MCC BAS86

MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
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BAS86
Features
•
•
•
•
•
Moisture Sensitivity Level 1
This diode features low turn-on voltage
The devices are protected by a PN junction guard ring against
excessive voltage, such as electrostatic discharges
This diode is also available in a DO-35 case with type designation
BAT86
Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
RoHS Compliant. See ordering information)
200mW
Small Signal Schottky
Barrier Diodes
50 Volts
Maximum Ratings
Symbol
VR
IF
IFRM
Ptot
RJA
TJ
TSTG
Rating
Continuous Reverse Voltage
Forward DC Current at Tamb=25℃
Repetitive Peak Forward Current tp<1s,Tamb=25℃
Power Dissipation at Tamb=65℃
Thermal Resistance Junction to Ambient Air
Junction Temperature
Storage Temperature
Rating
50
(2)
200
(2)
500
(2)
200
(2)
300
125
-65 to +150
MINIMELF
Unit
V
mA
mA
mW
℃/W
℃
℃
Cathode Mark
C
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol
V(BR)R
VF
IR
Ctot
trr
Parameter
Reverse Breakdown Voltage
(IR=10µAdc Pulsed)
Forward Voltage
IF=0.1mA, Pulse test tp<300μs
IF=1.0mA, Pulse test tp<300μs
IF=10mA, Pulse test tp<300μs
IF=30mA, Pulse test tp<300μs
IF=100mA, Pulse test tp<300μs
Leakage Current
(VR=40Vdc)
Capacitance
(VR=1.0V, f=1.0MHz)
Reverse Recovery Time
(IF=10mA, IR=10mA, Irr=1.0mA)
Min
Typ
Max
Units
50
---
---
V
-----------
0.200
0.275
0.365
0.460
0.700
0.300
0.380
0.450
0.600
0.900
A
V
DIMENSIONS
---
0.2
0.5
µA
---
---
8
pF
---
---
5.0
ns
Notes:1. Lead in Glass Exemption Applied, see EU Directive Annex 5.
2. Valid provided that electrodes are kept at ambient temperature
B
DIM
A
B
C
INCHES
MIN
.130
.008
.055
MM
MIN
3.30
.20
1.40
MAX
.146
.016
.059
MAX
3.70
.40
1.50
NOTE
∅
SUGGESTED SOLDER
PAD LAYOUT
0.105
0.075”
0.030”
Revision: A
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2011/09/16
MCC
BAS86
TM
Micro Commercial Components
PR - Reverse Power Dissipation (mW)
500
1000
VR = 50 V
450
Tj = 125 °C
IF - Forward Current (A)
400
350
300
250
PR - Limit
at 100 % VR
200
150
100
PR - Limit
at 80 % VR
R thJA = 540 K/W
100
Tj = 25 °C
10
1
50
0
25
0.1
50
75
100
125
0
150
Tj - Junction Temperature (°C)
15827
Figure 1. Max. Reverse Power Dissipation vs.
Junction Temperature
9
C D - Diode Capacitance (pF)
I R - Reverse Current (µA)
1000
100
10
75
100
125
150
Tj - Junction Temperature (°C)
15830
f = 1 MHz
8
7
6
5
4
3
2
1
0
50
Figure 2. Reverse Current vs. Junction Temperature
Revision: A
1.5
10
V R = V RRM
15828
1.0
Figure 3. Forward Current vs. Forward Voltage
10000
1
25
0.5
V F - Forward Voltage (V)
15829
0.1
1
10
100
V R - Reverse Voltage (V)
Figure 4. Diode Capacitance vs. Reverse Voltage
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MCC
TM
Micro Commercial Components
Ordering Information :
Device
Packing
Part Number-TP
Tape&Reel: 2.5Kpcs/Reel
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make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components
Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it
convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all
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approval of Micro Commercial Components Corporation.
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Revision: A
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2011/09/16