ONSEMI NCL30160DR2G

NCL30160
1.0A Constant-Current
Buck Regulator for Driving
High Power LEDs
The NCL30160 is an NFET hysteretic step−down, constant−current
driver for high power LEDs. Ideal for automotive, industrial and
general lighting applications utilizing minimal external components.
The NCL30160 operates with an input voltage range from 6.3 V to
40 V. The hysteretic control gives good power supply rejection and
fast response during load transients and PWM dimming to LED arrays
of varying number and type. A dedicated PWM input (DIM/EN)
enables wide range of pulsed dimming and a high switching frequency
up to 1.4 MHz allows the use of smaller external components
minimizing space and cost. Protection features include
resistor−programmed constant LED current, shorted LED protection,
under−voltage and thermal shutdown. The NCL30160 is available in a
SOIC−8 package.
http://onsemi.com
8
1
SOIC−8 NB
CASE 751
MARKING DIAGRAM
8
30160
ALYWX
G
Features
•
•
•
•
•
•
•
•
•
•
•
Integrated 1.0A MOSFET
VIN Range 6.3 V to 40 V
Short LED Shutdown Protection
Up to 1.4 MHz Switching Frequency
No Control Loop Compensation Required
Adjustable LED Current
Single Pin Brightness and Enable/Disable Control Using PWM
Supports All−Ceramic Output Capacitors and Capacitor−less Outputs
Thermal Shutdown Protection
Capable of 100% Duty Cycle Operation
This is a Pb−Free Device
1
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
PIN CONNECTIONS
CS
LX
CS
VIN
GND
DIM/ENABLE
VCC
ROT
Typical Application
•
•
•
•
•
LED Driver
Constant Current Source
Automotive Lighting
General Illumination
Industrial Lighting
ORDERING INFORMATION
Device
NCL30160DR2G
Package
Shipping†
SOIC−8 2500 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 1
1
Publication Order Number:
NCL30160/D
NCL30160
D1
VIN
CIN
L1
…
LED
LED
VIN
LX
DIM/Enable
ROT
ROT
CS
NCL30160
VCC
CVCC
RSENSE
GND
Figure 1. Typical Application Circuit
PIN FUNCTION DESCRIPTION
Pin
Pin Name
Description
Application Information
1, 2
CS
Current Sense feedback pin
Set the current through the LED array by connecting a resistor from this pin to
ground.
3
GND
Ground Pin
4
VCC
Output of Internal 5 V linear
regulator
5
ROT
Off−Time Setting Resistor
Resistor ROT from this pin to VCC sets the Off−Time range for the hysteretic
controller.
6
DIM/EN
PWM Dimming Control &
ENABLE
Connect a logic−level PWM signal to this pin to enable/disable the power
MOSFET and LED array
7
VIN
Input Voltage Pin
8
LX
Drain of Internal Power
MOSFET
Ground. Reference point for all voltages
The VCC pin supplies the power to the internal circuitry. The VCC is the
output of a linear regulator which is powered from VIN. A 2 uF ceramic
capacitor is recommended for bypassing and should be placed as close as
possible to the VCC and AGND pins. Do not connect to an external load.
Nominal operating input range is 6.3 V to 40 V. Input supply pin to the internal
circuitry and the positive input to the current sense comparators. Due high
frequency noise, a 10 mF ceramic capacitor is recommended to be placed as
close as possible to VIN and power ground.
The LX pin connects to the inductor and provides the switching current
necessary to operate in hysteretic mode.
