_N
1
Output
HiSPi serial DDR clock differential N
SLVS1_P
2
Output
HiSPi serial data, lane 1, differential P
SLVS1_N
3
Output
HiSPi serial data, lane 1, differential N
SLVS0_P
4
Output
HiSPi serial data, lane 0, differential P
SLVS0_N
5
Output
HiSPi serial data, lane 0, differential N
VDD_SLVS
6
Power
0.3 V−0.6 V or 1.7 V − 1.9 V port to HiSPi Output Driver. Set the High_VCM
(R0x306E[9]) bit to 1 when configuring VDD_SLVS to 1.7 V – 1.9 V.
DGND
7, 14, 18, 32, 40
Power
Digital ground
VDD_PLL
8
Power
PLL power, 2.8 V nominal
EXTCLK
9
Input
VAA
10, 16, 35, 37
Power
Analog power, 2.8 V nominal
External input clock
AGND
11, 17, 33, 39
Power
Analog ground.
VDD_IO
12, 20, 30, 42
Power
I/O supply power, 1.8/2.8 V nominal
VDD
13, 19, 31, 41, 43
Power
Digital power, 1.8 V nominal
Reserved
15
−
FLASH
21
Output
TEST
22
Input
Reserved, NC
Flash control output
Manufacturing test enable pin (connect to Dgnd)
SDATA
23
I/O
SADDR
24
Input
Two−Wire Serial address select. 0: 0x20. 1: 0x30
SCLK
25
Input
Two−Wire Serial clock input
RESET_BAR
26
Input
Asynchronous reset (active LOW). All settings are restored to factory default.
OE_BAR
27
Input
Output enable (active LOW)
TRIGGER
28
Input
Exposure synchronization input
SHUTTER
29
Output
Control for external mechanical shutter. Can be left floating if not used.
VAA_PIX
34, 38
Power
Pixel power, 2.8 V nominal
ATEST
36
−
SLVS3_P
44
Output
HiSPi serial data, lane 3, differential P
SLVS3_N
45
Output
HiSPi serial data, lane 3, differential N
SLVS2_P
46
Output
HiSPi serial data, lane 2, differential P
SLVS2_N
47
Output
HiSPi serial data, lane 2, differential N
SLVSC_P
48
Output
HiSPi serial DDR clock differential P
NOTE:
Two−Wire Serial data I/O
Reserved, NC
The 36 thermal connection pads should be all soldered to DGND plane for better thermal conductivity. Refer to PACKAGE
DIMENSIONS for details..
www.onsemi.com
7
DOUT11
DOUT10
DOUT9
DOUT8
DOUT7
DOUT6
DOUT5
DOUT4
DOUT3
DOUT2
DOUT1
DOUT0
AR0238
6
5
4
3
2
1
48
47
46
45
44
43
VAA
10
39
AGND
AGND
11
38
VAA_PIX
VDD_IO
12
37
VAA
VDD
13
36
AGND
DGND
14
35
ATEST
Reserved
15
34
SHUTTER
VAA
16
33
TRIGGER
AGND
17
32
OE_BAR
VDD
18
31
REST_BAR
19
20
21
22
23
24
25
26
27
28
29
30
VDD
DGND
VDD_IO
40
SCLK
9
SADDR
EXTCLK
LINE_VALID
VDD
SDATA
41
DGND
8
TEST
VDD_PLL
FRAME_VALID
VDD_IO
PIXCLK
42
FLASH
7
VDD_IO
DGND
(Top View − Lead Down)
Figure 5. 48−Lead Parallel mPLCC
www.onsemi.com
8
AR0238
Table 4. 48−Lead PARALLEL mPLCC
Name
mPLCC Pin
Type
DOUT6
1
Output
Data output 6
Description
DOUT7
2
Output
Data output 7
DOUT8
3
Output
Data output 8
DOUT9
4
Output
Data output 9
DOUT10
5
Output
Data output 10
DOUT11
6
Power
Data output 11
DGND
7, 14, 24, 40
Power
Digital ground
VDD_PLL
8
Power
PLL power, 2.8 V nominal
EXTCLK
9
Input
VAA
10, 16, 37
Power
Analog power, 2.8 V nominal
AGND
11, 17, 36, 39
Power
Analog Ground
VDD_IO
12, 19, 29, 42
Power
I/O supply power, 1.8/2.8 V nominal
VDD
13, 18, 30, 41
Power
Digital power, 1.8 V nominal
Reserved
15
−
FLASH
20
Power
Flash control output
PIXCLK
21
Output
Pixel Clock
FRAME_VALID
22
Output
Frame Valid
External input clock
Reserved, NC
TEST
23
Input
SDATA
25
I/O
Manufacturing test enable pin (connect to DGNG)
LINE_VALID
26
Output
SADDR
27
Input
Two−Wire Serial address select. 0: 0x20, 1: 0x30
SCLK
28
Input
Two−Wire Serial clock input
RESET_BAR
31
Input
Asynchronous reset (active LOW). All settings are restored to factory default
Two−Wire Serial data I/O
Line Valid
OE_BAR
32
Input
Output enable (active LOW)
TRIGGER
33
Input
Exposure synchronization input
SHUTTER
34
Output
ATEST
35
−
VAA_PIX
38
Power
Pixel power, 2.8 V nominal
DOUT0
43
Output
Data Output 0
DOUT1
44
Output
Data Output 1
DOUT2
45
Output
Data Output 2
DOUT3
46
Output
Data Output 3
DOUT4
47
Output
Data Output 4
DOUT5
48
Output
Data Output 5
NOTE:
Control for external mechanical shutter. Can be left floating if not used.
