DIODES ZXBM1004Q16TC

ZXBM1004
VARIABLE SPEED SINGLE-PHASE BLDC MOTOR CONTROLLER
DESCRIPTION
The ZXBM1004 is a single-phase, DC brushless motor pre-driver with PWM
variable speed control suitable for fan and blower motors. The controller is
intended for applications where the fan or blower speed is controlled by an
external PWM signal, thermistor or DC voltage.
FEATURES
QSOP16
• Compliant with external PWM speed control
• Compliant with thermistor control
• Minimum speed setting
• Low noise
• Auto restart
• Built in hall amplifier
• Speed pulse (FG) and lock rotor (RD) outputs
• Up to 18V input voltage (60V with external regulator)
• QSOP16 package
Associated application notes:AN41 - Thermistor control
AN42 - External PWM control
AN43 - Interfacing to the motor windings
APPLICATIONS
• Mainframe and personal computer fans and blowers
• Instrumentation fans
• Central heating blowers
• Automotive climate control
ORDERING INFORMATION - QSOP16
DEVICE
ZXBM1004Q16TA
ZXBM1004Q16TC
REEL SIZE
TAPE WIDTH
QUANTITY PER REEL
7" (180mm)
12mm
500
13" (330mm)
12mm
2,500
DEVICE MARKING
• ZETEX
ZXBM
1004
ISSUE 6 - MAY 2007
1
SEMICONDUCTORS
ZXBM1004
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Supply voltage
V CCmax
-0.6 to 20
LIMITS
UNIT
V
Input current
I CCmax
200
mA
V
Input voltage
V IN max
-0.5 to V CC +0.5
Output voltage
Power dissipation
V OUT max
P Dmax
-0.5 to V CC +0.5
V
500
mW
Operating temp.
T OPR
-40 to 110
⬚C
Storage temp.
T STG
-55 to 150
⬚C
Power Dissipation
and
1) Maximum allowable Power Dissipation, PD,
is shown plotted against Ambient Temperature,
TA, in the accompanying Power Derating Curve,
indicating the Safe Operating Area for the device.
PPhLo = IOH x (VCC - VOH)
2) Power consumed by the device, PT, can be
calculated from the equation:
where IOH is the application Ph1Lo and Ph2Lo
output currents
and
Vcc is the application device Supply
Voltage
and
VOH is the minimum High Level
Output Voltage for the Ph1Lo and
Ph2Lo outputs given in the Electrical
Characteristics
PT = PQ + PPhHi + PPhLo
where
PPhLo is power generated due to either one of
the phase outputs Ph1Lo or Ph2Lo being
active, given by:
PQ is power dissipated under quiescent
current conditions, given by:
PQ = Vcc x Icc
where Vcc is the application
device Supply Voltage
and
Icc is the maximum Supply
Current given in the Electrical
Characteristics
and
PPhHi is power generated due to either one of
the phase outputs Ph1Hi or Ph2Hi being
active, given by:
PPhHi = IOL x VOL
where IOL is the application Ph1Hi and Ph2Hi
output currents
and
VOL is the maximum Low Level
Output Voltage for the Ph1Hi and
Ph2Hi outputs given in the Electrical
Characteristics
ISSUE 6 - MAY 2007
SEMICONDUCTORS
2
ZXBM1004
ELECTRICAL CHARACTERISTICS (at Tamb = 25°C & VCC = 12V)
MIN.
PARAMETER
SYMBOL
Supply voltage
V CC
Supply current
I CC
Hall amp input voltage
V IN
40
Hall amp common mode voltage
V CM
0.5
Hall amp input offset
V OFS
Hall amp bias current
I BS
Ph1Lo, Ph2Lo output high voltage
V OH
Ph1Lo, Ph2Lo output low voltage
Ph1Lo, Ph2Lo output low voltage
TYP.
MAX.
