3.3V/5V DUAL LVTTL/LVCMOS-to-DIFFERENTIAL LVPECL TRANSLATOR Micrel, Inc. SY89322V ® Precision Edge SY89322V FEATURES ■ ■ ■ ■ ■ ■ ■ ■ 3.3V and 5V power supply option 300ps typical propagation delay Differential LVPECL outputs PNP LVTTL inputs for minimal loading Flow-through pinouts Q outputs will default HIGH with inputs open Max. frequency range 800MHz Available in ultra-small 8-pin MLF® (2mm x 2mm) package Precision Edge® DESCRIPTION The SY89322V is a dual TTL/CMOS-to-differential PECL translator capable of running from a 3.3V or 5V supply. This part can be used in either LVTTL/LVCMOS/LVPECL or TTL/CMOS/PECL systems. It requires only a single positive supply of +3.3V or +5V, no negative supply is required. The SY89322V is functionally equivalent to the SY100EPT22V, but in an ultra-small 8-lead MLF® package that features a 70% smaller footprint. The ultra-small package and the low skew, dual gate design of the SY89322V makes it ideal for those applications where space, performance and low power are at a premium. BLOCK DIAGRAM Q0 INO /Q0 LVTTL LVPECL Q1 INI /Q1 Precision Edge is a registered trademark of Micrel, Inc. MicroLeadFrame and MLF are registered trademarks of Amkor Technology, Inc. M9999-060809 [email protected] or (408) 955-1690 Rev.: E 1 Amendment: /0 Issue Date: June 2009 SY89322V Micrel, Inc. PACKAGE/ORDERING INFORMATION Ordering Information Q0 1 8 Package Type Operating Range Package Marking Lead Finish SY89322VMITR MLF-8 Industrial 322 Sn-Pb SY89322VMGTR(1) MLF-8 Industrial 322 with Pb-Free bar-line indicator Pb-Free NiPdAu VCC Part Number /Q0 Q1 /Q1 2 7 LVPECL LVTTL IN0 3 6 IN1 4 5 GND Note: 8-Pin MLF® Ultra-Small Outline (2mm × 2mm) 1. Pb-Free package is recommended for new designs. PIN DESCRIPTION Pin Number Pin Name Type 1, 2, 3, 4 Q0, /Q0, Q1, /Q1 100k ECL Output 5 GND, Exposed Pad Ground 6, 7 IN1, IN0 TTL/LVTTL Input 8 VCC Power M9999-060809 [email protected] or (408) 955-1690 Pin Function Differential LVPECL Outputs: Default to LOW if IN input left open. See “Output Interface Applications” section for recommendations on terminations. GND and exposed pad must be tied to ground plane. Single-ended TTL Inputs. Positive Power Supply: Bypass with 0.1µF//0.01µF low ESR capacitors. 2 SY89322V Micrel, Inc. Absolute Maximum Ratings(1) Operating Ratings(2) Supply Voltage (VCC) .................................. –0.5V to +6.0V Input Voltage (VIN) ......................................... –0.5V to VCC LVPECL Output Current (IOUT) Continuous ............................................................. 50mA Surge .................................................................... 100mA Input Current Source or sink current on IN, /IN .......................... ±50mA Lead Temperature (soldering, 20 sec.) ................... +260°C Storage Temperature (TS) ....................... –65°C to +150°C Supply Voltage (VCC) .................................. +3.0V to +3.6V ............................................................ +4.5V to +5.5V Ambient Temperature (TA) ......................... –40°C to +85°C Package Thermal Resistance(3) MLF® (θJA) Still-Air ................................................................. 