MICROCHIP DSPIC30F2011

dsPIC30F2011/2012/3012/3013
Data Sheet
High-Performance, 16-Bit
Digital Signal Controllers
© 2006 Microchip Technology Inc.
DS70139E
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
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hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PIC, PICSTART,
PRO MATE, PowerSmart, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs,
microperipherals, nonvolatile memory and analog products. In addition,
Microchip’s quality system for the design and manufacture of
development systems is ISO 9001:2000 certified.
DS70139E-page ii
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
dsPIC30F2011/2012/3012/3013 High-Performance
Digital Signal Controllers
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
High-Performance Modified RISC CPU:
•
•
•
•
•
•
•
•
•
•
Modified Harvard architecture
C compiler optimized instruction set architecture
Flexible addressing modes
83 base instructions
24-bit wide instructions, 16-bit wide data path
Up to 24 Kbytes on-chip Flash program space
Up to 2 Kbytes of on-chip data RAM
Up to 1 Kbytes of nonvolatile data EEPROM
16 x 16-bit working register array
Up to 30 MIPS operation:
- DC to 40 MHz external clock input
- 4 MHz - 10 MHz oscillator input with
PLL active (4x, 8x, 16x)
• Up to 21 interrupt sources:
- 8 user-selectable priority levels
- 3 external interrupt sources
- 4 processor trap sources
DSP Features:
• Dual data fetch
• Modulo and Bit-Reversed modes
• Two 40-bit wide accumulators with optional
saturation logic
• 17-bit x 17-bit single-cycle hardware fractional/
integer multiplier
• All DSP instructions are single cycle
- Multiply-Accumulate (MAC) operation
• single-cycle ±16 shift
Peripheral Features:
• High-current sink/source I/O pins: 25 mA/25 mA
• Three 16-bit timers/counters; optionally pair up
16-bit timers into 32-bit timer modules
• 16-bit Capture input functions
© 2006 Microchip Technology Inc.
•
•
•
16-bit Compare/PWM output functions
3-wire SPI modules (supports four Frame modes)
I2C™ module supports Multi-Master/Slave mode
and 7-bit/10-bit addressing
• Up to two addressable UART modules with FIFO
buffers
Analog Features:
• 12-bit Analog-to-Digital Converter (ADC) with:
- 200 ksps conversion rate
- Up to 10 input channels
- Conversion available during Sleep and Idle
• Programmable Low-Voltage Detection (PLVD)
• Programmable Brown-out Reset
Special Microcontroller Features:
• Enhanced Flash program memory:
- 10,000 erase/write cycle (min.) for
industrial temperature range, 100K (typical)
• Data EEPROM memory:
- 100,000 erase/write cycle (min.) for
industrial temperature range, 1M (typical)
• Self-reprogrammable under software control
• Power-on Reset (POR), Power-up Timer (PWRT)
and Oscillator Start-up Timer (OST)
• Flexible Watchdog Timer (WDT) with on-chip lowpower RC oscillator for reliable operation
• Fail-Safe Clock Monitor operation:
- Detects clock failure and switches to on-chip
low-power RC oscillator
• Programmable code protection
• In-Circuit Serial Programming™ (ICSP™)
• Selectable Power Management modes:
- Sleep, Idle and Alternate Clock modes
CMOS Technology:
•
•
•
•
Low-power, high-speed Flash technology
Wide operating voltage range (2.5V to 5.5V)
Industrial and Extended temperature ranges
Low-power consumption
DS70139E-page 1
dsPIC30F2011/2012/3012/3013
dsPIC30F2011/2012/3012/3013 Sensor Family
Input
Cap
Output
Comp/Std
PWM
A/D 12-bit
200 Ksps
I 2 C™
Timer
16-bit
SPI
EEPROM
Bytes
UART
Program Memory
dsPIC30F2011
18
12K
4K
1024
–
3
2
2
8 ch
1
1
1
dsPIC30F3012
18
24K
8K
2048
1024
3
2
2
8 ch
1
1
1
Device
Bytes
Instructions
SRAM
Bytes
Pins
dsPIC30F2012
28
12K
4K
1024
–
3
2
2
10 ch
1
1
1
dsPIC30F3013
28
24K
8K
2048
1024
3
2
2
10 ch
2
1
1
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
AVDD
AVSS
AN6/SCK1/INT0/OCFA/RB6
EMUD2/AN7/OC2/IC2/INT2/RB7
VDD
VSS
PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5
PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4
EMUC2/OC1/IC1/INT1/RD0
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AVDD
AVSS
AN6/OCFA/RB6
EMUD2/AN7/RB7
AN8/OC1/RB8
AN9/OC2/RB9
CN17/RF4
CN18/RF5
VDD
VSS
PGC/EMUC/U1RX/SDI1/SDA/RF2
PGD/EMUD/U1TX/SDO1/SCL/RF3
SCK1/INT0/RF6
EMUC2/IC1/INT1/RD8
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AVDD
AVSS
AN6/OCFA/RB6
EMUD2/AN7/RB7
AN8/OC1/RB8
AN9/OC2/RB9
U2RX/CN17/RF4
U2TX/CN18/RF5
VDD
VSS
PGC/EMUC/U1RX/SDI1/SDA/RF2
PGD/EMUD/U1TX/SDO1/SCL/RF3
SCK1/INT0/RF6
EMUC2/IC1/INT1/RD8
Pin Diagrams
MCLR
EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
OSC1/CLKI
OSC2/CLKO/RC15
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
dsPIC30F3012
dsPIC30F2011
18-Pin PDIP and SOIC
MCLR
EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
AN4/CN6/RB4
AN5/CN7/RB5
VSS
OSC1/CLKI
OSC2/CLKO/RC15
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
VDD
IC2/INT2/RD9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
dsPIC30F2012
28-Pin PDIP and SOIC
MCLR
EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
AN4/CN6/RB4
AN5/CN7/RB5
VSS
OSC1/CLKI
OSC2/CLKO/RC15
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
VDD
IC2/INT2/RD9
Note:
1
2
3
4
5
6
7
8
9
10
11
12
13
14
dsPIC30F3013
28-Pin SPDIP and SOIC
For descriptions of individual pins, see Section 1.0 “Device Overview”.
DS70139E-page 2
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
Pin Diagrams
28
27
26
25
24
23
22
EMUC3/AN1/VREF-/CN3/RB1
EMUD3/AN0/VREF+/CN2/RB0
MCLR
AVDD
AVSS
AN6/SCK1/INT0/OCFA/RB6
EMUD2/AN7/OC2/IC2/INT2/RB7
28-Pin QFN
dsPIC30F2011
8
9
10
11
12
13
14
1
2
3
4
5
6
7
21
20
19
18
17
16
15
NC
NC
NC
NC
VDD
VSS
PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5
EMUD1/SOSC1/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
VDD
NC
EMUC2/OC1/IC1/INT1/RD0
NC
PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
NC
NC
VSS
OSC1/CLKI
OSC2/CLKO/RC15
Note:
For descriptions of individual pins, see Section 1.0 “Device Overview”.
© 2006 Microchip Technology Inc.
DS70139E-page 3
dsPIC30F2011/2012/3012/3013
Pin Diagrams
28
27
26
25
24
23
22
EMUC3/AN1/VREF-/CN3/RB1
EMUD3/AN0/VREF+/CN2/RB0
MCLR
AVDD
AVSS
AN6/OCFA/RB6
EMUD2/AN7/RB7
28-Pin QFN
dsPIC30F2012
8
9
10
11
12
13
14
1
2
3
4
5
6
7
21
20
19
18
17
16
15
AN8/OC1/RB8
AN9/OC2/RB9
CN17/RF4
CN18/RF5
VDD
VSS
PGC/EMUC/U1RX/SDI1/SDA/RF2
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
VDD
IC2/INT2/RD9
EMUC2/IC1/INT1/RD8
SCK1/INT0/RF6
PGD/EMUD/U1TX/SDO1/SCL/RF3
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
AN4/CN6/RB4
AN5/CN7/RB5
VSS
OSC1/CLKI
OSC2/CLKO/RC15
Note:
For descriptions of individual pins, see Section 1.0 “Device Overview”.
DS70139E-page 4
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
Pin Diagram
PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4
NC
EMUC2/OC1/IC1/INT1/RD0
NC
NC
NC
NC
NC
VDD
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
44-Pin QFN
44 43 42 41 40 39 38 37 36 35 34
PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5
VSS
NC
VDD
NC
NC
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
dsPIC30F3012
33
32
31
30
29
28
27
26
25
24
23
OSC2/CLKO/RC15
OSC1/CLKI
VSS
VSS
NC
NC
NC
NC
AN3/CN5/RB3
NC
AN2/SS1/LVDIN/CN4/RB2
EMUD2/AN7/OC2/IC2/INT2/RB7
NC
AN6/SCK1/INT0/OCFA/RB6
NC
AVSS
AVDD
MCLR
EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1
NC
NC
12 13 14 15 16 17 18 19 20 21 22
Note:
For descriptions of individual pins, see Section 1.0 “Device Overview”.
© 2006 Microchip Technology Inc.
DS70139E-page 5
dsPIC30F2011/2012/3012/3013
Pin Diagrams
44
43
42
41
40
39
38
37
36
35
34
PGD/EMUD/U1TX/SDO1/SCL/RF3
SCK1/INT0/RF6
EMUC2/IC1/INT1/RD8
NC
NC
NC
NC
IC2/INT2/RD9
VDD
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
44-Pin QFN
1
2
3
4
5
6
7
8
9
10
11
dsPIC30F3013
33
32
31
30
29
28
27
26
25
24
23
OSC2/CLKO/RC15
OSC1/CLKI
VSS
VSS
NC
NC
AN5/CN7/RB5
AN4/CN6/RB4
AN3/CN5/RB3
NC
AN2/SS1/LVDIN/CN4/RB2
EMUD2/AN7/RB7
NC
AN6/OCFA/RB6
NC
AVSS
AVDD
MCLR
EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1
NC
NC
12
13
14
15
16
17
18
19
20
21
22
PGC/EMUC/U1RX/SDI1/SDA/RF2
VSS
NC
VDD
NC
NC
U2TX/CN18/RF5
NC
U2RX/CN17/RF4
AN9/OC2/RB9
AN8/OC1/RB8
Note:
For descriptions of individual pins, see Section 1.0 “Device Overview”.
DS70139E-page 6
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 CPU Architecture Overview........................................................................................................................................................ 17
3.0 Memory Organization ................................................................................................................................................................. 27
4.0 Address Generator Units............................................................................................................................................................ 41
5.0 Flash Program Memory.............................................................................................................................................................. 47
6.0 Data EEPROM Memory ............................................................................................................................................................. 53
7.0 I/O Ports ..................................................................................................................................................................................... 57
8.0 Interrupts .................................................................................................................................................................................... 63
9.0 Timer1 Module ........................................................................................................................................................................... 71
10.0 Timer2/3 Module ........................................................................................................................................................................ 75
11.0 Input Capture Module................................................................................................................................................................. 81
12.0 Output Compare Module ............................................................................................................................................................ 85
13.0 SPI Module................................................................................................................................................................................. 89
14.0 I2C Module ................................................................................................................................................................................. 93
15.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 101
16.0 12-bit Analog-to-Digital Converter (ADC) Module .................................................................................................................... 109
17.0 System Integration ................................................................................................................................................................... 119
18.0 Instruction Set Summary .......................................................................................................................................................... 133
19.0 Development Support............................................................................................................................................................... 141
20.0 Electrical Characteristics .......................................................................................................................................................... 145
21.0 Packaging Information.............................................................................................................................................................. 183
Index .................................................................................................................................................................................................. 193
The Microchip Web Site ..................................................................................................................................................................... 199
Customer Change Notification Service .............................................................................................................................................. 199
Customer Support .............................................................................................................................................................................. 199
Reader Response .............................................................................................................................................................................. 200
Product Identification System ............................................................................................................................................................ 201
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
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welcome your feedback.
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To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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© 2006 Microchip Technology Inc.
DS70139E-page 7
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 8
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
1.0
DEVICE OVERVIEW
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual“ (DS70157).
This data sheet contains information specific to the
dsPIC30F2011, dsPIC30F2012, dsPIC30F3012 and
dsPIC30F3013 Digital Signal Controllers (DSC). These
devices contain extensive Digital Signal Processor
(DSP) functionality within a high-performance 16-bit
microcontroller (MCU) architecture.
The following block diagrams depict the architecture for
these devices:
•
•
•
•
Figure 1-1 illustrates the dsPIC30F2011
Figure 1-2 illustrates the dsPIC30F2012
Figure 1-3 illustrates the dsPIC30F3012
Figure 1-4 illustrates the dsPIC30F3013
Following the block diagrams, Table 1-1 relates the I/O
functions to pinout information.
© 2006 Microchip Technology Inc.
DS70139E-page 9
dsPIC30F2011/2012/3012/3013
FIGURE 1-1:
dsPIC30F2011 BLOCK DIAGRAM
Y Data Bus
X Data Bus
16
Interrupt
Controller
PSV & Table
Data Access
24 Control Block 8
Data Latch
Y Data
RAM
(512 bytes)
Address
Latch
16
24
Address Latch
16
16
EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4
PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5
AN6/SCK1/INT0/OCFA/RB6
EMUD2/AN7/OC2/IC2/INT2/RB7
X RAGU
X WAGU
Y AGU
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
Data Latch
X Data
RAM
(512 bytes)
Address
Latch
16
16
24
Program Memory
(12 Kbytes)
16
16
16
Data Latch
Effective Address
PORTB
16
ROM Latch
16
24
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
OSC2/CLKO/RC15
IR
16
16
16 x 16
W Reg Array
Decode
PORTC
Instruction
Decode &
Control
16 16
Power-up
Timer
OSC1/CLKI
Timing
Generation
DSP
Engine
VDD, VSS
AVDD, AVSS
Watchdog
Timer
Low-Voltage
Detect
12-bit ADC
DS70139E-page 10
EMUC2/OC1/IC1/INT1/RD0
Oscillator
Start-up Timer
ALU<16>
POR/BOR
Reset
MCLR
Divide
Unit
16
16
PORTD
Input
Capture
Module
Output
Compare
Module
I2C™
Timers
SPI1
UART1
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 1-2:
dsPIC30F2012 BLOCK DIAGRAM
Y Data Bus
X Data Bus
16
Interrupt
Controller
PSV & Table
Data Access
24 Control Block 8
16
16
Data Latch
Y Data
RAM
(512 bytes)
Address
Latch
16
24
Address Latch
16
16
EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
AN4/CN6/RB4
AN5/CN7/RB5
AN6/OCFA/RB6
EMUD2/AN7/RB7
AN8/OC1/RB8
AN9/OC2/RB9
X RAGU
X WAGU
Y AGU
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
Data Latch
X Data
RAM
(512 bytes)
Address
Latch
16
16
24
Program Memory
(12 Kbytes)
16
Data Latch
Effective Address
16
PORTB
ROM Latch
16
24
IR
16 x 16
W Reg Array
Decode
Instruction
Decode &
Control
Timing
Generation
DSP
Engine
VDD, VSS
AVDD, AVSS
Divide
Unit
EMUC2/IC1/INT1/RD8
IC2/INT2/RD9
Oscillator
Start-up Timer
ALU<16>
POR/BOR
Reset
MCLR
PORTC
16 16
Power-up
Timer
OSC1/CLKI
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
OSC2/CLKO/RC15
16
16
Watchdog
Timer
Low-Voltage
Detect
12-bit ADC
PORTD
16
16
Input
Capture
Module
Output
Compare
Module
I2C™
Timers
SPI1
UART1
PGC/EMUC/U1RX/SDI1/SDA/RF2
PGD/EMUD/U1TX/SDO1/SCL/RF3
CN17/RF4
CN18/RF5
SCK1/INT0/RF6
PORTF
© 2006 Microchip Technology Inc.
DS70139E-page 11
dsPIC30F2011/2012/3012/3013
FIGURE 1-3:
dsPIC30F3012 BLOCK DIAGRAM
Y Data Bus
X Data Bus
16
16
Interrupt
Controller
PSV & Table
Data Access
24 Control Block 8
Data Latch
Y Data
RAM
(1 Kbytes)
Address
Latch
16
24
Address Latch
Data EEPROM
(1 Kbytes)
16
16
EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4
PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5
AN6/SCK1/INT0/OCFA/RB6
EMUD2/AN7/OC2/IC2/INT2/RB7
X RAGU
X WAGU
Y AGU
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
Data Latch
X Data
RAM
(1 Kbytes)
Address
Latch
16
16
24
Program Memory
(24 Kbytes)
16
16
Effective Address
PORTB
16
Data Latch
ROM Latch
16
24
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
OSC2/CLKO/RC15
IR
16
16
16 x 16
W Reg Array
Decode
PORTC
Instruction
Decode &
Control
16 16
Power-up
Timer
OSC1/CLKI
Timing
Generation
DSP
Engine
VDD, VSS
AVDD, AVSS
Watchdog
Timer
Low-Voltage
Detect
12-bit ADC
DS70139E-page 12
EMUC2/OC1/IC1/INT1/RD0
Oscillator
Start-up Timer
ALU<16>
POR/BOR
Reset
MCLR
Divide
Unit
16
16
PORTD
Input
Capture
Module
Output
Compare
Module
I2C™
Timers
SPI1
UART1
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 1-4:
dsPIC30F3013 BLOCK DIAGRAM
Y Data Bus
X Data Bus
PSV & Table
Data Access
24 Control Block 8
16
16
16
Interrupt
Controller
16
24
16
24
Address Latch
Data Latch
X Data
RAM
(1 Kbytes)
Address
Latch
16
16
16
EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
AN4/CN6/RB4
AN5/CN7/RB5
AN6/OCFA/RB6
EMUD2/AN7/RB7
AN8/OC1/RB8
AN9/OC2/RB9
X RAGU
X WAGU
Y AGU
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
Program Memory
(24 Kbytes)
16
Data Latch
Y Data
RAM
(1 Kbytes)
Address
Latch
Data EEPROM
(1 Kbytes)
Data Latch
Effective Address
16
PORTB
ROM Latch
16
24
IR
16
16 x 16
W Reg Array
Decode
Instruction
Decode &
Control
Timing
Generation
DSP
Engine
VDD, VSS
AVDD, AVSS
Divide
Unit
EMUC2/IC1/INT1/RD8
IC2/INT2/RD9
Oscillator
Start-up Timer
ALU<16>
POR/BOR
Reset
MCLR
PORTC
16 16
Power-up
Timer
OSC1/CLKI
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
OSC2/CLKO/RC15
16
Watchdog
Timer
Low-Voltage
Detect
12-bit ADC
PORTD
16
16
Input
Capture
Module
Output
Compare
Module
I2C™
Timers
SPI1
UART1,
UART2
PGC/EMUC/U1RX/SDI1/SDA/RF2
PGD/EMUD/U1TX/SDO1/SCL/RF3
U2RX/CN17/RF4
U2TX/CN18/RF5
SCK1/INT0/RF6
PORTF
© 2006 Microchip Technology Inc.
DS70139E-page 13
dsPIC30F2011/2012/3012/3013
Table 1-1 provides a brief description of device I/O
pinouts and the functions that may be multiplexed to a
port pin. Multiple functions may exist on one port pin.
When multiplexing occurs, the peripheral module’s
functional requirements may force an override of the
data direction of the port pin.
TABLE 1-1:
PINOUT I/O DESCRIPTIONS
Pin
Type
Buffer
Type
AN0 - AN9
I
Analog
AVDD
P
P
AVSS
P
P
CLKI
I
ST/CMOS
CLKO
O
—
CN0 - CN7
I
ST
Input change notification inputs.
Can be software programmed for internal weak pull-ups on all
inputs.
