SAMSUNG K4S281632B-N

shrink-TSOP
CMOS SDRAM
K4S281632B-N
2M x 16Bit x 4 Banks Synchronous DRAM in sTSOP
FEATURES
GENERAL DESCRIPTION
• JEDEC standard 3.3V power supply
The K4S281632B-N is 134,217,728 bits synchronous high
data rate Dynamic RAM organized as 4 x 2,097,152 words by
16 bits, fabricated with SAMSUNG′s high performance CMOS
technology. Synchronous design allows precise cycle control
with the use of system clock I/O transactions are possible on
every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same
device to be useful for a variety of high bandwidth, high performance memory system applications.
• LVTTL compatible with multiplexed address
• Four banks operation
• MRS cycle with address key programs
- CAS latency (2 & 3)
- Burst length (1, 2, 4, 8 & Full page)
- Burst type (Sequential & Interleave)
• All inputs are sampled at the positive going edge of the system
clock.
• Burst read single-bit write operation
ORDERING INFORMATION
• DQM for masking
• Auto & self refresh
Part No.
• 64ms refresh period (4K cycle)
Max Freq.
Interface Package
K4S281632B-NC/L1H
100MHz(CL=2)
K4S281632B-NC/L1L
100MHz(CL=3)
LVTTL
54pin
sTSOP(II)
FUNCTIONAL BLOCK DIAGRAM
I/O Control
Data Input Register
LWE
LDQM
Bank Select
2M x 16
2M x 16
2M x 16
Output Buffer
Sense AMP
Row Decoder
ADD
Row Buffer
Refresh Counter
Column Decoder
Col. Buffer
LCBR
LRAS
Address Register
CLK
2M x 16
Latency & Burst Length
LCKE
Programming Register
LRAS
LCBR
LWE
LCAS
LWCBR
Timing Register
CLK
CKE
CS
RAS
CAS
WE
LDQM
UDQM
* Samsung Electronics reserves the right to change products or specification without notice.
LDQM
DQi
shrink-TSOP
CMOS SDRAM
K4S281632B-N
PIN CONFIGURATION (Top view)
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
VDD
LDQM
WE
CAS
RAS
CS
BA0
BA1
A10/AP
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
54Pin sTSOP
(400mil x 441mil)
(0.4 mm Pin pitch)
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
VSS
N.C/RFU
UDQM
CLK
CKE
N.C
A11
A9
A8
A7
A6
A5
A4
VSS
PIN FUNCTION DESCRIPTION
Pin
Name
Input Function
CLK
System clock
Active on the positive going edge to sample all inputs.
CS
Chip select
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and DQM
CKE
Clock enable
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
A0 ~ A11
Address
Row/column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA11, Column address : CA0 ~ CA8
BA0 ~ BA1
Bank select address
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
RAS
Row address strobe
Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.
CAS
Column address strobe
Latches column addresses on the positive going edge of the CLK with CAS low.
Enables column access.
WE
Write enable
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
L(U)DQM
Data input/output mask
Makes data output Hi-Z, tSHZ after the clock and masks the output.
Blocks data input when L(U)DQM active.
Data input/output
Data inputs/outputs are multiplexed on the same pins.
VDD/VSS
DQ0 ~
Power supply/ground
Power and ground for the input buffers and the core logic.
VDDQ/VSSQ
Data output power/ground
Isolated power supply and ground for the output buffers to provide improved noise
immunity.
N.C/RFU
No connection
/reserved for future use
This pin is recommended to be left No Connection on the device.
15
shrink-TSOP
CMOS SDRAM
K4S281632B-N
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Voltage on any pin relative to Vss
VIN, VOUT
-1.0 ~ 4.6
V
Voltage on VDD supply relative to Vss
VDD, VDDQ
-1.0 ~ 4.6
V
TSTG
-55 ~ +150
°C
Power dissipation
PD
1
W
Short circuit current
IOS
50
mA
Storage temperature
Note : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
DC OPERATING CONDITIONS
Recommended operating conditions (Voltage referenced to VSS = 0V, TA = 0 to 70°C)
Parameter
Symbol
Min
Typ
Max
Unit
VDD, VDDQ
3.0
3.3
3.6
V
Input logic high voltage
VIH
2.0
3.0
VDD+0.3
V
1
Input logic low voltage
VIL
-0.3
0
0.8
V
2
Output logic high voltage
VOH
2.4
-
-
V
IOH = -2mA
Output logic low voltage
VOL
-
-
0.4
V
IOL = 2mA
ILI
-10
-
10
uA
3
Supply voltage
Input leakage current
Note
Notes : 1. VIH (max) = 5.6V AC.The overshoot voltage duration is ≤ 3ns.
