FAIRCHILD FDH700

FDH700
DISCRETE POWER AND SIGNAL
TECHNOLOGIES
ULTRA FAST DIODE
Information Only Data Sheet
FINAL REVERSE CURRENT & FORWARD VOLTAGE LIMITS MIGHT BE INCREASED SLIGHTLY
Absolute Maximum Ratings (note 1)
TA = 25OC unless otherwise noted
Parameter
Value
Units
Storage Temperature
-65 to +200
O
C
Maximum Junction Temperature
-65 to +175
O
C
Total Power Dissipation at 25OC
250
mW
1.67
mW/OC
Derate above 25OC
Working Inverse Voltage
DC Forward Current
20
V
150
mA
Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
CATHODE
BAND
0.500 Minimum
12.70 Typ 1.000
LOGO
FD
H7
00
0.022 (0.558) Diameter
0.018 (0.458) Typ 20 mils
0.200 (5.08)
0.120 (3.05)
Electrical Characteristics
SYM
Breakdown Voltage
IR
Reverse Leakage
VF
Forward Voltage
CT
TA = 25OC unless otherwise noted
CHARACTERISTICS
BV
TRR
0.090 (2.28) Diameter
0.060 (1.53)
MIN
MAX
30
420
520
640
760
810
0.89
UNITS
TEST CONDITIONS
V
IR
=
50
50
nA
uA
VR =
VR =
500
610
740
900
990
1.25
mV
mV
mV
mV
mV
V
IF
IF
IF
IF
IF
IF
=
=
=
=
=
=
5.0 uA
20 V
20 V TA = 150OC
10 uA
100 uA
1.0 mA
10 mA
20 mA
50 mA
Reverse Recovery Time
900
ps
IF= IR = 10 mA IRR = 1.0 mA
RLoop = 100 Ohm
Diode Capacitance
1.5
pF
VR =
© 1999 Fairchild Semiconductor Corporation
0 V, f = 1.0 MHz
FDH700 - Rev. A
DISCRETE POWER AND SIGNAL
TECHNOLOGIES
STANDARD DIGITAL MARKING CRITERIA
MAXIMUM CHARACTERS PER LINE: 3 MAXIMUM NUMBER OF LINES: 4
LOGO AND CHARACTERS M & W COUNT AS 2 CHARACTERS EACH
LEADS: COPPER CLAD STEEL
TYPICAL 20 Mils
LEADS TIN DIPPED
(60% SN 40% PB)
0.021 (0.533) Diameter
0.019 (0.483)
STUDS: DUMET (ALLOY 42)
GLASS SLEEVE
0.150 (3.810)
0.140 (3.556)
CATHODE BAND
1.105 (28.067)
1.081 (27.457)
0.050 (1.270)
Maximum
SEE NOTE 1 BELOW
Package Weight
0.14 grams
0.074 (1.880) Diameter
0.068 (1.727)
NOTE 1:
LEAD DIAMETER NOT CONTROLLED IN
THIS ZONE TO ALLOW FOR FLASH, LEAD
FINISH BUILD-UP, & MINOR
IRREGULARITIES OTHER THAN SLUGS.
DO-35 PACKAGE
Fairchild Semiconductor's Criteria
11-MAR-97
DISCRETE POWER AND SIGNAL
TECHNOLOGIES
FD700
Ultra Fast Diode Diode
Absolute Maximum Ratings (note 1)
TA = 25OC unless otherwise noted
Parameter
Value
Units
Storage Temperature
-65 to +200
O
C
Maximum Junction Temperature
-65 to +175
O
C
Total Power Dissipation at 25OC
250
mW
1.67
mW/OC
Derate above 25OC
Working Inverse Voltage
20
V
DC Forward Current
150
mA
Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
DO-7
PACKAGE
Electrical Characteristics
SYM
CHARACTERISTICS
BV
Breakdown Voltage
IR
Reverse Leakage
VF
Forward Voltage
TRR
CT
TA = 25OC unless otherwise noted
MIN
MAX
30
420
520
640
760
810
0.89
UNITS
TEST CONDITIONS
V
IR
=
50
50
nA
uA
VR =
VR =
500
610
740
880
950
1.10
mV
mV
mV
mV
mV
V
IF
IF
IF
IF
IF
IF
=
=
=
=
=
=
5.0 uA
20 V
20 V TA = 150OC
10 uA
100 uA
1.0 mA
10 mA
20 mA
50 mA
Reverse Recovery Time
700
ps
IF= IR = 10 mA IRR = 1.0 mA
RLoop = 100 Ohm
Diode Capacitance
1.0
pF
VR =
© 1997 Fairchild Semiconductor Corporation
0 V, f = 1.0 MHz
Rev. A June 1998
DISCRETE POWER AND SIGNAL
TECHNOLOGIES
LEADS:BORATED (ALLOY 42) DUMET
TYPICAL 20 mils Diameter
LEADS TIN DIPPED (60% SN 40% PB)
0.021 (0.533) Diameter
0.019 (0.483)
Typical Solder Thickness in micro-inches
Min
Avg
Max
125.9
162.1
204.3
GLASS PLUG
GLASS SLEEVE
0.287 (7.290)
0.265 (6.731)
"C" BEND SPRING
SOLDER PREFORM
Sb/Sn (5% - 10% Sb)
BORATED (ALLOY 42) DUMET
COMFAB STUDSEAL (FIRST SEAL)
1.110 (28.194)
1.085 (27.559)
0.050 (1.270)
MAXIMUM
SEE NOTE 1 BELOW
0.097 (2.464) Diameter
0.093 (2.362)
NOTE 1:
LEAD DIAMETER NOT CONTROLLED IN
THIS ZONE TO ALLOW FOR FLASH, LEAD
FINISH BUILD-UP, & MINOR
IRREGULARITIES OTHER THAN SLUGS.
DO-7 PACKAGE
Fairchild Semiconductor's Criteria
13-APR-93
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NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
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LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
2. A critical component is any component of a life
1. Life support devices or systems are devices or
support device or system whose failure to perform can
systems which, (a) are intended for surgical implant into
be reasonably expected to cause the failure of the life
the body, or (b) support or sustain life, or (c) whose
support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. H3