EMUD
EMUC
EMUD1
EMUC1
EMUD2
EMUC2
EMUD3
EMUC3
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
ST
ST
ST
ST
ST
ST
ST
ST
ICD Primary Communication Channel data input/output pin.
ICD Primary Communication Channel clock input/output pin.
ICD Secondary Communication Channel data input/output pin.
ICD Secondary Communication Channel clock input/output pin.
ICD Tertiary Communication Channel data input/output pin.
ICD Tertiary Communication Channel clock input/output pin.
ICD Quaternary Communication Channel data input/output pin.
ICD Quaternary Communication Channel clock input/output pin.
IC1 - IC2
I
ST
Capture inputs 1 through 2.
INT0
INT1
INT2
I
I
I
ST
ST
ST
External interrupt 0.
External interrupt 1.
External interrupt 2.
LVDIN
I
Analog
MCLR
I/P
ST
Master Clear (Reset) input or programming voltage input. This
pin is an active-low Reset to the device.
OC1-OC2
OCFA
O
I
—
ST
Compare outputs 1 through 2.
Compare Fault A input.
OSC1
I
ST/CMOS
OSC2
I/O
—
Oscillator crystal input. ST buffer when configured in RC mode;
CMOS otherwise.
Oscillator crystal output. Connects to crystal or resonator in
Crystal Oscillator mode. Optionally functions as CLKO in RC
and EC modes.
PGD
PGC
I/O
I
ST
ST
In-Circuit Serial Programming™ data input/output pin.
In-Circuit Serial Programming clock input pin.
RB0 - RB9
I/O
ST
PORTB is a bidirectional I/O port.
RC13 - RC15
I/O
ST
PORTC is a bidirectional I/O port.
RD0, RD8 - RD9
I/O
ST
PORTD is a bidirectional I/O port.
Pin Name
Description
Analog input channels.
Positive supply for analog module.
Ground reference for analog module.
External clock source input. Always associated with OSC1 pin
function.
Oscillator crystal output. Connects to crystal or resonator in
Crystal Oscillator mode. Optionally functions as CLKO in RC
and EC modes. Always associated with OSC2 pin function.
Low-Voltage Detect Reference Voltage Input pin.
RF2 - RF5
I/O
ST
PORTF is a bidirectional I/O port.
SCK1
SDI1
SDO1
SS1
I/O
I
O
I
ST
ST
—
ST
Synchronous serial clock input/output for SPI1.
SPI1 Data In.
SPI1 Data Out.
SPI1 Slave Synchronization.
Legend: CMOS =
ST
=
I
=
DS70139E-page 14
CMOS compatible input or output
Schmitt Trigger input with CMOS levels
Input
Analog =
O
=
P
=
Analog input
Output
Power
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
TABLE 1-1:
PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin
Type
Buffer
Type
SCL
SDA
I/O
I/O
ST
ST
SOSCO
SOSCI
O
I
—
ST/CMOS
T1CK
T2CK
I
I
ST
ST
Timer1 external clock input.
Timer2 external clock input.
U1RX
U1TX
U1ARX
U1ATX
U2RX
U2TX
I
O
I
O
I
O
ST
—
ST
—
ST
—
UART1 Receive.
UART1 Transmit.
UART1 Alternate Receive.
UART1 Alternate Transmit.
UART2 Receive.
UART2 Transmit.
Pin Name
Description
Synchronous serial clock input/output for I2C™.
Synchronous serial data input/output for I2C.
32 kHz low-power oscillator crystal output.
32 kHz low-power oscillator crystal input. ST buffer when
configured in RC mode; CMOS otherwise.
VDD
P
—
Positive supply for logic and I/O pins.
VSS
P
—
Ground reference for logic and I/O pins.
VREF+
I
Analog
Analog Voltage Reference (High) input.
I
Analog
Analog Voltage Reference (Low) input.
VREF-
Legend: CMOS =
ST
=
I
=
CMOS compatible input or output
Schmitt Trigger input with CMOS levels
Input
© 2006 Microchip Technology Inc.
Analog =
O
=
P
=
Analog input
Output
Power
DS70139E-page 15
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 16
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
2.0
CPU ARCHITECTURE
OVERVIEW
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
This section is an overview of the CPU architecture of
the dsPIC30F. The core has a 24-bit instruction word.
The Program Counter (PC) is 23 bits wide with the
Least Significant bit (LSb) always clear (see
Section 3.1 “Program Address Space”). The Most
Significant bit (MSb) is ignored during normal program
execution, except for certain specialized instructions.
Thus, the PC can address up to 4M instruction words
of user program space. An instruction prefetch mechanism helps maintain throughput. Program loop constructs, free from loop count management overhead,
are supported using the DO and REPEAT instructions,
both of which are interruptible at any point.
2.1
Core Overview
The working register array consists of 16 x 16-bit registers, each of which can act as data, address or offset
registers. One working register (W15) operates as a
Software Stack Pointer for interrupts and calls.
The data space is 64 Kbytes (32K words) and is split
into two blocks, referred to as X and Y data memory.
Each block has its own independent Address Generation Unit (AGU). Most instructions operate solely
through the X memory, AGU, which provides the
appearance of a single unified data space. The
Multiply-Accumulate (MAC) class of dual source DSP
instructions operate through both the X and Y AGUs,
splitting the data address space into two parts (see
Section 3.2 “Data Address Space”). The X and Y
data space boundary is device specific and cannot be
altered by the user. Each data word consists of 2 bytes
and most instructions can address data either as words
or bytes.
© 2006 Microchip Technology Inc.
Two ways to access data in program memory are:
• The upper 32 Kbytes of data space memory can
be mapped into the lower half (user space) of
program space at any 16K program word boundary, defined by the 8-bit Program Space Visibility
Page (PSVPAG) register. Thus any instruction
can access program space as if it were data
space, with a limitation that the access requires
an additional cycle. Only the lower 16 bits of each
instruction word can be accessed using this
method.
• Linear indirect access of 32K word pages within
program space is also possible using any working
register, via table read and write instructions.
Table read and write instructions can be used to
access all 24 bits of an instruction word.
Overhead-free circular buffers (Modulo Addressing)
are supported in both X and Y address spaces. This is
primarily intended to remove the loop overhead for
DSP algorithms.
The X AGU also supports Bit-Reversed Addressing on
destination effective addresses to greatly simplify input
or output data reordering for radix-2 FFT algorithms.
Refer to Section 4.0 “Address Generator Units” for
details on Modulo and Bit-Reversed Addressing.
The core supports Inherent (no operand), Relative,
Literal, Memory Direct, Register Direct, Register
Indirect, Register Offset and Literal Offset Addressing
modes. Instructions are associated with pre-defined
addressing modes, depending upon their functional
requirements.
For most instructions, the core is capable of executing
a data (or program data) memory read, a working register (data) read, a data memory write and a program
(instruction) memory read per instruction cycle. As a
result, 3 operand instructions are supported, allowing
C = A+B operations to be executed in a single cycle.
A DSP engine has been included to significantly
enhance the core arithmetic capability and throughput.
It features a high-speed 17-bit by 17-bit multiplier, a
40-bit ALU, two 40-bit saturating accumulators and a
40-bit bidirectional barrel shifter. Data in the accumulator or any working register can be shifted up to 15 bits
right, or 16 bits left in a single cycle. The DSP instructions operate seamlessly with all other instructions and
have been designed for optimal real-time performance.
The MAC class of instructions can concurrently fetch
two data operands from memory while multiplying two
W registers. To enable this concurrent fetching of data
operands, the data space has been split for these
instructions and linear is for all others. This has been
achieved in a transparent and flexible manner, by dedicating certain working registers to each address space
for the MAC class of instructions.
DS70139E-page 17
dsPIC30F2011/2012/3012/3013
The core does not support a multi-stage instruction
pipeline. However, a single-stage instruction prefetch
mechanism is used, which accesses and partially
decodes instructions a cycle ahead of execution, in
order to maximize available execution time. Most
instructions execute in a single cycle with certain
exceptions.
The core features a vectored exception processing
structure for traps and interrupts, with 62 independent
vectors. The exceptions consist of up to 8 traps (of
which 4 are reserved) and 54 interrupts. Each interrupt
is prioritized based on a user-assigned priority between
1 and 7 (1 being the lowest priority and 7 being the
highest), in conjunction with a predetermined ‘natural
order’. Traps have fixed priorities ranging from 8 to 15.
2.2
Programmer’s Model
The programmer’s model is shown in Figure 2-1 and
consists of 16 x 16-bit working registers (W0 through
W15), 2 x 40-bit accumulators (ACCA and ACCB),
STATUS register (SR), Data Table Page register
(TBLPAG), Program Space Visibility Page register
(PSVPAG), DO and REPEAT registers (DOSTART,
DOEND, DCOUNT and RCOUNT) and Program
Counter (PC). The working registers can act as data,
address or offset registers. All registers are memory
mapped. W0 acts as the W register for file register
addressing.
Some of these registers have a shadow register associated with each of them, as shown in Figure 2-1. The
shadow register is used as a temporary holding register
and can transfer its contents to or from its host register
upon the occurrence of an event. None of the shadow
registers are accessible directly. The following rules
apply for transfer of registers into and out of shadows.
• PUSH.S and POP.S
W0, W1, W2, W3, SR (DC, N, OV, Z and C bits
only) are transferred.
• DO instruction
DOSTART, DOEND, DCOUNT shadows are
pushed on loop start and popped on loop end.
2.2.1
SOFTWARE STACK POINTER/
FRAME POINTER
The dsPIC® DSC devices contain a software stack.
W15 is the dedicated Software Stack Pointer (SP),
which is automatically modified by exception processing and subroutine calls and returns. However, W15
can be referenced by any instruction in the same manner as all other W registers. This simplifies the reading,
writing and manipulation of the Stack Pointer (e.g., creating stack frames).
Note:
In order to protect against misaligned
stack accesses, W15<0> is always clear.
W15 is initialized to 0x0800 during a Reset. The user
may reprogram the SP during initialization to any
location within data space.
W14 has been dedicated as a Stack Frame Pointer, as
defined by the LNK and ULNK instructions. However,
W14 can be referenced by any instruction in the same
manner as all other W registers.
2.2.2
STATUS REGISTER
The dsPIC DSC core has a 16-bit STATUS register
(SR), the LSB of which is referred to as the SR Low
byte (SRL) and the MSB as the SR High byte (SRH).
See Figure 2-1 for SR layout.
SRL contains all the MCU ALU operation Status flags
(including the Z bit), as well as the CPU Interrupt Priority Level Status bits, IPL<2:0>, and the Repeat Active
Status bit, RA. During exception processing, SRL is
concatenated with the MSB of the PC to form a complete word value which is then stacked.
The upper byte of the STATUS register contains the
DSP Adder/Subtracter Status bits, the DO Loop Active
bit (DA) and the Digit Carry (DC) Status bit.
2.2.3
PROGRAM COUNTER
The program counter is 23 bits wide; bit 0 is always
clear. Therefore, the PC can address up to 4M
instruction words.
When a byte operation is performed on a working register, only the Least Significant Byte (LSB) of the target
register is affected. However, a benefit of memory
mapped working registers is that both the Least and
Most Significant Bytes (MSB) can be manipulated
through byte-wide data memory space accesses.
DS70139E-page 18
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 2-1:
PROGRAMMER’S MODEL
D15
D0
W0/WREG
PUSH.S Shadow
W1
DO Shadow
W2
W3
Legend
W4
DSP Operand
Registers
W5
W6
W7
Working Registers
W8
W9
DSP Address
Registers
W10
W11
W12/DSP Offset
W13/DSP Write-Back
W14/Frame Pointer
W15/Stack Pointer
SPLIM
AD39
Stack Pointer Limit Register
AD15
AD31
AD0
ACCA
DSP
Accumulators
ACCB
PC22
PC0
Program Counter
0
0
7
TABPAG
TBLPAG
7
Data Table Page Address
0
PSVPAG
Program Space Visibility Page Address
15
0
RCOUNT
REPEAT Loop Counter
15
0
DCOUNT
DO Loop Counter
22
0
DOSTART
DO Loop Start Address
DOEND
DO Loop End Address
22
15
0
Core Configuration Register
CORCON
OA
OB
SA
SB OAB SAB DA
SRH
© 2006 Microchip Technology Inc.
DC IPL2 IPL1 IPL0 RA
N
OV
Z
C
STATUS register
SRL
DS70139E-page 19
dsPIC30F2011/2012/3012/3013
2.3
Divide Support
The dsPIC DSC devices feature a 16/16-bit signed
fractional divide operation, as well as 32/16-bit and 16/
16-bit signed and unsigned integer divide operations, in
the form of single instruction iterative divides. The following instructions and data sizes are supported:
1.
2.
3.
4.
5.
DIVF - 16/16 signed fractional divide
DIV.sd - 32/16 signed divide
DIV.ud - 32/16 unsigned divide
DIV.s - 16/16 signed divide
DIV.u - 16/16 unsigned divide
The divide instructions must be executed within a
REPEAT loop. Any other form of execution (e.g., a
series of discrete divide instructions) will not function
correctly because the instruction flow depends on
RCOUNT. The divide instruction does not automatically
set up the RCOUNT value and it must, therefore, be
explicitly and correctly specified in the REPEAT instruction, as shown in Table 2-1 (REPEAT executes the target instruction {operand value+1} times). The REPEAT
loop count must be setup for 18 iterations of the DIV/
DIVF instruction. Thus, a complete divide operation
requires 19 cycles.
The 16/16 divides are similar to the 32/16 (same number
of iterations), but the dividend is either zero-extended or
sign-extended during the first iteration.
TABLE 2-1:
Note:
The divide flow is interruptible. However,
the user needs to save the context as
appropriate.
DIVIDE INSTRUCTIONS
Instruction
Function
DIVF
Signed fractional divide: Wm/Wn → W0; Rem → W1
DIV.sd
Signed divide: (Wm+1:Wm)/Wn → W0; Rem → W1
DIV.s
Signed divide: Wm/Wn → W0; Rem → W1
DIV.ud
Unsigned divide: (Wm+1:Wm)/Wn → W0; Rem → W1
DIV.u
Unsigned divide: Wm/Wn → W0; Rem → W1
DS70139E-page 20
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
2.4
DSP Engine
The DSP engine consists of a high-speed 17-bit x
17-bit multiplier, a barrel shifter and a 40-bit adder/
subtracter (with two target accumulators, round and
saturation logic).
The DSP engine also has the capability to perform
inherent
accumulator-to-accumulator
operations,
which require no additional data. These instructions are
ADD, SUB and NEG.
The dsPIC30F is a single-cycle instruction flow architecture, therefore, concurrent operation of the DSP
engine with MCU instruction flow is not possible.
However, some MCU ALU and DSP engine resources
may be used concurrently by the same instruction (e.g.,
ED, EDAC). See Table 2-2.
TABLE 2-2:
The DSP engine has various options selected through
various bits in the CPU Core Configuration register
(CORCON), as listed below:
1.
2.
3.
4.
5.
6.
Fractional or integer DSP multiply (IF).
Signed or unsigned DSP multiply (US).
Conventional or convergent rounding (RND).
Automatic saturation on/off for ACCA (SATA).
Automatic saturation on/off for ACCB (SATB).
Automatic saturation on/off for writes to data
memory (SATDW).
Accumulator Saturation mode selection
(ACCSAT).
7.
Note:
For CORCON layout, see Table 3-3.
A block diagram of the DSP engine is shown in
Figure 2-2.
DSP INSTRUCTION SUMMARY
Instruction
Algebraic Operation
CLR
A=0
ED
A = (x – y)2
ACC WB?
Yes
No
2
EDAC
A = A + (x – y)
No
MAC
A = A + (x * y)
Yes
MAC
A = A + x2
No
No change in A
Yes
MOVSAC
MPY
MPY.N
MSC
© 2006 Microchip Technology Inc.
A=x*y
No
A=–x*y
No
A=A–x*y
Yes
DS70139E-page 21
dsPIC30F2011/2012/3012/3013
FIGURE 2-2:
DSP ENGINE BLOCK DIAGRAM
40
S
a
40 Round t 16
u
Logic r
a
t
e
40-bit Accumulator A
40-bit Accumulator B
Carry/Borrow Out
Carry/Borrow In
Saturate
Adder
Negate
40
40
40
16
X Data Bus
Barrel
Shifter
40
Y Data Bus
Sign-Extend
32
16
Zero Backfill
32
33
17-bit
Multiplier/Scaler
16
16
To/From W Array
DS70139E-page 22
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
2.4.1
MULTIPLIER
The 17 x 17-bit multiplier is capable of signed or
unsigned operation and can multiplex its output using a
scaler to support either 1.31 fractional (Q31) or 32-bit
integer results. Unsigned operands are zero-extended
into the 17th bit of the multiplier input value. Signed
operands are sign-extended into the 17th bit of the multiplier input value. The output of the 17 x 17-bit multiplier/scaler is a 33-bit value which is sign-extended to
40 bits. Integer data is inherently represented as a
signed two’s complement value, where the MSB is
defined as a sign bit. Generally speaking, the range of
an N-bit two’s complement integer is -2N-1 to 2N-1 – 1.
For a 16-bit integer, the data range is -32768 (0x8000)
to 32767 (0x7FFF) including ‘0’. For a 32-bit integer,
the data range is -2,147,483,648 (0x8000 0000) to
2,147,483,645 (0x7FFF FFFF).
When the multiplier is configured for fractional multiplication, the data is represented as a two’s complement
fraction, where the MSB is defined as a sign bit and the
radix point is implied to lie just after the sign bit (QX format). The range of an N-bit two’s complement fraction
with this implied radix point is -1.0 to (1 – 21-N). For a
16-bit fraction, the Q15 data range is -1.0 (0x8000) to
0.999969482 (0x7FFF) including ‘0’ and has a precision of 3.01518x10-5. In Fractional mode, the 16x16
multiply operation generates a 1.31 product, which has
a precision of 4.65661 x 10-10.
The same multiplier is used to support the MCU multiply instructions, which include integer 16-bit signed,
unsigned and mixed sign multiplies.
2.4.2.1
The adder/subtracter is a 40-bit adder with an optional
zero input into one side and either true or complement
data into the other input. In the case of addition, the
carry/borrow input is active high and the other input is
true data (not complemented), whereas in the case of
subtraction, the carry/borrow input is active low and the
other input is complemented. The adder/subtracter
generates overflow Status bits SA/SB and OA/OB,
which are latched and reflected in the STATUS register:
• Overflow from bit 39: this is a catastrophic
overflow in which the sign of the accumulator is
destroyed.
• Overflow into guard bits 32 through 39: this is a
recoverable overflow. This bit is set whenever all
the guard bits are not identical to each other.
The adder has an additional saturation block which
controls accumulator data saturation if selected. It uses
the result of the adder, the overflow Status bits
described above, and the SATA/B (CORCON<7:6>)
and ACCSAT (CORCON<4>) mode control bits to
determine when and to what value to saturate.
Six STATUS register bits have been provided to
support saturation and overflow. They are:
1.
2.
3.
The MUL instruction can be directed to use byte or
word-sized operands. Byte operands direct a 16-bit
result. Word operands direct a 32-bit result to the specified register(s) in the W array.
2.4.2
DATA ACCUMULATORS AND
ADDER/SUBTRACTER
The data accumulator consists of a 40-bit adder/
subtracter with automatic sign extension logic. It can
select one of two accumulators (A or B) as its preaccumulation source and post-accumulation destination. For the ADD and LAC instructions, the data to be
accumulated or loaded can be optionally scaled via the
barrel shifter prior to accumulation.
© 2006 Microchip Technology Inc.
Adder/Subtracter, Overflow and
Saturation
4.
5.
6.
