LINER LTC1350CNW

LTC1350
3.3V Low Power
EIA/TIA-562 3-Driver/
5-Receiver Transceiver
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FEATURES
■
■
■
■
■
■
■
■
■
■
DESCRIPTIO
Low Supply Current: 300µA
Receivers 4 and 5 Kept Alive
in Shutdown: 35µA
ESD Protection: ±10kV
Operates from a Single 3.3V Supply
Uses Small Capacitors: 0.1µF
Operates to 120kBaud
Three-State Outputs are High Impedance
When Off
Output Overvoltage Does Not Force Current
Back into Supplies
EIA/TIA-562 I/O Lines Can Be Forced to ±25V
Without Damage
Flowthrough Architecture
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APPLICATIO S
■
In Shutdown mode, two receivers are kept alive and the
supply current is only 35µA. All RS232 outputs assume
a high impedance state in Shutdown or with the power
off.
The LTC1350 is fully compliant with all data rate and
overvoltage EIA/TIA-562 specifications. The transceiver
can operate up to 120kbaud with a 1000pF and 3kΩ load.
Both driver outputs and receiver inputs can be forced to
±25V without damage and can survive multiple ±10kV
ESD strikes.
, LTC and LT are registered trademarks of Linear Technology Corporation.
Notebook Computers
Palmtop Computers
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■
The LTC®1350 is a 3-driver/5-receiver EIA/TIA-562
transceiver with very low supply current. In the no load
condition, the supply current is only 300µA. The charge
pump only requires four 0.1µF capacitors.
TYPICAL APPLICATIO
Quiescent and Shutdown Supply Current
vs Temperature
3-Drivers/5-Receivers with Shutdown
V–
27
C2 +
3
26
C2 –
4
C1–
5
DR1 OUT
6
RX1 IN
7
DR2 OUT
8
RX2 IN
9
RX3 IN
10
RX4 IN
11
DR3 OUT
12
RX5 IN
13
ON/OFF
14
NC
25
VCC
C1
+
LTC1350
24
23
22
21
20
19
18
17
16
15
DR1 IN
RX1 OUT
DR2 IN
RX2 OUT
RX3 OUT
RX4 OUT
DR3 IN
RX5 OUT
GND
NC
NC
600
500
QUIESCENT CURRENT (µA)
28
2
85
TEST CONDITION: VCC = 3.3V
ALL DRIVER INPUTS TIED TO VCC
400
75
65
QUIESCENT
CURRENT
300
55
200
45
100
0
–40 –20
SHUTDOWN CURRENT
40
20
60
0
TEMPERATURE (˚C)
SHUTDOWN CURRENT (µA)
1
V+
35
80
0
100
LTC1350 • TA02
LTC1350 • TA01
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LTC1350
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ABSOLUTE
RATI GS
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PACKAGE/ORDER I FOR ATIO
Supply Voltage (VCC) ................................................ 5V
Input Voltage
Driver ....................................... – 0.3V to V CC + 0.3V
Receiver ............................................... – 25V to 25V
ON/OFF Pin ................................ – 0.3V to VCC + 0.3V
Output Voltage
Driver .................................................... – 25V to 25V
Receiver .................................... – 0.3V to VCC + 0.3V
Short-Circuit Duration
V + ................................................................... 30 sec
V – ................................................................... 30 sec
Driver Output .............................................. Indefinite
Receiver Output .......................................... Indefinite
Operating Temperature Range
Commercial (LTC1350C) ........................ 0°C to 70°C
Industrial (LTC1350I) ........................ – 40°C to 85°C
Storage Temperature Range ................ – 65°C to 150°C
Lead Temperature (Soldering, 10 sec)................. 300°C
TOP VIEW
V+
1
ORDER PART
NUMBER
28 V–
VCC 2
27 C2+
C1+
26 C2–
3
C1– 4
25 DR1 IN
DR1 OUT 5
24 RX1 OUT
RX1 IN 6
23 DR2 IN
DR2 OUT 7
22 RX2 OUT
RX2 IN 8
21 RX3 OUT
RX3 IN 9
20 RX4 OUT
RX4 IN 10
19 DR3 IN
DR3 OUT 11
LTC1350CG
LTC1350CNW
LTC1350CSW
LTC1350IG
LTC1350INW
LTC1350ISW
18 RX5 OUT
RX5 IN 12
17 GND
ON/OFF 13
16 NC
NC 14
15 NC
G PACKAGE
28-LEAD SSOP
NW PACKAGE
28-LEAD PDIP
SW PACKAGE
28-LEAD PLASTIC SO WIDE
TJMAX = 125°C, θJA = 96°C/W (G)
TJMAX = 125°C, θJA = 56°C/W (NW)
TJMAX = 125°C, θJA = 85°C/W (SW)
Consult LTC Marketing for parts specified with wider operating temperature
ranges.