Reserved, NC
The 29 thermal connection pads should be all soldered to DGND plane for better thermal conductivity. Refer to PACKAGE
DIMENSIONS for details.
www.onsemi.com
9
AR0238
PIXEL DATA FORMAT
readout to start on the same pixel. The pixel adjustment is
always performed for mono−chrome or color versions. The
active area is surrounded with optically transparent dummy
pixels to improve image uniformity within the active area.
Not all dummy pixels or barrier pixels can be read out.
PIXEL ARRAY STRUCTURE
While the sensor’s format is 1928 x1088, additional active
columns and active rows are included for use when
horizontal or vertical mirrored readout is enabled, to allow
1944
1116
10 Barrier + 4 Border Pixels
2 Barrier + 6 Border Pixels
1928 × 1088
5.78 × 3.26 mm
2 Barrier + 6 Border Pixels
10 Barrier + 4 Border Pixels
Light Dummy Pixel
Active Pixel
Figure 6. Pixel Array Description
www.onsemi.com
10
AR0238
Column Readout Direction
Active Pixel (0,0)
Array Pixel (0, 0)
Row Readout Direction
R G R G R
G R G
G B G B G
B G B
R G R G R
G R G
G B G B G
B G B
R G R G R
G R G
G B G B G
B G B
Figure 7. Pixel Color Pattern Detail (RGB) (Top Right Corner)
…
Column Readout Direction
Row Readout Direction
Active Pixel (0, 0)
Array Pixel (0, 0)
B G R G B G R
G
G IR G IR G IR G IR
…
R G B
G R G B
G
G IR G IR G IR G IR
Figure 8. Pixel Color Pattern Detail (RGB−IR) (Top Right Corner)
DEFAULT READOUT ORDER
When the sensor is imaging, the active surface of the
sensor faces the scene as shown in Figure 9. When the image
is read out of the sensor, it is read one row at a time, with the
rows and columns sequenced as shown in Figure 9.
By convention, the sensor core pixel array is shown with
pixel (0,0) in the top right corner (see Figure 7). This reflects
the actual layout of the array on the die. Also, the first pixel
data read out of the sensor in default condition is that of pixel
(10, 14).
www.onsemi.com
11
AR0238
Lens
Scene
Sensor (Rear View)
Row
Readout
Order
Column Readout Order
Pixel (0,0)
Figure 9. Imaging a Scene
FEATURES OVERVIEW
For a complete description, recommendations, and usage
guidelines for product features, refer to the AR0238
Developer Guide.
IMAGE ACQUISITION MODE
The AR0238 supports two image acquisition modes:
• Electronic rolling shutter (ERS) mode
This is the normal mode of operation. When the AR0238
is streaming, it generates frames at a fixed rate, and each
frame is integrated (exposed) using the ERS. When ERS
mode is in use, timing and control logic within the sensor
sequences through the rows of the array, resetting and then
reading each row in turn. In the time interval between reset−
ting a row and subsequently reading that row, the pixels in
the row integrate incident light. The integration (exposure)
time is controlled by varying the time between row reset and
row readout. For each row in a frame, the time between row
reset and row readout is the same, leading to a uniform
integration time across the frame. When the integration time
is changed (by using the two−wire serial interface to change
register settings), the timing and control logic controls the
transition from old to new integration time in such a way that
the stream of output frames from the AR0238 switches
cleanly from the old integration time to the new while only
generating frames with uniform integration. See “Changes
to Integration Time” in the AR0238 Register Reference.
• Global reset mode.
This mode can be used to acquire a single image at the
current resolution. In this mode, the end point of the pixel
integration time is controlled by an external
electromechanical shutter, and the AR0238 provides control
signals to interface to that shutter. The benefit of using an
external electromechanical shutter is that it eliminates the
visual artifacts associated with ERS operation. Visual
artifacts arise in ERS operation, particularly at low frame
rates, because an ERS image effectively integrates each row
of the pixel array at a different point in time.
3.0 mm Dual Conversion Gain Pixel
To improve the low light performance and keep the high
dynamic range, a large (3.0 um) dual conversion gain pixel
is implemented for better image optimization. With a dual
conversion gain pixel, the conversion gain of the pixel may
be dynamically changed to better adapt the pixel response
based on dynamic range of the scene. This gain can be
switched manually or automatically by an auto exposure
control module.