OA:
ACCA overflowed into guard bits
OB:
ACCB overflowed into guard bits
SA:
ACCA saturated (bit 31 overflow and saturation)
or
ACCA overflowed into guard bits and saturated
(bit 39 overflow and saturation)
SB:
ACCB saturated (bit 31 overflow and saturation)
or
ACCB overflowed into guard bits and saturated
(bit 39 overflow and saturation)
OAB:
Logical OR of OA and OB
SAB:
Logical OR of SA and SB
The OA and OB bits are modified each time data
passes through the adder/subtracter. When set, they
indicate that the most recent operation has overflowed
into the accumulator guard bits (bits 32 through 39).
The OA and OB bits can also optionally generate an
arithmetic warning trap when set and the corresponding overflow trap flag enable bit (OVATE, OVBTE) in
the INTCON1 register (refer to Section 8.0 “Interrupts”) is set. This allows the user to take immediate
action, for example, to correct system gain.
DS70139E-page 23
dsPIC30F2011/2012/3012/3013
The SA and SB bits are modified each time data
passes through the adder/subtracter but can only be
cleared by the user. When set, they indicate that the
accumulator has overflowed its maximum range (bit 31
for 32-bit saturation or bit 39 for 40-bit saturation) and
will be saturated if saturation is enabled. When saturation is not enabled, SA and SB default to bit 39 overflow
and thus indicate that a catastrophic overflow has
occurred. If the COVTE bit in the INTCON1 register is
set, SA and SB bits generate an arithmetic warning trap
when saturation is disabled.
The overflow and saturation Status bits can optionally
be viewed in the STATUS register (SR) as the logical
OR of OA and OB (in bit OAB) and the logical OR of SA
and SB (in bit SAB). This allows programmers to check
one bit in the STATUS register to determine if either
accumulator has overflowed, or one bit to determine if
either accumulator has saturated. This would be useful
for complex number arithmetic which typically uses
both the accumulators.
The device supports three saturation and overflow
modes:
1.
2.
3.
Bit 39 Overflow and Saturation:
When bit 39 overflow and saturation occurs, the
saturation logic loads the maximally positive 9.31
(0x7FFFFFFFFF) or maximally negative 9.31
value (0x8000000000) into the target accumulator. The SA or SB bit is set and remains set until
cleared by the user. This is referred to as ‘super
saturation’ and provides protection against erroneous data or unexpected algorithm problems
(e.g., gain calculations).
Bit 31 Overflow and Saturation:
When bit 31 overflow and saturation occurs, the
saturation logic then loads the maximally positive 1.31 value (0x007FFFFFFF) or maximally
negative 1.31 value (0x0080000000) into the
target accumulator. The SA or SB bit is set and
remains set until cleared by the user. When this
Saturation mode is in effect, the guard bits are
not used, so the OA, OB or OAB bits are never
set.
Bit 39 Catastrophic Overflow:
The bit 39 overflow Status bit from the adder is
used to set the SA or SB bit which remains set
until cleared by the user. No saturation operation
is performed and the accumulator is allowed to
overflow (destroying its sign). If the COVTE bit in
the INTCON1 register is set, a catastrophic
overflow can initiate a trap exception.
DS70139E-page 24
2.4.2.2
Accumulator ‘Write-Back’
The MAC class of instructions (with the exception of
MPY, MPY.N, ED and EDAC) can optionally write a
rounded version of the high word (bits 31 through 16)
of the accumulator that is not targeted by the instruction
into data space memory. The write is performed across
the X bus into combined X and Y address space. The
following addressing modes are supported:
1.
2.
W13, Register Direct:
The rounded contents of the non-target
accumulator are written into W13 as a 1.15
fraction.
[W13]+=2, Register Indirect with Post-Increment:
The rounded contents of the non-target accumulator are written into the address pointed to by
W13 as a 1.15 fraction. W13 is then
incremented by 2 (for a word write).
2.4.2.3
Round Logic
The round logic is a combinational block which performs a conventional (biased) or convergent (unbiased) round function during an accumulator write
(store). The Round mode is determined by the state of
the RND bit in the CORCON register. It generates a 16bit, 1.15 data value, which is passed to the data space
write saturation logic. If rounding is not indicated by the
instruction, a truncated 1.15 data value is stored and
the least significant word (lsw) is simply discarded.
Conventional rounding takes bit 15 of the accumulator,
zero-extends it and adds it to the ACCxH word (bits 16
through 31 of the accumulator). If the ACCxL word
(bits 0 through 15 of the accumulator) is between
0x8000 and 0xFFFF (0x8000 included), ACCxH is
incremented. If ACCxL is between 0x0000 and 0x7FFF,
ACCxH is left unchanged. A consequence of this algorithm is that over a succession of random rounding
operations, the value tends to be biased slightly
positive.
Convergent (or unbiased) rounding operates in the
same manner as conventional rounding, except when
ACCxL equals 0x8000. If this is the case, the LSb
(bit 16 of the accumulator) of ACCxH is examined. If it
is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not
modified. Assuming that bit 16 is effectively random in
nature, this scheme will remove any rounding bias that
may accumulate.
The SAC and SAC.R instructions store either a truncated (SAC) or rounded (SAC.R) version of the contents
of the target accumulator to data memory via the X bus
(subject to data saturation, see Section 2.4.2.4 “Data
Space Write Saturation”). Note that for the MAC class
of instructions, the accumulator write-back operation
functions in the same manner, addressing combined
MCU (X and Y) data space though the X bus. For this
class of instructions, the data is always subject to
rounding.
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
2.4.2.4
Data Space Write Saturation
2.4.3
BARREL SHIFTER
In addition to adder/subtracter saturation, writes to data
space may also be saturated but without affecting the
contents of the source accumulator. The data space
write saturation logic block accepts a 16-bit, 1.15 fractional value from the round logic block as its input,
together with overflow status from the original source
(accumulator) and the 16-bit round adder. These are
combined and used to select the appropriate 1.15
fractional value as output to write to data space
memory.
The barrel shifter is capable of performing up to 16-bit
arithmetic or logic right shifts, or up to 16-bit left shifts
in a single cycle. The source can be either of the two
DSP accumulators, or the X bus (to support multi-bit
shifts of register or memory data).
If the SATDW bit in the CORCON register is set, data
(after rounding or truncation) is tested for overflow and
adjusted accordingly. For input data greater than
0x007FFF, data written to memory is forced to the maximum positive 1.15 value, 0x7FFF. For input data less
than 0xFF8000, data written to memory is forced to the
maximum negative 1.15 value, 0x8000. The MSb of the
source (bit 39) is used to determine the sign of the
operand being tested.
The barrel shifter is 40 bits wide, thereby obtaining a
40-bit result for DSP shift operations and a 16-bit result
for MCU shift operations. Data from the X bus is presented to the barrel shifter between bit positions 16 to
31 for right shifts, and bit positions 0 to 16 for left shifts.
The shifter requires a signed binary value to determine
both the magnitude (number of bits) and direction of the
shift operation. A positive value shifts the operand right.
A negative value shifts the operand left. A value of ‘0’
does not modify the operand.
If the SATDW bit in the CORCON register is not set, the
input data is always passed through unmodified under
all conditions.
© 2006 Microchip Technology Inc.
DS70139E-page 25
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 26
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
3.0
MEMORY ORGANIZATION
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual “ (DS70157).
3.1
Program Address Space
The program address space is 4M instruction words.
The program space memory map for the dsPI30F2011/
2012 is shown in Figure 3-1. The program space
memory map for the dsPI30F3012/3013 is shown in
Figure 3-2.
© 2006 Microchip Technology Inc.
Program memory is addressable by a 24-bit value from
either the 23-bit PC, table instruction Effective Address
(EA), or data space EA, when program space is
mapped into data space as defined by Table 3-1. Note
that the program space address is incremented by two
between successive program words in order to provide
compatibility with data space addressing.
User program space access is restricted to the lower
4M instruction word address range (0x000000 to
0x7FFFFE) for all accesses other than TBLRD/TBLWT,
which uses TBLPAG<7> to determine user or configuration space access. In Table 3-1, Program Space
Address Construction, bit 23 allows access to the
Device ID, the User ID and the Configuration bits.
Otherwise, bit 23 is always clear.
DS70139E-page 27
dsPIC30F2011/2012/3012/3013
FIGURE 3-1:
dsPIC30F2011/2012
PROGRAM SPACE
MEMORY MAP
Reset - GOTO Instruction
Reset - Target Address
FIGURE 3-2:
dsPIC30F3012/3013
PROGRAM SPACE
MEMORY MAP
Reset - GOTO Instruction
Reset - Target Address
000000
000002
000004
Interrupt Vector Table
Interrupt Vector Table
Vector Tables
Reserved
Vector Tables
00007E
000080
000084
Reserved
0000FE
000100
001FFE
002000
User Flash
Program Memory
(8K instructions)
Reserved
(Read ‘0’s)
Reserved
(Read ‘0’s)
Data EEPROM
(1 Kbyte)
7FFFFE
800000
F7FFFE
F80000
F8000E
F80010
Reserved
DS70139E-page 28
Configuration Memory
Space
Configuration Memory
Space
8005BE
8005C0
Reserved
DEVID (2)
003FFE
004000
7FFBFE
7FFC00
Reserved
8005FE
800600
Device Configuration
Registers
000084
0000FE
000100
7FFFFE
800000
Reserved
UNITID (32 instr.)
00007E
000080
Alternate Vector Table
User Memory
Space
User Memory
Space
Alternate Vector Table
User Flash
Program Memory
(4K instructions)
000000
000002
000004
UNITID (32 instr.)
8005BE
8005C0
8005FE
800600
Reserved
Device Configuration
Registers
F7FFFE
F80000
F8000E
F80010
Reserved
FEFFFE
FF0000
FFFFFE
DEVID (2)
FEFFFE
FF0000
FFFFFE
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
TABLE 3-1:
PROGRAM SPACE ADDRESS CONSTRUCTION
Program Space Address
Access
Space
Access Type
<23>
<22:16>
<15>
<14:1>
Instruction Access
User
TBLRD/TBLWT
User
(TBLPAG<7> = 0)
TBLPAG<7:0>
Data EA<15:0>
TBLRD/TBLWT
Configuration
(TBLPAG<7> = 1)
TBLPAG<7:0>
Data EA<15:0>
Program Space Visibility
User
FIGURE 3-3:
<0>
PC<22:1>
0
0
PSVPAG<7:0>
0
Data EA<14:0>
DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
23 bits
Using
Program
Counter
Program Counter
0
Select
Using
Program
Space
Visibility
0
1
0
EA
PSVPAG Reg
8 bits
15 bits
EA
Using
Table
Instruction
1/0
User/
Configuration
Space
Select
Note:
TBLPAG Reg
8 bits
16 bits
24-bit EA
Byte
Select
Program space visibility cannot be used to access bits <23:16> of a word in program memory.
© 2006 Microchip Technology Inc.
DS70139E-page 29
dsPIC30F2011/2012/3012/3013
3.1.1
DATA ACCESS FROM PROGRAM
MEMORY USING TABLE
INSTRUCTIONS
A set of table instructions are provided to move byte or
word-sized data to and from program space. See Figure 3-4 and Figure 3-5.
1.
This architecture fetches 24-bit wide program memory.
Consequently, instructions are always aligned.
However, as the architecture is modified Harvard, data
can also be present in program space.
There are two methods by which program space can
be accessed: via special table instructions, or through
the remapping of a 16K word program space page into
the upper half of data space (see Section 3.1.2 “Data
Access from Program Memory Using Program
Space Visibility”). The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the lsw
of any address within program space, without going
through data space. The TBLRDH and TBLWTH instructions are the only method whereby the upper 8 bits of a
program space word can be accessed as data.
2.
3.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses.
Program memory can thus be regarded as two 16-bit
word wide address spaces, residing side by side, each
with the same address range. TBLRDL and TBLWTL
access the space which contains the lsw, and TBLRDH
and TBLWTH access the space which contains the
MSB.
4.
TBLRDL: Table Read Low
Word: Read the LS Word of the program address;
P<15:0> maps to D<15:0>.
Byte: Read one of the LSB of the program
address;
P<7:0> maps to the destination byte when byte
select = 0;
P<15:8> maps to the destination byte when byte
select = 1.
TBLWTL: Table Write Low (refer to Section 5.0
“Flash Program Memory” for details on Flash
Programming)
TBLRDH: Table Read High
Word: Read the MS Word of the program address;
P<23:16> maps to D<7:0>; D<15:8> will always
be = 0.
Byte: Read one of the MSB of the program
address;
P<23:16> maps to the destination byte when
byte select = 0;
The destination byte will always be = 0 when
byte select = 1.
TBLWTH: Table Write High (refer to Section 5.0
“Flash Program Memory” for details on Flash
Programming)
Figure 3-3 shows how the EA is created for table operations and data space accesses (PSV = 1). Here,
P<23:0> refers to a program space word, whereas
D<15:0> refers to a data space word.
FIGURE 3-4:
PROGRAM DATA TABLE ACCESS (lsw)
PC Address
0x000000
0x000002
0x000004
0x000006
Program Memory
‘Phantom’ Byte
(read as ‘0’)
DS70139E-page 30
23
16
8
0
00000000
00000000
00000000
00000000
TBLRDL.W
TBLRDL.B (Wn<0> = 0)
TBLRDL.B (Wn<0> = 1)
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 3-5:
PROGRAM DATA TABLE ACCESS (MSB)
TBLRDH.W
PC Address
0x000000
0x000002
0x000004
0x000006
23
16
8
0
00000000
00000000
00000000
00000000
TBLRDH.B (Wn<0> = 0)
Program Memory
‘Phantom’ Byte
(read as ‘0’)
3.1.2
TBLRDH.B (Wn<0> = 1)
DATA ACCESS FROM PROGRAM
MEMORY USING PROGRAM
SPACE VISIBILITY
The upper 32 Kbytes of data space may optionally be
mapped into any 16K word program space page. This
provides transparent access of stored constant data
from X data space without the need to use special
instructions (i.e., TBLRDL/H, TBLWTL/H instructions).
Program space access through the data space occurs
if the MSb of the data space EA is set and program
space visibility is enabled by setting the PSV bit in the
Core Control register (CORCON). The functions of
CORCON are discussed in Section 2.4 “DSP
Engine”.
Data accesses to this area add an additional cycle to
the instruction being executed, since two program
memory fetches are required.
Note that the upper half of addressable data space is
always part of the X data space. Therefore, when a
DSP operation uses program space mapping to access
this memory region, Y data space should typically contain state (variable) data for DSP operations, whereas
X data space should typically contain coefficient
(constant) data.
Although each data space address, 0x8000 and higher,
maps directly into a corresponding program memory
address (see Figure 3-6), only the lower 16 bits of the
24-bit program word are used to contain the data. The
upper 8 bits should be programmed to force an illegal
instruction to maintain machine robustness. Refer to
the “dsPIC30F/33F Programmer’s Reference Manual”
(DS70157) for details on instruction encoding.
© 2006 Microchip Technology Inc.
Note that by incrementing the PC by 2 for each
program memory word, the LS 15 bits of data space
addresses directly map to the LS 15 bits in the corresponding program space addresses. The remaining
bits are provided by the Program Space Visibility Page
register, PSVPAG<7:0>, as shown in Figure 3-6.
Note:
PSV access is temporarily disabled during
table reads/writes.
For instructions that use PSV which are executed
outside a REPEAT loop:
• The following instructions require one instruction
cycle in addition to the specified execution time:
- MAC class of instructions with data operand
prefetch
- MOV instructions
- MOV.D instructions
• All other instructions require two instruction cycles
in addition to the specified execution time of the
instruction.
For instructions that use PSV which are executed
inside a REPEAT loop:
• The following instances require two instruction
cycles in addition to the specified execution time
of the instruction:
- Execution in the first iteration
- Execution in the last iteration
- Execution prior to exiting the loop due to an
interrupt
- Execution upon re-entering the loop after an
interrupt is serviced
• Any other iteration of the REPEAT loop allow the
instruction accessing data, using PSV, to execute
in a single cycle.
DS70139E-page 31
dsPIC30F2011/2012/3012/3013
FIGURE 3-6:
DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION
Data Space
Program Space
0x0000
PSVPAG(1)
0x00
8
15
EA<15> = 0
Data 16
Space
15
EA
EA<15> = 1
0x000000
0x8000
15
Address
Concatenation 23
23
15
0
0x001200
Upper Half of Data
Space is Mapped
into Program Space
0x001FFF
0xFFFF
Data Read
BSET
MOV
MOV
MOV
CORCON,#2 ; Set PSV bit
#0x0, W0
; Set PSVPAG register
W0, PSVPAG
0x9200, W0 ; Access program memory location
; using a data space access
Note 1: PSVPAG is an 8-bit register, containing bits <22:15> of the program space address.
DS70139E-page 32
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
3.2
Data Address Space
The core has two data spaces. The data spaces can be
considered either separate (for some DSP instructions), or as one unified linear address range (for MCU
instructions). The data spaces are accessed using two
Address Generation Units (AGUs) and separate data
paths.
3.2.1
DATA SPACE MEMORY MAP
The data space memory is split into two blocks, X and
Y data space. A key element of this architecture is that
Y space is a subset of X space, and is fully contained
within X space. In order to provide an apparent Linear
Addressing space, X and Y spaces have contiguous
addresses.
FIGURE 3-7:
When executing any instruction other than one of the
MAC class of instructions, the X block consists of the 64Kbyte data address space (including all Y addresses).
When executing one of the MAC class of instructions,
the X block consists of the 64-Kbyte data address
space, excluding the Y address block (for data reads
only). In other words, all other instructions regard the
entire data memory as one composite address space.
The MAC class instructions extract the Y address space
from data space and address it using EAs sourced from
W10 and W11. The remaining X data space is
addressed using W8 and W9. Both address spaces are
concurrently accessed only with the MAC class
instructions.
The data space memory map for the dsPIC30F2011
and dsPIC30F2012 is shown in Figure 3-7. The data
space memory map for the dsPIC30F3012 and
dsPIC30F3013 is shown in Figure 3-8.
dsPIC30F2011/2012 DATA SPACE MEMORY MAP
MSB
Address
MSB
2 Kbyte
SFR Space
1 Kbyte
SRAM Space
LSB
0x0000
0x0001
SFR Space
0x07FF
0x0801
0x09FF
0x0A01
0x07FE
0x0800
X Data RAM (X)
0x09FE
0x0A00
Y Data RAM (Y)
0x0BFF
0x0C01
0x0BFE
0x0C00
0x1FFF
0x1FFE
0x8001
0x8000
8 Kbyte
Near
Data
Space
X Data
Unimplemented (X)
Optionally
Mapped
into Program
Memory
0xFFFF
© 2006 Microchip Technology Inc.
LSB
Address
16 bits
0xFFFE
DS70139E-page 33
dsPIC30F2011/2012/3012/3013
FIGURE 3-8:
dsPIC30F3012/3013 DATA SPACE MEMORY MAP
MSB
Address
MSB
2 Kbyte
SFR Space
2 Kbyte
SRAM Space
LSB
0x0000
0x0001
SFR Space
0x07FE
0x0800
0x07FF
0x0801
0x0BFF
0x0C01
X Data RAM (X)
8 Kbyte
Near
Data
Space
0x0BFE
0x0C00
Y Data RAM (Y)
0x0FFF
0x1001
0x0FFE
0x1000
0x1FFF
0x1FFE
0x8001
0x8000
X Data
Unimplemented (X)
Optionally
Mapped
into Program
Memory
0xFFFF
DS70139E-page 34
LSB
Address
16 bits
0xFFFE
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE
SFR SPACE
SFR SPACE
X SPACE
FIGURE 3-9:
Y SPACE
UNUSED
X SPACE
(Y SPACE)
X SPACE
UNUSED
UNUSED
Non-MAC Class Ops (Read/Write)
MAC Class Ops (Write)
Indirect EA using any W
© 2006 Microchip Technology Inc.
