1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328 1/27/09 4:58 PM Page 54 KA, SC hybrid IC EU features NEW • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding (COB) • Various types of package are available • High reliability achieved by KOA’s original thick film technology • Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production EW information Nordering New Part # KA 7777 D Product Code KA: Hybrid IC SC: Non-Noble KOA Ref. Number Terminal Surface Material D: SnAgCu T: Sn Substrate Materials Conductors, Resistors Mounting Package, Outside Terminals Over Coating, Plating o= Available Item AI2O3 Alumina Glass epoxy Item Conductor resistance Heat shock RuO2 Item COB BGA QFP Chip Package SIP DIP, SOP ZIP Over Coating Epoxy metamorphic phenol Epoxy Printing Mounting o o x o Ag-Pd Ag-Pt 18mΩ/ /15µmµ 5mΩ/ /10µm -55°C~+125°C 300 Cycles -55°C~+125°C 500 Cycles 5Ω~10MΩ ±100x10-6/K Specifications Au Wire, AI Wire 0.8mm Pitch~ 0.4mm Pitch~ 0.6mm x 0.3mm (0.4mm x 0.2mm)~ Lead Pitch 1.8mm, 2.0mm, 2.5mm, 2.54mm 1.27mm, 1.8mm, 2.54mm 2.54mm Color Black Black Bonding o o Cu 2mΩ/ /20µm -55°C~+125°C 500 Cycles 10Ω~1MΩ ±100x10-6/k UL Standard 94 V0 Approved 94 V1 Approved x= Not available Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. 1/08/09 KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com 249 modules Component - KA/CB Series