ATMEL ATA6662_08

Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Operating Range from 5V to 27V
Baud Rate up to 20 Kbaud
Improved Slew Rate Control According to LIN Specification 2.0 and SAEJ2602-2
Fully Compatible with 3.3V and 5V Devices
Dominant Time-out Function at Transmit Data (TXD)
Normal and Sleep Mode
Wake-up Capability via LIN Bus (90 µs Dominant)
External Wake-up via WAKE Pin (35 µs Low Level)
Control of External Voltage Regulator via INH Pin
Very Low Standby Current During Sleep Mode (10 µA)
Wake-up Source Recognition
Bus Pin Short-circuit Protected versus GND and Battery
LIN Input Current Typically 5 µA if VBAT Is Disconnected
Overtemperature Protection
High EMC Level
Interference and Damage Protection According to ISO/CD 7637
ESD HBM 8 kV at LIN Bus Pin, Supply Pin VS and WAKE Pin According to STM5.1
LIN Transceiver
ATA6662
1. Description
The ATA6662 is a fully integrated LIN transceiver complying with the LIN
specification 2.0 and SAEJ2602-2. It interfaces the LIN protocol handler and the physical layer. The device is designed to handle the low-speed data communication in
vehicles, for example, in convenience electronics. Improved slope control at the LIN
bus ensures secure data communication up to 20 Kbaud with an RC oscillator for protocol handling. Sleep Mode guarantees minimal current consumption. The ATA6662
has advanced EMI and ESD performance.
Figure 1-1.
Block Diagram
7
VS
6
LIN
Receiver
RXD
1
Filter
Short-circuit and overtemperature protection
Wake-up bus timer
TXD
4
TXD
time-out
timer
Slew rate control
VS
VS
Control unit
WAKE
3
Wake-up
timer
5
Sleep mode
2
EN
GND
8
INH
4916J–AUTO–02/08
2. Pin Configuration
Figure 2-1.
Pinning SO8
RXD
EN
WAKE
TXD
Table 2-1.
2
1
2
3
4
8
7
6
5
INH
VS
LIN
GND
Pin Description
Pin
Symbol
1
RXD
2
EN
3
WAKE
Function
Receive data output (open drain)
Enables Normal Mode; when the input is open or low, the device is in Sleep Mode
High voltage input for local wake-up request
4
TXD
Transmit data input; active low output (strong pull-down) after a local wake-up request
5
GND
Ground, heat sink
6
LIN
LIN bus line input/output
7
VS
Battery supply
8
INH
Battery-related inhibit output for controlling an external voltage regulator; active high after a wake-up
request
ATA6662
4916J–AUTO–02/08
ATA6662
3. Functional Description
3.1
Physical Layer Compatibility
Since the LIN physical layer is independent from higher LIN layers (e.g., the LIN protocol layer),
all nodes with a LIN physical layer according to revision 2.0 can be mixed with LIN physical layer
nodes, which, according to older versions (i.e., LIN 1.0, LIN 1.1, LIN 1.2, LIN 1.3), are without
any restrictions.
3.2
Supply Pin (VS)
Undervoltage detection is implemented to disable transmission if VS falls to a value below 5V in
order to avoid false bus messages. After switching on VS, the IC switches to Pre-normal Mode
and INHIBIT is switched on. The supply current in Sleep Mode is typically 10 µA.
3.3
Ground Pin (GND)
The ATA6662 is neutral on the LIN pin in the case of a GND disconnection. It is able to handle a
ground shift up to 11.5% of VS.
3.4
Bus Pin (LIN)
A low-side driver with internal current limitation and thermal shutdown and an internal pull-up
resistor are implemented as specified for LIN 2.0. The voltage range is from –27V to +40V. This
pin exhibits no reverse current from the LIN bus to VS, even in the case of a GND shift or VBatt
disconnection. The LIN receiver thresholds are compatible to the LIN protocol specification.The
fall time (from recessive to dominant) and the rise time (from dominant to recessive) are slope
controlled. The output has a self-adapting short circuit limitation; that is, during current limitation,
as the chip temperature increases, the current is reduced.
