BYQ28E, BYQ28EF, BYQ28EB, UG10DCT, UGF10DCT, UGB10DCT Series Vishay Semiconductors formerly General Semiconductor Dual Ultrafast Soft Recovery Rectifiers Reverse Voltage 100 to 200 V Forward Current 10 A Reverse Recovery Time 20ns ITO-220AB (BYQ28EF, UGF10 Series) 0.188 (4.77) 0.172 (4.36) 0.405 (10.27) 0.383 (9.72) 0.110 (2.80) 0.100 (2.54) 0.185 (4.70) 0.415 (10.54) MAX. 0.175 (4.44) 0.154 (3.91) 0.370 (9.40) 0.360 (9.14) 0.676 (17.2) 0.646 (16.4) 0.600 (15.5) 0.580 (14.5) 0.055 (1.39) 0.045 (1.14) 0.148 (3.74) 0.350 (8.89) 0.330 (8.38) PIN 0.113 (2.87) 0.103 (2.62) 3 2 1 0.145 (3.68) 0.135 (3.43) 0.410 (10.41) 0.390 (9.91) 1 PIN 2 3 0.191 (4.85) 0.171 (4.35) 0.603 (15.32) 0.573 (14.55) 0.350 (8.89) 0.330 (8.38) 0.635 (16.13) 0.625 (15.87) 0.560 (14.22) 0.530 (13.46) PIN 1 PIN 2 PIN 3 CASE PIN 2 PIN 3 0.110 (2.79) 0.100 (2.54) PIN 1 0.110 (2.80) 0.100 (2.54) 0.060 (1.52) 1.148 (29.16) 1.118 (28.40) 0.160 (4.06) 0.140 (3.56) 0.131 (3.39) DIA. 0.122 (3.08) 0.140 (3.56) DIA. 0.130 (3.30) TO-220AB (BYQ28E, UG10 Series) 0.560 (14.22) 0.530 (13.46) 0.037 (0.94) 0.027 (0.69) 0.105 (2.67) 0.095 (2.41) 0.022 (0.55) 0.014 (0.36) 0.205 (5.20) 0.195 (4.95) Dimensions in inches and (millimeters) 0.105 (2.67) 0.095 (2.41) 0.104 (2.65) 0.096 (2.45) 0.035 (0.90) 0.028 (0.70) TO-263AB (BYQ28EB, UGB10 Series) 0.022 (0.56) 0.014 (0.36) 0.205 (5.20) 0.195 (4.95) 0.411 (10.45) 0.190 (4.83) 0.380 (9.65) 0.160 (4.06) 0.055 (1.40) 0.045 (1.14) 0.245 (6.22) MIN 0.42 (10.66) K Mounting Pad Layout TO-263AB 0.33 (8.38) 0.055 (1.40) 0.360 (9.14) 0.047 (1.19) 0.320 (8.13) 0.624 (15.85) 1 0.63 (17.02) K 2 0.591 (15.00) 0-0.01 (0-0.254) 0.110 (2.79) 0.090 (2.29) 0.037 (0.940) 0.027 (0.686) 0.08 (2.032) 0.105 (2.67) 0.24 (6.096) 0.12 (3.05) 0.095 (2.41) 0.021 (0.53) PIN 1 0.014 (0.36) PIN 2 K - HEATSINK 0.205 (5.20) 0.140 (3.56) 0.110 (2.79) 0.195 (4.95) Features Mechanical Data • Plastic package has Underwriters Laboratories Flammability Classification 94V-0 • High reverse energy capability • Excellent high temperature switching • High temperature soldering guaranteed: 250°C/10 seconds at terminals • Glass passivated chip junction • Soft recovery characteristics Case: JEDEC TO-220AB, ITO-220AB & TO-263AB molded plastic body Document Number 88549 27-Jun-03 Terminals: Plated leads, solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Mounting Torque: 10 in-lbs maximum Weight: 0.08 oz., 2.24 g www.vishay.com 1 BYQ28E, BYQ28EF, BYQ28EB, UG10DCT, UGF10DCT, UGB10DCT Series Vishay Semiconductors formerly General Semiconductor Maximum Ratings UG10BCT (TC = 25°C unless otherwise noted) Parameter Symbol UG10CCT UG10DCT BYQ28E-100 BYQ28E-150 BYQ28E-200 Unit Maximum repetitive peak reverse voltage VRRM 100 150 200 V Working peak reverse voltage VRWM 100 150 200 V Maximum DC blocking voltage VDC 100 150 200 V Maximum average forward rectified current Total device at TC = 100°C Per leg IF(AV) 10 5 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) per