93°C/W 500lfpm ............................................................... 87°C/W MLF® (ΨJB) Junction-to-Board ................................................ 60°C/W DC ELECTRICAL CHARACTERISTICS TA = –40°C to +85°C Symbol Parameter VCC Power Supply Voltage ICC Power Supply Current Condition Min Typ 3.0 4.5 Max Units 3.6 5.5 V V 25 mA Max Units TTL DC ELECTRICAL CHARACTERISTICS VCC = +3.3V ±10% or +5.0V ±10%; TA = –40°C to +85°C, unless otherwise noted. Symbol Parameter VIH Input HIGH Voltage VIL Input LOW Voltage IIH Input HIGH Current IIL VIK Condition Min Typ 2.0 V 0.8 V VIN = 2.7V VIN = VCC 20 100 µA µA Input LOW Current VIN = 0.5V –0.2 mA Input Clamp Voltage IIN = –18mA –1.2 V PECL DC ELECTRICAL CHARACTERISTICS VCC = +3.3V ±10% or +5V ±10%; RL = 50Ω to VCC–2V; TA = –40°C to +85°C, unless otherwise noted. Symbol Parameter VOH Output HIGH VOL Output LOW Voltage Condition Min Typ Max Units VCC–1.080 VCC–0.880 V VCC–1.83 VCC–1.550 V Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. M9999-060809 [email protected] or (408) 955-1690 3 SY89322V Micrel, Inc. AC ELECTRICAL CHARACTERISTICS VCC = +3.3V ±10% or +5.0V ±10%; RL = 50Ω to VCC – 2V, TA = –40°C to +85°C, unless otherwise noted. Symbol Parameter fMAX Maximum Toggle Frequency tPD Propagation Delay tSKEW Within-Device Skew tJitter tr, tf Condition Min Max Units 800 MHz 600 ps Note 4 100 ps Part-to-Part Jitter Note 4 500 ps Cycle-to-Cycle Jitter Note 5 2 psRMS Total Jitter Note 6 25 psPP 500 ps IN-to-Q Typ 100 Output Rise/Fall Time (20% to 80%) 200 Notes: 4. Same transition at common VCC levels. 5. Cycle-to-cycle jitter definition: The variation of periods between adjacent cycles, Tn – Tn–1,where T is the time between rising edges of the output signal. 6. Total jitter definition: with an ideal clock input of frequency ≤ fMAX, no more than one output edge in 1012 output edge will deviate by more than the specified peak-to-peak jitter value. LVPECL OUTPUT INTERFACE APPLICATIONS VCC VCC R1 R1 VCC VCC ZO = 50Ω ZO = 50Ω ZO = 50Ω 50Ω VCC —2V R2 50Ω R2 VCC = 3.3V; Rpd = 50Ω VCC = 5V; Rpd = 100Ω VCC = 3.3V; R1 = 130Ω, R2 = 82Ω VCC = 5V; R1 = 83Ω, R2 = 125Ω Figure 1a. Parallel TheveninEquivalent Termination VCC —2V VCC VCC R1 R3 R1 VCC ZO = 50Ω R2 Rpd Figure 1b. Three Resistor “Y Termination” VCC VCC —2V R4 R2 VCC —1.3V VCC = 3.3V; R1 = 130Ω, R2 = 82Ω, R3 = 1kΩ, R4 = 1.6kΩ, VCC = 5V; R1 = 83Ω, R2 = 125Ω, R3 = 1kΩ, R4 = 2.8kΩ, Figure 1c. Terminating Unused I/O M9999-060809 [email protected] or (408) 955-1690 VCC ZO = 50Ω 4 C (Optional) 0.01µF SY89322V Micrel, Inc. 8-PIN ULTRA-SMALL EPAD-MicroLeadFrame® (MLF-8) Package EP- Exposed Pad Die CompSide Island Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane PCB Thermal Consideration for 8-Pin MLF® Package Package Notes: 1. Package meets Level 2 qualification. 2. All parts are dry-packaged before shipment. 3. Exposed pads must be soldered to a ground for proper thermal management. MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB USA http://www.micrel.com The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2006 Micrel, Incorporated. M9999-060809 [email protected] or (408) 955-1690 5