3.5
Input Pin (TXD)
This pin is the microcontroller interface to control the state of the LIN output. TXD is low to bring
LIN low. If TXD is high, the LIN output transistor is turned off. Then, the bus is in Recessive
Mode via the internal pull-up resistor. The TXD pin is compatible to both a 3.3V or 5V supply.
3.6
TXD Dominant Time-out Function
The TXD input has an internal pull-down resistor. An internal timer prevents the bus line from
being driven permanently in dominant state. If TXD is forced low longer than tdom > 6 ms, the pin
LIN will be switched off (Recessive Mode). To reset this mode, switch TXD to high (> 10 µs)
before switching LIN to dominant again.
3.7
Output Pin (RXD)
This pin reports to the microcontroller the state of the LIN bus. LIN high (recessive) is reported
by a high level at RXD, LIN low (dominant) is reported by a low voltage at RXD. The output is an
open drain, therefore, it is compatible to a 3.3V or 5V power supply. The AC characteristics are
defined with a pull-up resistor of 5 kΩ to 5V and a load capacitor of 20 pF. The output is
short-current protected. In Unpowered Mode (VS = 0V), RXD is switched off. For ESD protection
a Zener diode is integrated, with VZ = 6.1V.
3
4916J–AUTO–02/08
3.8
Enable Input Pin (EN)
This pin controls the Operation Mode of the interface. If EN = 1, the interface is in Normal Mode,
with the transmission path from TXD to LIN and from LIN to Rx both active. A falling edge on EN
while TXD is already set to high, the device is switched to Sleep Mode and no transmission is
possible. In Sleep Mode, the LIN bus pin is connected to VS with a weak pull-up current source.
The device can transmit only after being woken up (see Section 3.9, “Inhibit Output Pin (INH)” ).
During Sleep Mode the device is still supplied from the battery voltage. The supply current is typically 10 µA. The pin EN provides a pull-down resistor in order to force the transceiver into Sleep
Mode in case the pin is disconnected.
3.9
Inhibit Output Pin (INH)
This pin is used to control an external switchable voltage regulator having a wake-up input. The
inhibit pin provides an internal switch towards pin VS. If the device is in Normal Mode, the inhibit
high-side switch is turned on and the external voltage regulator is activated. When the device is
in Sleep Mode, the inhibit switch is turned off and disables the voltage regulator.
A wake-up event on the LIN bus or at pin WAKE will switch the INH pin to the VS level. After a
system power-up (VS rises from zero), the pin INH switches automatically to the VS level.
3.10
Wake-up Input Pin (WAKE)
This pin is a high-voltage input used to wake the device up from Sleep Mode. It is usually connected to an external switch in the application to generate a local wake-up. If you do not need a
local wake-up in your application, connect pin WAKE directly to pin VS. A pull-up current source
with typically –10 µA is implemented. The voltage threshold for a wake-up signal is 3V below the
VS voltage with an output current of typically –3 µA.
Wake-up events from Sleep Mode:
• LIN bus
• EN pin
• WAKE pin
Figure 3-1 on page 6, Figure 3-2 on page 7 and Figure 3-3 on page 7 show details of wake-up
operations.
4
ATA6662
4916J–AUTO–02/08
ATA6662
3.11
Operation Modes
1. Normal Mode
This is the normal transmitting and Receiving Mode. All features are available.
2. Sleep Mode
In this mode the transmission path is disabled and the device is in low power mode.
Supply current from VBatt is typically 10 µA. A wake-up signal from the LIN bus or via pin
WAKE will be detected and will switch the device to Fail-safe Mode. If EN then switches
to high, Normal Mode is activated. Input debounce timers at pin WAKE (tWAKE), LIN
(tBUS) and EN (tsleep,tnom) prevent unwanted wake-up events due to automotive transients or EMI. In Sleep Mode the INH pin is left floating. The internal termination
between pin LIN and pin VS is disabled to minimize the power dissipation in case pin
LIN is short-circuited to GND. Only a weak pull-up current (typical 10 µA) between pin
LIN and pin VS is present. The Sleep Mode can be activated independently from the
actual level on pin LIN or WAKE, guaranteeing that the lowest power consumption is
achievable even in the case of a continuous dominant level on pin LIN or a continuous
LOW on pin WAKE.
