TI SN74HC244NSR

SN54HC244, SN74HC244
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003
D
Wide Operating Voltage Range of 2 V to 6 V
High-Current Outputs Drive Up To
15 LSTTL Loads
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
D
D
D
D
Low Power Consumption, 80-µA Max ICC
Typical tpd = 11 ns
±6-mA Output Drive at 5 V
Low Input Current of 1 µA Max
SN54HC244 . . . J OR W PACKAGE
SN74HC244 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
20
2
19
3
18
4
17
5
6
16
15
7
14
8
13
9
12
10
11
2Y4
1A1
1OE
VCC
1
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
1A2
2Y3
1A3
2Y2
1A4
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
SN54HC244 . . . FK PACKAGE
(TOP VIEW)
2OE
D
D
description/ordering information
These octal buffers and line drivers are designed specifically to improve both the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HC244
devices are organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low,
the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
ORDERING INFORMATION
PACKAGE†
TA
PDIP – N
SN74HC244N
Tube of 25
SN74HC244DW
Reel of 2000
SN74HC244DWR
SOP – NS
Reel of 2000
SN74HC244NSR
HC244
SSOP – DB
Reel of 2000
SN74HC244DBR
HC244
Tube of 70
SN74HC244PW
Reel of 2000
SN74HC244PWR
Reel of 250
SN74HC244PWT
CDIP – J
Tube of 20
SNJ54HC244J
SNJ54HC244J
CFP – W
Tube of 85
SNJ54HC244W
SNJ54HC244W
LCCC – FK
Tube of 55
SNJ54HC244FK
TSSOP – PW
–55°C
125°C
–55 C to 125
C
TOP-SIDE
MARKING
Tube of 20
SOIC – DW
–40 C to 85
–40°C
85°C
C
ORDERABLE
PART NUMBER
SN74HC244N
HC244
HC244
SNJ54HC244FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54HC244, SN74HC244
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003
FUNCTION TABLE
(each buffer/driver)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54HC244, SN74HC244
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HC244
VCC
VIH
Supply voltage
VCC = 2 V
VCC = 4.5 V
High-level input voltage
VCC = 6 V
VCC = 2 V
VIL
VI
VO
∆t/∆v
t/ v
Low-level input voltage
NOM
MAX
2
5
6
MAX
2
5
6
3.15
3.15
4.2
4.2
0
UNIT
V
V
0.5
0.5
1.35
1.35
1.8
1.8
VCC
VCC
VCC = 2 V
VCC = 4.5 V
Input transition rise/fall time
NOM
1.5
0
Output voltage
MIN
1.5
VCC = 4.5 V
VCC = 6 V
Input voltage
SN74HC244
MIN
0
VCC
VCC
0
1000
1000
500
500
V
V
V
ns
VCC = 6 V
400
400
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VOH
VOL
TEST CONDITIONS
VI = VCC or 0,
SN54HC244
MIN
MAX
SN74HC244
MIN
MAX
UNIT
2V
1.9
1.998
1.9
1.9
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
IOH = –6 mA
IOH = –7.8 mA
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
5.34
2V
0.002
0.1
0.1
0.1
IOL = 20 µA
A
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
6V
±0.01
±0.5
±10
±5
µA
8
160
80
µA
10
10
10
pF
IOL = 6 mA
IOL = 7.8 mA
ICC
Ci
TA = 25°C
TYP
MAX
4.5 V
VI = VIH or VIL
VI = VCC or 0
VO = VCC or 0,
MIN
IOH = –20 µA
A
VI = VIH or VIL
II
IOZ
VCC
VI = VIH or VIL
IO = 0
6V
2 V to 6 V
POST OFFICE BOX 655303
3
• DALLAS, TEXAS 75265
V
V
3
SN54HC244, SN74HC244
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
TA = 25°C
TYP
MAX
SN54HC244
SN74HC244
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
2V
40
115
170
145
tpd
A
Y
4.5 V
13
23
34
29
6V
11
20
29
25
ten
OE
tdis
OE
tt
Y
Y
Y
MIN
MIN
MAX
MIN
MAX
2V
75
150
225
190
4.5 V
15
30
45
38
6V
13
26
38
32
2V
75
150
225
190
4.5 V
15
30
45
38
6V
13
26
38
32
2V
28
60
90
75
4.5 V
8
12
18
15
6V
6
10
15
13
UNIT
ns
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
TYP
MAX
SN54HC244
SN74HC244
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
2V
56
165
245
210
tpd
A
Y
4.5 V
18
33
49
42
ten
tt
OE
Y
Y
MIN
MAX
MIN
MAX
6V
15
28
42
35
2V
100
200
300
250
4.5 V
20
40
60
50
6V
17
34
51
43
2V
45
210
315
265
4.5 V
17
42
63
53
6V
13
36
53
45
UNIT
ns
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance per buffer/driver
POST OFFICE BOX 655303
No load
• DALLAS, TEXAS 75265
TYP
35
UNIT
pF
SN54HC244, SN74HC244
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
VCC
PARAMETER
Test
Point
From Output
Under Test
tPZH
S1
ten
RL
CL
(see Note A)
1 kΩ
tPZL
tPHZ
tdis
S2
RL
tPLZ
tpd or tt
1 kΩ
––
LOAD CIRCUIT
CL
S1
S2
50 pF
or
150 pF
Open
Closed
Closed
Open
Open
Closed
Closed
Open
Open
Open
50 pF
50 pF
or
150 pF
VCC
Input
50%
50%
0V
tPLH
In-Phase
Output
50%
10%
tPHL
90%
VOH
50%
10% V
OL
tf
90%
tr
tPHL
Out-of-Phase
Output
90%
tPLH
50%
10%
50%
10%
90%
VOH
VOL
tf
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
Output
Control
(Low-Level
Enabling)
VCC
50%
50%
0V
tPZL
Output
Waveform 1
(See Note B)
tPLZ
10%
tPZH
Input
50%
10%
90%
VCC
90%
50%
10% 0 V
tr
Output
Waveform 2
(See Note B)
≈VCC
≈VCC
50%
VOL
tPHZ
50%
90%
VOH
≈0 V
tf
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
5962-8409601VRA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
5962-8409601VSA
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
84096012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
8409601RA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
8409601SA
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/65705B2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/65705BRA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/65705BSA
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
1
SN54HC244J
ACTIVE
CDIP
J
20
TBD
Call TI
Level-NC-NC-NC
SN74HC244ADBLE
OBSOLETE
SSOP
DB
20
TBD
Call TI
Call TI
SN74HC244APWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
Call TI
SN74HC244DBLE
OBSOLETE
SSOP
DB
20
Call TI
Call TI
SN74HC244DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244N
ACTIVE
PDIP
N
20
CU NIPDAU
Level-NC-NC-NC
TBD
20
Pb-Free
(RoHS)
SN74HC244N3
OBSOLETE
PDIP
N
20
TBD
Call TI
SN74HC244NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74HC244NSG4
ACTIVE
SO
NS
20
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244PWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
SN74HC244PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
Addendum-Page 1
CU NIPDAU
Call TI
Call TI
Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74HC244PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244PWT
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC244PWTE4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54HC244FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54HC244J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54HC244W
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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