HDR
By default, the sensor powers up in Linear Mode. One can
change to HDR Mode. The HDR scheme used is
multi−exposure HDR. This allows the sensor to handle up to
96 dB of dynamic range. In HDR mode, the sensor
sequentially captures two exposures by maintaining two
separate read and reset pointers that are interleaved within
the rolling shutter readout. The exposure ratio may be set to
4x, 8x, 16x, or 32x. Sensor also provides flexibility to
choose any exposure ratio by setting number of t2 exposure
rows indepen− dent of the t1 exposure. The data will be
output as line interleaved data as described in the T1/T2 Line
Interleaved Mode section. There is also an option to output
either T1 only or T2 only.
RESOLUTION
The active array supports a maximum of 1928x1088
pixels to support 1080p resolution. Utilizing a 3.0 um pixel
will result in an optical format of 1/2.7−inch (approximately
6.6 mm diagonal).
EMBEDDED DATA AND STATISTICS
FRAME RATE
The AR0238 has the capability to output image data and
statistics embedded within the frame timing. There are two
types of information embedded within the frame readout.
At full (1080p) resolution, the AR0238 is capable of
running up to 60 fps in linear mode and 30 fps in line
interleaved mode.
www.onsemi.com
12
AR0238
• Embedded Data:
•
only a subset of registers is available for switching. The
AR0238 supports a highly configurable context switching
RAM of size 256 x 16. Within this Context Memory,
changes to any register may be stored. The register set for
each context must be the same, but the number of contexts
and registers per context are limited only by the size of the
context memory.
Alternatively, the user may switch between two
predefined register sets A and B by writing to a context
switch change bit. When the context switch is configured to
context A the sensor will reference the context A registers.
If the context switch is changed from A to B during the
readout of frame n, the sensor will then reference the context
B coarse_integration_time registers in frame n+1 and all
other context B registers at the beginning of reading frame
n+2. The sensor will show the same behavior when changing
from context B to context A. The registers listed in Table 5
are context−switchable:
If enabled, these are displayed on the two rows
immediately before the first active pixel row is
displayed.
Embedded Statistics:
If enabled, these are displayed on the two rows
immediately after the last active pixel row is displayed.
MULTI−CAMERA SYNCHRONIZATION
SLAVE MODE
The slave mode feature of the AR0238 supports triggering
the start of a frame readout from an input signal that is
supplied from an external ASIC. The slave mode signal
allows for precise control of frame rate and register change
updates.
Context Switching and Register Updates
The user has the option of using the highly configurable
context memory, or a simplified implementation in which
Table 5. LIST OF CONFIGURABLE REGISTERS FOR CONTEXT A AND CONTEXT B
Context A
Context B
Register Description
Register Description
coarse_integration_time
coarse_integration_time_cb
line_length_pck
line_length_pck_cb
frame_length_lines
frame_length_lines_cb
row_bin
row_bin_cb
col_bin
col_bin_cb
fine_gain
fine_gain_cb
coarse_gain
coarse_gain_cb
coarse_integration_time2
coarse_integration_time2_cb
dcg_manual_set
dcg_manual_set_cb
dcg_manual_set_t1
dcg_manual_set_t1_cb
bypass_pix_comb
bypass_pix_cb
coarse_gain_t1
coarse_gain_t1_cb
fine_gain_t1
fine_gain_t1_cb
x_addr_start
x_addr_start_cb
y_addr_start
y_addr_start_cb
x_addr_end
x_addr_end_cb
y_addr_end
y_addr_end_cb
y_odd_inc
y_odd_inc_cb
x_odd_inc
x_odd_inc_cb
green1_gain
green1_gain_cb
blue_gain
blue_gain_cb
red_gain
red_gain_cb
green2_gain
green2_gain_cb
global_gain
global_gain_cb
operation_mode_ctrl
operation_mode_ctrl_cb
bypass_pix_comb
bypass_pix_comb_cb
www.onsemi.com
13
AR0238
ANALOG/DIGITAL GAINS
SILICON / FIRMWARE / SEQUENCER REVISION
INFORMATION
A programmable analog gain of 1.0x to 16x (linear and
HDR) applied simultaneously to all color channels will be
featured along with a digital gain of 1x to 16x that may be
configured on a per color channel basis. Analog gain can be
applied per exposure in line interleaved mode.
A revision register will be provided to read out (via I2C)
silicon and sequencer/OTPM revision information. This
will be helpful to distinguish among different lots of material
if there are future OTPM or sequencer revisions.
LENS SHADING CORRECTION
SKIPPING/BINNING MODES
The latest lens shading correction algorithm will be
included for potential low Z height applications.
The AR0238 supports subsampling. Subsampling allows
the sensor to read out a smaller set of active pixels by either
skipping, binning, or summing pixels within the readout
window. Horizontal binning is achieved in the digital
readout. The sensor will sample the combined 2x adjacent
pixels within the same color plane. Vertical row binning is
applied in the pixel readout. Row binning can be configured
as 2x rows within the same color plane. Pixel skipping can
be configured up to 2x in both the x−direction and
y−direction. Skipping pixels in the x−direction will not
reduce the row time. Skipping pixels in the y direction will
reduce the number of rows from the sensor effectively
reducing the frame time. Skipping will introduce image
artifacts from aliasing.
The AR0238 supports row wise vertical binning. Row
wise vertical summing is only supported in monochrome
sensors.