3. Fail-safe Mode
At system power-up, the device automatically switches to Fail-safe Mode. It switches
the INH pin to a high state, to the VS level. The microcontroller of the application will
then confirm the Normal Mode by setting the EN pin to high.
3.12
Remote Wake-up via Dominant Bus State
A voltage less than the LIN pre-wake detection VLINL at pin LIN activates the internal LIN
transceiver.
A falling edge at pin LIN, followed by a dominant bus level VBUSdom maintained for a certain time
period (tBUS) and a rising edge at pin LIN results in a remote wake-up request.
The device switches to Fail-safe Mode. Pin INH is activated (switches to VS) and the internal termination resistor is switched on. The remote wake-up request is indicated by a low level at pin
RXD to interrupt the microcontroller (see Figure 3-2 on page 7).
3.13
Local Wake-up via Pin WAKE
A falling edge at pin WAKE, followed by a low level maintained for a certain time period (tWAKE),
results in a local wake-up request. The wake-up time (tWAKE) ensures that no transient, according to ISO7637, creates a wake-up. The device switches to Fail-safe Mode. Pin INH is activated
(switches to VS) and the internal termination resistor is switched on. The local wake-up request
is indicated by a low level at pin RXD to interrupt the microcontroller and a strong pull-down at
pin TXD (see Figure 3-3 on page 7). The voltage threshold for a wake-up signal is 3V below the
VS voltage with an output current of typical –3 µA. Even in the case of a continuous low at pin
WAKE it is possible to switch the IC into Sleep Mode via a low at pin EN. The IC will stay in
Sleep Mode for an unlimited time. To generate a new wake up at pin WAKE it needs first a high
signal > 6 µs before a negative edge starts the wake-up filtering time again.
5
4916J–AUTO–02/08
3.14
Wake-up Source Recognition
The device can distinguish between a local wake-up request (pin WAKE) and a remote wake-up
request (dominant LIN bus). The wake-up source can be read on pin TXD in Fail-safe Mode. If
an external pull-up resistor (typically 5 kΩ) has been added on pin TXD to the power supply of
the microcontroller, a high level indicates a remote wake-up request (weak pull-down at pin
TXD) and a low level indicates a local wake-up request (strong pull-down at pin TXD).
The wake-up request flag (signalled on pin RXD) as well as the wake-up source flag (signalled
on pin TXD) are reset immediately if the microcontroller sets pin EN to high (see Figure 3-2 on
page 7 and Figure 3-3 on page 7).
Figure 3-1.
Mode of Operation
a: VS > 5V
b: VS < 5V
c: Bus wake-up event
d: Wake-up from wake switch
Unpowered Mode
VBatt = 0V
b
a
Fail-safe Mode
INH: high (INH internal high-side switch ON)
Communication: OFF
b
b
c
EN = 1
d
Go to sleep command
EN = 0; after 1 → 0 while TXD = 1
Normal Mode
INH: high (INH HS switch ON)
Communication: ON
3.15
Local wake-up event
EN = 1
Sleep Mode
INH: high impedance (INH HS switch OFF)
Communication: OFF
Fail-safe Features
• There are now reverse currents < 15 µA at pin LIN during loss of VBAT or GND; this is optimal
behavior for bus systems where some slave nodes are supplied from battery or ignition.
• Pin EN provides a pull-down resistor to force the transceiver into Sleep Mode if EN is
disconnected.
• Pin RXD is set floating if VBAT is disconnected.
• Pin TXD provides a pull-down resistor to provide a static low if TXD is disconnected.
• The LIN output driver has a current limitation, and if the junction temperature Tj exceeds the
thermal shut-down temperature Toff, the output driver switches off.
• The implemented hysteresis, Thys, enables the LIN output again after the temperature has
been decreased.
6
ATA6662
4916J–AUTO–02/08
ATA6662
Figure 3-2.
LIN Wake-up Waveform Diagram
Bus wake-up filtering time
(tBUS)
LIN bus
High
INH
Low or floating
RXD
High or floating
Low
External
voltage
regulator
Off state
Regulator wake-up time delay
Normal
Mode
EN High
RXD
Node in sleep state
Microcontroller start-up
delay time
Figure 3-3.