MAC Class Ops (Read)
Indirect EA using W8, W9
Indirect EA using W10, W11
DS70139E-page 35
dsPIC30F2011/2012/3012/3013
3.2.2
DATA SPACES
3.2.3
The X data space is used by all instructions and supports all addressing modes. There are separate read
and write data buses. The X read data bus is the return
data path for all instructions that view data space as
combined X and Y address space. It is also the X
address space data path for the dual operand read
instructions (MAC class). The X write data bus is the
only write path to data space for all instructions.
The X data space also supports Modulo Addressing for
all instructions, subject to Addressing mode restrictions. Bit-Reversed Addressing is only supported for
writes to X data space.
The Y data space is used in concert with the X data
space by the MAC class of instructions (CLR, ED,
EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to
provide two concurrent data read paths. No writes
occur across the Y bus. This class of instructions dedicates two W register pointers, W10 and W11, to always
address Y data space, independent of X data space,
whereas W8 and W9 always address X data space.
Note that during accumulator write back, the data
address space is considered a combination of X and Y
data spaces, so the write occurs across the X bus.
Consequently, the write can be to any address in the
entire data space.
The Y data space can only be used for the data
prefetch operation associated with the MAC class of
instructions. It also supports Modulo Addressing for
automated circular buffers. Of course, all other instructions can access the Y data address space through the
X data path as part of the composite linear space.
The boundary between the X and Y data spaces is
defined as shown in Figure 3-8 and is not user programmable. Should an EA point to data outside its own
assigned address space, or to a location outside physical memory, an all zero word/byte is returned. For
example, although Y address space is visible by all
non-MAC instructions using any addressing mode, an
attempt by a MAC instruction to fetch data from that
space using W8 or W9 (X space pointers) returns
0x0000.
TABLE 3-2:
EFFECT OF INVALID
MEMORY ACCESSES
Attempted Operation
Data Returned
EA = an unimplemented address
0x0000
W8 or W9 used to access Y data
space in a MAC instruction
0x0000
W10 or W11 used to access X
data space in a MAC instruction
0x0000
DATA SPACE WIDTH
The core data width is 16 bits. All internal registers are
organized as 16-bit wide words. Data space memory is
organized in byte addressable, 16-bit wide blocks.
3.2.4
DATA ALIGNMENT
To help maintain backward compatibility with PIC®
MCU devices and improve data space memory usage
efficiency, the dsPIC30F instruction set supports both
word and byte operations. Data is aligned in data memory and registers as words, but all data space EAs
resolve to bytes. Data byte reads read the complete
word that contains the byte, using the LSb of any EA to
determine which byte to select. The selected byte is
placed onto the LSB of the X data path (no byte
accesses are possible from the Y data path as the MAC
class of instruction can only fetch words). That is, data
memory and registers are organized as two parallel
byte wide entities with shared (word) address decode
but separate write lines. Data byte writes only write to
the corresponding side of the array or register which
matches the byte address.
As a consequence of this byte accessibility, all Effective
Address calculations (including those generated by the
DSP operations which are restricted to word-sized
data) are internally scaled to step through word-aligned
memory. For example, the core would recognize that
Post-Modified Register Indirect Addressing mode
[Ws++] results in a value of Ws + 1 for byte operations
and Ws + 2 for word operations.
All word accesses must be aligned to an even address.
Misaligned word data fetches are not supported so
care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. Should a misaligned read or write be attempted, an address error
trap is generated. If the error occurred on a read, the
instruction underway is completed, whereas if it
occurred on a write, the instruction is executed, but the
write does not occur. In either case, a trap is then executed, allowing the system and/or user to examine the
machine state prior to execution of the address fault.
FIGURE 3-10:
15
MSB
DATA ALIGNMENT
87
LSB
0
0001
Byte 1
Byte 0
0000
0003
Byte 3
Byte 2
0002
0005
Byte 5
Byte 4
0004
All Effective Addresses are 16 bits wide and point to
bytes within the data space. Therefore, the data space
address range is 64 Kbytes or 32K words.
DS70139E-page 36
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
All byte loads into any W register are loaded into the
LSB. The MSB is not modified.
A Sign-Extend (SE) instruction is provided to allow
users to translate 8-bit signed data to 16-bit signed
values. Alternatively, for 16-bit unsigned data, users
can clear the MSB of any W register by executing a
Zero-Extend (ZE) instruction on the appropriate
address.
Although most instructions are capable of operating on
word or byte data sizes, it should be noted that some
instructions, including the DSP instructions, operate
only on words.
3.2.5
NEAR DATA SPACE
An 8-Kbyte ‘near’ data space is reserved in X address
memory space between 0x0000 and 0x1FFF, which is
directly addressable via a 13-bit absolute address field
within all memory direct instructions. The remaining X
address space and all of the Y address space is
addressable indirectly. Additionally, the whole of X data
space is addressable using MOV instructions, which
support memory direct addressing with a 16-bit
address field.
3.2.6
There is a Stack Pointer Limit register (SPLIM) associated with the Stack Pointer. SPLIM is uninitialized at
Reset. As is the case for the Stack Pointer, SPLIM<0>
is forced to ‘0’ because all stack operations must be
word aligned. Whenever an Effective Address (EA) is
generated using W15 as a source or destination
pointer, the address thus generated is compared with
the value in SPLIM. If the contents of the Stack Pointer
(W15) and the SPLIM register are equal, and a push
operation is performed, a stack error trap does not
occur. The stack error trap occurs on a subsequent
push operation. Thus, for example, if it is desirable to
cause a stack error trap when the stack grows beyond
address 0x2000 in RAM, initialize the SPLIM with the
value, 0x1FFE.
Similarly, a Stack Pointer underflow (stack error) trap is
generated when the Stack Pointer address is found to
be less than 0x0800, thus preventing the stack from
interfering with the Special Function Register (SFR)
space.
A write to the SPLIM register should not be immediately
followed by an indirect read operation using W15.
SOFTWARE STACK
The dsPIC DSC devices contain a software stack. W15
is used as the Stack Pointer.
The Stack Pointer always points to the first available
free word and grows from lower addresses towards
higher addresses. It pre-decrements for stack pops
and post-increments for stack pushes, as shown in
Figure 3-11. Note that for a PC push during any CALL
instruction, the MSB of the PC is zero-extended before
the push, ensuring that the MSB is always clear.
Note:
A PC push during exception processing
concatenates the SRL register to the MSB
of the PC prior to the push.
FIGURE 3-11:
Stack Grows Towards
Higher Address
0x0000
CALL STACK FRAME
15
0
PC<15:0>
000000000 PC<22:16>
<Free Word>
W15 (before CALL)
W15 (after CALL)
POP : [--W15]
PUSH : [W15++]
© 2006 Microchip Technology Inc.
DS70139E-page 37
SFR Name
CORE REGISTER MAP
Address
(Home)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
W0
0000
W0/WREG
0000 0000 0000 0000
W1
0002
W1
0000 0000 0000 0000
W2
0004
W2
0000 0000 0000 0000
W3
0006
W3
0000 0000 0000 0000
W4
0008
W4
0000 0000 0000 0000
W5
000A
W5
0000 0000 0000 0000
W6
000C
W6
0000 0000 0000 0000
W7
000E
W7
0000 0000 0000 0000
© 2006 Microchip Technology Inc.
W8
0010
W8
0000 0000 0000 0000
W9
0012
W9
0000 0000 0000 0000
W10
0014
W10
0000 0000 0000 0000
W11
0016
W11
0000 0000 0000 0000
W12
0018
W12
0000 0000 0000 0000
W13
001A
W13
0000 0000 0000 0000
W14
001C
W14
0000 0000 0000 0000
W15
001E
W15
0000 1000 0000 0000
SPLIM
0020
SPLIM
0000 0000 0000 0000
ACCAL
0022
ACCAL
0000 0000 0000 0000
ACCAH
0024
ACCAH
0000 0000 0000 0000
ACCAU
0026
ACCBL
0028
ACCBL
0000 0000 0000 0000
ACCBH
002A
ACCBH
0000 0000 0000 0000
ACCBU
002C
PCL
002E
PCH
0030
—
—
—
—
—
—
—
—
TBLPAG
0032
—
—
—
—
—
—
—
—
TBLPAG
0000 0000 0000 0000
PSVPAG
0034
—
—
—
—
—
—
—
—
PSVPAG
0000 0000 0000 0000
RCOUNT
0036
RCOUNT
DCOUNT
0038
DCOUNT
DOSTARTL
003A
DOSTARTH
003C
DOENDL
003E
DOENDH
SR
Legend:
Note:
Sign Extension (ACCA<39>)
ACCAU
Sign Extension (ACCB<39>)
0000 0000 0000 0000
ACCBU
0000 0000 0000 0000
PCL
0000 0000 0000 0000
—
PCH
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
DOSTARTL
—
—
—
—
—
—
—
0040
—
—
—
—
—
—
—
0042
OA
OB
SA
SB
OAB
SAB
DA
—
0
—
DOSTARTH
—
—
DOENDH
DC
IPL2
DOENDL
u = uninitialized bit
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
0
IPL1
IPL0
RA
N
uuuu uuuu uuuu uuu0
0000 0000 0uuu uuuu
uuuu uuuu uuuu uuu0
0000 0000 0uuu uuuu
OV
Z
C
0000 0000 0000 0000
dsPIC30F2011/2012/3012/3013
DS70139E-page 38
TABLE 3-3:
© 2006 Microchip Technology Inc.
TABLE 3-3:
SFR Name
CORE REGISTER MAP (CONTINUED)
Address
(Home)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
EDT
DL2
DL1
DL0
SATA
SATB
Bit 5
Bit 4
Bit 2
Bit 1
Bit 0
Reset State
IPL3
PSV
RND
IF
0000 0000 0010 0000
CORCON
0044
—
—
—
US
MODCON
0046
XMODEN
YMODEN
—
—
XMODSRT
0048
XS<15:1>
0
uuuu uuuu uuuu uuu0
XMODEND
004A
XE<15:1>
1
uuuu uuuu uuuu uuu1
YMODSRT
004C
YS<15:1>
0
uuuu uuuu uuuu uuu0
YMODEND
004E
YE<15:1>
1
XBREV
0050
BREN
0052
—
DISICNT
Legend:
Note:
BWM<3:0>
SATDW ACCSAT
Bit 3
YWM<3:0>
XB<14:0>
—
DISICNT<13:0>
XWM<3:0>
0000 0000 0000 0000
uuuu uuuu uuuu uuu1
uuuu uuuu uuuu uuuu
0000 0000 0000 0000
u = uninitialized bit
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F2011/2012/3012/3013
DS70139E-page 39
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 40
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
4.0
ADDRESS GENERATOR UNITS
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual“ (DS70157).
The dsPIC DSC core contains two independent
address generator units: the X AGU and Y AGU. The Y
AGU supports word-sized data reads for the DSP MAC
class of instructions only. The dsPIC DSC AGUs support three types of data addressing:
• Linear Addressing
• Modulo (Circular) Addressing
• Bit-Reversed Addressing
FILE REGISTER INSTRUCTIONS
Most file register instructions use a 13-bit address field
(f) to directly address data present in the first 8192
bytes of data memory (near data space). Most file
register instructions employ a working register, W0,
which is denoted as WREG in these instructions. The
destination is typically either the same file register or
WREG (with the exception of the MUL instruction),
which writes the result to a register or register pair. The
MOV instruction allows additional flexibility and can
access the entire data space during file register
operation.
4.1.2
MCU INSTRUCTIONS
The three-operand MCU instructions are of the form:
Operand 3 = Operand 1 <function> Operand 2
Linear and Modulo Data Addressing modes can be
applied to data space or program space. Bit-Reversed
Addressing is only applicable to data space addresses.
4.1
4.1.1
Instruction Addressing Modes
The addressing modes in Table 4-1 form the basis of
the addressing modes optimized to support the specific
features of individual instructions. The addressing
modes provided in the MAC class of instructions are
somewhat different from those in the other instruction
types.
where Operand 1 is always a working register (i.e., the
addressing mode can only be register direct), which is
referred to as Wb. Operand 2 can be a W register,
fetched from data memory or a 5-bit literal. The result
location can be either a W register or an address
location. The following addressing modes are
supported by MCU instructions:
•
•
•
•
•
Register Direct
Register Indirect
Register Indirect Post-modified
Register Indirect Pre-modified
5-bit or 10-bit Literal
Note:
TABLE 4-1:
Not all instructions support all the addressing modes given above. Individual
instructions may support different subsets
of these addressing modes.
FUNDAMENTAL ADDRESSING MODES SUPPORTED
Addressing Mode
Description
File Register Direct
The address of the File register is specified explicitly.
Register Direct
The contents of a register are accessed directly.
Register Indirect
The contents of Wn forms the EA.
Register Indirect Post-modified
The contents of Wn forms the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-modified
Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset The sum of Wn and Wb forms the EA.
Register Indirect with Literal Offset
© 2006 Microchip Technology Inc.
The sum of Wn and a literal forms the EA.
DS70139E-page 41
dsPIC30F2011/2012/3012/3013
4.1.3
MOVE AND ACCUMULATOR
INSTRUCTIONS
Move instructions and the DSP accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
addressing modes supported by most MCU instructions, move and accumulator instructions also support
Register Indirect with Register Offset Addressing
mode, also referred to as Register Indexed mode.
Note:
For the MOV instructions, the addressing
mode specified in the instruction can differ
for the source and destination EA.
However, the 4-bit Wb (register offset)
field is shared between both source and
destination (but typically only used by
one).
In summary, the following addressing modes are
supported by move and accumulator instructions:
•
•
•
•
•
•
•
•
Register Direct
Register Indirect
Register Indirect Post-modified
Register Indirect Pre-modified
Register Indirect with Register Offset (Indexed)
Register Indirect with Literal Offset
8-bit Literal
16-bit Literal
Note:
4.1.4
Not all instructions support all the addressing modes given above. Individual
instructions may support different subsets
of these addressing modes.
MAC INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also
referred to as MAC instructions, utilize a simplified set of
addressing modes to allow the user to effectively
manipulate the data pointers through register indirect
tables.
The two source operand prefetch registers must belong
to the set {W8, W9, W10, W11}. For data reads, W8
and W9 are always directed to the X RAGU. W10 and
W11 are always directed to the Y AGU. The effective
addresses generated (before and after modification)
must, therefore, be valid addresses within X data space
for W8 and W9 and Y data space for W10 and W11.
Note:
Register Indirect with Register Offset
addressing is only available for W9 (in X
space) and W11 (in Y space).
DS70139E-page 42
In summary, the following addressing modes are
supported by the MAC class of instructions:
•
•
•
•
•
Register Indirect
Register Indirect Post-modified by 2
Register Indirect Post-modified by 4
Register Indirect Post-modified by 6
Register Indirect with Register Offset (Indexed)
4.1.5
OTHER INSTRUCTIONS
Besides the various addressing modes outlined above,
some instructions use literal constants of various sizes.
For example, BRA (branch) instructions use 16-bit
signed literals to specify the branch destination directly,
whereas the DISI instruction uses a 14-bit unsigned
literal field. In some instructions, such as ADD Acc, the
source of an operand or result is implied by the opcode
itself. Certain operations, such as NOP, do not have any
operands.
4.2
Modulo Addressing
Modulo Addressing is a method of providing an automated means to support circular data buffers using
hardware. The objective is to remove the need for software to perform data address boundary checks when
executing tightly looped code, as is typical in many
DSP algorithms.
Modulo Addressing can operate in either data or program space (since the data pointer mechanism is
essentially the same for both). One circular buffer can
be supported in each of the X (which also provides the
pointers into program space) and Y data spaces. Modulo Addressing can operate on any W register pointer.
However, it is not advisable to use W14 or W15 for Modulo Addressing since these two registers are used as
the Stack Frame Pointer and Stack Pointer, respectively.
In general, any particular circular buffer can only be
configured to operate in one direction, as there are certain restrictions on the buffer Start address (for incrementing buffers), or end address (for decrementing
buffers) based upon the direction of the buffer.
The only exception to the usage restrictions is for buffers that have a power-of-2 length. As these buffers satisfy the Start and end address criteria, they can operate
in a Bidirectional mode (i.e., address boundary checks
are performed on both the lower and upper address
boundaries).
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
4.2.1
START AND END ADDRESS
4.2.2
The Modulo Addressing scheme requires that a starting and an ending address be specified and loaded
into the 16-bit Modulo Buffer Address registers:
XMODSRT, XMODEND, YMODSRT and YMODEND
(see Table 3-3).
Note:
Y space Modulo Addressing EA calculations assume word-sized data (LSb of
every EA is always clear).
The length of a circular buffer is not directly specified. It
is determined by the difference between the corresponding Start and end addresses. The maximum possible length of the circular buffer is 32K words
(64 Kbytes).
W ADDRESS REGISTER
SELECTION
The Modulo and Bit-Reversed Addressing Control register, MODCON<15:0>, contains enable flags as well
as a W register field to specify the W address registers.
The XWM and YWM fields select which registers operate with Modulo Addressing. If XWM = 15, X RAGU
and X WAGU Modulo Addressing is disabled. Similarly,
if YWM = 15, Y AGU Modulo Addressing is disabled.
The X Address Space Pointer W register (XWM), to
which Modulo Addressing is to be applied, is stored in
MODCON<3:0> (see Table 3-3). Modulo Addressing is
enabled for X data space when XWM is set to any value
other than ‘15’ and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM), to
which Modulo Addressing is to be applied, is stored in
MODCON<7:4>. Modulo Addressing is enabled for Y
data space when YWM is set to any value other than
‘15’ and the YMODEN bit is set at MODCON<14>.
FIGURE 4-1:
MODULO ADDRESSING OPERATION EXAMPLE
Byte
Address
0x1100
MOV
MOV
MOV
MOV
MOV
MOV
#0x1100,W0
W0,XMODSRT
#0x1163,W0
W0,MODEND
#0x8001,W0
W0,MODCON
MOV
#0x0000,W0
;W0 holds buffer fill value
MOV
#0x1110,W1
;point W1 to buffer
DO
AGAIN,#0x31
MOV
W0,[W1++]
AGAIN: INC W0,W0
0x1163
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;fill the 50 buffer locations
;fill the next location
;increment the fill value
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
© 2006 Microchip Technology Inc.
DS70139E-page 43
dsPIC30F2011/2012/3012/3013
4.2.3
MODULO ADDRESSING
APPLICABILITY
Modulo Addressing can be applied to the Effective
Address (EA) calculation associated with any W register. It is important to realize that the address boundaries check for addresses less than, or greater than the
upper (for incrementing buffers), and lower (for decrementing buffers) boundary addresses (not just equal
to). Address changes may, therefore, jump beyond
boundaries and still be adjusted correctly.
Note:
4.3
The modulo corrected Effective Address is
written back to the register only when PreModify or Post-Modify Addressing mode is
used to compute the Effective Address.
When an address offset (e.g., [W7+W2]) is
used, Modulo address correction is performed, but the contents of the register
remain unchanged.
Bit-Reversed Addressing
Bit-Reversed Addressing is intended to simplify data
re-ordering for radix-2 FFT algorithms. It is supported
by the X AGU for data writes only.
The modifier, which may be a constant value or register
contents, is regarded as having its bit order reversed. The
address source and destination are kept in normal order.
Thus, the only operand requiring reversal is the modifier.
4.3.1
BIT-REVERSED ADDRESSING
IMPLEMENTATION
Bit-Reversed Addressing is enabled when:
1.
2.
3.