18
V
6
8.5
mA
No load (1)
mV
diff p-p
4.7
VCC-1.5
⫾7
400
VCC-2.2
UNIT CONDITIONS
V
mV
650
V CC -1.8
nA
V OLA
0.4
0.6
V
V
I OH =80mA
I OL =16mA (2)
V OLB
0.4
0.6
V
I OL =50␮A (3)
Ph1Lo, Ph2Lo output source current
I OH
-80
mA
Ph1Lo, Ph2Lo output sink current
I OL
16
mA
Ph1Hi, Ph2Hi output low voltage
V OL
0.7
V
Ph1Hi, Ph2Hi output sink current
I OL
100
mA
C PWM charge current
I PWMC
-6.2
-7.6
-9
␮A
C PWM discharge current
I PWMD
65
80
95
␮A
C PWM high threshold voltage
V THH
2.95
3
3.15
V
V THL
0.94
1
1.11
V
2.925
3.0
3.14
V
C PWM low threshold voltage
0.5
24
kHz
PWM frequency
F PWM
ThRef voltage
V ThRef
ThRef output current
I OThRef
-0.2
-1
mA
S MIN input current
I ISMIN
-0.25
-0.5
␮A
SPD voltage minimum
V SPDL
1
SPD voltage maximum
V SPDH
SPD input current
I ISPD
C LCK charge current
I LCKC
C LCK discharge current
I LCKD
0.2
C LCK high threshold voltage
V THH
3
V
C LCK low threshold voltage
V THL
1
V
3
-0.8
-2
FG & RD low level output voltage
C PWM =0.1nF
I OThRef =-100␮A
Vin = 2V
V
100% PWM drive
V
0% PWM drive
␮A
Vin = 2V
␮A
-3
0.35
␮A
1:12
Lock condition On:Off ratio
FG & RD output current
-2
I OL =100mA
I OL
5
mA
V OL
0.5
V
I OI =5mA
Notes:
(1) Measured with pins H+, H-, CLCK and CPWM = 0V and all other signal pins open circuit.
(2) Measured when opposing phase output is low.
(3) Measured when opposing phase output is high.
ISSUE 6 - MAY 2007
3
SEMICONDUCTORS
ZXBM1004
Block diagram
Pin assignments
Vcc
V+OP
1
H+
H-
Ph1Lo
ZXBM1004
ThRef
SPD
Ph2Lo
Ph2Hi
QSOP16
Ph1Hi
SMIN
FG
C PWM
RD
C LCK
Gnd
ISSUE 6 - MAY 2007
SEMICONDUCTORS
4
ZXBM1004
PIN FUNCTIONAL DESCRIPTION
If required this pin can also be used as an enable pin.
The application of a voltage >3.0V will force the PWM
drive fully off, in effect disabling the drive.
H+ - Hall input
H- - Hall input
The rotor position is detected by a Hall sensor, with the
output applied to the H+ and H- pins. This sensor can be
either a 4 pin 'naked' Hall device or of the 3 pin buffered
switching type. For a 4 pin device the differential Hall
output signal is connected to the H+ and H- pins. For a
buffered Hall sensor the Hall device output is attached
to the H+ pin, with a pull-up attached if needed, whilst
the H- pin has an external potential divider attached to
hold the pin at half Vcc. When H+ is high in relation to H-,
Ph2 is the active drive.
SMIN - Sets Minimum Speed
A voltage can be set on this pin via a potential divider
between the ThRef and Gnd. This voltage is monitored
by the SPD pin such that it cannot rise above it. As a
higher voltage on the SPD pin represents a lower speed
it therefore restricts the lower speed range of the fan. If
this feature is not required the pin is left tied to ThRef so
no minimum speed will be set.
If the fan is being controlled from an external voltage
source onto the SPD pin then either this feature should
not be used or if it is required then a >1k⍀ resistor
should be placed in series with the SPD pin.
ThRef - Network Reference
This is a reference voltage of nominal 3V. It is designed
for the ability to 'source' and therefore it will not 'sink'
any current from a higher voltage.
CPWM - Sets PWM Frequency
The total current drawn from the pin by the minimum
speed potential divider to pin SMIN and any voltage
setting network should not exceed 1mA at maximum
temperature.
This pin has an external capacitor attached to set the
PWM frequency for the Phase drive outputs. A
capacitor value of 0.1nF will provide a PWM frequency
of typically 24kHz.
SPD - Speed Control Input
The CPWM timing period (TPWM) is determined by the
following equation:
The voltage applied to the SPD pin provides control
over the Fan Motor speed by varying the Pulse Width
Modulated (PWM) drive ratio at the Ph1Lo and Ph2Lo
outputs. The control signal takes the form of a voltage
input of range 3V to 1V, representing 0% to 100% drive
respectively.