COMPRESSION
When the AR0238 is configured for linear mode
operation, the sensor can optionally compress 12−bit data to
10−bit using A−law compression. The A−law compression
is disabled by default.
PACKAGING
The AR0238 will be offered in a 11.43 x 11.43 48−Lead
mPLCC package.
PARALLEL INTERFACE
The parallel pixel data interface uses these output−only
signals:
• FRAME_VALID
• LINE_VALID
• PIXCLK
• DOUT[11:0]
CLOCKING OPTIONS
The sensor contains a phase−locked loop (PLL) that is
used for timing generation and control. The required VCO
clock frequency is attained through the use of a pre−PLL
clock divider followed by a multiplier. The PLL multiplier
should be an even integer. If an odd integer (M) is
programmed, the PLL will default to the lower (M−1) value
to maintain an even multiplier value. The multiplier is
followed by a set of dividers used to generate the output
clocks required for the sensor array, the pixel analog and
digital readout paths, and the output parallel and serial
interfaces. Use of the PLL is required when using the HiSPi
interface.
HIGH SPEED SERIAL PIXEL (HISPI) INTERFACE
The HiSPi interface supports three protocols,
Streaming−S, Streaming−SP, and Packetized SP. The
streaming protocols conform to a standard video application
where each line of active or intra−frame blanking provided
by the sensor is transmitted at the same length. The
Packetized SP protocol will transmit only the active data
ignoring line−to−line and frame−to−frame blanking data.
The HiSPi interface building block is a unidirectional
differential serial interface with four data and one double
data rate (DDR) clock lanes. One clock for every four serial
data lanes is provided for phase alignment across multiple
lanes. The AR0238 supports serial data widths of 10 or 12
bits on one, two, or four lanes. The specification includes a
DLL to compensate for differences in group delay for each
data lane. The DLL is connected to the clock lane and each
data lane, which acts as a control master for the output delay
buffers. Once the DLL has gained phase lock, each lane can
be delayed in
1/8 unit interval (UI) steps. This additional delay allows
the user to increase the setup or hold time at the receiver
circuits and can be used to compensate for skew introduced
in PCB design. Delay compensation may be set for clock
and/or data lines in the hispi_timing register R0x31C0. If the
DLL timing adjustment is not required, the data and clock
lane delay settings should be set to a default code of 0x0000
to reduce jitter, skew, and power dissipation.
TEMPERATURE SENSOR
The AR0238 sensor has a built-in PTAT-based
temperature sensor, accessible through registers, that is
capable of measuring die junction temperature. The value
read out from the temperature sensor register is an ADC
output value that needs to be converted downstream to a
final temperature value in degrees Celsius. Since the PTAT
device characteristic response is quite linear in the
temperature range of operation required, a simple linear
function can be used to convert the ADC output value to the
final temperature in degrees Celsius.
A single reference point will be made available via
register read as well as a slope for back−calculating the
junction temperature value. An error of +/-5% or better over
the full specified operating range of the sensor is to be
expected.
www.onsemi.com
14
AR0238
SENSOR CONTROL INTERFACE
device can drive SDATA LOW−the interface protocol
determines which device is allowed to drive SDATA at any
given time. The two−wire serial interface can run at 100 kHz
or 400 kHz.
The two−wire serial interface bus enables read/write
access to control and status registers within the AR0238.
The interface protocol uses a master/slave model in which
a master controls one or more slave devices. The sensor acts
as a slave device. The master generates a clock (SCLK) that
is an input to the sensor and is used to synchronize transfers.
Data is transferred between the master and the slave on a
bidirectional signal (SDATA). SDATA is pulled up to VDD_IO
off−chip by a 1.5 kW resistor. Either the slave or master
T1/T2 LINE INTERLEAVED MODE
The AR0238 outputs the T1 and T2 exposures separately,
in a line interleaved format. The purpose of this is to enable
off chip HDR linear combination and processing. See the
AR0238 Developer Guide for more information.
70
Red
60
Green (R)
Green (B)
Quantum Efficiency (%)
50
Blue
40
30
20
10
0
350
450
550
650
750
850
Wavelength (nm)
Figure 10. Quantum Efficiency − RGB
www.onsemi.com
15
950
1050
1150
AR0238
70
Red
60
Green (R)
Green (B)
Quantum Efficiency (%)
50
Blue
IR
40
30
20
10
0
450
350
550
650
750
850
950
1050
1150
Wavelength (nm)
Figure 11. Quantum Efficiency − RGB−IR
ELECTRICAL SPECIFICATIONS
Unless otherwise stated, the following specifications
apply under the following conditions: VDD = 1.8 V –
0.10/+0.15; VDD_IO = VDD_PLL = VAA = VAA_PIX =
2.8 V ± 0.3 V; VDD_SLVS = 0.4 V – 0.1/+0.2; TA = −40°C
to +85°C−; output load = 10 pF; frequency = 74.25 MHz;
HiSPi off.
TWO−WIRE SERIAL REGISTER INTERFACE
The electrical characteristics of the two−wire serial
register interface (SCLK, SDATA) are shown in Figure 12 and
Table 6.