http://onsemi.com
2
NCL30160
MAXIMUM RATINGS
Symbol
Min
Max
Unit
VIN to GND
Rating
VIN
−0.3
40
V
MOSFET Drain Voltage to GND
LX
−
40
V
VCC to GND
VCC
−
6
V
DIM/EN to GND
DIM
−0.3
6
V
CS to GND
CS
−0.3
6
V
ROT
−0.3
ROT to GND
Absolute Maximum Junction Temperature
TJ(MAX)
Operating Junction Temperature Range
TJ
6
150
−40
V
°C
125
°C
Maximum LED Drive Current
ILIM
1.5
A
Storage Temperature Range
Tstg
−55 to +125
°C
PD
RqJA
1.11
111.7
W
°C/W
TL
260 peak
°C
MSL
1
−
Thermal Characteristics
SOIC−8 Plastic Package
Maximum Power Dissipation @ TA = 25°C (Note 1)
Thermal Resistance Junction−to−Air (Note 2)
Lead Temperature Soldering (10 sec):
Re−flow (SMD styles only)
Pb−Free (Note 3)
Moisture Sensitivity Level (Note 4)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The maximum package power dissipation limit must not be exceeded.
PD +
TJ(max) * T A
R qJA
2. When mounted on a multi−layer board with 35 mm2 copper area, using 1 oz Cu.
3. 60−180 seconds minimum above 237°C.
4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
http://onsemi.com
3
NCL30160
ELECTRICAL CHARACTERISTICS (Unless otherwise noted: VIN = 12 V, TA = 25°C, unless otherwise specified.)
Symbol
Characteristics
Min
Typ
Max
Unit
40
V
SYSTEM PARAMETERS
VIN
Input Supply Voltage Range
Normal Operation
8.0
Functional (Note 5)
6.3
IQ_IN
Quiescent Current into VIN
1.5
mA
VCC
Internal Regulator Output (Note 6)
5.0
V
VUV+
Under−Voltage Lock−out Threshold
(VIN Rising)
5.5
6.0
6.5
V
VUV−
Under−Voltage Lock−out Threshold
(VIN Falling)
5.2
5.6
6.3
V
25°C
213
220
226
mV
−40 to 125°C
209
CURRENT LIMIT AND REGULATION
VCS_UL
CS Regulation Upper Limit
(CS Increasing, FET Turns−OFF)
VCS_LL
CS Regulation Lower Limit
(CS Decreasing, FET Turns−ON)
25°C
174
−40 to 125°C
171
VOCP
Over Current Protect Limit
(Reference to CS Pin)
FSW
Switching Frequency Range (Note 7)
231
180
186
mV
189
500
mV
1400
kHz
DIM INPUT
VPWMH/L
PWM (DIM/EN) high level input voltage
VPWML
PWM (DIM/EN) low level input voltage
IDIM−PU
DIM/EN Pull−up Current
fpwm
PWM (DIM/EN) dimming frequency range
dmax
Maximum Duty Cycle (Note 7)
1.4
V
0.4
50
0.1
V
mA
20
100
kHz
%
POWER MOSFET
VBRDSS
Drain−to−Source Breakdown Voltage
IDSS
Drain−to−Source Leakage Current
(VGS = 0 V, VDS = 40 V)
10
mA
RDS(on)
On Resistance
(Id = 500 mA)
55
mW
VSD
Source−Drain Body Diode
(Forward On−Voltage)
0.8
1.1
V
tPD_Off
Propagation Delay VCS_UL − LX_High
35
ns
TSD
Thermal Shutdown
165
°C
THyst
Thermal Hysteresis
40
°C
Minimum Off−time
137
ns
40
V
THERMAL SHUTDOWN
OFF TIMER
tOFF−MIN
5. The functional range of VIN is the voltage range over which the device will function. Output current and internal parameters may deviate from
normal values for VIN and VCC voltages between 6.3 V and 8 V, depending on load conditions
