MCC TM Micro Commercial Components Micro Commercial Components Corp. Products End of Life Notification Issue date: Jan-1st-2009 Last Buy Date :N/A Description and Purpose: MCC has undergone a review of its core business and products , and determined to discontinue below products: Discontinued Devices Possible Replacements SD101A N/A SD101B N/A SD101C N/A SD103A N/A SD103B N/A SD103C N/A LLSD101A SD101AW LLSD101B SD101BW LLSD101C SD101CW LLSD103A SD103AW LLSD103B SD103BW LLSD103C SD103CW 1N5711 N/A DL5711 1N5711W 1N6263 N/A DL6263 1N6263W www.mccsemi.com MCC omponents 20736 Marilla Street Chatsworth !"# $ % !"# TM Micro Commercial Components DL5711 DL6263 Features • • • For general purpose applications These diodes are also available in the DO-35 case with type designation 1N5711 and 1N6263, in the Micro-MELF case with type designation MCL5711 and MCL6263. Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates Compliant. See ordering information) Small Signal Schottky Diodes Maximum Ratings MINIMELF Repetitive Peak Reverse Voltage VR 70V DL5711 DL6263 60V Maximum Forward tp<10uS, IFSM 2.0A Surge Current TA=25OC Power Dissipation PTOT 400mW* Junction Temperature TJ 125OC Storage Temperature TSTG -55~+150OC Range * Valid provided that electrodes are kept at ambient temperature Cathode Mark C B A Electrical Characteristics @ 25°C Unless Otherwise Specified DIMENSION DIM Maximum Forward Voltage VF Minimum Reverse Breakdown voltage DL5711 DL6263 Maximum Leakage current Maximum Junction Capacitance Maximum Reverse recovery time VR 0.41V 1.0V IF = 1.0mA IF = 15mA IR 70V 60V 200nA VR=50V CJ 2.0pF VR=0, f=1MHz trr 1.0ns IF=5.0mA , IR=5.0mA , INCHES MM NOTE MIN MAX MIN MAX A B .134 .008 .142 .016 3.40 0.20 3.60 0.40 C .055 .059 1.40 1.50 SUGGESTED SOLDER PAD LAYOUT 0.105 0.075” Maximum Thermal resistance junction to Ambient Air RθJA 0.3K/ W 0.030” Note:1.Lead in Glass Exemption Applied, see EU Directive Annex 5. Revision: 6 www.mccsemi.com 1 of 3 2008/07/14 MCC DL5711,DL6263 TM Micro Commercial Components Fig.1 Typical variation of fwd. current vs forward. voltage for primary conduction through the Schottky barrier Fig.2 Typical forward conduction curve of combination Schottky barrier and PN junction guard ring mA mA IF IF VF VF Fig.3 Typical variation of reverse current at various temperatures Fig.4 Typical capacitance curve as a function of reverse voltage uA PF TJ=25 C IR CJ Revision: 6 VR VR www.mccsemi.com 2 of 3 2008/07/14 MCC TM Micro Commercial Components Ordering Information Device Packing (Part Number)-TP Tape&Reel;2.5Kpcs/Reel ***IMPORTANT NOTICE*** Micro Commercial Components Corp . reserves the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are represented on our website, harmless against all damages. ***APPLICATIONS DISCLAIMER*** Products offer by Micro Commercial Components Corp . are not intended for use in Medical, Aerospace or Military Applications. www.mccsemi.com Revision: 6 3 of 3 2008/07/14 3