SDATA
tLOW
tf
tSU;DAT
tr
tf
tHD;STA
tBUF
tr
SCLK
tHD;STA
S
NOTE:
tHD;DAT
tHIGH
tSU;STA
tSU;STO
Sr
P
Read sequence: For an 8−bit READ, read waveforms start after WRITE command and register address are
issued.
Figure 12. Two−Wire Serial Bus Timing Parameters
www.onsemi.com
16
S
AR0238
Table 6. Two−Wire Serial Bus Characteristics
fEXTCLK = 27 MHz; VDD = 1.8 V; VDD_IO = 2.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; TA = 25°C
Standard Mode
Fast Mode
Symbol
Min
Max
Min
Max
Unit
fSCL
0
100
0
400
KHz
tHD;STA
4.0
−
0.6
−
ms
LOW period of the SCLK clock
tLOW
4.7
−
1.3
−
ms
HIGH period of the SCLK clock
tHIGH
4.0
−
0.6
−
ms
Set−up time for a repeated START
condition
tSU;STA
4.7
−
0.6
−
ms
Data hold time
tHD;DAT
0 (Note 13)
0.9
(Note 12)
ms
Data set−up time
tSU;DAT
250
−
100 (Note 13)
−
ns
Rise time of both SDATA and SCLK signals
tr
−
1000
20 + 0.1Cb
(Note 14)
300
ns
Fall time of both SDATA and SCLK signals
tf
−
300
20 + 0.1Cb
(Note 14)
300
ns
tSU;STO
4.0
−
0.6
−
ms
tBUF
4.7
−
1.3
−
ms
Cb
−
400
−
400
pF
CIN_SI
−
3.3
−
3.3
pF
CLOAD_SD
−
30
−
30
pF
RSD
1.5
4.7
1.5
4.7
kW
Parameter
SCLK Clock Frequency
Hold time (repeated) START condition. After this period, the first
clock pulse is generated
Set−up time for STOP condition
Bus free time between a STOP and START condition
Capacitive load for each bus line
Serial interface input pin capacitance
SDATA max load capacitance
SDATA pull−up resistor
0
3.45
(Note 11) (Note 12)
8. This table is based on I2C standard (v2.1 January 2000). Philips Semiconductor.
9. Two−wire control is I2C−compatible.
10. All values referred to VIHmin = 0.9 VDD and VILmax = 0.1 VDD levels. Sensor EXCLK = 27 MHz.
11. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK.
12. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal.
13. A Fast−mode I2C−bus device can be used in a Standard−mode I2C−bus system, but the requirement tSU;DAT 250 ns must then be met.
This will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW
period of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the
Standard−mode I2C−bus specification) before the SCLK line is released.
14. Cb = total capacitance of one bus line in pF.
www.onsemi.com
17
AR0238
I/O TIMING
See Figure 13 below and Table 7 on page 18 for I/O
timing (AC) characteristics.
By default, the AR0238 launches pixel data, FV, and LV
with the falling edge of PIXCLK. The expectation is that the
user captures DOUT[11:0], FV, and LV using the rising edge
of PIXCLK.
tR
tF
90%
10%
tRP
90%
tFP
90%
10%
90%
10%
10%
tEXTCLK
EXTCLK
PIXCLK
tPD
Data[11:0]
LINE_VALID/
FRAME_VALID
Pxl_0
Pxl_1
Pxl_2
Pxl_n
tPFL
tPLL
tPLH
tPFH
FRAME_VALID Leads LINE_VALID
by 6 PIXCLKs
FRAME_VALID Trails LINE_VALID
by 6 PIXCLKs
Figure 13. I/O Timing Diagram
Table 7. I/O TIMING CHARACTERISTICS
Symbol
Definition
fEXTCLK1s
Input Clock Frequency
tEXTCLK1
Input Clock Period
Condition
Min
Typ
Max
Unit
6
–
48
MHz
20.8
–
166
ns
tR
Input Clock Rise Time
–
3
–
ns
tF
Input Clock Fall Time
–
3
–
ns
tRP
Pixclk Rise Time
2
3.5
5
ns
tFP
Pixclk Fall Time
2
3.5
5
ns
Clock Duty Cycle
45
50
55
%
EXTCLK to PIXCLK Propagation Delay
Nominal Voltages,
PLL Disabled
10
14
18
ns
PIXCLK Frequency
Default, Nominal
Voltages
6
–
74.25
MHz
tPD
PIXCLK to Data Valid
Default, Nominal
Voltages
0
2.5
5
ns
tPFH
PIXCLK to FV HIGH
Default, Nominal
Voltages
−2
3
6
ns
tPLH
PIXCLK to LV HIGH
Default, Nominal
Voltages
−2
3
6
ns
tPFL
PIXCLK to FV LOW
Default, Nominal
Voltages
−2
2.5
6
ns
tPLL
PIXCLK to LV LOW
Default, Nominal
Voltages
−2
2.5
6
ns
Output Load Capacitance
–
< 10
–
pF
Input Pin Capacitance
–
2.5
–
pF
tCP
fPIXCLK
CLOAD
CIN
NOTE:
I/O timing characteristics are measured under the following conditions:
− Temperature is 25°C ambient
− 10 pF load
− 1.8 V I/O supply voltage
www.onsemi.com
18
AR0238
DC ELECTRICAL CHARACTERISTICS
The DC electrical characteristics are shown in the tables
below.