TPWM =
(V THH − V THL ) x C
(V
− V THL ) x C
+ THH
I PWMC
I PWMD
Where:
If variable speed control is not required this pin can be
left with an external potential divider to set a fixed
speed or tied to ground to provide full speed i.e. 100%
PWM drive.
C = CPWM +15, in pF
V T H H and V T H L are the C P W M pin
threshold voltages
IPWMC and IPWMD are the charge and
discharge currents in ␮A.
TPWM is in ms
ISSUE 6 - MAY 2007
5
SEMICONDUCTORS
ZXBM1004
Ph1Lo & Ph2Lo - Low-side External
H-bridge Driver
As these threshold voltages are nominally set to VTHH =
3V and VTHL = 1V the equations can be simplified as
follows:
TPWM =
This pair of outputs drive the Low side of the external
high power H-bridge devices which in turn drives the
single phase winding. These outputs provide both the
commutation and PWM waveforms. The outputs are of
the Darlington emitter follower type with an active
pull-down to help faster switch off when using bipolar
devices. When in the high state the outputs will provide
up to 80mA of drive into the base or gates of external
transistors as shown in the Typical Application circuit
following.
2C
2C
+
I PWMC
I PWMD
CLCK - Locked rotor timing capacitor
Should the fan stop rotating for any reason, i.e. an
obstruction in the fan blade or a seized bearing, then
the device will enter a Rotor Locked condition. In this
condition after a predetermined time (TLOCK) the RD pin
will go high and the Phase outputs will be disabled.
After a further delay (TOFF) the controller will re-enable
the Phase drive for a defined period (TON) in an attempt
to re-start the fan. This cycle of (TOFF) and (TON) will be
repeated indefinitely or until the fan re-starts.
When in the low state the active Phase drive is capable
of sinking up to 16mA when driving low to aid turn off
times during PWM operation. When the Phase is
inactive the output is held low by an internal pull-down
resistor.
Ph1Hi & Ph2Hi - High-side External H-bridge
Driver
GND - Ground
These are the High side outputs to the external
H-bridge and are open collector outputs capable of
sinking 100mA. This signal provides commutation only
to the H-bridge.
This is the device supply ground return pin and will
generally be the most negative supply pin to the fan.
RD - Locked Rotor error output
This pin is the Locked Rotor output as referred to in the
CLCK timing section above. It is high when the rotor is
stopped and low when it is running.
V+OP - Phase Outputs Supply Voltage
This pin is the supply to the Phase outputs and will be
connected differently dependant upon external
transistor type.
This is an open collector drive giving an active pull
down with the high level being provided by an external
pull up resistor.
For bipolar devices this pin will be connected by a
resistor to the VCC pin. The resistor is used to control
the current into the transistor base so its value is
chosen accordingly.
FG - Frequency Generator (speed) output
For MOSFET devices the pin will connect directly to the
VCC pin.
This is the Frequency Generator output and is a
buffered signal from the Hall sensor.
This is an open collector drive giving an active pull
down with the high level being provided by an external
pull up resistor.
ISSUE 6 - MAY 2007
SEMICONDUCTORS
6
ZXBM1004
VCC - Applied Voltage
This is the device internal circuitry supply voltage. For
5V to 12V fans this can be supplied directly from the Fan
Motor supply. For fans likely to run in excess of the 18V
maximum rating for the device this will be supplied
from an external regulator such as a Zener diode.
RD Timing Waveform:
Hall
VTHH
C LCK
VTHL
T Lock
T Off
TOn
RD
FG
Applications Information
The ZXBM1004 is primarily controlled by a voltage on
the SPD pin. A voltage of 1V represents a 100% PWM at
the Phase Outputs and in turn represents full speed. 3V
on the SPD pin conversely represents 0% PWM. The
motor can therefore be controlled simply by applying a
control voltage onto the SPD pin with the minimal use
of external components.
A common form of control of fans is by a PWM signal
derived from a central processor or controller. This
signal can be converted into a voltage and that voltage
adjusted as neccesary to compensate for motor none
linearity, inclusion of the Minimum speed feature etc.
Full applications details and further examples of how to
control the ZXBM1004 are available in the Applications
Notes AN41, AN42 and AN43.
This voltage control method easily lends itself to
control by other signal types. For example if a
thermistor is applied to the SPD pin a varying voltage
can be generated at the SPD pin as the resistance of the
thermistor varies with temperature.
