SEMIKRON SEMIX253GD126HDC

SEMiX 253GD126HDc
Absolute Maximum Ratings
Symbol Conditions
IGBT
,
,12
4
6) SEMiX® 33c
Trench IGBT Modules
SEMiX 253GD126HDc
Preliminary Data
Features
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Typical Applications
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Units
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Characteristics
Symbol Conditions
IGBT
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min.
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typ.
max.
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Thermal characteristics
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Temperature sensor
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Mechanical data
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8
GD
1
15-06-2005 SEN
© by SEMIKRON
SEMiX 253GD126HDc
Fig. 1 Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2 Rated current vs. temperature IC = f (TC)
Fig. 3 Typ. turn-on /-off energy = f (IC)
Fig. 4 Typ. turn-on /-off energy = f (RG)
Fig. 5 Typ. transfer characteristic
Fig. 6 Typ. gate charge characteristic
2
15-06-2005 SEN
© by SEMIKRON
SEMiX 253GD126HDc
Fig. 7 Typ. switching times vs. IC
Fig. 8 Typ. switching times vs. gate resistor RG
Fig. 9 Transient thermal impedance of IGBT
Fig. 10 Transient thermal impedance of FWD
Fig. 11 CAL diode forward charact., incl. RCC´+EE´
Fig. 12 Typ. CAL diode peak reverse recovery current
3
15-06-2005 SEN
© by SEMIKRON
SEMiX 253GD126HDc
Fig. 13 Typ. CAL diode recovered charge
4L
2S 33
2S 33
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX.
This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee
expressed or implied is made regarding delivery, performance or suitability.
4
15-06-2005 SEN
© by SEMIKRON