leg IFSM 55 A Non-repetitive peak reverse current per leg at tp= 100µs IRSM 0.2 A Electrostatic discharge capacitor voltage, Human body model: C = 250pF, R = 1.5kΩ VC 8 KV TJ, TSTG –40 to +150 °C VISOL 4500 (NOTE 1) 3500 (NOTE 2) 1500 (NOTE 3) V Symbol Value Unit VF 1.25 1.10 0.895 V IR 10 200 µA Maximum reverse recovery time per leg at IF = 1.0A, di/dt = 100A/µs, VR = 30V, Irr = 0.1 IRM trr 25 ns Maximum reverse recovery time per leg at IF = 0.5A, IR = 1.0A, Irr = 0.25A trr 20 ns Maximum stored charge per leg IF = 2A, di/dt = 20A/µs, VR = 30V, Irr = 0.1 IRM Qrr 9 nC Operating junction and storage temperature range RMS Isolation voltage (BYQ28EF, UGF types) from terminals to heatsink with t = 1 second, RH ≤ 30% Electrical Characteristics (T C = 25°C unless otherwise noted) Parameter Maximum instantaneous forward voltage at IF = 10A, at IF = 5A, at IF = 5A, Maximum reverse current per leg at working peak reverse voltage (Note 4) per leg (Note 4) TJ = 25°C TJ = 25°C TJ = 150°C TJ = 25°C TJ = 100°C Thermal Characteristics (T C UG10 UGF10 UGB10 Symbol BYQ28E BYQ28EF BYQ28EB Unit RθJA RθJC 50 4.5 55 6.7 50 4.5 °C/W °C/W = 25°C unless otherwise noted) Parameter Typical thermal resistance — junction to ambient per leg — junction to case Notes: (1) Clip mounting (on case), where lead does not overlap heatsink with 0.110” offset (2) Clip mounting (on case), where leads do overlap heatsink (3) Screw mounting with 4-40 screw, where washer diameter is ≤ 4.9 mm (0.19”) (4) Pulse test: 300µs pulse width, 1% duty cycle www.vishay.com 2 Document Number 88549 27-Jun-03 BYQ28E, BYQ28EF, BYQ28EB, UG10DCT, UGF10DCT, UGB10DCT Series Vishay Semiconductors formerly General Semiconductor Ratings and Characteristic Curves (TA = 25°C unless otherwise noted) Maximum Non-Repetitive Peak Forward Surge Current Per Leg Forward Current Derating Curve 15 100 Peak Forward Surge Current (A) Average Forward Current (A) Resistive or Inductive Load 10 5 0 TC = 105°C 8.3ms Single Half Sine-Wave (JEDEC Method) 10 1 50 0 150 100 1 Typical Reverse Characteristics Per Leg 100 IR – Instantaneous Reverse Current (µA) IF – Instantaneous Forward Current (A) Typical Instantaneous Forward Characteristics Per Leg Pulse Width = 300µs 1% Duty Cycle 10 TJ = 125°C TJ = 100°C 1.0 TJ = 25°C 0.1 0.01 0.2 0.4 0.6 0.8 1.0 1.2 1000 TJ = 125°C 100 100°C 10 1.0 25°C 0.1 20 1.4 Reverse Switching Characteristics Per Leg 60 80 100 Typical Junction Capacitance Per Leg 50 100 @2A, 20A/µs 40 pF – Junction Capacitance Stored Charge/Reverse Recovery Time (nC/ns) 40 Percent of Rated Peak Reverse Voltage (%) Instantaneous Forward Voltage (V) @5A, 50A/µs 30 @1A, 100A/µs 20 @5A, 50A/µs @1A, 100A/µs 10 25 50 75 100 Junction Temperature (°C) Document Number 88549 27-Jun-03 TJ = 125°C f = 1.0 MHZ Vsig = 50mVp-p 10 trr Qrr @2A, 20A/µs 0 100 10 Number of Cycles at 60 HZ Case Temperature (°C) 125 1 0.1 1 10 100 Reverse Voltage (V) www.vishay.com 3