MCC GBJ1504-BP

MCC
TM
Micro Commercial Components
GBJ15005
THRU
GBJ1510
omponents
20736 Marilla Street Chatsworth
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Features
15 Amp
Glass Passivated
Bridge Rectifier
50 to 1000 Volts
Lead Free Finish/RoHS Compliant (NOTE 1)("P" Suffix
designates RoHS Compliant. See ordering information)
Ideal for printed circuit board
Low forward voltage drop, high current capability.
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
GBJ
Maximum Ratings
•
•
•
•
•
•
Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
Typical Thermal Resistance 0.8°C/W J to C (With heatsink)
Typical Thermal Resistance 3.5°C/W J to L (Without heatsink)
Typical Thermal Resistance 12°C/W J to A (Without heatsink)
UL Recognized File # E165989
MCC
Device
Maximum
Maximum Maximum
Catalog
Marking
Reccurrent
RMS
DC
Number
Peak Reverse
Voltage
Blocking
Voltage
Voltage
GBJ15005 GBJ15005
50V
35V
50V
GBJ1501
GBJ1501
100V
70V
100V
GBJ1502
GBJ1502
200V
140V
200V
GBJ1504
GBJ1504
400V
280V
400V
GBJ1506
GBJ1506
600V
420V
600V
GBJ1508
GBJ1508
800V
560V
800V
GBJ1510
GBJ1510
1000V
700V
1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
2
I t Rating for fusing
Typical Junction
Capacitance
Notes:
IF(AV)
15 A
Tc = 100°C
IFSM
240A
8.3ms, half sine
VF
1.05V
I FM = 7.5A
TJ = 25°C
IR
2
10 µA
500uA
TJ = 25°C
TJ = 125°C
I
A
H
D
E
+
F
P
G
B
C
L
M
K
N
O
J
O
DIMENSIONS
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
INCHES
MIN
1.170
.780
.670
.019
.430
.090
.120
.130
.170
.100
.020
.080
.040
.390
.290
.150
MAX
1.190
.800
.710
.019
.440
.110
.130
.150
.190
.110
.030
.090
.040
.400
.300
.170
MM
MIN
29.70
19.70
17.00
4.70
10.80
2.30
3.10
3.40
4.40
2.50
0.60
2.00
0.90
9.80
7.30
3.80
MAX
30.30
20.30
18.00
4.90
11.20
2.70
3.40
3.80
4.80
2.90
0.80
2.40
1.10
10.20
7.70
4.20
NOTE
240A2S (t<8.3ms)
It
CJ
60 pF
Measured at
1.0MHz, VR=4.0V
1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7
~
~
Case Type
3. Device mounted on 300mm * 300mm *1.6mm Cu Plate Heatsink
Revision: 6
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2008/01/30
MCC
RATING AND CHARACTERISTIC CURVES
GBJ15005 thru GBJ1510
WITH HEATSINK
12
9
SINGLE PHASE HALF WAVE 60Hz
RESISTIVE OR INDUCTIVE LOAD
6
WITHOUT HEATSINK
3
0
20
40
60
80
120
100
FIG.2 - MAXIMUM NON-REPETITIVE SURGE CURRENT
PEAK FORWARD SURGE CURRENT,
AMPERES
AVERAGE FORWARD CURRENT
AMPERES
FIG.1 - FORWARD CURRENT DERATING CURVE
15
300
250
200
150
100
Single Half-Sine-Wave
(JEDEC METHOD)
50
0
140
1
2
5
CASE TEMPERATURE , C
20
10
50
100
NUMBER OF CYCLES AT 60Hz
FIG.4 - TYPICAL FORWARD CHARACTERISTICS
FIG.3 - TYPICAL JUNCTION CAPACITANCE
100
100
INSTANTANEOUS FORWARD CURRENT ,(A)
CAPACITANCE , (pF)
TM
Micro Commercial Components
10
10
TJ = 25 C
1.0
0.1
PULSE WIDTH 300us
TJ = 25 C, f = 1MHz
1.0
0.01
1.0
4.0
100
10.0
0
REVERSE VOLTAGE , VOLTS
0.2
0.6
0.4
0.8
1.0
1.2
1.4
1.6
1.8
INSTANTANEOUS FORWARD VOLTAGE , VOLTS
FIG.5 - TYPICAL REVERSE CHARACTERISTICS
INSTANTANEOUS REVERSE CURRENT ,(uA)
1000
TJ = 125 C
100
TJ = 100 C
10
TJ = 50 C
1.0
TJ = 25 C
0.1
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE, (%)
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Revision: 6
2 of 3
2008/01/30
MCC
TM
Micro Commercial Components
Ordering Information
Device
Packing
(Part Number)-BP
Bulk;15pcs/Tube
***IMPORTANT NOTICE***
Micro Commercial Components Corp . reserves the right to make changes without further notice to any
product herein to make corrections, modifications , enhancements , improvements , or other changes .
Micro Commercial Components Corp . does not assume any liability arising out of the application or
use of any product described herein; neither does it convey any license under its patent rights ,nor
the rights of others . The user of products in such applications shall assume all risks of such use
and will agree to hold Micro Commercial Components Corp . and all the companies whose
products are represented on our website, harmless against all damages.
***APPLICATIONS DISCLAIMER***
Products offer by Micro Commercial Components Corp . are not intended for use in Medical,
Aerospace or Military Applications.
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Revision: 6
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2008/01/30