Wake-up from Wake-up Switch
State change
Wake pin
INH
Low or floating
RXD
High or floating
TXD
TXD weak pull-down resistor
High
Low
High
TXD strong pull-down
Weak
pull-down
Wake filtering time
tWAKE
Voltage
regulator
On state
Off state
Regulator wake-up time delay
EN
Node in
operation
EN High
Node in sleep state
Microcontroller start-up
delay time
7
4916J–AUTO–02/08
4. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters
Max.
Unit
–0.3
+40
V
Wake DC and transient voltage (with 33-kΩ serial resistor)
- Transient voltage due to ISO7637 (coupling 1 nF)
–1
–150
+40
+100
V
V
Logic pins (RXD, TXD, EN)
–0.3
+5.5
V
LIN
- DC voltage
- Transient voltage due to ISO7637 (coupling 1 nF)
–27
–150
+40
+100
V
V
INH
- DC voltage
–0.3
+40
V
VS
- Continuous supply voltage
Symbol
Min.
Typ.
According to IBEE LIN EMC
Test specification 1.0 following IEC 61000-4-2
- Pin VS, LIN to GND
- Pin WAKE (33 kΩ serial resistor)
±6
±5
KV
KV
ESD HBM following STM5.1
with 1.5 kΩ/100 pF
- Pin VS, LIN, WAKE to GND
- Pin INH to GND
±8
±6
KV
KV
±3
KV
±750
V
HBM ESD
ANSI/ESD-STM5.1
JESD22-A114
AEC-Q100 (002)
CDM ESD STM 5.3.1
Tj
–40
+150
°C
Storage temperature
Tstg
–55
+150
°C
Thermal shutdown
Toff
150
165
180
°C
Thermal shutdown hysteresis
Thys
5
10
20
°C
Typ.
Max.
Unit
145
K/W
Junction temperature
Note:
1. Equivalent to discharge a 100-pF capacitor through a 1.5-kΩ resistor.
5. Thermal Resistance
Parameters
Symbol
Thermal resistance junction ambient
RthJA
Special heat sink at GND (pin 5) on PCB (fused lead
frame to pin 5)
RthJA
8
Min.
80
K/W
ATA6662
4916J–AUTO–02/08
ATA6662
6. Electrical Characteristics
5V < VS < 27V, Tj = –40°C to +150°C
No.
1
1.1
1.2
Parameters
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
5
13.5
27
V
A
VS Pin
DC voltage range nominal
Supply current in Sleep Mode
1.3
1.4
Test Conditions
Supply current in Normal Mode
7
VS
Sleep Mode
Vlin > VBatt – 0.5V
VBatt < 14V
7
IVSstby
10
20
µA
A
Bus recessive
7
IVSrec
1.6
3
mA
A
Bus dominant
Total bus load > 500Ω
7
IVSdom
1.6
3
mA
A
1.5
VS undervoltage threshold on
VSth
4
4.95
V
A
1.6
VS undervoltage threshold off
VSth
4.05
5
V
A
1.7
VS undervoltage threshold
hysteresis
7
VSth_hys
50
500
mV
A
1.3
8
mA
A
0.4
V
A
2
RXD Output Pin (Open Drain)
2.1
Low-level input current
Normal Mode
VLIN = 0V, VRXD = 0.4V
1
IRXDL
2.2
RXD saturation voltage
5-kΩ pull-up resistor to 5V
1
VsatRXD
2.3
High-level leakage current
Normal Mode
VLIN = VBAT, VRXD = 5V
1
IRXDH
–3
+3
µA
A
2.4
ESD zener diode
IRXD = 100 µA
1
VZRXD
5.8
8.6
V
A
3
2.5
TXD Input Pin
3.1
Low-level voltage input
4
VTXDL
–0.3
+0.8
V
A
3.2
High-level voltage input
4
VTXDH
2
7
V
A
600
kΩ
A
+3
µA
A
8
mA
A
3.3
Pull-down resistor
VTXD = 5V
4
RTXD
125
3.4
Low-level leakage current
VTXD = 0V
4
ITXD
–3
3.5
Low-level input current at local
wake-up request
Fail-safe Mode
VLIN = VBAT; VWAKE = 0V
4
ITXDwake
1.3
4
250
2.5
EN Input Pin
4.1
Low-level voltage input