6. VCC should not be driven from a voltage higher than VIN or in the absence of a voltage at VIN.
7. Guaranteed by design.
http://onsemi.com
4
NCL30160
DIM / Enable
VIN
VCC
5 V Regulator
(6.3 V to 40 Vmax)
VCC
LX
Enable Pull−Up
Resistor
Gate Driver
S
Q
R
Q
Peak Current
Comparator
220 mV
CS
Valley Current
Timer (toff)
&
Thermal
Shutdown
ROT
Comparator
180 mV
Short Circuit Protection
Comparator
500 mV
GND
Figure 2. Simplified Block Diagram
TYPICAL APPLICATION CIRCUITS AND WAVEFORMS
(TJ = 25°C, Unless Otherwise Specified)
D1
VIN
CIN
L1
LED
LX
VIN
DIM/Enable
ROT
PWM
ROT
CS
NCL30160
VCC
CVCC
RSENSE
GND
Figure 3. Typical Application Circuit To Drive One LED (Buck)
http://onsemi.com
5
NCL30160
Figure 4. Typical Operation Waveforms
(VCC = 12 V, VLED = 6.5 V, RSENSE = 0.68 W, L = 100 mH)
THEORY OF OPERATION
sensed when the FET is turned back on and a correction
signal is sent to the off time circuit to adjust the off time as
necessary.
This switching power supply is comprised of an inverted
buck regulator controlled by a current mode, hysteretic
control circuit. The buck regulator operates exactly like a
conventional buck regulator except the power device
placement has been inverted to allow for a low side power
FET. Referring to Figure 1, when the FET is conducting,
current flows from the input,through the inductor, the LED
and the FET to ground.
When the FET shuts off, current continues to flow through
the inductor and LED, but is diverted through the diode
(D1). This operation keeps the current in the LED
continuous with a continuous current ramp.
The control circuit controls the current hysteretically.
Figure 2 illustrates the operation of this circuit. The CS
comparator thresholds are set to provide a 10% current
ripple. The peak current comparator threshold of 220 mV
sets Ipeak at 10% above the average current while the valley
current comparator threshold of 180 mV sets Ivalley at 10%
below the average current.
When the FET is conducting, the current in the inductor
ramps up. This current is sensed by an external sense resistor
that is connected from CS to ground. When the CS pin
reaches 220 mV, the peak current comparator turns off the
power FET. A conventional hysteretic controller would
monitor the load current and turn the switch back on when
the CS pin reaches 180 mV. But in this topology, the current
information is not available to the control circuit when the
FET is off. To set the proper FET off time, the CS voltage is
Figure 5. Typical Current Waveforms
The current waveshape is triangular, and the peak and
valley currents are controlled. The average value for a
triangular waveshape is halfway between the peak and
valley, so even with changes in duty cycle due to input
voltage variations or load changes, the average current will
remain constant.
In the event there is a short−circuit across the LEDs, a
large amount of current could potentially flow through the
circuit during startup. To protect against this, the NCL30160
comes with a short circuit protection feature. If the voltage
on the CS pin is detected to be greater than 500 mV
(equating to 2.5 times the intended average output current),
the NCL31060 will turn off the FET, and prevent the FET
from turning on again until power is recycled to NCL30160.
http://onsemi.com
6
NCL30160
Figure 7. Dimming Waveforms
Figure 6. Short-Circuit Protection
By applying a pulsed signal to DIM/EN, the average
output current can be adjusted to the duty ratio of the pulsed
signal. It is recommended to keep the frequency of the
DIM/EN signal above 100 Hz to avoid any visible flickering
of the LED.
When VIN rises above the UVLO threshold voltage,
switching operation of the FET will begin. However, until
the VIN voltage reaches 8 V, the VCC regulator may not
provide the expected gate drive voltage to the FET. This
could result in the RDS(on) of the FET being higher than
expected or there not being enough gate drive capability to
operate at the maximum rated switching frequency. For
optimal performance, it is recommended to operate the part
at a VIN voltage of 8 V or greater.
Setting The Output Current
The average output current is determined as being the
middle of the peak and valley of the output current, set by the
CS comparator thresholds. The nominal average output
current will be the current value equivalent to 200 mV at the
CS pin. The proper RSENSE value for a desired average
output current can be calculated by:
R SENSE +
200 mV
I LED
Figure 8. Dimming Performance
PWM Dimming
For a given RSENSE value, the average output current, and
therefore the brightness of the LED, can be set to a lower
value through the DIM/EN pin. When the DIM/EN pin is
brought low, the internal FET will turn off and switching
will remain off until the DIM/EN pin is brought back into its
high state.