Table 8. DC ELECTRICAL CHARACTERISTICS
Symbol
Min
Typ
Max
Unit
1.7
1.8
1.95
V
1.7/2.5
1.8/2.8
1.9/3.1
V
Analog voltage
2.5
2.8
3.1
V
VAA_PIX
Pixel supply voltage
2.5
2.8
3.1
V
VDD_PLL
PLL supply voltage
2.5
2.8
3.1
V
HiSPi supply voltage
0.3
0.4
0.6
V
VDD
VDD_IO
VAA
VDD_SLVS
Definition
Condition
Core digital voltage
I/O digital voltage
VIH
Input HIGH voltage
VDD_IO*0.7
–
–
V
VIL
Input LOW voltage
–
–
VDD_IO*0.3
V
IIN
Input leakage current
20
–
–
mA
VOH
Output HIGH voltage
VDD_IO−0.3
–
–
V
VOL
Output LOW voltage
–
–
0.4
V
IOH
Output HIGH current
At specified VOH
−22
–
–
mA
IOL
Output LOW current
At specified VOL
–
–
22
mA
Min
Max
Unit
Core digital voltage
–0.3
2.4
V
I/O digital voltage
–0.3
4
V
VAA_MAX
Analog voltage
–0.3
4
V
VAA_PIX
Pixel supply voltage
–0.3
4
V
VDD_PLL
PLL supply voltage
–0.3
4
V
–0.3
2.4
V
–40
85
°C
No pull−up resistor; VIN = VDD_IO or
DGND
Table 9. ABSOLUTE MAXIMUM RATINGS
Symbol
VDD_MAX
VDD_IO_MAX
Definition
Condition
VDD_SLVS_MAX HiSPi I/O digital voltage
tST
Storage temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
www.onsemi.com
19
AR0238
Table 10. 1080p30 LINEAR 74 MHZ PARALLEL 2.8 V
(Operating currents are measured in mA at the following conditions: VAA = VAA_PIX = VDD_PLL = VDD_IO = 2.8 V; VDD = 1.8 V; PLL
Enabled and PIXCLK = 74.25 MHz; Low power mode enabled; TA = 25°C)
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
Digital Operating Current
Streaming 1080p30
IDD
1.8
20
34
50
mA
I/O Digital Operating Current
Streaming 1080p30
IDD_IO
2.8
15
28
50
mA
Analog Operating Current
Streaming 1080p30
IAA
2.8
15
26
50
mA
Pixel Supply Current
Streaming 1080p30
IAA_PIX
2.8
1
3
7
mA
PLL Supply Current
Streaming 1080p30
IDD_PLL
2.8
5.5
6.4
7
mA
Power
138.2
238.72
409.2
mW
Table 11. 1080p30 LINEAR 74 MHZ PARALLEL 1.8 V
(Operating currents are measured in mA at the following conditions: VAA = VAA_PIX = VDD_PLL = 2.8 V; VDD = VDD_IO = 1.8 V; PLL
Enabled and PIXCLK = 74.25 MHz; Low power mode enabled; TA = 25°C Dark Image, 8× Analog Gain, HCG, 20 ms integration time)
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
Digital Operating Current
Streaming 1080p30
IDD
1.8
20
34
50
mA
I/O Digital Operating Current
Streaming 1080p30
IDD_IO
1.8
10
14
30
mA
Analog Operating Current
Streaming 1080p30
IAA
2.8
15
26
50
mA
Pixel Supply Current
Streaming 1080p30
IAA_PIX
2.8
1
3
7
mA
PLL Supply Current
Streaming 1080p30
IDD_PLL
2.8
5.5
6.4
7
mA
Power
114.2
185.52
323.2
mW
Table 12. 1080p30 LINEAR 74 MHZ HISPI SLVS
(Operating currents are measured in mA at the following conditions: VAA = VAA_PIX = VDD_PLL = 2.8 V; VDD = VDD_IO = 1.8 V;
VDD_SLVS = 0.4 V; PLL Enabled and PIXCLK = 74.25 MHz; 4−lane HiSPi mode; Low power mode enabled; TA = 25°C Dark Image,
8× Analog Gain, HCG, 20 ms integration time)
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
Digital Operating Current
Streaming 1080p30
IDD
1.8
25
44
65
mA
Analog Operating Current
Streaming 1080p30
IAA
2.8
15
26
50
mA
Pixel Supply Current
Streaming 1080p30
IAA_PIX
2.8
1
3
7
mA
PLL Supply Current
Streaming 1080p30
IDD_PLL
2.8
6
7.5
8.5
mA
SLVS Supply Current
Streaming 1080p30
IDD_SLVS
0.4
6
9.5
14
mA
Power
109
185.2
306
mW
Table 13. 1080p30 LINEAR 74 MHZ HISPI HIVCM
(Operating currents are measured in mA at the following conditions: VAA = VAA_PIX = VDD_PLL = 2.8 V; VDD = VDD_IO = VDD_SLVS =
1.8 V; PLL Enabled and PIXCLK = 74.25 MHz; 4−lane HiSPi mode; Low power mode enabled; TA = 25°C Dark Image, 8× Analog Gain,
HCG, 20 ms integration time)
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
Digital Operating Current
Streaming 1080p30
IDD
1.8
25
44
65
mA
Analog Operating Current
Streaming 1080p30
IAA
2.8
15
26
50
mA