2
VENL
–0.3
+0.8
V
A
4.2
High-level voltage input
2
VENH
2
7
V
A
4.3
Pull-down resistor
VEN = 5V
2
REN
125
600
kΩ
A
4.4
Low-level input current
VEN = 0V
2
IEN
–3
+3
µA
A
5
250
INH Output Pin
5.1
High-level voltage
Normal Mode
IINH = –2 mA
8
VINHH
VS – 3
VS
V
A
5.2
High-level leakage current
Sleep Mode
VINH = 27V, VBatt = 27V
8
IINHL
–3
+3
µA
A
3
VWAKEH
VS –
1V
VS +
0.3V
V
A
3
VWAKEL
–1V
VS –
3V
V
A
6
WAKE Pin
6.1
High-level input voltage
6.2
Low-level input voltage
IWAKE = Typically –3 µA
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
9
4916J–AUTO–02/08
6. Electrical Characteristics (Continued)
5V < VS < 27V, Tj = –40°C to +150°C
No.
Parameters
Test Conditions
6.3
Wake pull-up current
6.4
High-level leakage current
7
Pin
Symbol
Min.
Typ.
VS < 27V
3
IWAKE
–30
–10
VS = 27V, VWAKE = 27V
3
IWAKE
–5
0.9 ×
VS
Max.
Unit
Type*
µA
A
+5
µA
A
VS
V
A
LIN Bus Driver
7.1
Driver recessive output voltage
RLOAD = 500Ω / 1 kΩ
6
VBUSrec
7.2
Driver dominant voltage
VBUSdom_DRV_LoSUP
VVS = 7V, Rload = 500Ω
6
V_LoSUP
1.2
V
A
7.3
Driver dominant voltage
VBUSdom_DRV_HiSUP
VVS = 18V, Rload = 500Ω
6
V_HiSUP
2
V
A
7.4
Driver dominant voltage
VBUSdom_DRV_LoSUP
VVS = 7V, Rload = 1000Ω
6
V_LoSUP_1k
0.6
V
A
7.5
Driver dominant voltage
VBUSdom_DRV_HiSUP
VVS = 18V, Rload = 1000Ω
6
V_HiSUP_1k_
0.8
V
A
7.6
Pull-up resistor to VS
The serial diode is
mandatory
6
RLIN
20
30
60
kΩ
A
7.7
LIN current limitation
VBUS = VBAT_max
6
IBUS_LIM
40
120
200
mA
A
7.8
Input leakage current at the
receiver, including pull-up
resistor as specified
Input leakage current
Driver off
VBUS = 0V, VBatt = 12V
6
IBUS_PAS_dom
–1
mA
A
7.9
Leakage current LIN recessive
Driver off
8V < VBAT < 18V
8V < VBUS < 18V
VBUS ≥ VBAT
6
IBUS_PAS_rec
7.10
Leakage current at ground loss;
Control unit disconnected from GNDDevice = VS
VBAT =12V
ground; Loss of local ground
must not affect communication in 0V < VBUS < 18V
the residual network
6
IBUS_NO_gnd
7.11
Node has to sustain the current
that can flow under this
condition; Bus must remain
operational under this condition
VBAT disconnected
VSUP_Device = GND
0V < VBUS < 18V
6
IBUS
8
–10
15
20
µA
A
+0.5
+10
µA
A
5
15
µA
A
0.5 ×
VS
0.525
× VS
V
A
LIN Bus Receiver
8.1
Center of receiver threshold
VBUS_CNT =
(Vth_dom + Vth_rec) / 2
6
VBUS_CNT
0.475 ×
VS
8.2
Receiver dominant state
VEN = 5V
6
VBUSdom
–27
0.4 ×
VS
V
A
8.3
Receiver recessive state
VEN = 5V
6
VBUSrec
0.6 ×
VS
40
V
A
8.4
Receiver input hysteresis
VHYS = Vth_rec – Vth_dom
6
VBUShys
0.028 ×
VS
0.175
× VS
V
A
8.5
Pre-wake detection LIN
High-level input voltage
6
VLINH
VS –
1V
VS +
0.3V
V
A
8.6
Pre-wake detection LIN
Low-level input voltage
6
VLINL
–27V
VS –
3.3V
V
A
Switches the LIN receiver on
0.1 ×
VS
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
10
ATA6662
4916J–AUTO–02/08
ATA6662
6. Electrical Characteristics (Continued)
5V < VS < 27V, Tj = –40°C to +150°C
No.