DC ELECTRICAL CHARACTERISTICS
The ● denotes specifications which apply over the full operating
temperature range. VCC = 3.3V, C1 = C2 = C3 = C4 = 0.1µF, unless noted.
PARAMETER
Any Driver
Output Voltage Swing
CONDITIONS
Logic Input Voltage Level
Logic Input Current
Output Short-Circuit Current
Output Leakage Current
Any Receiver
Input Voltage Thresholds
Hysteresis
Input Resistance
Output Voltage
Output Short-Circuit Current
Output Leakage Current
MIN
TYP
●
●
3.7
– 3.7
Input Low Level (VOUT = High)
Input High Level (VOUT = Low)
VIN = VCC
VIN = 0V
VOUT = 0V
Shutdown (Note 3), VOUT = ±20V
●
●
2.0
4.5
– 4.5
1.4
1.4
Input Low Threshold
Input High Threshold
●
●
0.8
●
0.1
3
3k to GND
VIN = ±10V
Output Low, IOUT = – 1.6mA (VCC = 3.3V)
Output High, IOUT = 160µA (VCC = 3.3V)
Sinking Current, VOUT = VCC
Shutdown (Note 3), 0V ≤ VOUT ≤ VCC
Positive
Negative
±9
●
0.8
5
–5
●
●
●
●
MAX
3.0
–3
±10
10
1.3
1.7
0.4
5
0.2
3.2
– 20
1
500
2.4
1
7
0.4
10
UNITS
V
V
V
V
µA
µA
mA
µA
V
V
V
kΩ
V
V
mA
µA
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LTC1350
DC ELECTRICAL CHARACTERISTICS
The ● denotes specifications which apply over the full operating
temperature range. VCC = 3.3V, C1 = C2 = C3 = C4 = 0.1µF, unless noted.
PARAMETER
Power Supply Generator
V + Output Voltage
V – Output Voltage
Supply Rise Time
Power Supply
VCC Supply Current
CONDITIONS
MIN
IOUT = 0mA
IOUT = 5mA
IOUT = 0mA
IOUT = – 5mA
Shutdown to Turn-On
MAX
UNITS
5.7
5.5
– 5.3
– 5.0
0.2
No Load (All Drivers VIN = VCC)(Note 2) 0°C ≤ TA ≤ 70°C
No Load (All Drivers VIN = 0)(Note 2) 0°C ≤ TA ≤ 70°C
No Load (All Drivers VIN = VCC)(Note 2) 0°C ≤ TA ≤ 85°C
No Load (All Drivers VIN = VCC)(Note 2) – 40°C ≤ TA ≤ 0°C
No Load (All Drivers VIN = 0)(Note 2) – 40°C ≤ TA ≤ 85°C
Shutdown (Note 3)
ON/OFF Threshold Low
ON/OFF Threshold High
TYP
●
●
●
●
●
●
●
●
2.0
0.3
0.5
0.3
0.3
0.5
35
1.4
1.4
V
V
V
V
ms
0.6
1.0
1.0
1.5
1.5
50
0.8
mA
mA
mA
mA
mA
µA
V
V
AC CHARACTERISTICS
The ● denotes specifications which apply over the full operating temperature range.
VCC = 5V, C1 = C2 = C3 = C4 = 0.1µF, unless noted.
PARAMETER
Slew Rate
Driver Propagation Delay
(TTL to EIA/TIA-562)
Receiver Propagation Delay
(EIA/TIA-562 to TTL)
CONDITIONS
RL = 3k, CL = 51pF
RL = 3k, CL = 1000pF
t HLD (Figure 1)
t LHD (Figure 1)
t HLR (Figure 2)
t LHR (Figure 2)
Note 1: Absolute Maximum Ratings are those values beyond which the life
of the device may be impaired.
Note 2: Supply current is measured with driver and receiver outputs
unloaded.
MIN
3
●
●
●
●
TYP
8
5
2
2
0.3
0.3
MAX
30
3.5
3.5
0.8
0.8
UNITS
V/µs
V/µs
µs
µs
µs
µs
Note 3: Supply current measurement in Shutdown mode is performed
with VON/OFF = 0V.