Pixel Supply Current
Streaming 1080p30
IAA_PIX
2.8
1
3
7
mA
PLL Supply Current
Streaming 1080p30
IDD_PLL
2.8
6
7.5
8.5
mA
SLVS Supply Current
Streaming 1080p30
IDD_SLVS
1.8
12
20
35
mA
Power
128.2
217.4
363.4
mW
www.onsemi.com
20
AR0238
Table 14. 1080p60 LINEAR 74 MHZ HISPI SLVS
(Operating currents are measured in mA at the following conditions: VAA = VAA_PIX = VDD_PLL = 2.8 V; VDD = VDD_IO = 1.8 V;
VDD_SLVS = 0.4 V; PLL Enabled and PIXCLK = 74.25 MHz; 4−lane HiSPi mode; TA= 25°C Dark Image, 8× Analog Gain, HCG, 20 ms
integration time)
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
IDD
1.8
50
88
130
mA
Digital Operating Current
Streaming 1080p60
Analog Operating Current
Streaming 1080p60
IAA
2.8
20
36
60
mA
Pixel Supply Current
Streaming 1080p60
IAA_PIX
2.8
1
4
8
mA
PLL Supply Current
Streaming 1080p60
IDD_PLL
2.8
7
8.5
9.5
mA
SLVS Supply Current
Streaming 1080p60
IDD_SLVS
0.4
6
9.5
14
mA
Power
170.8
298
442.6
mW
Table 15. 1080p60 LINEAR 74 MHZ HISPI HIVCM
(Operating currents are measured in mA at the following conditions: VAA = VAA_PIX = VDD_PLL = 2.8 V; VDD = VDD_IO = 1.8 V;
VDD_SLVS = 1.8 V; PLL Enabled and PIXCLK = 74.25 MHz; 4−lane HiSPi mode; TA= 25°C Dark Image, 8× Analog Gain, HCG, 20 ms
integration time)
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
IDD
1.8
50
88
130
mA
Digital Operating Current
Streaming 1080p60
Analog Operating Current
Streaming 1080p60
IAA
2.8
20
36
60
mA
Pixel Supply Current
Streaming 1080p60
IAA_PIX
2.8
1
4
8
mA
PLL Supply Current
Streaming 1080p60
IDD_PLL
2.8
7
8.5
9.5
mA
SLVS Supply Current
Streaming 1080p60
IDD_SLVS
1.8
12
20
35
mA
Power
190
330.2
500
mW
Table 16. 1080p30 LINE−INLEAVED 74MHZ HISPI SLVS
(Operating currents are measured in mA at the following conditions: VAA = VAA_PIX = VDD_PLL = 2.8 V; VDD = VDD_IO = 1.8 V;
VDD_SLVS = 0.4 V; PLL Enabled and PIXCLK = 74.25 MHz; 4−lane HiSPi mode; TA= 25°C Dark Image, 8× Analog Gain, HCG, 20 ms
integration time)
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
Digital Operating Current
Streaming 1080p30
IDD
1.8
50
88
130
mA
Analog Operating Current
Streaming 1080p30
IAA
2.8
20
36
60
mA
Pixel Supply Current
Streaming 1080p30
IAA_PIX
2.8
1
4
8
mA
PLL Supply Current
Streaming 1080p30
IDD_PLL
2.8
7
8.5
9.5
mA
SLVS Supply Current
Streaming 1080p30
IDD_SLVS
0.4
6
9.5
14
mA
Power
170.8
298
442.6
mW
Table 17. 1080p30 LINE−INLEAVED 74MHZ HISPI HIVCM
(Operating currents are measured in mA at the following conditions: VAA = VAA_PIX = VDD_PLL = 2.8 V; VDD = VDD_IO = 1.8 V;
VDD_SLVS = 1.8 V; PLL Enabled and PIXCLK = 74.25 MHz; 4−lane HiSPi mode; TA= 25°C Dark Image, 8× Analog Gain, HCG, 20 ms
integration time)
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
Digital Operating Current
Streaming 1080p30
IDD
1.8
50
88
130
mA
Analog Operating Current
Streaming 1080p30
IAA
2.8
20
36
60
mA
Pixel Supply Current
Streaming 1080p30
IAA_PIX
2.8
1
4
8
mA
PLL Supply Current
Streaming 1080p30
IDD_PLL
2.8
7
8.5
9.5
mA
SLVS Supply Current
Streaming 1080p30
IDD_SLVS
1.8
12
20
35
mA
Power
190
330.2
500
mW
www.onsemi.com
21
AR0238
HiSPi ELECTRICAL SPECIFICATIONS
The ON Semiconductor AR0238 sensor supports both
SLVS and HiVCM HiSPi modes. Refer to the High-Speed
Serial Pixel (HiSPi) Interface Physical Layer Specification
v2.00.00 for electrical definitions, specifications, and
timing information. The VDD_SLVS supply in this datasheet
corresponds to VDD_TX in the HiSPi Physical Layer
Specification. Similarly, VDD is equivalent to VDD_HiSPi
as referenced in the specification. The DLL as implemented
on AR0238 is limited in the number of available delay steps
and differs from the HiSPi specification as described in this
section.