ISSUE 6 - MAY 2007
7
SEMICONDUCTORS
ZXBM1004
Figure 1: Typical circuit for thermistor controlled speed
Figure 2: Typical circuit for external PWM controlled speed
ISSUE 6 - MAY 2007
SEMICONDUCTORS
8
ZXBM1004
Figure 3: Typical circuit for 48V input and external PWM control
Figure 4: Typical circuit for constant speed operation
ISSUE 6 - MAY 2007
9
SEMICONDUCTORS
ZXBM1004
Drive transisitors
Zetex offers a range of devices that are ideally suited to
interface between the ZXBM1004 controller and the
motor. The following tables show a selection of
products ranging from single packaged H-bridge
devices to individual power components that can be
used in this application. If your needs are not covered
by this selection then please refer to the the more
comprehensive listings that can be found on the Zetex
website: www.zetex.com
Description
MOSFET
H-Bridge
Part Number
ZXMHC6A07T8
ZXMHC3A01T8
N+P
channel
MOSFET
ID
IDM
2xN
V
60
A
1.8
2xP
-60
-1.5
A
8.7
-7.5
2xN
30
3.1
14.5
120
2xP
-30
-2.3
-10.8
210
max. m
300
Package
SM-8
425
SM-8
60
4.7
22
55
P
-60
-3.5
-18
105
N
30
35
-30
6.4
-5.4
30
P
-25
48
ZXMN10A09K
N
100
7.7
27
85
ZXMN6A09K
ZXMN3A04K
N
60
11.2
40
45
N
30
18.4
66
20
Content
BVCEO
IC
ICM
VCE(sat) at IC=2A
V
A
A
max. mV
Description Part Number
High side
switch
Bipolar
BVDSS
N
ZXMC4559DN8
ZXMC3A16DN8
Low side
switch
MOSFET
RDS(on) @ VGS=10V
Content
ZXT953K
PNP
-100
-5
-10
-175
ZXT951K
PNP
-60
-6
-15
-165
ZXT790AK
PNP
-40
-3
-6
-450
SO8
SO8
DPAK
Package
DPAK
ISSUE 6 - MAY 2007
SEMICONDUCTORS
10
ZXBM1004
Definitions
Product change
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Customers are solely responsible for obtaining the latest relevant information before placing orders.
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The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user's
application and meets with the user's requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with
respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or
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breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use
of these circuit applications, under any circumstances.
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approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body
or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions
for use provided in the labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in
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To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally
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Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales
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ESD (Electrostatic discharge)
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The
possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage
can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of
being affected should be replaced.
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Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory
requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of
hazardous substances and/or emissions.
All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and
ELV directives.
Product status key:
"Preview"Future device intended for production at some point. Samples may be available
"Active"Product status recommended for new designs
"Last time buy (LTB)"Device will be discontinued and last time buy period and delivery is in effect
"Not recommended for new designs"Device is still in production to support existing designs and production
"Obsolete"Production has been discontinued
Datasheet status key:
"Draft version"This term denotes a very early datasheet version and contains highly provisional
information, which may change in any manner without notice.
"Provisional version"This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to
the test conditions and specifications may occur, at any time and without notice.
"Issue"This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and
without notice.
ISSUE 6 - MAY 2007
11
SEMICONDUCTORS
ZXBM1004
PACKAGE OUTLINE QSOP16
PACKAGE DIMENSIONS
Dim
Millimeters
Inches
Min.
Max.
Min.
Max.
A
0.053
0.069
1.35
1.75
A1
0.004
0.010
0.10
0.25
A2
0.049
0.059
1.25
1.50
D
0.189
0.197
4.80
5.00
0.009 Ref
ZD
0.23 BSC
E
0.228
0.244
5.79
6.20
E1
0.150
0.157
3.81
3.99
L
0.016
0.050
0.41
1.27
e
0.025 BSC
0.64 BSC
b
0.008
0.012
0.20
0.30
c
0.007
0.010
0.18
0.25
θ
0°
8°
0°
8°
Note: Dimensions in inches are control dimensions, dimensions in millimeters are approximate.
© Zetex Semiconductors plc 2007
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ISSUE 6 - MAY 2007
SEMICONDUCTORS
12