Inductor Selection
The inductor that is used directly affects the switching
frequency the driver operates at. The value of the inductor
sets the slope at which the output current rises and falls
during the switching operation. The slope of the current, in
turn, determines how long it takes the current to go from the
valley point of the current ripple to the peak when the FET
is on and the current and rising, and how long it takes the
current to go from the peak point of the current to the valley
when the FET is off and the current is falling. These times
can be approximated from the following equations:
t ON
+
VIN * V LED * I OUT
http://onsemi.com
7
ǒ
L
FET R
DI
DS
Ǔ
(on) ) DCRL ) RSENSE
NCL30160
t OFF +
L DI
V LED ) V diode ) I OUT
It is also important to select a diode that is capable of
withstanding the peak reverse voltage it will see in the
application. It is recommended to select a diode with a rated
reverse voltage greater than VIN. It is also recommended to
use a low-capacitance Schottky diode for better efficiency
performance.
DCRL
Where DCRL is the dc resistance of the inductor, VLED is
the forward voltages of the LEDs, FETRDS(ON) is the
on-resistance of the power MOSFET, and Vdiode is the
forward voltage of the catch diode.
The switching frequency can then be approximated from
the following:
f SW +
Selecting The Off-Time Setting Resistor
The off-time setting resistor (ROT) programs the
NCL30160 with the initial time duration that the MOSFET
is turned off when the switching operation begins. During
subsequent switching cycles, the voltage at the CS pin is
sensed every time the MOSFET is turned on, and the
off-time will be adjusted depending on how much of a
discrepancy exists between the sensed value and the CS
lower limit threshold value. The ROT value can be calculated
using the following equation:
1
t ON ) t OFF
Higher values of inductance lead to slower rates of rise
and fall of the output current. This allows for smaller
discrepancies between the expected and actual output
current ripple due to propagation delays between sensing at
the CS pin and the turning on and off of the power MOSFET.
However, the inductor value should be chosen such that the
peak output current value does not exceed the rated
saturation current of the inductor.
R OT + t OFF
Where tOFF is the expected off time during normal
switching operation, calculated in the Inductor Selection
section above.
Catch Diode Selection
The catch diode needs to be selected such that average
current through the diode does not exceed the rated average
forward current of the diode. The average current through
the diode can be calculated as:
I avg_diode + I OUT
10 11 W
Input Capacitor
A decoupling capacitor from VIN to ground should be
used to provide the current needed when the power
MOSFET turns on. A 4.7 mF ceramic capacitor is
recommended.
t OFF
t ON ) t OFF
http://onsemi.com
8
NCL30160
95
95
90
90
EFFICIENCY (%)
100
EFFICIENCY (%)
100
85
80
75
70
65
60
85
80
75
70
65
0
5
10
15
20
25
30
35
60
40
15
20
25
30
35
Figure 10. Efficiency, 700 mA, Vf_LED = 3.5 V
1.65
90
1.60
85
1.55
IQIN (mA)
95
EFFICIENCY (%)
10
Figure 9. Efficiency, 350 mA, Vf_LED = 3.5 V
1.70
80
75
1.45
1.40
65
1.35
5
10
15
20
VIN (V)
25
30
35
1.30
40
40
1.50
70
0
5
VIN (V)
100
60
0
VIN (V)
5
10
15
Figure 11. Efficiency, 1 A, Vf_LED = 3.5 V
20
25
VIN (V)
30
35
40
100
120
Figure 12. IQIN vs. VIN
SWITCHING FREQUENCY (kHz)
700
LED CURRENT (mA)
600
500
100 Hz
400
10 kHz
300
200
100
0
20
40
60
DIMMING DUTY RATIO (%)
80
240
220
200
180
160
140
120
100
−40
100
−20
0
20
40
60
TEMPERATURE (°C)
80
Figure 14. Switching Frequency vs.
Temperature (12 V VIN, 3 LEDs, 0.7 A, 0.47 mH)
Figure 13. LED Current vs. Dimming Duty
Ratio
http://onsemi.com
9
NCL30160
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
10
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCL30160/D