Table 18. CHANNEL SKEW
Measurement Conditions: VDD_HiSPi = 1.8 V; VDD_HiSPi_TX = 0.4V; Data Rate = 480 Mbps;
DLL set to 0
Data Lane Skew in Reference to Clock
tCHSKEW1PHY
www.onsemi.com
22
−150
ps
AR0238
POWER−ON RESET AND STANDBY TIMING
5. After 100 ms, turn on VDD_SLVS power supply.
6. After the last power supply is stable, enable
EXTCLK.
7. Assert RESET_BAR for at least 1 ms. The parallel
interface will be tri−stated during this time.
8. Wait 150000 EXTCLKs (for internal initialization
into software standby.
9. Configure PLL, output, and image settings to
desired values.
10. Wait 1ms for the PLL to lock.
11. Set streaming mode (R0x301a[2] = 1).
POWER−UP SEQUENCE
The recommended power−up sequence for the AR0238 is
shown in Figure 14. The available power supplies
(VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA,
VAA_PIX) must have the separation specified below.
1. Turn on VDD_PLL power supply.
2. After 100 ms, turn on VAA and VAA_PIX power
supply.
3. 3. After 100 ms, turn on VDD_IO power supply.
4. After 100 ms, turn on VDD power supply.
VDD_PLL (2.8)
VAA_PIX
VAA (2.8)
VDD_IO (1.8/2.8)
t0
t1
t2
VDD (1.8)
t3
VDD_SLVS (0.4)
EXTCLK
t4
RESET_BAR
t5
tX
Hard
Reset
t6
Internal
Initialization
Software
Standby
PLL Lock
Streaming
Figure 14. Power Up
Table 19. POWER−UP SEQUENCE
Definition
Symbol
Min
Typ
Max
Unit
VDD_PLL to VAA/VAA_PIX (Note 17)
t0
0
100
–
ms
VAA/VAA_PIX to VDD_IO
t1
0
100
–
ms
VDD_IO to VDD
t2
0
100
–
ms
VDD to VDD_SLVS
t3
0
100
–
ms
Xtal settle time
tx
–
30
(Note 15)
–
ms
Hard Reset
t4
1
(Note 16)
–
–
ms
Internal Initialization
t5
150000
–
–
EXTCLK
s
PLL Lock Time
t6
1
–
–
ms
15. Xtal settling time is component−dependent, usually taking about 10 – 100 ms.
16. Hard reset time is the minimum time required after power rails are settled. In a circuit where Hard reset is held down by RC circuit, then the
RC time must include the all power rail settle time and Xtal settle time.
17. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered before or at least at the same time as the
others. If the case happens that VDD_PLL is powered after other supplies then sensor may have functionality issues and will experience
high current draw on this supply.
www.onsemi.com
23
AR0238
POWER−DOWN SEQUENCE
2. The soft standby state is reached after the current
row or frame, depending on configuration, has
ended.
3. Turn off VDD_SLVS.
4. Turn off VDD.
5. Turn off VDD_IO.
6. Turn off VAA/VAA_PIX.
7. Turn off VDD_PLL.
The recommended power−down sequence for the
AR0238 is shown in Figure 15. The available power
supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA,
VAA_PIX) must have the separation specified below.
1. Disable streaming if output is active by setting
standby R0x301a[2] = 0
VDD_SLVS (0.4)
t0
VDD (1.8)
t1
VDD_IO (1.8/2.8)
t2
VAA_PIX
VAA (2.8)
t3
VDD_PLL (2.8)
EXTCLK
t4
Power Down until Next
Power Up Cycle
Figure 15. Power Down
Table 20. POWER−DOWN SEQUENCE
NOTE:
Definition
Symbol
Min
Typ
Max
Unit
VDD_SLVS to VDD
t0
0
–
–
ms
VDD to VDD_IO
t1
0
–
–
ms
VDD_IO to VAA/VAA_PIX
t2
0
–
–
ms
VAA/VAA_PIX to VDD_PLL
t3
0
–
–
ms
Power Down until Next Power Up Time
t4
100
–
–
ms
t4 is required between power down and next power up time; all decoupling caps from regulators must be completely discharged.
www.onsemi.com
24
AR0238
PACKAGE DIMENSIONS
PLCC48 11.43x11.43 (HiSPi)
CASE 776AQ
ISSUE D
www.onsemi.com
25
AR0238
PACKAGE DIMENSIONS
PLCC48 11.43x11.43 (Parallel)
CASE 776AS
ISSUE A
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
◊
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
26
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
AR0238/D