NSxT, NSFxT, NSBxT Vishay Semiconductors formerly General Semiconductor Glass Passivated General Purpose Plastic Rectifier Reverse Voltage 50 to 1000 Forward Current 8.0A ITO-220AC (NSFxT) 0.188 (4.77) 0.172 (4.36) 0.405 (10.27) 0.383 (9.72) 0.110 (2.80) 0.100 (2.54) TO-220AC (NSxT) 0.140 (3.56) DIA. 0.130 (3.30) 0.185 (4.70) 0.415 (10.54) MAX. 0.131 (3.39) DIA. 0.122 (3.08) 0.175 (4.44) 0.154 (3.91) 0.370 (9.40) 0.360 (9.14) 0.148 (3.74) DIA. 0.055 (1.39) 0.045 (1.14) 0.676 (17.2) 0.646 (16.4) 0.600 (15.5) 0.580 (14.5) 0.350 (8.89) 0.330 (8.38) 0.113 (2.87) 0.103 (2.62) PIN 0.145 (3.68) 0.135 (3.43) 0.410 (10.41) 0.390 (9.91) 0.350 (8.89) 0.330 (8.38) 0.635 (16.13) 0.625 (15.87) 1 2 0.191 (4.85) 0.171 (4.35) 0.560 (14.22) 0.530 (13.46) PIN 1 2 0.603 (15.32) 0.573 (14.55) 1.148 (29.16) 1.118 (28.40) 0.160 (4.06) 0.140 (3.56) PIN 1 PIN 2 0.110 (2.79) 0.100 (2.54) 0.560 (14.22) 0.530 (13.46) PIN 1 0.037 (0.94) 0.027 (0.69) 0.205 (5.20) 0.195 (4.95) 0.022 (0.55) 0.014 (0.36) CASE PIN 2 0.105 (2.67) 0.037 (0.94) 0.027 (0.68) 0.095 (2.41) 0.110 (2.80) 0.100 (2.54) 0.060 (1.52) 0.205 (5.20) 0.195 (4.95) TO-263AB (NSBxT) 0.022 (0.56) 0.014 (0.36) 0.190 (4.83) 0.411 (10.45) 0.380 (9.65) 0.160 (4.06) 0.055 (1.40) 0.045 (1.14) 0.245 (6.22) MIN Mounting Pad Layout TO-263AB K 0.42 (10.66) 0.055 (1.40) 0.360 (9.14) 0.320 (8.13) 0.33 (8.38) Dimensions in inches and (millimeters) 0.047 (1.19) 1 K 2 0.624 (15.85) 0.591 (15.00) 0-0.01 (0-0.254) 0.63 (17.02) 0.110 (2.79) 0.090 (2.29) 0.027 (0.686) 0.037 (0.940) 0.105 (2.67) 0.08 (2.032) 0.095 (2.41) 0.24 (6.096) 0.12 (3.05) 0.021 (0.53) 0.014 (0.36) PIN 1 PIN 2 K - HEATSINK 0.205 (5.20) 0.195 (4.95) Features Mechanical Data • Plastic package has Underwriters Laboratory Flammability Classification 94V-0 • High forward current capability • High surge current capability • Low forward voltage drop • Glass passivated chip junction • High temperature soldering guaranteed: 260°C/10 seconds, 0.160” (4.06mm) lead length Case: JEDEC TO-220AC, ITO-220AC & TO-263AB molded plastic body Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Torque: 10 in. -lbs. max. Mounting Position: Any Weight: 0.064 ounce, 1.81 grams Document Number 88690 08-Jul-02 0.140 (3.56) 0.110 (2.79) www.vishay.com 1 NSxT, NSFxT, NSBxT Vishay Semiconductors formerly General Semiconductor Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Symbols NS8 AT NS8 BT NS8 DT NS8 GT NS8 JT NS8 KT NS8 MT Units Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward rectified current at TC=100°C IF(AV) 8.0 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 125 A TJ, TSTG -55 to +150 °C Parameter Operating junction and storage temperature range (1) RMS Isolation voltage (NSF type only) from terminals to heatsink with t = 1.0 second, RH ≤ 30% 4500 3500(2) 1500(3) VISOL Electrical Characteristics V Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbols NS8 AT NS8 BT NS8 DT NS8 GT NS8 JT NS8 KT NS8 MT Units Maximum instantaneous forward voltage at 8.0A VF 1.1 V Maximum DC reverse current at rated DC blocking voltage IR 10 100 µA CJ 55 pF TC=25°C TC=100°C Typical junction capacitance at 4.0V, 1MHz Thermal Characteristics Parameter Typical thermal resistance (4) Ratings at 25°C ambient temperature unless otherwise specified. Symbols NSxT NSFxt NSBxt Units RΘJC 3.0 5.0 3.0 °C/W Notes: (1) Clip mounting (on case), where lead does not overlap heatsink with 0.110” offset (2) Clip mounting (on case), where leads do overlap heatsink (3) Screw mounting with 4-40 screw, where washer diameter is ≤ 4.9mm (0.19”) (4) Thermal resistance from junction to case mounted on heat sink www.vishay.com 2 Document Number 88690 08-Jul-02 NSxT, NSFxT, NSBxT Vishay Semiconductors formerly General Semiconductor Ratings and Characteristic Curves (T A = 25°C unless otherwise noted) Fig. 1 – Forward Current Derating Curve Fig. 2 – Maximum Non-Repetitive Peak Forward Surge Current 10 175 TJ = TJ max. 8.3ms Single Half Sine-Wave (JEDEC Method) Peak Forward Surge Current (A) Average Forward Current (A) 60 HZ Resistive or Inductive Load 8.0 6.0 4.0 2.0 0 125 1.0 Cycle 100 75 50 25 0 0 50 Case Temperature (°C) Number of Cycles at 60 HZ Fig. 3 – Typical Instantaneous Forward Characteristics Fig. 4 – Typical Reverse Characteristics Instantaneous Reverse Current (µA) 100 Pulse Width = 300µs 1% Duty Cycle 10 1 0.1 0.6 100 10 1 150 100 100 Instantaneous Forward Current (A) 150 10 TJ = 100°C 1 TJ = 75°C TJ = 25°C 0.1 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Instantaneous Forward Voltage (V) 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Fig. 5 – Typical Junction Capacitance Per Leg Junction Capacitance (pF) 120 TJ = 25°C f = 1.0MHZ Vsig = 50MVp-p 100 80 60 40 20 0 0.1 10 1 100 1,000 Reverse Voltage (V) Document Number 88690 08-Jul-02 www.vishay.com 3