EPCOS B82422T

SMT inductors
SIMID series, SIMID 2220-T
Series/Type:
B82422T
Date:
October 2008
%BUB4IFFU
© EPCOS AG 2008. Reproduction, publication and dissemination of this publication, enclosures
hereto and the information contained therein without EPCOS’ prior express consent is prohibited.
SMT inductors, SIMID series
B82442T
SIMID 2220-T
Size 2220 (EIA) or 5650 (IEC)
Rated inductance 1 NH to 10000 NH
Rated current 46 mA to 3510 mA
Construction
■ Ferrite drum core
■ Laser-welded winding
■ Flame-retardant molding
Features
Temperature range up to 150 °C
Very high current handling capability
High L values
Qualified to AEC-Q200
Suitable for lead-free reflow soldering
as referenced in JEDEC J-STD 020C
■ RoHS-compatible
■
■
■
■
■
Applications
■
■
■
■
■
■
Filtering of supply voltages, coupling, decoupling
DC/DC converters/switch-mode power supplies
Automotive electronics
Telecommunications
Consumer electronics
Industrial electronics
Terminals
■ Base material CuSn6
■ Layer composition Ni, Sn (lead-free)
■ Electro-plated
Marking
■ Marking on component:
Manufacturer, letter "T", L value (in μH),
tolerance of L value (coded), date of manufacture (YWWD)
■ Minimum data on reel:
Manufacturer, ordering code, L value, quantity, date of packing
Delivery mode and packing unit
■ 12-mm blister tape, wound on 330-mm ∅ reel
■ Packing unit: 1500 pcs./reel
Please read Cautions and warnings and
Important notes at the end of this document.
2
10/08
SMT inductors, SIMID series
B82442T
SIMID 2220-T
Dimensional drawing and layout recommendation
3.5±0.11)
A
0.7±0.2 1)
B
C
D
B
0.7 min.1)
5+0.3
0.15 max.
IND0053-6
5.6+0.3
A
B
C
D
4.5
2.0
4.0
8.0
5+0.3
Marking
1) Soldering area
Dimensions in mm
IND0918-C-E
Taping and packing
Reel
12±0.3
2±0.05
_0
12.4 +1.5
<_ 6.0
1.6±0.1
8±0.1
62±1.5
IND0350-S
Direction of unreeling
IND0564-H-E
Dimensions in mm
Please read Cautions and warnings and
Important notes at the end of this document.
13±0.2
_2
330 +0
1.5+0.1
<_ 7.2
Component
18.4 max.
5.5±0.1
4±0.1
1.75±0.1
Blister tape
3
10/08
SMT inductors, SIMID series
B82442T
SIMID 2220-T
Technical data and measuring conditions
Rated inductance LR
Measured with impedance analyzer Agilent 4294A
at frequency fL, 0.1 V, 20 °C
Q factor Qmin
Measured with impedance analyzer Agilent 4294A
at frequency fQ, 20 °C
Rated temperature TR
85 °C
Rated current IR
Maximum permissible DC with temperature increase
of ≤ 60 K at rated temperature
Saturation current Isat
Maximum permissible DC with inductance decrease
ΔL/L0 ≤ 10%, 20 °C
Self-resonance frequency fres,min
Measured with network analyzer Agilent 8753D, 20 °C
DC resistance Rmax
Measured at 20 °C
Solderability (lead-free)
Sn95.5Ag3.8Cu0.7: (245 ±5) °C, (5 ±0.3) s
Wetting of soldering area ≥ 90%
(based on IEC 60068-2-58)
Resistance to soldering heat
260 °C, 40 s (as referenced in JEDEC J-STD 020C)
Climatic category
55/150/56 (to IEC 60068-1)
Storage conditions
Mounted: –55 °C … +150 °C
Packaged: –25 °C … +40 °C, ≤ 75% RH
Weight
Approx. 0.4 g
Please read Cautions and warnings and
Important notes at the end of this document.