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LTC1350
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TYPICAL PERFOR A CE CHARACTERISTICS
Receiver Input Thresholds
vs Temperature
Driver Output Voltage
vs Temperature
5
VCC = 3.3V
OUTPUT HIGH
1
ALL DRIVERS WITH LOAD, RL = 3k
–1
–2
VCC = 3.3V
OUTPUT LOW
–4
–5
–40 –20
40
20
0
60
TEMPERATURE (°C)
1.8
VTH+
1.6
VTH–
1.4
1.2
80
80
45
4.5
40
SUPPLY CURRENT (mA)
LEAKAGE CURRENT (µA)
RL = 3k
3 DRIVERS LOADED
3.5
3.0
2.5
RL = 3k
1 DRIVER LOADED
25
15
5
100
VOUT = –20V
20
0.5
80
VOUT = 20V
0
10
30
20
40
50
TEMPERATURE (°C)
SHORT-CIRCUIT CURRENT (mA)
60
70
12
8
ISC+
6
4
0
–40 –20
0
40
60
20
TEMPERATURE (˚C)
80
100
LTC1350 • TPC06
RECEIVER
OUTPUT
CL = 50pF
30
DRIVER
OUTPUT
RL = 3k
ISC–
ISC–
10
Receiver Output Waveform
DRIVER
OUTPUT
RL = 3k
CL = 1000pF
20
140
14
Driver Output Waveforms
25
120
LTC1350 • TPC03
LTC1350 • TPC05
Receiver Short-Circuit Current
vs Temperature
35
80 100
60
40
DATA RATE (k Baud)
2
0
LTC1350 • TPC04
40
20
16
30
10
40
20
0
60
TEMPERATURE (°C)
0
Driver Short-Circuit Current
vs Temperature
35
1.0
0
–40 –20
100
Driver Leakage in Shutdown
vs Temperature
5.0
1.5
10
LT1350 • TPC02
VCC Supply Current
vs Temperature
2.0
15
0
40
20
60
0
TEMPERATURE (˚C)
LTC1350 • TPC01
4.0
20
5
1.0
–40 –20
100
VCC = 3.3V
RL = 3k
CL = 2500pF
3 DRIVERS ACTIVE
25
SUPPLY CURRENT (mA)
2.0
2
–3
30
SHORT-CIRCUIT CURRENT (mA)
3
THRESHOLD VOLTAGE (V)
DRIVER OUTPUT VOLTAGE (V)
4
0
Supply Current vs Data Rate
2.2
INPUT
15
INPUT
10
ISC+
5
0
–40 –20
0
40
60
20
TEMPERATURE (˚C)
LTC1350 • TPC08
80
LTC1350 • TPC09
100
LTC1350 • TPC07
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LTC1350
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PI FU CTIO S
VCC: 3.3V Input Supply Pin. Supply current is typically
35µA in the Shutdown mode. This pin should be decoupled
with a 0.1µF ceramic capacitor.
GND: Ground Pin.
ON/OFF: TTL/CMOS Compatible Shutdown Pin. A logic
low puts the device in the Shutdown mode with receivers
4 and 5 kept alive and the supply current equal to 35µA. All
driver and other receiver outputs are in high impedance
state. This pin cannot float.
V +:
V+
Positive Supply Output.
≅ 2VCC – 1V. This pin
requires an external capacitor (C = 0.1µF) for charge
storage. The capacitor may be tied to ground or VCC. With
multiple devices, the V + and V – pins may be paralleled into
common capacitors. For a large number of devices,
increasing the size of the shared common storage
capacitors is recommended to reduce ripple.
V –: Negative Supply Output. V – ≅ – (2VCC – 1.3V). This
pin requires an external capacitor (C = 0.1µF) for charge
storage.
C1+, C1–, C2+, C2–: Commutating Capacitor Inputs. These
pins require two external capacitors (C = 0.1µF): one from
C1+ to C1– and another from C2+ to C2 –. To maintain
charge pump efficiency, the capacitor’s effective series
resistance should be less than 20Ω.
DR IN: EIA/TIA-562 Driver Input Pins. Inputs are TTL/
CMOS compatible. Inputs should not be allowed to float.
Tie unused inputs to VCC.
DR OUT: Driver Outputs at EIA/TIA-562 Voltage Levels.
Outputs are in a high impedance state when in the Shutdown
mode or VCC = 0V. The driver outputs are protected against
ESD to ±10kV for human body model discharges.
RX IN: Receiver Inputs. These pins can be forced to ±25V
without damage. The receiver inputs are protected against
ESD to ±10kV for human body model discharges. Each
receiver provides 0.4V of hysteresis for noise immunity.
RX OUT: Receiver Outputs with TTL/CMOS Voltage Levels.
Receiver 1, 2 and 3 outputs are in a high impedance state
when in Shutdown mode to allow data line sharing.
Receivers 4 and 5 are kept alive in Shutdown.