2. VIL (min) = -2.0V AC. The undershoot voltage duration is ≤ 3ns.
3. Any input 0V ≤ VIN ≤ VDDQ,
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
CAPACITANCE
(VDD = 3.3V, TA = 23°C, f = 1MHz, VREF =1.4V ± 200 mV)
Pin
Symbol
Min
Max
Unit
Note
CCLK
2.5
4.0
pF
1
CIN
2.5
5.0
pF
2
Address
CADD
2.5
5.0
pF
2
DQ0 ~ DQ15
COUT
4.0
6.5
pF
3
Clock
RAS, CAS, WE, CS, CKE, DQM
shrink-TSOP
CMOS SDRAM
K4S281632B-N
DC CHARACTERISTICS
(Recommended operating condition unless otherwise noted, TA = 0 to 70°C)
Parameter
Symbol
Version
Test Condition
-1H
Operating current
(One bank active)
Precharge standby current in
power-down mode
ICC1
ICC2P
Burst length = 1
tRC ≥ tRC(min)
IO = 0 mA
140
CKE ≤ VIL(max), tCC = 10ns
1
ICC2PS CKE & CLK ≤ VIL(max), tCC = ∞
ICC2N
Precharge standby current in
non power-down mode
ICC2NS
ICC3N
ICC3NS
Note
mA
1
mA
1
CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are changed one time during 20ns
20
CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
7
mA
Active standby current in power- ICC3P CKE ≤ VIL(max), tCC = 10ns
down mode
ICC3PS CKE & CLK ≤ VIL(max), tCC = ∞
Active standby current in
non power-down mode
(One bank active)
Unit
-1L
5
mA
5
CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are changed one time during 20ns
30
mA
CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
20
mA
Operating current
(Burst mode)
ICC4
IO = 0 mA
Page burst
4Banks Activated
tCCD = 2CLKs
145
mA
1
Refresh current
ICC5
tRC ≥ tRC(min)
210
mA
2
Self refresh current
ICC6
CKE ≤ 0.2V
G
1.5
mA
3
F
800
uA
4
Notes : 1. Measured with outputs open.
2. Refresh period is 64ms.
3. K4S281632B-NC**
4. K4S281632B-NL**
5. Unless otherwise noted, input swing IeveI is CMOS(VIH /VIL=VDDQ/VSSQ)
shrink-TSOP
CMOS SDRAM
K4S281632B-N
AC OPERATING TEST CONDITIONS (VDD = 3.3V ± 0.3V, TA = 0 to 70°C)
Parameter
AC input levels (Vih/Vil)
Input timing measurement reference level
Input rise and fall time
Output timing measurement reference level
Output load condition
Value
Unit
2.4/0.4
V
1.4
V
tr/tf = 1/1
ns
1.4
V
See Fig. 2
Vtt = 1.4V
3.3V
50Ω
1200Ω
VOH (DC) = 2.4V, IOH = -2mA
VOL (DC) = 0.4V, IOL = 2mA
Output
870Ω
Output
Z0 = 50Ω
50pF
50pF
(Fig. 1) DC output load circuit
(Fig. 2) AC output load circuit
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
Parameter
Version
Symbol
-1H
Unit
Note
-1L
Row active to row active delay
tRRD(min)
20
ns
1
RAS to CAS delay
tRCD(min)
20
ns
1
tRP(min)
20
ns
1
tRAS(min)
50
ns
1
tRAS(max)
100
us
Row cycle time
tRC(min)
70
ns
1
Last data in to row precharge
tRDL(min)
2
CLK
2,5
Last data in to Active delay
tDAL(min)
2 CLK + 20 ns
-
5
Last data in to new col. address delay
tCDL(min)
1
CLK
2
Last data in to burst stop
tBDL(min)
1
CLK
2
Col. address to col. address delay
tCCD(min)
1
CLK
3
ea
4
Row precharge time
Row active time
Number of valid output data
CAS latency=3
2
CAS latency=2
1
Notes : 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time
and then rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
5. tRDL=1CLK and tDAL=1CLK+20ns is also supported .
SAMSUNG recommends tRDL=2CLK and tDAL=2CLK + 20ns.
shrink-TSOP
CMOS SDRAM
K4S281632B-N
AC CHARACTERISTICS (AC operating conditions unless otherwise noted)
Parameter
-1H
Symbol
Min
CLK cycle time
CAS latency=3
tCC
CAS latency=2
CLK to valid
output delay
Output data
hold time
CAS latency=3
10
Max
1000
10
tSAC
CAS latency=2
CAS latency=3
-1L
tOH
CAS latency=2
Min
10
Unit
Note
ns
1
ns
1,2
ns
2
Max
1000
12
6
6
6
7
3
3
3
3
CLK high pulse width
tCH
3
3
ns
3
CLK low pulse width
tCL
3
3
ns
3
Input setup time
tSS
2
2
ns
3
Input hold time
tSH
1
1
ns
3
CLK to output in Low-Z
tSLZ
1
1
ns
2
CLK to output
in Hi-Z
CAS latency=3
tSHZ
CAS latency=2
6
6
6
7
ns
Notes : 1. Parameters depend on programmed CAS latency.