BWM (W register selection) in the MODCON
register is any value other than ‘15’ (the stack
cannot be accessed using Bit-Reversed
Addressing) and
the BREN bit is set in the XBREV register and
the addressing mode used is Register Indirect
with Pre-Increment or Post-Increment.
DS70139E-page 44
If the length of a bit-reversed buffer is M = 2N bytes,
then the last ‘N’ bits of the data buffer Start address
must be zeros.
XB<14:0> is the bit-reversed address modifier or ‘pivot
point’ which is typically a constant. In the case of an
FFT computation, its value is equal to half of the FFT
data buffer size.
Note:
All bit-reversed EA calculations assume
word-sized data (LSb of every EA is
always clear). The XB value is scaled
accordingly to generate compatible (byte)
addresses.
When enabled, Bit-Reversed Addressing is only executed for register indirect with pre-increment or postincrement addressing and word-sized data writes. It
does not function for any other addressing mode or for
byte-sized data. Normal addresses are generated
instead. When Bit-Reversed Addressing is active, the
W address pointer is always added to the address
modifier (XB) and the offset associated with the Register Indirect Addressing mode is ignored. In addition, as
word-sized data is a requirement, the LSb of the EA is
ignored (and always clear).
Note:
Modulo Addressing and Bit-Reversed
Addressing should not be enabled
together. In the event that the user attempts
to do this, Bit-Reversed Addressing
assumes priority when active for the X
WAGU, and X WAGU Modulo Addressing
is disabled. However, Modulo Addressing
continues to function in the X RAGU.
If Bit-Reversed Addressing has already been enabled
by setting the BREN (XBREV<15>) bit, then a write to
the XBREV register should not be immediately followed
by an indirect read operation using the W register that
has been designated as the bit-reversed pointer.
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 4-2:
BIT-REVERSED ADDRESS EXAMPLE
Sequential Address
b15 b14 b13 b12 b11 b10 b9 b8
b7 b6 b5 b4
b3 b2 b1
0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
b15 b14 b13 b12 b11 b10 b9 b8
b7 b6 b5 b1
b2 b3 b4
0
Bit-Reversed Address
Pivot Point
XB = 0x0008 for a 16-word Bit-Reversed Buffer
TABLE 4-2:
BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)
Normal Address
Bit-Reversed Address
A3
A2
A1
A0
Decimal
A3
A2
A1
A0
Decimal
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
8
0
0
1
0
2
0
1
0
0
4
0
0
1
1
3
1
1
0
0
12
0
1
0
0
4
0
0
1
0
2
0
1
0
1
5
1
0
1
0
10
0
1
1
0
6
0
1
1
0
6
0
1
1
1
7
1
1
1
0
14
1
0
0
0
8
0
0
0
1
1
1
0
0
1
9
1
0
0
1
9
1
0
1
0
10
0
1
0
1
5
1
0
1
1
11
1
1
0
1
13
1
1
0
0
12
0
0
1
1
3
1
1
0
1
13
1
0
1
1
11
1
1
1
0
14
0
1
1
1
7
1
1
1
1
15
1
1
1
1
15
TABLE 4-3:
BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER
Buffer Size (Words)
XB<14:0> Bit-Reversed Address Modifier Value
1024
0x0200
512
0x0100
256
0x0080
128
0x0040
64
0x0020
32
0x0010
16
0x0008
8
0x0004
4
0x0002
2
0x0001
© 2006 Microchip Technology Inc.
DS70139E-page 45
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 46
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
5.0
FLASH PROGRAM MEMORY
5.2
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
RTSP is accomplished using TBLRD (table read) and
TBLWT (table write) instructions.
With RTSP, the user may erase program memory, 32
instructions (96 bytes) at a time and can write program
memory data, 32 instructions (96 bytes) at a time.
The dsPIC30F family of devices contains internal program Flash memory for executing user code. There are
two methods by which the user can program this
memory:
1.
2.
5.1
5.3
Table Instruction Operation
Summary
The TBLRDL and the TBLWTL instructions are used to
read or write to bits<15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
Word or Byte mode.
Run-Time Self-Programming (RTSP)
In-Circuit Serial Programming™ (ICSP™)
The TBLRDH and TBLWTH instructions are used to read
or write to bits<23:16> of program memory. TBLRDH
and TBLWTH can access program memory in Word or
Byte mode.
In-Circuit Serial Programming
(ICSP)
dsPIC30F devices can be serially programmed while in
the end application circuit. This is simply done with two
lines for Programming Clock and Programming Data
(which are named PGC and PGD respectively), and
three other lines for Power (VDD), Ground (VSS) and
Master Clear (MCLR). This allows customers to manufacture boards with unprogrammed devices, and then
program the microcontroller just before shipping the
product. This also allows the most recent firmware or a
custom firmware to be programmed.
FIGURE 5-1:
Run-Time Self-Programming
(RTSP)
A 24-bit program memory address is formed using
bits<7:0> of the TBLPAG register and the Effective
Address (EA) from a W register specified in the table
instruction, as shown in Figure 5-1.
ADDRESSING FOR TABLE AND NVM REGISTERS
24 bits
Using
Program
Counter
Program Counter
0
0
NVMADR Reg EA
Using
NVMADR
Addressing
1/0
NVMADRU Reg
8 bits
16 bits
Working Reg EA
Using
Table
Instruction
User/Configuration
Space Select
© 2006 Microchip Technology Inc.
1/0
TBLPAG Reg
8 bits
16 bits
24-bit EA
Byte
Select
DS70139E-page 47
dsPIC30F2011/2012/3012/3013
5.4
RTSP Operation
The dsPIC30F Flash program memory is organized
into rows and panels. Each row consists of 32 instructions or 96 bytes. Each panel consists of 128 rows or
4K x 24 instructions. RTSP allows the user to erase one
row (32 instructions) at a time and to program four
instructions at one time. RTSP may be used to program
multiple program memory panels, but the Table Pointer
must be changed at each panel boundary.
Each panel of program memory contains write latches
that hold 32 instructions of programming data. Prior to
the actual programming operation, the write data must
be loaded into the panel write latches. The data to be
programmed into the panel is loaded in sequential
order into the write latches; instruction 0, instruction 1,
etc. The instruction words loaded must always be from
a 32 address boundary.
The basic sequence for RTSP programming is to set up
a Table Pointer, then do a series of TBLWT instructions
to load the write latches. Programming is performed by
setting the special bits in the NVMCON register. 32
TBLWTL and four TBLWTH instructions are required to
load the 32 instructions. If multiple panel programming
is required, the Table Pointer needs to be changed and
the next set of multiple write latches written.
All of the table write operations are single-word writes
(2 instruction cycles), because only the table latches
are written. A programming cycle is required for
programming each row.
The Flash Program Memory is readable, writable and
erasable during normal operation over the entire VDD
range.
5.5
The four SFRs used to read and write the program
Flash memory are:
•
•
•
•
NVMCON
NVMADR
NVMADRU
NVMKEY
5.5.1
NVMCON REGISTER
The NVMCON register controls which blocks are to be
erased, which memory type is to be programmed, and
start of the programming cycle.
5.5.2
NVMADR REGISTER
The NVMADR register is used to hold the lower two
bytes of the Effective Address. The NVMADR register
captures the EA<15:0> of the last table instruction that
has been executed and selects the row to write.
5.5.3
NVMADRU REGISTER
The NVMADRU register is used to hold the upper byte
of the Effective Address. The NVMADRU register captures the EA<23:16> of the last table instruction that
has been executed.
5.5.4
NVMKEY REGISTER
NVMKEY is a write-only register that is used for write
protection. To start a programming or an erase
sequence, the user must consecutively write 0x55 and
0xAA to the NVMKEY register. Refer to Section 5.6
“Programming Operations” for further details.
Note:
DS70139E-page 48
Control Registers
The user can also directly write to the
NVMADR and NVMADRU registers to
specify a program memory address for
erasing or programming.
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
5.6
Programming Operations
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. A programming operation is nominally 2 msec in
duration and the processor stalls (waits) until the operation is finished. Setting the WR bit (NVMCON<15>)
starts the operation and the WR bit is automatically
cleared when the operation is finished.
5.6.1
4.
5.
PROGRAMMING ALGORITHM FOR
PROGRAM FLASH
The user can erase or program one row of program
Flash memory at a time. The general process is:
1.
2.
3.
Read one row of program Flash (32 instruction
words) and store into data RAM as a data
“image”.
Update the data image with the desired new
data.
Erase program Flash row.
a) Setup NVMCON register for multi-word,
program Flash, erase, and set WREN bit.
b) Write address of row to be erased into
NVMADRU/NVMDR.
c) Write ‘55’ to NVMKEY.
d) Write ‘AA’ to NVMKEY.
e) Set the WR bit. This begins erase cycle.
f) CPU stalls for the duration of the erase cycle.
g) The WR bit is cleared when erase cycle
ends.
EXAMPLE 5-1:
6.
Write 32 instruction words of data from data
RAM “image” into the program Flash write
latches.
Program 32 instruction words into program
Flash.
a) Setup NVMCON register for multi-word,
program Flash, program, and set WREN
bit.
b) Write ‘55’ to NVMKEY.
c) Write ‘AA’ to NVMKEY.
d) Set the WR bit. This begins program cycle.
e) CPU stalls for duration of the program cycle.
f) The WR bit is cleared by the hardware
when program cycle ends.
Repeat steps 1 through 5 as needed to program
desired amount of program Flash memory.
5.6.2
ERASING A ROW OF PROGRAM
MEMORY
Example 5-1 shows a code sequence that can be used
to erase a row (32 instructions) of program memory.
ERASING A ROW OF PROGRAM MEMORY
; Setup NVMCON for erase operation, multi word
; program memory selected, and writes enabled
MOV
#0x4041,W0
;
;
MOV
W0,NVMCON
; Init pointer to row to be ERASED
MOV
#tblpage(PROG_ADDR),W0
;
;
MOV
W0,NVMADRU
MOV
#tbloffset(PROG_ADDR),W0
;
MOV
W0, NVMADR
;
DISI
#5
;
;
MOV
#0x55,W0
;
MOV
W0,NVMKEY
MOV
#0xAA,W1
;
MOV
W1,NVMKEY
;
BSET
NVMCON,#WR
;
NOP
;
NOP
;
© 2006 Microchip Technology Inc.
write
Init NVMCON SFR
Initialize PM Page Boundary SFR
Intialize in-page EA[15:0] pointer
Initialize NVMADR SFR
Block all interrupts with priority <7 for
next 5 instructions
Write the 0x55 key
Write the 0xAA key
Start the erase sequence
Insert two NOPs after the erase
command is asserted
DS70139E-page 49
dsPIC30F2011/2012/3012/3013
5.6.3
LOADING WRITE LATCHES
5.6.4
Example 5-2 shows a sequence of instructions that
can be used to load the 96 bytes of write latches. 32
TBLWTL and 32 TBLWTH instructions are needed to
load the write latches selected by the Table Pointer.
EXAMPLE 5-2:
INITIATING THE PROGRAMMING
SEQUENCE
For protection, the write initiate sequence for NVMKEY
must be used to allow any erase or program operation
to proceed. After the programming command has been
executed, the user must wait for the programming time
until programming is complete. The two instructions following the start of the programming sequence should
be NOPs as shown in Example 5-3.
LOADING WRITE LATCHES
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
MOV
#0x0000,W0
;
; Initialize PM Page Boundary SFR
MOV
W0,TBLPAG
MOV
#0x6000,W0
; An example program memory address
; Perform the TBLWT instructions to write the latches
; 0th_program_word
MOV
#LOW_WORD_0,W2
;
MOV
#HIGH_BYTE_0,W3
;
; Write PM low word into program latch
TBLWTL W2,[W0]
; Write PM high byte into program latch
TBLWTH W3,[W0++]
; 1st_program_word
MOV
#LOW_WORD_1,W2
;
MOV
#HIGH_BYTE_1,W3
;
; Write PM low word into program latch
TBLWTL W2,[W0]
TBLWTH W3,[W0++]
; Write PM high byte into program latch
; 2nd_program_word
MOV
#LOW_WORD_2,W2
;
MOV
#HIGH_BYTE_2,W3
;
; Write PM low word into program latch
TBLWTL W2, [W0]
; Write PM high byte into program latch
TBLWTH W3, [W0++]
•
•
•
; 31st_program_word
MOV
#LOW_WORD_31,W2
;
MOV
#HIGH_BYTE_31,W3
;
; Write PM low word into program latch
TBLWTL W2, [W0]
; Write PM high byte into program latch
TBLWTH W3, [W0++]
Note: In Example 5-2, the contents of the upper byte of W3 has no effect.
EXAMPLE 5-3:
INITIATING A PROGRAMMING SEQUENCE
DISI
#5
MOV
MOV
MOV
MOV
BSET
NOP
NOP
#0x55,W0
W0,NVMKEY
#0xAA,W1
W1,NVMKEY
NVMCON,#WR
DS70139E-page 50
;
;
;
;
;
;
;
;
;
Block all interrupts with priority <7 for
next 5 instructions
Write the 0x55 key
Write the 0xAA key
Start the erase sequence
Insert two NOPs after the erase
command is asserted
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 5-1:
File Name
NVM REGISTER MAP
Addr.
Bit 15
Bit 14
Bit 13
NVMCON
0760
WR
WREN
WRERR
NVMADR
0762
NVMADRU
0764
—
—
—
—
—
—
—
—
NVMADR<23:16>
0000 0000 uuuu uuuu
0766
—
—
—
—
—
—
—
—
KEY<7:0>
0000 0000 0000 0000
NVMKEY
Legend:
Note:
Bit 12 Bit 11 Bit 10
—
—
—
Bit 9
—
Bit 8
Bit 7
TWRI
—
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
PROGOP<6:0>
NVMADR<15:0>
Bit 1
Bit 0
All RESETS
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
u = uninitialized bit
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F2011/2012/3012/3013
DS70139E-page 51
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 52
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
6.0
DATA EEPROM MEMORY
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual“ (DS70157).
The data EEPROM memory is readable and writable
during normal operation over the entire VDD range. The
data EEPROM memory is directly mapped in the
program memory address space.
The four SFRs used to read and write the program
Flash memory are used to access data EEPROM
memory, as well. As described in Section 5.5 “Control
Registers”, these registers are:
•
•
•
•
NVMCON
NVMADR
NVMADRU
NVMKEY
The EEPROM data memory allows read and write of
single words and 16-word blocks. When interfacing to
data memory, NVMADR, in conjunction with the
NVMADRU register, are used to address the
EEPROM location being accessed. TBLRDL and
TBLWTL instructions are used to read and write data
EEPROM. The dsPIC30F devices have up to 8 Kbytes
(4K words) of data EEPROM with an address range
from 0x7FF000 to 0x7FFFFE.
Control bit WR initiates write operations similar to program Flash writes. This bit cannot be cleared, only set,
in software. They are cleared in hardware at the completion of the write operation. The inability to clear the
WR bit in software prevents the accidental or
premature termination of a write operation.
The WREN bit, when set, allows a write operation. On
power-up, the WREN bit is clear. The WRERR bit is set
when a write operation is interrupted by a MCLR Reset
or a WDT Time-out Reset during normal operation. In
these situations, following Reset, the user can check
the WRERR bit and rewrite the location. The address
register NVMADR remains unchanged.
Note:
6.1
Interrupt flag bit NVMIF in the IFS0 register is set when write is complete. It must be
cleared in software.
Reading the Data EEPROM
A TBLRD instruction reads a word at the current program word address. This example uses W0 as a
pointer to data EEPROM. The result is placed in
register W4 as shown in Example 6-1.
EXAMPLE 6-1:
MOV
MOV
MOV
TBLRDL
DATA EEPROM READ
#LOW_ADDR_WORD,W0 ; Init Pointer
#HIGH_ADDR_WORD,W1
W1,TBLPAG
[ W0 ], W4
; read data EEPROM
A word write operation should be preceded by an erase
of the corresponding memory location(s). The write typically requires 2 ms to complete, but the write time
varies with voltage and temperature.
A program or erase operation on the data EEPROM
does not stop the instruction flow. The user is responsible for waiting for the appropriate duration of time
before initiating another data EEPROM write/erase
operation. Attempting to read the data EEPROM while
a programming or erase operation is in progress results
in unspecified data.
© 2006 Microchip Technology Inc.
DS70139E-page 53
dsPIC30F2011/2012/3012/3013
6.2
6.2.1
Erasing Data EEPROM
ERASING A BLOCK OF DATA
EEPROM
In order to erase a block of data EEPROM, the
NVMADRU and NVMADR registers must initially point
to the block of memory to be erased. Configure
NVMCON for erasing a block of data EEPROM and
set the WR and WREN bits in the NVMCON register.
Setting the WR bit initiates the erase, as shown in
Example 6-2.
EXAMPLE 6-2:
DATA EEPROM BLOCK ERASE
; Select data EEPROM block, WR, WREN bits
MOV
#0x4045,W0
; Initialize NVMCON SFR
MOV
W0,NVMCON
; Start erase cycle by setting WR after writing key sequence
DISI
#5
; Block all interrupts with priority <7 for
; next 5 instructions
MOV
#0x55,W0
;
; Write the 0x55 key
MOV
W0,NVMKEY
MOV
#0xAA,W1
;
; Write the 0xAA key
MOV
W1,NVMKEY
BSET
NVMCON,#WR
; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete
6.2.2
ERASING A WORD OF DATA
EEPROM
The NVMADRU and NVMADR registers must point to
the block. Select WR a block of data Flash and set the
WR and WREN bits in the NVMCON register. Setting
the WR bit initiates the erase, as shown in Example 63.
EXAMPLE 6-3:
DATA EEPROM WORD ERASE
; Select data EEPROM word, WR, WREN bits
MOV
#0x4044,W0
MOV
W0,NVMCON
; Start erase cycle by setting WR after writing key sequence
DISI
#5
; Block all interrupts with priority <7 for
; next 5 instructions
MOV
#0x55,W0
;
; Write the 0x55 key
MOV
W0,NVMKEY
MOV
#0xAA,W1
;
; Write the 0xAA key
MOV
W1,NVMKEY
BSET
NVMCON,#WR
; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete
DS70139E-page 54
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
6.3
Writing to the Data EEPROM
To write an EEPROM data location, the following
sequence must be followed:
1.
2.
3.
Erase data EEPROM word.
a) Select word, data EEPROM erase, and set
WREN bit in NVMCON register.
b) Write address of word to be erased into
NVMADR.
c) Enable NVM interrupt (optional).
d) Write ‘55’ to NVMKEY.
e) Write ‘AA’ to NVMKEY.
f) Set the WR bit. This begins erase cycle.
g) Either poll NVMIF bit or wait for NVMIF
interrupt.
h) The WR bit is cleared when the erase cycle
ends.
Write data word into data EEPROM write
latches.
Program 1 data word into data EEPROM.
a) Select word, data EEPROM program, and
set WREN bit in NVMCON register.
b) Enable NVM write done interrupt (optional).
c) Write ‘55’ to NVMKEY.
d) Write ‘AA’ to NVMKEY.
e) Set the WR bit. This begins program cycle.
f) Either poll NVMIF bit or wait for NVM
interrupt.
g) The WR bit is cleared when the write cycle
ends.
EXAMPLE 6-4:
The write does not initiate if the above sequence is not
exactly followed (write 0x55 to NVMKEY, write 0xAA to
NVMCON, then set WR bit) for each word. It is strongly
recommended that interrupts be disabled during this
code segment.
Additionally, the WREN bit in NVMCON must be set to
enable writes. This mechanism prevents accidental
writes to data EEPROM due to unexpected code execution. The WREN bit should be kept clear at all times
except when updating the EEPROM. The WREN bit is
not cleared by hardware.