9
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
Internal Timers
9.1
Dominant time for wake-up via
LIN bus
VLIN = 0V
6
tBUS
30
90
150
µs
A
9.2
Time of low pulse for wake-up
via pin WAKE
VWAKE = 0V
3
tWAKE
7
35
50
µs
A
9.3
Time delay for mode change
from Fail-safe Mode to Normal
Mode via pin EN
VEN = 5V
2
tnorm
2
7
15
µs
A
9.4
Time delay for mode change
from Normal Mode into Sleep
Mode via pin EN
VEN = 0V
2
tsleep
2
7
12
µs
A
9.5
TXD dominant time out timer
VTXD = 0V
4
tdom
6
9
20
ms
A
9.6
Power-up delay between
VS = 5V until INH switches to
high
VVS = 5V
200
µs
A
10
LIN Bus Driver (see Figure 6-1 on page 12)
Bus load conditions: Load1, small, 1 nF 1 kΩ; Load2, big, 10 nF 500Ω; RRXD = 5 kΩ; CRXD = 20 pF;
The following two rows specify the timing parameters for proper operation at 20.0 kBits/s.
10.1
10.2
10.3
10.4
11
tVS
Duty cycle 1
THRec(max) = 0.744 × VS
THDom(max) = 0.581 × VS
VS = 7.0V to 18V
tBit = 50 µs
D1 = tbus_rec(min) / (2 × tBit)
6
D1
Duty cycle 2
THRec(min) = 0.422 × VS
THDom(min) = 0.284 × VS
VS = 7.0V to 18V
tBit = 50 µs
D2 = tbus_rec(max) / (2 × tBit)
6
D2
Duty cycle 3
THRec(max) = 0.778 × VS
THDom(max) = 0.616 × VS
VS = 7.0V to 18V
tBit = 96 µs
D3 = tbus_rec(min) / (2 × tBit)
6
D3
Duty cycle 4
THRec(max) = 0.389 × VS
THDom(max) = 0.251 × VS
VS = 7.0V to 18V
tBit = 96 µs
D4 = tbus_rec(min) / (2 × tBit)
6
D4
0.590
6
µs
A
+2
µs
A
0.396
A
0.581
A
0.417
A
A
Receiver Electrical AC Parameters of the LIN Physical Layer
LIN receiver, RXD load conditions (CRXD): 20 pF, Rpull-up = 5 kΩ
11.1
Propagation delay of receiver
(see Figure 6-1 on page 12)
trec_pd = max(trx_pdr, trx_pdf)
VS = 7.0V to 18V
1
trx_pd
11.2
Symmetry of receiver
propagation delay rising edge
minus falling edge
trx_sym = trx_pdr – trx_pdf
VS = 7.0V to 18V
1
trx_sym
–2
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
11
4916J–AUTO–02/08
Figure 6-1.
Definition of Bus Timing Parameter
tBit
tBit
tBit
TXD
(Input to transmitting node)
tBus_dom(max)
tBus_rec(min)
Thresholds of
THRec(max)
receiving node 1
VS
(Transceiver supply
of transmitting node)
THDom(max)
LIN Bus Signal
Thresholds of
THRec(min)
receiving node 2
THDom(min)
tBus_dom(min)
tBus_rec(max)
RXD
(Output of receiving node 1)
trx_pdr(1)
trx_pdf(1)
RXD
(Output of receiving node 2)
trx_pdr(2)
12
trx_pdf(2)
ATA6662
4916J–AUTO–02/08
ATA6662
Figure 6-2.