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W
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SWITCHI G TI E WAVEFOR S
VCC
DR
INPUT
1.4V
1.4V
0V
V+
DR
OUTPUT
0V
0V
t LHD
V–
t HLD
LTC1350 • F01
Figure 1. Driver Propagation Delay Timing
VCC
1.7V
RX
INPUT
RX
OUTPUT
1.3V
0V
2.4V
0.8V
t LHR
t HLR
VCC
0V
LTC1350 • F02
Figure 2. Receiver Propagation Delay Timing
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LTC1350
TEST CIRCUITS
Driver Timing Test Load
DRIVER
INPUT
Receiver Timing Test Load
DRIVER
OUTPUT
RX
OUTPUT
RX INPUT
DRIVER
51pF
RX
51pF
3k
LTC1350 • TA04
LTC1350 • TA03
ESD Test Circuit
V+
C1
0.1µF
VCC
C2
0.1µF
DR1 OUT
RX1 IN
RS232
LINE PINS
PROTECTED
TO ±10kV
DR2 OUT
RX2 IN
RX3 IN
RX4 IN
DR3 OUT
RX5 IN
ON/OFF
NC
1
2
28
LTC1350
V–
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
C3
0.1µF
C4
0.1µF
DR1 IN
RX1 OUT
DR2 IN
RX2 OUT
RX3 OUT
RX4 OUT
DR3 IN
RX5 OUT
GND
NC
NC
LTC1350 • TC01
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LTC1350
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PACKAGE DESCRIPTIO
G Package
28-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1640)
9.90 – 10.50*
(.390 – .413)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
1.25 ±0.12
7.8 – 8.2
5.3 – 5.7
0.42 ±0.03
7.40 – 8.20
(.291 – .323)
0.65 BSC
1 2 3 4 5 6 7 8 9 10 11 12 13 14
RECOMMENDED SOLDER PAD LAYOUT
5.00 – 5.60**
(.197 – .221)
2.0
(.079)
0° – 8°
0.09 – 0.25
(.0035 – .010)
0.65
(.0256)
BSC
0.55 – 0.95
(.022 – .037)
0.05
(.002)
0.22 – 0.38
(.009 – .015)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
MILLIMETERS
2. DIMENSIONS ARE IN
(INCHES)
G28 SSOP 0802
3. DRAWING NOT TO SCALE
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
**DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
NW Package
28-Lead PDIP (Wide .600 Inch)
(Reference LTC DWG # 05-08-1520)
1.467*
(36.957)
MAX
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
.505 – .560*
(12.827 – 14.224)
.600 – .625
(15.240 – 15.875)
.008 – .015
(0.203 – 0.381)
+.035
.625 –.015
(
+0.889
15.87
–0.381
NOTE:
1. DIMENSIONS ARE
)
.045 – .065
(1.143 – 1.651)
.150 ± .005
(3.810 ± 0.127)
.015
(0.381)
MIN
.070
(1.778)
TYP
.120
(3.175)
MIN
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.035 – .080
(0.889 – 2.032)
.100
(2.54)
BSC
.018 ± .003
(0.457 ± 0.076)
NW28 1002
1350fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
7
LTC1350
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PACKAGE DESCRIPTIO
SW Package
28-Lead Plastic Small Outline (Wide .300 Inch)
(Reference LTC DWG # 05-08-1620)
.050 BSC .045 ±.005
.030 ±.005
TYP
.697 – .712
(17.70 – 18.08)
NOTE 4
N
28
27
26
25
24
23
22
21
20
19
18
17
16
15
N
.325 ±.005
.420
MIN
.394 – .419
(10.007 – 10.643)
NOTE 3
1
2
3
N/2
N/2
RECOMMENDED SOLDER PAD LAYOUT
.005
(0.127)
RAD MIN
.009 – .013
(0.229 – 0.330)
.291 – .299
(7.391 – 7.595)
NOTE 4
.010 – .029 × 45°
(0.254 – 0.737)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
.037 – .045
(0.940 – 1.143)
.093 – .104
(2.362 – 2.642)
0° – 8° TYP
.050
(1.270)
BSC
NOTE 3
.016 – .050
(0.406 – 1.270)
NOTE:
1. DIMENSIONS IN
.004 – .012
(0.102 – 0.305)
.014 – .019
(0.356 – 0.482)
TYP
INCHES
(MILLIMETERS)
2. DRAWING NOT TO SCALE
3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
S28 (WIDE) 0502
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®
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Linear Technology Corporation
LW/TP 0103 1K REV A • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7487
(408) 432-1900 ● FAX: (408) 434-0507
●
WWW.linear.com
 LINEAR TECHNOLOGY CORPORATION 1993