After a write sequence has been initiated, clearing the
WREN bit does not affect the current write cycle. The
WR bit is inhibited from being set unless the WREN bit
is set. The WREN bit must be set on a previous instruction. Both WR and WREN cannot be set with the same
instruction.
At the completion of the write cycle, the WR bit is
cleared in hardware and the Nonvolatile Memory Write
Complete Interrupt Flag bit (NVMIF) is set. The user
may either enable this interrupt or poll this bit. NVMIF
must be cleared by software.
6.3.1
WRITING A WORD OF DATA
EEPROM
Once the user has erased the word to be programmed,
then a table write instruction is used to write one write
latch, as shown in Example 6-4.
6.3.2
WRITING A BLOCK OF DATA
EEPROM
To write a block of data EEPROM, write to all sixteen
latches first, then set the NVMCON register and
program the block.
DATA EEPROM WORD WRITE
; Point to data memory
MOV
#LOW_ADDR_WORD,W0
MOV
#HIGH_ADDR_WORD,W1
MOV
W1,TBLPAG
MOV
#LOW(WORD),W2
TBLWTL
W2,[ W0]
; The NVMADR captures last table access address
; Select data EEPROM for 1 word op
MOV
#0x4004,W0
MOV
W0,NVMCON
; Operate key to allow write operation
DISI
#5
; Init pointer
; Get data
; Write data
; Block all interrupts with priority <7 for
; next 5 instructions
MOV
#0x55,W0
; Write the 0x55 key
MOV
W0,NVMKEY
MOV
#0xAA,W1
MOV
W1,NVMKEY
; Write the 0xAA key
BSET
NVMCON,#WR
; Initiate program sequence
NOP
NOP
; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete
© 2006 Microchip Technology Inc.
DS70139E-page 55
dsPIC30F2011/2012/3012/3013
EXAMPLE 6-5:
6.4
DATA EEPROM BLOCK WRITE
MOV
MOV
MOV
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
MOV
DISI
#5
#LOW_ADDR_WORD,W0
#HIGH_ADDR_WORD,W1
W1,TBLPAG
#data1,W2
W2,[ W0]++
#data2,W2
W2,[ W0]++
#data3,W2
W2,[ W0]++
#data4,W2
W2,[ W0]++
#data5,W2
W2,[ W0]++
#data6,W2
W2,[ W0]++
#data7,W2
W2,[ W0]++
#data8,W2
W2,[ W0]++
#data9,W2
W2,[ W0]++
#data10,W2
W2,[ W0]++
#data11,W2
W2,[ W0]++
#data12,W2
W2,[ W0]++
#data13,W2
W2,[ W0]++
#data14,W2
W2,[ W0]++
#data15,W2
W2,[ W0]++
#data16,W2
W2,[ W0]++
#0x400A,W0
W0,NVMCON
MOV
MOV
MOV
MOV
BSET
NOP
NOP
#0x55,W0
W0,NVMKEY
#0xAA,W1
W1,NVMKEY
NVMCON,#WR
; Init pointer
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
Get 1st data
write data
Get 2nd data
write data
Get 3rd data
write data
Get 4th data
write data
Get 5th data
write data
Get 6th data
write data
Get 7th data
write data
Get 8th data
write data
Get 9th data
write data
Get 10th data
write data
Get 11th data
write data
Get 12th data
write data
Get 13th data
write data
Get 14th data
write data
Get 15th data
write data
Get 16th data
write data. The NVMADR captures last table access address.
Select data EEPROM for multi word op
Operate Key to allow program operation
Block all interrupts with priority <7 for
next 5 instructions
; Write the 0x55 key
; Write the 0xAA key
; Start write cycle
Write Verify
Depending on the application, good programming
practice may dictate that the value written to the memory should be verified against the original value. This
should be used in applications where excessive writes
can stress bits near the specification limit.
6.5
Protection Against Spurious Write
There are conditions when the device may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been built-in. On power-up, the WREN bit is cleared;
also, the Power-up Timer prevents EEPROM write.
The write initiate sequence and the WREN bit together
help prevent an accidental write during brown-out,
power glitch, or software malfunction.
DS70139E-page 56
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
7.0
I/O PORTS
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual “ (DS70046).
All of the device pins (except VDD, VSS, MCLR and
OSC1/CLKI) are shared between the peripherals and
the parallel I/O ports.
All I/O input ports feature Schmitt Trigger inputs for
improved noise immunity.
7.1
Parallel I/O (PIO) Ports
When a peripheral is enabled and the peripheral is
actively driving an associated pin, the use of the pin as
a general purpose output pin is disabled. The I/O pin
can be read, but the output driver for the parallel port bit
is disabled. If a peripheral is enabled, but the peripheral
is not actively driving a pin, that pin can be driven by a
port.
Any bit and its associated data and Control registers
that are not valid for a particular device are disabled.
That means the corresponding LATx and TRISx
registers and the port pin read as zeros.
When a pin is shared with another peripheral or function that is defined as an input only, it is nevertheless
regarded as a dedicated port because there is no
other competing source of outputs.
A parallel I/O (PIO) port that shares a pin with a peripheral is, in general, subservient to the peripheral. The
peripheral’s output buffer data and control signals are
provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
has ownership of the output data and control signals of
the I/O pad cell. Figure 7-1 shows how ports are shared
with other peripherals and the associated I/O cell (pad)
to which they are connected.
The format of the registers for the shared ports,
(PORTB, PORTC, PORTD and PORTF) are shown in
Table 7-1 through Table 7-6.
Note:
All port pins have three registers directly associated
with the operation of the port pin. The Data Direction
register (TRISx) determines whether the pin is an input
or an output. If the data direction bit is a ‘1’, then the pin
is an input. All port pins are defined as inputs after a
Reset. Reads from the latch (LATx), read the latch.
Writes to the latch, write the latch (LATx). Reads from
the port (PORTx), read the port pins and writes to the
port pins, write the latch (LATx).
FIGURE 7-1:
The actual bits in use vary between
devices.
BLOCK DIAGRAM OF A SHARED PORT STRUCTURE
Output Multiplexers
Peripheral Module
Peripheral Input Data
Peripheral Module Enable
Peripheral Output Enable
Peripheral Output Data
I/O Cell
1 Output Enable
0
1
PIO Module
Output Data
0
Read TRIS
Data Bus
WR TRIS
D
I/O Pad
Q
CK
TRIS Latch
D
WR LAT +
WR Port
Q
CK
Data Latch
Read LAT
Input Data
Read Port
© 2006 Microchip Technology Inc.
DS70139E-page 57
dsPIC30F2011/2012/3012/3013
7.2
Configuring Analog Port Pins
The use of the ADPCFG and TRIS registers control the
operation of the A/D port pins. The port pins that are
desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared
(output), the digital output level (VOH or VOL) is
converted.
When the PORT register is read, all pins configured as
analog input channels are read as cleared (a low level).
Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a
digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.
DS70139E-page 58
7.2.1
I/O PORT WRITE/READ TIMING
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically this instruction
would be a NOP.
EXAMPLE 7-1:
MOV
#0xF0, W0;
;
MOV W0, TRISB;
NOP
;
btss PORTB, #7;
PORT WRITE/READ
EXAMPLE
Configure PORTB<7:4>
as inputs
and PORTB<3:0> as outputs
additional instruction cycle
bit test RB7 and skip if set
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 7-1:
SFR
Name
PORTB REGISTER MAP FOR dsPIC30F2011/3012
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
TRISB
02C6
—
—
—
—
—
—
—
—
PORTB
02C8
—
—
—
—
—
—
—
—
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
0000 0000 0000 0000
LATB
02CB
—
—
—
—
—
—
—
—
LATB7
LATB6
LATB5
LATB4
LATB3
LATB2
LATB1
LATB0
0000 0000 0000 0000
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TABLE 7-2:
SFR
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 0000 0000 1111 1111
PORTB REGISTER MAP FOR dsPIC30F2012/3013
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
TRISB
02C6
—
—
—
—
—
—
TRISB9
TRISB8
PORTB
02C8
—
—
—
—
—
—
RB9
RB8
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
0000 0000 0000 0000
LATB
02CB
—
—
—
—
—
—
LATB9
LATB8
LATB7
LATB6
LATB5
LATB4
LATB3
LATB2
LATB1
LATB0
0000 0000 0000 0000
SFR
Name
PORTC REGISTER MAP FOR dsPIC30F2011/2012/3012/3013
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TRISC
02CC
—
—
—
—
—
—
—
—
—
—
—
—
—
1110 0000 0000 0000
PORTC
02CE
RC15
RC14
RC13
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
LATC
02D0
LATC15
LATC14
LATC13
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
TABLE 7-4:
SFR
Name
TRISC15 TRISC14 TRISC13
PORTD REGISTER MAP FOR dsPIC30F2011/3012
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TRISD
02D2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
PORTD
02D4
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
RD0
0000 0000 0000 0000
LATD
02D6
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
LATD0
0000 0000 0000 0000
TRISD0 0000 0000 0000 0001
DS70139E-page 59
dsPIC30F2011/2012/3012/3013
TABLE 7-3:
TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 0000 0011 1111 1111
SFR
Name
PORTD REGISTER MAP FOR dsPIC30F2012/3013
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TRISD
02D2
—
—
—
—
—
—
TRISD9
TRISD8
—
—
—
—
—
—
—
—
0000 0011 0000 0000
PORTD
02D4
—
—
—
—
—
—
RD9
RD8
—
—
—
—
—
—
—
—
0000 0000 0000 0000
LATD
02D6
—
—
—
—
—
—
LATD9
LATD8
—
—
—
—
—
—
—
—
0000 0000 0000 0000
TABLE 7-6:
PORTF REGISTER MAP FOR dsPIC30F2012/3013
SFR
Name
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TRISF
02DE
—
—
—
—
—
—
—
—
—
TRISF6
TRISF5
TRISF4
TRISF3
TRISF2
—
—
0000 0000 0111 1100
PORTF
02E0
—
—
—
—
—
—
—
—
—
RF6
RF5
RF4
RF3
RF2
—
—
0000 0000 0000 0000
LATF
02E2
—
—
—
—
—
—
—
—
—
LATF6
LATF5
LATF4
LATF3
LATF2
—
—
0000 0000 0000 0000
Note:
The dsPIC30F2011/3012 do not have TRISF, PORTF or LATF.
dsPIC30F2011/2012/3012/3013
DS70139E-page 60
TABLE 7-5:
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
7.3
Input Change Notification Module
The input change notification module provides the
dsPIC30F devices the ability to generate interrupt
requests to the processor, in response to a change of
state on selected input pins. This module is capable of
detecting input change of states even in Sleep mode,
when the clocks are disabled. There are up to 10 external signals (CN0 through CN7, CN17 and CN18) that
may be selected (enabled) for generating an interrupt
request on a change of state.
TABLE 7-7:
INPUT CHANGE NOTIFICATION REGISTER MAP FOR dsPIC30F2011/3012 (BITS 7-0)
SFR
Name
Addr.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
CNEN1
00C0
CN7IE
CN6IE
CN5IE
CN4IE
CN3IE
CN2IE
CN1IE
CN0IE
0000 0000 0000 0000
CNEN2
00C2
—
—
—
—
—
—
—
—
0000 0000 0000 0000
CNPU1
00C4
CN7PUE
CN6PUE
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CN1PUE
CN0PUE
0000 0000 0000 0000
CNPU2
00C6
—
—
—
—
—
—
—
—
0000 0000 0000 0000
TABLE 7-8:
INPUT CHANGE NOTIFICATION REGISTER MAP FOR dsPIC30F2012/3013 (BITS 7-0)
SFR
Name
Addr.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
CNEN1
00C0
CN7IE
CN6IE
CN5IE
CN4IE
CN3IE
CNEN2
00C2
—
—
—
—
—
CNPU1
00C4
CN7PUE
CN6PUE
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CNPU2
00C6
—
—
—
—
—
Bit 2
Bit 1
Bit 0
Reset State
CN2IE
CN1IE
CN0IE
0000 0000 0000 0000
CN18IE
CN17IE
—
0000 0000 0000 0000
CN1PUE
CN0PUE
0000 0000 0000 0000
—
0000 0000 0000 0000
CN18PUE CN17PUE
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2006 Microchip Technology Inc.
DS70139E-page 61
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 62
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
8.0
INTERRUPTS
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
• INTCON1<15:0>, INTCON2<15:0>
Global interrupt control functions are derived from
these two registers. INTCON1 contains the control and status flags for the processor exceptions.
The INTCON2 register controls the external
interrupt request signal behavior and the use of
the alternate vector table.
Note:
The dsPIC30F sensor family has up to 21 interrupt
sources and 4 processor exceptions (traps) which must
be arbitrated based on a priority scheme.
The CPU is responsible for reading the Interrupt Vector
Table (IVT) and transferring the address contained in
the interrupt vector to the program counter. The interrupt vector is transferred from the program data bus
into the program counter via a 24-bit wide multiplexer
on the input of the program counter.
The Interrupt Vector Table (IVT) and Alternate Interrupt
Vector Table (AIVT) are placed near the beginning of
program memory (0x000004). The IVT and AIVT are
shown in Figure 8-1.
The interrupt controller is responsible for preprocessing the interrupts and processor exceptions
before they are presented to the processor core. The
peripheral interrupts and traps are enabled, prioritized
and controlled using centralized Special Function Registers:
• IFS0<15:0>, IFS1<15:0>, IFS2<15:0>
All interrupt request flags are maintained in these
three registers. The flags are set by their respective peripherals or external signals and they are
cleared via software.
• IEC0<15:0>, IEC1<15:0>, IEC2<15:0>
All interrupt enable control bits are maintained in
these three registers. These control bits are used
to individually enable interrupts from the
peripherals or external signals.
• IPC0<15:0>... IPC10<7:0>
The user assignable priority level associated with
each of these 41 interrupts is held centrally in
these eleven registers.
• IPL<3:0>
The current CPU priority level is explicitly stored
in the IPL bits. IPL<3> is present in the CORCON
register, whereas IPL<2:0> are present in the
STATUS register (SR) in the processor core.
© 2006 Microchip Technology Inc.
Interrupt flag bits get set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an
interrupt.
All interrupt sources can be user assigned to one of 7
priority levels, 1 through 7, via the IPCx registers. Each
interrupt source is associated with an interrupt vector,
as shown in Table 8-1. Levels 7 and 1 represent the
highest and lowest maskable priorities, respectively.
Note:
Assigning a priority level of ‘0’ to an interrupt source is equivalent to disabling that
interrupt.
If the NSTDIS bit (INTCON1<15>) is set, nesting of
interrupts is prevented. Thus, if an interrupt is currently
being serviced, processing of a new interrupt is prevented even if the new interrupt is of higher priority than
the one currently being serviced.
Note:
The IPL bits become read-only whenever
the NSTDIS bit has been set to ‘1’.
Certain interrupts have specialized control bits for features like edge or level triggered interrupts, interrupton-change, etc. Control of these features remains
within the peripheral module which generates the
interrupt.
The DISI instruction can be used to disable the
processing of interrupts of priorities 6 and lower for a
certain number of instructions, during which the DISI bit
(INTCON2<14>) remains set.
When an interrupt is serviced, the PC is loaded with the
address stored in the vector location in program memory that corresponds to the interrupt. There are 63 different vectors within the IVT (refer to Table 8-1). These
vectors are contained in locations 0x000004 through
0x0000FE of program memory (refer to Table 8-1).
These locations contain 24-bit addresses, and in order
to preserve robustness, an address error trap takes
place if the PC attempts to fetch any of these words
during normal execution. This prevents execution of
random data as a result of accidentally decrementing a
PC into vector space, accidentally mapping a data
space address into vector space, or the PC rolling over
to 0x000000 after reaching the end of implemented
program memory space. Execution of a GOTO instruction to this vector space also generates an address
error trap.
DS70139E-page 63
dsPIC30F2011/2012/3012/3013
8.1
Interrupt Priority
The user assignable interrupt priority (IP<2:0>) bits for
each individual interrupt source are located in the LS
3 bits of each nibble within the IPCx register(s). Bit 3 of
each nibble is not used and is read as a ‘0’. These bits
define the priority level assigned to a particular interrupt
by the user.
Note:
The user selectable priority levels start at
0 as the lowest priority and level 7 as the
highest priority.
Natural Order Priority is determined by the position of
an interrupt in the vector table, and only affects
interrupt operation when multiple interrupts with the
same user-assigned priority become pending at the
same time.
Table 8-1 lists the interrupt numbers and interrupt
sources for the dsPIC30F2011/2012/3012/3013
devices and their associated vector numbers.
Note 1: The natural order priority scheme has 0
as the highest priority and 53 as the
lowest priority.
2: The natural order priority number is the
same as the INT number.
The ability for the user to assign every interrupt to one
of seven priority levels means that the user can assign
a very high overall priority level to an interrupt with a
low natural order priority. For example, the PLVD (Low
Voltage Detect) can be given a priority of 7. The INT0
(External Interrupt 0) may be assigned to priority level
1, thus giving it a very low effective priority.
DS70139E-page 64
TABLE 8-1:
INT
Number
INTERRUPT VECTOR TABLE
Vector
Number
Interrupt Source
Highest Natural Order Priority
0
8
INT0 — External Interrupt 0
1
9
IC1 — Input Capture 1
2
10
OC1 — Output Compare 1
3
4
5
6
7
8
9
10
11
12
13
11
12
13
14
15
16
17
18
19
20
21
T1 — Timer 1
IC2 — Input Capture 2
OC2 — Output Compare 2
T2 — Timer 2
T3 — Timer 3
SPI1
U1RX — UART1 Receiver
U1TX — UART1 Transmitter
ADC — ADC Convert Done
NVM — NVM Write Complete
SI2C — I2C™ Slave Interrupt
14
22
MI2C — I2C Master Interrupt
15
23
Input Change Interrupt
16
24
INT1 — External Interrupt 1
17-22
25-30 Reserved
23
31
INT2 — External Interrupt 2
24
32
U2RX* — UART2 Receiver
25
33
U2TX* — UART2 Transmitter
26-41
34-49 Reserved
42
50
LVD — Low-Voltage Detect
43-53
51-61 Reserved
Lowest Natural Order Priority
* Only the dsPIC30F3013 has UART2 and the U2RX,
U2TX interrupts. These locations are reserved for
the dsPIC30F2011/2012/3012.
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
8.2
Reset Sequence
A Reset is not a true exception because the interrupt
controller is not involved in the Reset process. The processor initializes its registers in response to a Reset
which forces the PC to zero. The processor then begins
program execution at location 0x000000. A GOTO
instruction is stored in the first program memory location immediately followed by the address target for the
GOTO instruction. The processor executes the GOTO to
the specified address and then begins operation at the
specified target (start) address.
8.2.1
8.3
Traps
Traps can be considered as non-maskable interrupts
indicating a software or hardware error, which adhere
to a predefined priority as shown in Figure 8-1. They
are intended to provide the user a means to correct
erroneous operation during debug and when operating
within the application.
Note:
RESET SOURCES
In addition to external Reset and Power-on Reset
(POR), there are 6 sources of error conditions which
‘trap’ to the Reset vector.
• Watchdog Time-out:
The watchdog has timed out, indicating that the
processor is no longer executing the correct flow
of code.
• Uninitialized W Register Trap:
An attempt to use an uninitialized W register as
an Address Pointer causes a Reset.
• Illegal Instruction Trap:
Attempted execution of any unused opcodes
results in an illegal instruction trap. Note that a
fetch of an illegal instruction does not result in an
illegal instruction trap if that instruction is flushed
prior to execution due to a flow change.
• Brown-out Reset (BOR):
A momentary dip in the power supply to the
device has been detected which may result in
malfunction.
• Trap Lockout:
Occurrence of multiple trap conditions
simultaneously causes a Reset.