4
10/08
SMT inductors, SIMID series
B82442T
SIMID 2220-T
Characteristics and ordering codes
fL; fQ
IR
Isat
Rmax
fres,min
MHz
mA
mA
Ω
MHz
15
7.96
3510
7330
0.025
111
B82442T1102M050
1.5
15
7.96
3020
5480
0.033
60
B82442T1152M050
2.2
15
7.96
2710
4820
0.038
46
B82442T1222M050
3.3
15
7.96
2460
4010
0.046
36
B82442T1332M050
4.7
15
7.96
1950
3450
0.073
30
B82442T1472M050
15
7.96
1680
2770
0.106
23
B82442T1682M050
15
2.52
1510
2280
0.132
19
B82442T1103K050
15
15
2.52
1260
1870
0.190
16
B82442T1153K050
22
15
2.52
1040
1590
0.238
13
B82442T1223K050
33
15
2.52
840
1380
0.360
11
B82442T1333K050
47
15
2.52
700
1120
0.519
8.0
B82442T1473K050
68
15
2.52
570
900
0.781
7.0
B82442T1683K050
100
20
0.796
510
760
0.99
6.1
B82442T1104K050
150
20
0.796
410
610
1.50
4.6
B82442T1154K050
220
20
0.796
330
500
2.21
3.9
B82442T1224K050
330
20
0.796
280
430
3.29
3.4
B82442T1334K050
470
20
0.796
240
350
4.73
2.6
B82442T1474K050
680
20
0.796
210
300
5.87
2.3
B82442T1684K050
1000
20
0.252
150
246
9.5
1.8
B82442T1105K050
1500
20
0.252
130
200
14.9
1.5
B82442T1155K050
2200
20
0.252
100
168
22.5
1.2
B82442T1225K050
3300
20
0.252
85
138
32.8
1.0
B82442T1335K050
4700
20
0.252
73
119
48.6
0.8
B82442T1475K050
6800
20
0.252
65
102
60.3
0.6
B82442T1685K050
10000
20
0.0796
46
81
0.5
B82442T1106K050
Tolerance
LR
Qmin
μH
1.0
±20%
^
M
6.8
10
±10%
^
K
112
Closer tolerances and intermediate values on request.
Higher currents possible at temperatures <TR on request.
Sample kit available. Ordering code: B82442X002
For more information refer to chapter “Sample kits”.
Please read Cautions and warnings and
Important notes at the end of this document.
5
10/08
Ordering code
SMT inductors, SIMID series
B82442T
SIMID 2220-T
Impedance |Z| versus frequency f
measured with impedance analyzer Agilent
4294A/E4991A, typical values at 20 °C
IND0686-L
10 6
Ω
Inductance L versus DC load current IDC
measured with LCR meter Agilent 4285A,
typical values at 20 °C
IND0882-K
10 5
µH B82442T
B82442T
| Z | 10 5
L
10000 µH
10 4
10 4
1000 µH
10 3
10 3
100 µH
10 2
10 2
10000 µH
1000 µH
100 µH
10 µH
1 µH
10 1
10 0
10
10 5
10 6
10 7
10
10 8 Hz 10 9
f
IND0685-F
50
I op
IR
10000 µH
1000 µH
100 µH
40
10
0.2
10 6
_1
10 0
A 10 1
I DC
IND0602-K
0.6
0.4
10 5
10
1.0
20
0 4
10
_2
0.8
10 µH
1 µH
30
10
1.2
B82442T
Q
_1
Current derating Iop/IR
versus ambient temperature TA
(rated temperature TR = 85 °C)
Q factor versus frequency f
measured with impedance analyzer Agilent
4294A/E4991A, typical values at 20 °C
60
1 µH
10 0
_1
10 4
10 µH
10 1
10 7
0
Hz 10 8
f
6
0
10/08
20
40
60
80
100 120 ˚C 150
TA
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Please read Cautions and warnings and
Important notes at the end of this document.
7
10/08
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with
them than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very
high level of operational safety and especially in customer applications in which the malfunction
or failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of
the customer application or other action taken by the customer (e.g. installation of protective
circuitry or redundancy) that no injury or damage is sustained by third parties in the event of
malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue,
MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are
trademarks registered or pending in Europe and in other countries. Further information will be
found on the Internet at www.epcos.com/trademarks.
8
03/09