Application Circuit
Master node
pull-up
VBATTERY
22 µF
100 nF
12V
1k
7
ATA6662
5 kΩ
VDD
Microcontroller
VS
Receiver
1
LIN sub bus
5V
RXD
Filter
SCI
LIN
Wake-up bus timer
4
TXD
Time-out
timer
TXD
IO
3
WAKE
220 pF
Control unit
10 kΩ
33 kΩ
Slew rate control
Short-circuit and
overtemperature
protection
VS
VS
External
switch
6
Wake-up
timer
5
Sleep mode
GND
2
8
EN
INH
13
4916J–AUTO–02/08
7. Ordering Information
Extended Type Number
Package
ATA6662-TAQY
Remarks
SO8
LIN transceiver, Pb-free, 4k, taped and reeled
8. Package Information
Package: SO 8
Dimensions in mm
5±0.2
4.9±0.1
0.1+0.15
1.4
0.2
3.7±0.1
0.4
1.27
3.8±0.1
6±0.2
3.81
8
5
technical drawings
according to DIN
specifications
1
4
Drawing-No.: 6.541-5031.01-4
Issue: 1; 15.08.06
14
ATA6662
4916J–AUTO–02/08
ATA6662
9. Revision History
Please note that the following page numbers referred to in this section refer to the specific revision
mentioned, not to this document.
Revision No.
History
4916J-AUTO-02/08
•
•
•
•
4916I-AUTO-12/07
• Section 3.1 “Physical Layer Compatibility” on page 3 added
• Section 6 “Electrical Characteristics” numbers 1.5, 1.6 and 1.7 on page 9
changed
4916H-AUTO-10/07
• Section 7 “Ordering Information” on page 14 changed
4916G-AUTO-07/07
• Put datasheet in a new template
• Capital T for time generally changed in a lower case t
4916F-AUTO-05/07
4916E-AUTO-02/07
4916D-AUTO-02/07
•
•
•
•
“Pre-normal Mode” in “Fail-safe Mode” changed
Section 3.9 “Inhibit Output Pin (INH) on page 4 changed
Section 4 “Absolute Maximum Ratings” on page 8 changed
Section 6 “Electrical Characteristics” number 5.1 on page 9 changed
Figure 1-1 “Block Diagram” on page 1 changed
Figure 6-2 “Application Circuit” on page 13 changed
Features on page 1 changed
Section 6 “Electrical Characteristics” numbers 10.1 to 10.4 and 11.1,
11.2 changed
• Section 4 “Absolute Maximum Ratings” on page 8 changed
• Section 2 “Electrical Characteristics” on pages 9 to 11 changed
•
•
•
•
•
•
•
•
•
•
Features on page 1 changed
Section 1 “Description” on page 1 changed
Table 2-1 “Pin Description” on page 2 changed
Section 3.2 “Ground Pin (GND) on page 3 changed
Section 3.7 “Enable Input Pin (EN)” on page 4 changed
Section 3.11 “Remote Wake-up via Dominant Bus State” on page 5
changed
Figure 3-1 “Mode of Operation” on page 6 changed
Section 3-14 “Fail-safe Features” on page 6 changed
Section 4 “Absolute Maximum Ratings” on page 8 changed
Section 6 “Electrical Characteristics” on pages 9 to 11 changed
15
4916J–AUTO–02/08
Headquarters
International
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Atmel Asia
Room 1219
Chinachem Golden Plaza
77 Mody Road Tsimshatsui
East Kowloon
Hong Kong
Tel: (852) 2721-9778
Fax: (852) 2722-1369
Atmel Europe
Le Krebs
8, Rue Jean-Pierre Timbaud
BP 309
78054
Saint-Quentin-en-Yvelines Cedex
France
Tel: (33) 1-30-60-70-00
Fax: (33) 1-30-60-71-11
Atmel Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Technical Support
[email protected]
Sales Contact
www.atmel.com/contacts
Product Contact
Web Site
www.atmel.com
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF
THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use
as components in applications intended to support or sustain life.
© 2008 Atmel Corporation. All rights reserved. Atmel ®, logo and combinations thereof, and others are registered trademarks or trademarks of
Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
4916J–AUTO–02/08