FAIRCHILD FPF1504

FPF1504
Advanced Load Management Switch
Features
Description


The FPF1504 is a low-RDS P-channel MOSFET load
switch of the IntelliMAX™ family. Integrated slew-rate
control prevents excessive inrush current from the
supply rails with capacitive loads common in power
applications. In addition, the FPF1504 features output
discharge capability.





1.0V to 3.6V Input Voltage Operating Range
Typical RDS(ON):
- 15mΩ at VIN=3.3V
-
20mΩ at VIN=1.8V
-
55mΩ at VIN=1.0V
Slew Rate Control with tR: 130µs
Output Discharge Function
Low <1µA Quiescent Current at VON=VIN
The input voltage range operates from 1.0V to 3.6V to
fulfill today's mobile device supply requirements. Switch
control is by a logic input (ON pin) capable of interfacing
directly with low-voltage CMOS control signals and
GPIOs in embedded processors.
ESD Protected: 4000V HBM, 2000V CDM
GPIO/CMOS-Compatible Enable Circuitry
Applications






Mobile Devices and Smart Phones
Portable Media Devices
Digital Cameras
Advanced Notebook, UMPC, and MID
Portable Medical Devices
GPS and Navigation Equipment
Figure 1.
Block Diagram
Ordering Information
Part Number
Part
Marking
Switch
(Typical)
At 1.8VIN
Input
Buffer
Output
Discharge
ON Pin
Activity
FPF1504
G4
20mΩ
CMOS
YES
Active
HIGH
© 2012 Fairchild Semiconductor Corporation
FPF1504 • Rev. 1.0.0
tR
Package
4-Ball, Wafer-Level Chip130µs Scale Package (WLCSP),
1.0 x 1.0mm, 0.5mm Pitch
www.fairchildsemi.com
FPF1504 — Advanced Load Management Switch
June 2012
FPF1504 — Advanced Load Management Switch
Application Diagram
VIN
CIN
VOUT
T o Load
COUT
FPF1504
OFF ON
ON
Figure 2.
GND
Typical Application
Notes:
1. CIN=1F, X5R, 0603, for example Murata GRM185R60J105KE26.
2. COUT=1F, X5R, 0805, for example Murata GRM216R61A105KA01.
Pin Configurations
Figure 3.
1 x 1mm WLCSP Bumps Facing Down
Figure 4.
1 x 1mm WLCSP Bumps Facing Up
VOUT
A1
A2
VIN
VIN
A2
A1
VOUT
GND
B1
B2
ON
ON
B2
B1
GND
Figure 5.
Pin Assignments (Top View)
Figure 6.
Pin Assignments (Bottom View)
Pin Definitions
Pin #
Name
A1
VOUT
A2
VIN
B1
GND
B2
ON
Description
Switch Output
Supply Input; Input to the Power Switch
Ground
ON/OFF Control, Active HIGH
© 2012 Fairchild Semiconductor Corporation
FPF1504 • Rev. 1.0.0
www.fairchildsemi.com
2
FPF1504 — Advanced Load Management Switch
Physical Dimensions
0.03 C
E
2X
F
A
PIN A1 AREA
B
0.50
D
0.50
(Ø0.250)
Cu Pad
(Ø0.350)
Solder Mask
0.03 C
2X
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06 C
0.332±0.018
0.250±0.025
0.625
0.539
0.05 C
C
D
SEATING PLANE
SIDE VIEWS
0.005
0.50
C A B
NOTES:
Ø0.315±0.025
4X
B
A
0.50
A. NO JEDEC REGISTRATION APPLIES.
(Y)±0.018
F
1 2
(X)±0.018
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
BOTTOM VIEW
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: MKT-UC004ABrev2.
Figure 25. 4-Ball, 1.0 x 1.0mm Wafer-Level Chip Scale (WLCSP) Packaging
Product-Specific Dimensions
Product
D
E
X
Y
FPF1504UCX
960µm ±30µm
960µm ±30µm
0.230mm
0.230mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2012 Fairchild Semiconductor Corporation
FPF1504 • Rev. 1.0.0
www.fairchildsemi.com
9
FPF1504 — Advanced Load Management Switch
© 2012 Fairchild Semiconductor Corporation
FPF1504 • Rev. 1.0.0
www.fairchildsemi.com
10