Note that many of these trap conditions can only be
detected when they occur. Consequently, the questionable instruction is allowed to complete prior to trap
exception processing. If the user chooses to recover
from the error, the result of the erroneous action that
caused the trap may have to be corrected.
There are 8 fixed priority levels for traps: Level 8
through Level 15, which implies that the IPL3 is always
set during processing of a trap.
If the user is not currently executing a trap, and he sets
the IPL<3:0> bits to a value of ‘0111’ (Level 7), then all
interrupts are disabled, but traps can still be processed.
8.3.1
TRAP SOURCES
The following traps are provided with increasing priority. However, since all traps can be nested, priority has
little effect.
Math Error Trap:
The math error trap executes under the following three
circumstances:
1.
2.
3.
4.
© 2006 Microchip Technology Inc.
If the user does not intend to take corrective action in the event of a trap error
condition, these vectors must be loaded
with the address of a default handler that
simply contains the RESET instruction. If,
on the other hand, one of the vectors
containing an invalid address is called, an
address error trap is generated.
If an attempt is made to divide by zero, the
divide operation is aborted on a cycle boundary
and the trap is taken.
If enabled, a math error trap is taken when an
arithmetic operation on either accumulator A or
B causes an overflow from bit 31 and the accumulator guard bits are not utilized.
If enabled, a math error trap is taken when an
arithmetic operation on either accumulator A or
B causes a catastrophic overflow from bit 39 and
all saturation is disabled.
If the shift amount specified in a shift instruction
is greater than the maximum allowed shift
amount, a trap occurs.
DS70139E-page 65
dsPIC30F2011/2012/3012/3013
Address Error Trap:
Stack Error Trap:
This trap is initiated when any of the following
circumstances occurs:
This trap is initiated under the following conditions:
1.
2.
3.
4.
A misaligned data word access is attempted.
A data fetch from our unimplemented data
memory location is attempted.
A data access of an unimplemented program
memory location is attempted.
An instruction fetch from vector space is
attempted.
Note:
5.
6.
In the MAC class of instructions, wherein
the data space is split into X and Y data
space, unimplemented X space includes
all of Y space, and unimplemented Y
space includes all of X space.
Execution of a “BRA #literal” instruction or a
“GOTO #literal” instruction, where literal
is an unimplemented program memory address.
Executing instructions after modifying the PC to
point to unimplemented program memory
addresses. The PC may be modified by loading
a value into the stack and executing a RETURN
instruction.
1.
2.
The Stack Pointer is loaded with a value which
is greater than the (user programmable) limit
value written into the SPLIM register (stack
overflow).
The Stack Pointer is loaded with a value which
is less than 0x0800 (simple stack underflow).
Oscillator Fail Trap:
This trap is initiated if the external oscillator fails and
operation becomes reliant on an internal RC backup.
8.3.2
HARD AND SOFT TRAPS
It is possible that multiple traps can become active
within the same cycle (e.g., a misaligned word stack
write to an overflowed address). In such a case, the
fixed priority shown in Figure 8-2 is implemented,
which may require the user to check if other traps are
pending, in order to completely correct the Fault.
‘Soft’ traps include exceptions of priority level 8 through
level 11, inclusive. The arithmetic error trap (level 11)
falls into this category of traps.
‘Hard’ traps include exceptions of priority level 12
through level 15, inclusive. The address error (level
12), stack error (level 13) and oscillator error (level 14)
traps fall into this category.
Each hard trap that occurs must be acknowledged
before code execution of any type can continue. If a
lower priority hard trap occurs while a higher priority
trap is pending, acknowledged, or is being processed,
a hard trap conflict occurs.
The device is automatically Reset in a hard trap conflict
condition. The TRAPR Status bit (RCON<15>) is set
when the Reset occurs, so that the condition may be
detected in software.
DS70139E-page 66
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
IVT
AIVT
8.4
TRAP VECTORS
Reset - GOTO Instruction
Reset - GOTO Address
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
Reserved Vector
Reserved Vector
Reserved Vector
Interrupt 0 Vector
Interrupt 1 Vector
—
—
—
Interrupt 52 Vector
Interrupt 53 Vector
Reserved
Reserved
Reserved
Oscillator Fail Trap Vector
Stack Error Trap Vector
Address Error Trap Vector
Math Error Trap Vector
Reserved Vector
Reserved Vector
Reserved Vector
Interrupt 0 Vector
Interrupt 1 Vector
—
—
—
Interrupt 52 Vector
Interrupt 53 Vector
FIGURE 8-2:
0x000000
0x000002
0x000004
0x000014
0x0000 15
Stack Grows Towards
Higher Address
Decreasing
Priority
FIGURE 8-1:
0x0000FE
If there is a pending IRQ with a priority level greater
than the current processor priority level in the IPL bits,
the processor is interrupted.
The processor then stacks the current program counter
and the low byte of the processor STATUS register
(SRL), as shown in Figure 8-2. The low byte of the
STATUS register contains the processor priority level at
the time prior to the beginning of the interrupt cycle.
The processor then loads the priority level for this interrupt into the STATUS register. This action disables all
lower priority interrupts until the completion of the
Interrupt Service Routine.
PC<15:0>
SRL IPL3 PC<22:16>
<Free Word>
W15 (before CALL)
W15 (after CALL)
PUSH: [W15++]
Note 1: The user can always lower the priority
level by writing a new value into SR. The
Interrupt Service Routine must clear the
interrupt flag bits in the IFSx register
before lowering the processor interrupt
priority, in order to avoid recursive
interrupts.
2: The IPL3 bit (CORCON<3>) is always
clear when interrupts are being processed. It is set only during execution of
traps.
Interrupt Sequence
All interrupt event flags are sampled in the beginning of
each instruction cycle by the IFSx registers. A pending
Interrupt Request (IRQ) is indicated by the flag bit
being equal to a ‘1’ in an IFSx register. The IRQ causes
an interrupt to occur if the corresponding bit in the Interrupt Enable (IECx) register is set. For the remainder of
the instruction cycle, the priorities of all pending interrupt requests are evaluated.
0
POP : [--W15]
0x00007E
0x000080
0x000082
0x000084
0x000094
INTERRUPT STACK
FRAME
The RETFIE (return from interrupt) instruction unstacks
the program counter and STATUS registers to return
the processor to its state prior to the interrupt
sequence.
8.5
Alternate Vector Table
In program memory, the Interrupt Vector Table (IVT) is
followed by the Alternate Interrupt Vector Table (AIVT),
as shown in Figure 8-1. Access to the alternate vector
table is provided by the ALTIVT bit in the INTCON2 register. If the ALTIVT bit is set, all interrupt and exception
processes use the alternate vectors instead of the
default vectors. The alternate vectors are organized in
the same manner as the default vectors. The AIVT supports emulation and debugging efforts by providing a
means to switch between an application and a support
environment without requiring the interrupt vectors to
be reprogrammed. This feature also enables switching
between applications for evaluation of different
software algorithms at run time.
If the AIVT is not required, the program memory allocated to the AIVT may be used for other purposes.
AIVT is not a protected section and may be freely
programmed by the user.
© 2006 Microchip Technology Inc.
DS70139E-page 67
dsPIC30F2011/2012/3012/3013
8.6
Fast Context Saving
A context saving option is available using shadow registers. Shadow registers are provided for the DC, N,
OV, Z and C bits in SR, and the registers W0 through
W3. The shadows are only one level deep. The shadow
registers are accessible using the PUSH.S and POP.S
instructions only.
When the processor vectors to an interrupt, the
PUSH.S instruction can be used to store the current
value of the aforementioned registers into their
respective shadow registers.
If an ISR of a certain priority uses the PUSH.S and
POP.S instructions for fast context saving, then a
higher priority ISR should not include the same instructions. Users must save the key registers in software
during a lower priority interrupt if the higher priority ISR
uses fast context saving.
DS70139E-page 68
8.7
External Interrupt Requests
The interrupt controller supports three external interrupt request signals, INT0-INT2. These inputs are edge
sensitive; they require a low-to-high or a high-to-low
transition to generate an interrupt request. The
INTCON2 register has three bits, INT0EP-INT2EP, that
select the polarity of the edge detection circuitry.
8.8
Wake-up from Sleep and Idle
The interrupt controller may be used to wake-up the
processor from either Sleep or Idle modes, if Sleep or
Idle mode is active when the interrupt is generated.
If an enabled interrupt request of sufficient priority is
received by the interrupt controller, then the standard
interrupt request is presented to the processor. At the
same time, the processor wakes up from Sleep or Idle
and begin execution of the Interrupt Service Routine
(ISR) needed to process the interrupt request.
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 8-2:
SFR
Name
ADR
dsPIC30F2011/2012/3012 INTERRUPT CONTROLLER REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Reset State
—
0000 0000 0000 0000
INTCON1
0080 NSTDIS
—
—
—
—
OVATE
OVBTE
COVTE
—
—
—
MATHERR
ADDRERR
INTCON2
0082 ALTIVT
DISI
—
—
—
—
—
—
—
—
—
—
—
INT2EP
INT1EP
IFS0
0084
CNIF
MI2CIF
SI2CIF
NVMIF
ADIF
U1TXIF
U1RXIF
SPI1IF
T3IF
T2IF
OC2IF
IC2IF
T1IF
OC1IF
IC1IF
INT0IF
0000 0000 0000 0000
—
—
INT2IF
—
—
—
—
—
—
INT1IF
0000 0000 0000 0000
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
SPI1IE
T3IE
T2IE
OC2IE
IC2IE
T1IE
OC1IE
IC1IE
INT0IE
0000 0000 0000 0000
—
—
INT2IE
—
—
—
—
—
—
INT1IE
0000 0000 0000 0000
—
—
—
—
—
—
—
—
—
—
0086
—
—
—
—
—
—
0088
—
—
—
—
—
LVDIF
IEC0
008C
CNIE
MI2CIE
SI2CIE
NVMIE
ADIE
IEC1
008E
—
—
—
—
—
—
IEC2
0090
—
—
—
—
—
LVDIE
IPC0
0094
—
T1IP<2:0>
—
IPC1
0096
—
T31P<2:0>
IPC2
0098
—
ADIP<2:0>
IPC3
009A
—
CNIP<2:0>
IPC4
009C
—
IPC5
009E
—
IPC6
00A0
—
—
—
IPC7
00A2
—
—
IPC8
00A4
—
IPC9
00A6
—
IPC10
00A8
—
Legend:
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
—
—
—
U1TXIE U1RXIE
OC1IP<2:0>
—
IC1IP<2:0>
—
—
T2IP<2:0>
—
U1TXIP<2:0>
—
OC2IP<2:0>
—
U1RXIP<2:0>
—
MI2CIP<2:0>
—
SI2CIP<2:0>
INT0EP 0000 0000 0000 0000
0000 0000 0000 0000
INT0IP<2:0>
0100 0100 0100 0100
—
IC2IP<2:0>
0100 0100 0100 0100
—
SPI1IP<2:0>
0100 0100 0100 0100
—
NVMIP<2:0>
0100 0100 0100 0100
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0100 0000 0000 0000
—
—
—
—
—
—
1
0
0
—
1
0
0
0000 0000 0100 0100
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
—
—
—
—
—
—
—
—
—
—
—
—
0000 0100 0000 0000
INT2IP<2:0>
LVDIP<2:0>
INT1IP<2:0>
0000 0000 0000 0100
DS70139E-page 69
dsPIC30F2011/2012/3012/3013
IFS1
IFS2
STKERR OSCFAIL
Bit 0
SFR
Name
ADR
dsPIC30F3013 INTERRUPT CONTROLLER REGISTER MAP
Bit 15
INTCON1
0080 NSTDIS
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
—
—
—
—
OVATE
OVBTE
COVTE
—
—
—
MATHERR
ADDRERR
Bit 2
Bit 1
STKERR OSCFAIL
Bit 0
Reset State
—
0000 0000 0000 0000
INTCON2
0082 ALTIVT
DISI
—
—
—
—
—
—
—
—
—
—
—
INT2EP
INT1EP
IFS0
0084
CNIF
MI2CIF
SI2CIF
NVMIF
ADIF
U1TXIF
U1RXIF
SPI1IF
T3IF
T2IF
OC2IF
IC2IF
T1IF
OC1IF
IC1IF
INT0IF
0000 0000 0000 0000
IFS1
0086
—
—
—
—
—
—
U2TXIF
U2RXIF
INT2IF
—
—
—
—
—
—
INT1IF
0000 0000 0000 0000
IFS2
0088
—
—
—
—
—
LVDIF
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
IEC0
008C
CNIE
MI2CIE
SI2CIE
NVMIE
ADIE
IEC1
008E
—
—
—
—
—
IEC2
0090
—
—
—
—
—
IPC0
0094
—
T1IP<2:0>
—
IPC1
0096
—
T31P<2:0>
IPC2
0098
—
ADIP<2:0>
IPC3
009A
—
CNIP<2:0>
IPC4
009C
—
IPC5
009E
—
IPC6
00A0
—
—
—
IPC7
00A2
—
—
—
IPC8
00A4
—
—
IPC9
00A6
—
IPC10
00A8
—
Legend:
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
—
—
—
INT0EP 0000 0000 0000 0000
U1TXIE U1RXIE
SPI1IE
T3IE
T2IE
OC2IE
IC2IE
T1IE
OC1IE
IC1IE
INT0IE
0000 0000 0000 0000
U2TXIE
U2RXIE
INT2IE
—
—
—
—
—
—
INT1IE
0000 0000 0000 0000
—
—
—
—
—
—
—
—
—
—
LVDIE
OC1IP<2:0>
—
IC1IP<2:0>
—
—
T2IP<2:0>
—
U1TXIP<2:0>
—
OC2IP<2:0>
—
U1RXIP<2:0>
—
MI2CIP<2:0>
—
SI2CIP<2:0>
0000 0000 0000 0000
INT0IP<2:0>
0100 0100 0100 0100
—
IC2IP<2:0>
0100 0100 0100 0100
—
SPI1IP<2:0>
0100 0100 0100 0100
—
NVMIP<2:0>
0100 0100 0100 0100
INT1IP<2:0>
0000 0000 0000 0100
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
—
—
—
—
—
—
—
—
—
—
—
—
0000 0100 0000 0000
INT2IP<2:0>
LVDIP<2:0>
U2TXIP<2:0>
0100 0000 0000 0000
—
U2RXIP<2:0>
0000 0000 0100 0100
dsPIC30F2011/2012/3012/3013
DS70139E-page 70
TABLE 8-3:
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
9.0
TIMER1 MODULE
These operating modes are determined by setting the
appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1
presents a block diagram of the 16-bit timer module.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual “ (DS70046).
16-bit Timer Mode: In the 16-bit Timer mode, the timer
increments on every instruction cycle up to a match
value preloaded into the Period register PR1, then
resets to ‘0’ and continues to count.
This section describes the 16-bit general purpose
Timer1 module and associated operational modes.
Figure 9-1 depicts the simplified block diagram of the
16-bit Timer1 module. The following sections provide
detailed descriptions including setup and Control registers, along with associated block diagrams for the operational modes of the timers.
When the CPU goes into the Idle mode, the timer stops
incrementing unless the TSIDL (T1CON<13>) bit = 0.
If TSIDL = 1, the timer module logic resumes the incrementing sequence on termination of CPU Idle mode.
16-bit Synchronous Counter Mode: In the 16-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in PR1,
then resets to ‘0’ and continues.
The Timer1 module is a 16-bit timer that serves as the
time counter for the real-time clock or operates as a
free-running interval timer/counter. The 16-bit timer has
the following modes:
When the CPU goes into the Idle mode, the timer stops
incrementing unless the respective TSIDL bit = 0. If
TSIDL = 1, the timer module logic resumes the incrementing sequence upon termination of the CPU Idle
mode.
• 16-bit Timer
• 16-bit Synchronous Counter
• 16-bit Asynchronous Counter
These operational characteristics are supported:
16-bit Asynchronous Counter Mode: In the 16-bit
Asynchronous Counter mode, the timer increments on
every rising edge of the applied external clock signal.
The timer counts up to a match value preloaded in PR1,
then resets to ‘0’ and continues.
• Timer gate operation
• Selectable prescaler settings
• Timer operation during CPU Idle and Sleep
modes
• Interrupt on 16-bit Period register match or falling
edge of external gate signal
FIGURE 9-1:
When the timer is configured for the Asynchronous
mode of operation and the CPU goes into the Idle
mode, the timer stops incrementing if TSIDL = 1.
16-BIT TIMER1 MODULE BLOCK DIAGRAM
PR1
Equal
Comparator x 16
TSYNC
1
Reset
Sync
TMR1
0
1
Q
D
Q
CK
TGATE
TON
SOSCO/
T1CK
© 2006 Microchip Technology Inc.
TCKPS<1:0>
2
1x
LPOSCEN
SOSCI
TGATE
TCS
TGATE
T1IF
Event Flag
0
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
DS70139E-page 71
dsPIC30F2011/2012/3012/3013
9.1
Timer Gate Operation
The 16-bit timer can be placed in the Gated Time Accumulation mode. This mode allows the internal TCY to
increment the respective timer when the gate input signal (T1CK pin) is asserted high. Control bit, TGATE
(T1CON<6>), must be set to enable this mode. The
timer must be enabled (TON = 1) and the timer clock
source set to internal (TCS = 0).
When the CPU goes into the Idle mode, the timer stops
incrementing unless TSIDL = 0. If TSIDL = 1, the timer
resumes the incrementing sequence upon termination
of the CPU Idle mode.
9.2
Timer Prescaler
The input clock (FOSC/4 or external clock) to the 16-bit
Timer has a prescale option of 1:1, 1:8, 1:64 and 1:256,
selected by control bits, TCKPS<1:0> (T1CON<5:4>).
The prescaler counter is cleared when any of the
following occurs:
• a write to the TMR1 register
• a write to the T1CON register
• device Reset, such as POR and BOR
However, if the timer is disabled (TON = 0), then the
timer prescaler cannot be reset since the prescaler
clock is halted.
TMR1 is not cleared when T1CON is written. It is
cleared by writing to the TMR1 register.
9.3
9.4
Timer Interrupt
The 16-bit timer has the ability to generate an interrupton-period match. When the timer count matches the
Period register, the T1IF bit is asserted and an interrupt
is generated, if enabled. The T1IF bit must be cleared in
software. The timer interrupt flag, T1IF, is located in the
IFS0 Control register in the interrupt controller.
When the Gated Time Accumulation mode is enabled,
an interrupt is also generated on the falling edge of the
gate signal (at the end of the accumulation cycle).
Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T1IE. The timer interrupt
enable bit is located in the IEC0 Control register in the
interrupt controller.
9.5
Real-Time Clock
Timer1, when operating in Real-Time Clock (RTC)
mode, provides time of day and event time-stamping
capabilities. Key operational features of the RTC are:
•
•
•
•
Operation from 32 kHz LP oscillator
8-bit prescaler
Low power
Real-Time Clock interrupts
These operating modes are determined by setting the
appropriate bit(s) in the T1CON Control register.
FIGURE 9-2:
RECOMMENDED
COMPONENTS FOR
TIMER1 LP OSCILLATOR
RTC
Timer Operation During Sleep
Mode
The timer operates during CPU Sleep mode if:
• The timer module is enabled (TON = 1), and
• The timer clock source is selected as external
(TCS = 1), and
• The TSYNC bit (T1CON<2>) is asserted to a logic
‘0’ which defines the external clock source as
asynchronous.
C1
SOSCI
32.768 kHz
XTAL
dsPIC30FXXXX
SOSCO
C2
R
When all three conditions are true, the timer continues
to count up to the Period register and be reset to
0x0000.
When a match between the timer and the Period register occurs, an interrupt can be generated if the
respective timer interrupt enable bit is asserted.