2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter.
3. Assumed input rise and fall time (tr & tf) = 1ns.
If tr & tf is longer than 1ns, transient time compensation should be considered,
i.e., [(tr + tf)/2-1]ns should be added to the parameter.
DQ BUFFER OUTPUT DRIVE CHARACTERISTICS
Parameter
Symbol
Condition
Min
Output rise time
trh
Measure in linear
region : 1.2V ~ 1.8V
Output fall time
tfh
Output rise time
Output fall time
Typ
Max
Unit
Notes
1.37
4.37
Volts/ns
3
Measure in linear
region : 1.2V ~ 1.8V
1.30
3.8
Volts/ns
3
trh
Measure in linear
region : 1.2V ~ 1.8V
2.8
3.9
5.6
Volts/ns
1,2
tfh
Measure in linear
region : 1.2V ~ 1.8V
2.0
2.9
5.0
Volts/ns
1,2
Notes : 1. Rise time specification based on 0pF + 50 Ω to VSS, use these values to design to.
2. Fall time specification based on 0pF + 50 Ω to VDD, use these values to design to.
3. Measured into 50pF only, use these values to characterize to.
4. All measurements done with respect to VSS.
shrink-TSOP
CMOS SDRAM
K4S281632B-N
SIMPLIFIED TRUTH TABLE
Command
Register
Mode register set
Auto refresh
Refresh
CKEn-1
CKEn
CS
RAS
CAS
WE
DQM
H
X
L
L
L
L
X
OP code
L
L
L
H
X
X
H
Entry
Self
fefresh
Exit
H
BA0,1
L
H
L
H
H
H
H
X
X
X
X
L
H
H
X
V
Read &
column address
Auto precharge disable
H
X
L
H
L
H
X
V
Write &
column address
Auto precharge disable
Auto precharge enable
X
L
H
L
L
X
H
X
L
H
H
L
X
H
X
L
L
H
L
X
H
L
Exit
L
H
Entry
H
L
Precharge power down mode
Exit
L
Column
address
(A0 ~ A8)
V
L
Column
address
(A0 ~ A8)
H
All banks
Entry
L
DQM
H
No operation command
H
H
H
X
X
X
L
V
V
V
X
X
X
X
H
X
X
X
L
H
H
H
H
X
X
X
L
V
V
V
X
X
H
X
X
X
L
H
H
H
3
Row address
H
Auto precharge enable
Clock suspend or
active power down
3
3
L
Bank selection
1,2
X
X
H
Note
3
H
Precharge
A11,
A9 ~ A0
L
Bank active & row addr.
Burst stop
A10/AP
X
V
L
X
H
4
4,5
4
4,5
6
X
X
X
X
X
X
X
V
X
X
X
7
(V=Valid, X=Don′t care, H=Logic high, L=Logic low)
Notes : 1. OP Code : Operand code
A0 ~ A11 & BA0 ~ BA1 : Program keys. (@ MRS)
2. MRS can be issued only at all banks precharge state.
A new command can be issued after 2 CLK cycles of MRS.
3. Auto refresh functions are as same as CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by "Auto".
Auto/self refresh can be issued only at all banks precharge state.
4. BA0 ~ BA1 : Bank select addresses.
If both BA0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected.
If both BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank B is selected.
If both BA0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank C is selected.
If both BA0 and BA1 are "High" at read, write, row active and precharge, bank D is selected.
If A10/AP is "High" at row precharge, BA0 and BA1 is ignored and all banks are selected.
5. During burst read or write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at tRP after the end of burst.
6. Burst stop command is valid at every burst length.
7. DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (Write DQM latency is 0),
but makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)
shrink-TSOP
CMOS SDRAM
K4S281632B-N
PACKAGE DIMENSIONS FOR 54-sTSOP
Unit : Millimeters
0~8°C
0.25
TYP
0.010
#28
#1
#27
+0.075
0.125 -0.035
0.005+0.003
-0.001
( 0.50 )
0.020
10.16
0.400
11.76± 0.20
0.463±0.008
0.45~0.75
0.018~0.030
#54
11.60
MAX
0.457
11.20
0.441
± 0.10
0.21
0.008
± 0.004
0.10
MAX
0.004
(
0.40
)
0.016
0.16±0.10
0.006 ±0.004
0.40
0.0157
± 0.05
± 0.002
1.00
0.039
± 0.10
± 0.004
1.20
MAX
0.047
0.05
MIN
0.010