DS70139E-page 72
C1 = C2 = 18 pF; R = 100K
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
9.5.1
RTC OSCILLATOR OPERATION
When the TON = 1, TCS = 1 and TGATE = 0, the timer
increments on the rising edge of the 32 kHz LP oscillator output signal, up to the value specified in the Period
register and is then reset to ‘0’.
The TSYNC bit must be asserted to a logic ‘0’
(Asynchronous mode) for correct operation.
Enabling LPOSCEN (OSCCON<1>) disables the
normal Timer and Counter modes and enables a timer
carry-out wake-up event.
9.5.2
RTC INTERRUPTS
When an interrupt event occurs, the respective interrupt
flag, T1IF, is asserted and an interrupt is generated if
enabled. The T1IF bit must be cleared in software. The
respective Timer interrupt flag, T1IF, is located in the
IFS0 register in the interrupt controller.
Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T1IE. The timer interrupt
enable bit is located in the IEC0 Control register in the
interrupt controller.
When the CPU enters Sleep mode, the RTC continues
to operate, provided the 32 kHz external crystal oscillator is active and the control bits have not been
changed. The TSIDL bit should be cleared to ‘0’ in
order for RTC to continue operation in Idle mode.
© 2006 Microchip Technology Inc.
DS70139E-page 73
SFR Name
Addr.
TIMER1 REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
TMR1
0100
Timer1 Register
PR1
0102
Period Register 1
T1CON
0104
TON
—
TSIDL
—
—
—
—
—
—
Legend:
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TGATE
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
uuuu uuuu uuuu uuuu
1111 1111 1111 1111
TCKPS1 TCKPS0
—
TSYNC
TCS
—
0000 0000 0000 0000
dsPIC30F2011/2012/3012/3013
DS70139E-page 74
TABLE 9-1:
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
10.0
TIMER2/3 MODULE
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual “(DS70046).
This section describes the 32-bit general purpose
Timer module (Timer2/3) and associated Operational
modes. Figure 10-1 depicts the simplified block diagram of the 32-bit Timer2/3 module. Figure 10-2 and
Figure 10-3 show Timer2/3 configured as two
independent 16-bit timers, Timer2 and Timer3,
respectively.
The Timer2/3 module is a 32-bit timer (which can be
configured as two 16-bit timers) with selectable
operating modes. These timers are utilized by other
peripheral modules, such as:
• Input Capture
• Output Compare/Simple PWM
The following sections provide a detailed description,
including setup and Control registers, along with associated block diagrams for the operational modes of the
timers.
The 32-bit timer has the following modes:
• Two independent 16-bit timers (Timer2 and
Timer3) with all 16-bit operating modes (except
Asynchronous Counter mode)
• Single 32-bit timer operation
• Single 32-bit synchronous counter
Further, the following operational characteristics are
supported:
•
•
•
•
•
ADC event trigger
Timer gate operation
Selectable prescaler settings
Timer operation during Idle and Sleep modes
Interrupt on a 32-bit period register match
16-bit Timer Mode: In the 16-bit mode, Timer2 and
Timer3 can be configured as two independent 16-bit
timers. Each timer can be set up in either 16-bit Timer
mode or 16-bit Synchronous Counter mode. See
Section 9.0 “Timer1 Module” for details on these two
operating modes.
The only functional difference between Timer2 and
Timer3 is that Timer2 provides synchronization of the
clock prescaler output. This is useful for high frequency
external clock inputs.
32-bit Timer Mode: In the 32-bit Timer mode, the timer
increments on every instruction cycle, up to a match
value preloaded into the combined 32-bit Period
register PR3/PR2, then resets to ‘0’ and continues to
count.
For synchronous 32-bit reads of the Timer2/Timer3
pair, reading the ls word (TMR2 register) causes the ms
word to be read and latched into a 16-bit holding register, termed TMR3HLD.
For synchronous 32-bit writes, the holding register
(TMR3HLD) must first be written to. When followed by
a write to the TMR2 register, the contents of TMR3HLD
is transferred and latched into the MSB of the 32-bit
timer (TMR3).
32-bit Synchronous Counter Mode: In the 32-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in the
combined 32-bit period register, PR3/PR2, then resets
to ‘0’ and continues.
When the timer is configured for the Synchronous
Counter mode of operation and the CPU goes into the
Idle mode, the timer stops incrementing unless the
TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer
module logic resumes the incrementing sequence
upon termination of the CPU Idle mode.
These operating modes are determined by setting the
appropriate bit(s) in the 16-bit T2CON and T3CON
SFRs.
For 32-bit timer/counter operation, Timer2 is the ls word
and Timer3 is the ms word of the 32-bit timer.
Note:
For 32-bit timer operation, T3CON control
bits are ignored. Only T2CON control bits
are used for setup and control. Timer2
clock and gate inputs are utilized for the
32-bit timer module, but an interrupt is
generated with the Timer3 interrupt flag
(T3IF) and the interrupt is enabled with the
Timer3 interrupt enable bit (T3IE).
© 2006 Microchip Technology Inc.
DS70139E-page 75
dsPIC30F2011/2012/3012/3013
FIGURE 10-1:
32-BIT TIMER2/3 BLOCK DIAGRAM
Data Bus<15:0>
TMR3HLD
16
16
Write TMR2
Read TMR2
16
Reset
TMR3
TMR2
MSB
LSB
Sync
ADC Event Trigger
Equal
Comparator x 32
PR3
T3IF
Event Flag
PR2
0
1
Q
D
Q
CK
TGATE (T2CON<6>)
TCS
TGATE
TGATE
(T2CON<6>)
TON
T2CK
Note:
TCKPS<1:0>
2
1x
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
Timer Configuration bit T32 (T2CON<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control
bits are respective to the T2CON register.
DS70139E-page 76
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 10-2:
16-BIT TIMER2 BLOCK DIAGRAM
PR2
Equal
Reset
T2IF
Event Flag
Comparator x 16
TMR2
Sync
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
TGATE
TON
T2CK
FIGURE 10-3:
TCKPS<1:0>
2
1x
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
16-BIT TIMER3 BLOCK DIAGRAM
PR3
ADC Event Trigger
Equal
Comparator x 16
TMR3
Reset
0
1
Q
D
Q
CK
TGATE
T3CK
TGATE
TCS
TGATE
T3IF
Event Flag
Sync
TON
1x
01
TCY
© 2006 Microchip Technology Inc.
TCKPS<1:0>
2
Prescaler
1, 8, 64, 256
00
DS70139E-page 77
dsPIC30F2011/2012/3012/3013
10.1
Timer Gate Operation
The 32-bit timer can be placed in the Gated Time Accumulation mode. This mode allows the internal TCY to
increment the respective timer when the gate input signal (T2CK pin) is asserted high. Control bit, TGATE
(T2CON<6>), must be set to enable this mode. When
in this mode, Timer2 is the originating clock source.
The TGATE setting is ignored for Timer3. The timer
must be enabled (TON = 1) and the timer clock source
set to internal (TCS = 0).
The falling edge of the external signal terminates the
count operation but does not reset the timer. The user
must reset the timer in order to start counting from zero.
10.2
ADC Event Trigger
When a match occurs between the 32-bit timer (TMR3/
TMR2) and the 32-bit combined period register (PR3/
PR2), or between the 16-bit timer TMR3 and the 16-bit
period register PR3, a special ADC trigger event signal
is generated by Timer3.
10.3
10.4
Timer Operation During Sleep
Mode
The timer does not operate during CPU Sleep mode
because the internal clocks are disabled.
10.5
Timer Interrupt
The 32-bit timer module can generate an interrupt-onperiod match or on the falling edge of the external gate
signal. When the 32-bit timer count matches the
respective 32-bit period register, or the falling edge of
the external “gate” signal is detected, the T3IF bit
(IFS0<7>) is asserted and an interrupt is generated if
enabled. In this mode, the T3IF interrupt flag is used as
the source of the interrupt. The T3IF bit must be
cleared in software.
Enabling an interrupt is accomplished via the
respective timer interrupt enable bit, T3IE (IEC0<7>).
Timer Prescaler
The input clock (FOSC/4 or external clock) to the timer
has a prescale option of 1:1, 1:8, 1:64, and 1:256,
selected by control bits, TCKPS<1:0> (T2CON<5:4>
and T3CON<5:4>). For the 32-bit timer operation, the
originating clock source is Timer2. The prescaler operation for Timer3 is not applicable in this mode. The
prescaler counter is cleared when any of the following
occurs:
• a write to the TMR2/TMR3 register
• a write to the T2CON/T3CON register
• device Reset, such as POR and BOR
However, if the timer is disabled (TON = 0), then the
Timer 2 prescaler cannot be reset since the prescaler
clock is halted.
TMR2/TMR3 is not cleared when T2CON/T3CON is
written.
DS70139E-page 78
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 10-1:
TIMER2/3 REGISTER MAP
SFR Name Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TMR2
0106
Timer2 Register
uuuu uuuu uuuu uuuu
TMR3HLD
0108
Timer3 Holding Register (for 32-bit timer operations only)
uuuu uuuu uuuu uuuu
TMR3
010A
Timer3 Register
uuuu uuuu uuuu uuuu
PR2
010C
Period Register 2
1111 1111 1111 1111
PR3
010E
Period Register 3
T2CON
0110
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS1 TCKPS0
T32
—
TCS
—
0000 0000 0000 0000
0112
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS1 TCKPS0
—
—
TCS
—
0000 0000 0000 0000
T3CON
Legend:
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
1111 1111 1111 1111
dsPIC30F2011/2012/3012/3013
DS70139E-page 79
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 80
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
11.0
INPUT CAPTURE MODULE
These operating modes are determined by setting the
appropriate bits in the IC1CON and IC2CON registers.
The dsPIC30F2011/2012/3012/3013 devices have two
capture channels.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
11.1
The simple capture events in the dsPIC30F product
family are:
This section describes the input capture module and
associated operational modes. The features provided
by this module are useful in applications requiring frequency (period) and pulse measurement.
•
•
•
•
•
Figure 11-1 depicts a block diagram of the input capture module. Input capture is useful for such modes as:
• Frequency/Period/Pulse Measurements
• Additional Sources of External Interrupts
Capture every falling edge
Capture every rising edge
Capture every 4th rising edge
Capture every 16th rising edge
Capture every rising and falling edge
These simple Input Capture modes are configured by
setting the appropriate bits, ICM<2:0> (ICxCON<2:0>).
Important operational features of the input capture
module are:
11.1.1
• Simple Capture Event mode
• Timer2 and Timer3 mode selection
• Interrupt on input capture event
FIGURE 11-1:
Simple Capture Event Mode
CAPTURE PRESCALER
There are four input capture prescaler settings specified by bits ICM<2:0> (ICxCON<2:0>). Whenever the
capture channel is turned off, the prescaler counter is
cleared. In addition, any Reset clears the prescaler
counter.
INPUT CAPTURE MODE BLOCK DIAGRAM
From GP Timer Module
T3_CNT
T2_CNT
16
1
ICx pin
Prescaler
1, 4, 16
3
Clock
Synchronizer
Edge
Detection
Logic
16
0
ICTMR
FIFO
R/W
Logic
ICM<2:0>
Mode Select
ICxBUF
ICBNE, ICOV
ICI<1:0>
ICxCON
Data Bus
Note:
Interrupt
Logic
Set Flag
ICxIF
Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input capture
channel (1 or 2).
© 2006 Microchip Technology Inc.
DS70139E-page 81
dsPIC30F2011/2012/3012/3013
11.1.2
CAPTURE BUFFER OPERATION
Each capture channel has an associated FIFO buffer
which is four 16-bit words deep. There are two status
flags which provide status on the FIFO buffer:
• ICBNE — Input Capture Buffer Not Empty
• ICOV — Input Capture Overflow
The ICBNE is set on the first input capture event and
remains set until all capture events have been read
from the FIFO. As each word is read from the FIFO, the
remaining words are advanced by one position within
the buffer.
In the event that the FIFO is full with four capture
events, and a fifth capture event occurs prior to a read
of the FIFO, an overflow condition occurs and the ICOV
bit is set to a logic ‘1’. The fifth capture event is lost and
is not stored in the FIFO. No additional events are captured until all four events have been read from the
buffer.
If a FIFO read is performed after the last read and no
new capture event has been received, the read will
yield indeterminate results.
11.1.3
TIMER2 AND TIMER3 SELECTION
MODE
The input capture module consists of up to 8 input capture channels. Each channel can select between one of
two timers for the time base, Timer2 or Timer3.
Selection of the timer resource is accomplished
through SFR bit, ICTMR (ICxCON<7>). Timer3 is the
default timer resource available for the input capture
module.
11.1.4
HALL SENSOR MODE
When the input capture module is set for capture on
every edge, rising and falling, ICM<2:0> = 001, the following operations are performed by the input capture
logic:
• The input capture interrupt flag is set on every
edge, rising and falling.
• The interrupt on Capture mode setting bits,
ICI<1:0>, is ignored since every capture
generates an interrupt.
• A capture overflow condition is not generated in
this mode.
11.2
Input Capture Operation During
Sleep and Idle Modes
An input capture event generates a device wake-up or
interrupt, if enabled, if the device is in CPU Idle or Sleep
mode.
Independent of the timer being enabled, the input capture module wakes up from the CPU Sleep or Idle mode
when a capture event occurs if ICM<2:0> = 111 and the
interrupt enable bit is asserted. The same wake-up can
generate an interrupt if the conditions for processing the
interrupt have been satisfied. The wake-up feature is
useful as a method of adding extra external pin interrupts.
11.2.1
INPUT CAPTURE IN CPU SLEEP
MODE
CPU Sleep mode allows input capture module operation with reduced functionality. In the CPU Sleep mode,
the ICI<1:0> bits are not applicable and the input capture module can only function as an external interrupt
source.
The capture module must be configured for interrupt
only on rising edge (ICM<2:0> = 111) in order for the
input capture module to be used while the device is in
Sleep mode. The prescale settings of 4:1 or 16:1 are
not applicable in this mode.
11.2.2
INPUT CAPTURE IN CPU IDLE
MODE
CPU Idle mode allows input capture module operation
with full functionality. In the CPU Idle mode, the Interrupt mode selected by the ICI<1:0> bits is applicable,
as well as the 4:1 and 16:1 capture prescale settings
which are defined by control bits ICM<2:0>. This mode
requires the selected timer to be enabled. Moreover,
the ICSIDL bit must be asserted to a logic ‘0’.
If the input capture module is defined as
ICM<2:0> = 111 in CPU Idle mode, the input capture
pin serves only as an external interrupt pin.
11.3
Input Capture Interrupts
The input capture channels have the ability to generate
an interrupt based upon the selected number of capture events. The selection number is set by control bits,
ICI<1:0> (ICxCON<6:5>).
Each channel provides an interrupt flag (ICxIF) bit. The
respective capture channel interrupt flag is located in
the corresponding IFSx register.
Enabling an interrupt is accomplished via the respective capture channel interrupt enable (ICxIE) bit. The
capture interrupt enable bit is located in the
corresponding IEC Control register.
DS70139E-page 82
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 11-1:
SFR Name
Addr.
IC1BUF
0140
IC1CON
0142
IC2BUF
0144
IC2CON
0146
INPUT CAPTURE REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
—
—
ICSIDL
—
—
—
—
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
Input 1 Capture Register
—
ICTMR
—
ICSIDL
—
—
—
—
—
Legend:
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
ICTMR
Reset State
uuuu uuuu uuuu uuuu
Input 2 Capture Register
—
Bit 0
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
0000 0000 0000 0000
dsPIC30F2011/2012/3012/3013
DS70139E-page 83
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 84
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
12.0
OUTPUT COMPARE MODULE
The key operational features of the output compare
module include:
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
This section describes the output compare module and
associated operational modes. The features provided
by this module are useful in applications requiring operational modes, such as:
• Generation of Variable Width Output Pulses
• Power Factor Correction
Figure 12-1 depicts a block diagram of the output
compare module.
FIGURE 12-1:
•
•
•
•
•
•
Timer2 and Timer3 Selection mode
Simple Output Compare Match mode
Dual Output Compare Match mode
Simple PWM mode
Output Compare During Sleep and Idle modes
Interrupt on Output Compare/PWM Event
These operating modes are determined by setting the
appropriate bits in the 16-bit OC1CON and OC2CON
registers. The dsPIC30F2011/2012/3012/3013 devices
have 2 compare channels.
OCxRS and OCxR in Figure 12-1 represent the Dual
Compare registers. In the Dual Compare mode, the
OCxR register is used for the first compare and OCxRS
is used for the second compare.
OUTPUT COMPARE MODE BLOCK DIAGRAM
Set Flag bit
OCxIF
OCxRS
Output
Logic
OCxR
3
Output
Enable
OCx
OCM<2:0>
Mode Select
Comparator
0
S Q
R
1
OCTSEL
0
1
OCFA
(for x = 1, 2, 3 or 4)
From GP
Timer Module
TMR2<15:0
Note:
TMR3<15:0> T2P2_MATCH
T3P3_MATCH
Where ‘x’ is shown, reference is made to the registers associated with the respective output compare
channel (1 or 2).
© 2006 Microchip Technology Inc.
DS70139E-page 85
dsPIC30F2011/2012/3012/3013
12.1
Timer2 and Timer3 Selection Mode
Each output compare channel can select between one
of two 16-bit timers, Timer2 or Timer3.
The selection of the timers is controlled by the OCTSEL
bit (OCxCON<3>). Timer2 is the default timer resource
for the output compare module.
12.2
Simple Output Compare Match
Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 001,
010 or 011, the selected output compare channel is
configured for one of three simple Output Compare
Match modes:
• Compare forces I/O pin low
• Compare forces I/O pin high
• Compare toggles I/O pin
Dual Output Compare Match Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 100
or 101, the selected output compare channel is configured for one of two Dual Output Compare modes,
which are:
• Single Output Pulse mode
• Continuous Output Pulse mode
12.3.1
For the user to configure the module for the generation
of a single output pulse, the following steps are
required (assuming timer is off):
TCY.
• Determine instruction cycle time
• Calculate desired pulse width value based on TCY.
• Calculate time to start pulse from timer start value
of 0x0000.
• Write pulse width start and stop times into OCxR
and OCxRS Compare registers (x denotes
channel 1, 2, ...,N).
• Set Timer Period register to value equal to or
greater than value in OCxRS Compare register.
• Set OCM<2:0> = 100.
• Enable timer, TON (TxCON<15>) = 1.
To initiate another single pulse, issue another write to
set OCM<2:0> = 100.
DS70139E-page 86
• Determine instruction cycle time TCY.
• Calculate desired pulse value based on TCY.
• Calculate timer to start pulse width from timer start
value of 0x0000.
• Write pulse width start and stop times into OCxR
and OCxRS (x denotes channel 1, 2, ...,N)
Compare registers, respectively.
• Set Timer Period register to value equal to or
greater than value in OCxRS Compare register.
• Set OCM<2:0> = 101.
• Enable timer, TON (TxCON<15>) = 1.
Simple PWM Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 110
or 111, the selected output compare channel is configured for the PWM mode of operation. When configured
for the PWM mode of operation, OCxR is the main latch
(read-only) and OCxRS is the secondary latch. This
enables glitchless PWM transitions.
The user must perform the following steps in order to
configure the output compare module for PWM
operation:
1.
2.
3.
SINGLE PULSE MODE
CONTINUOUS PULSE MODE
For the user to configure the module for the generation
of a continuous stream of output pulses, the following
steps are required:
12.4
The OCxR register is used in these modes. The OCxR
register is loaded with a value and is compared to the
selected incrementing timer count. When a compare
occurs, one of these Compare Match modes occurs. If
the counter resets to zero before reaching the value in
OCxR, the state of the OCx pin remains unchanged.
12.3
12.3.2
4.
Set the PWM period by writing to the appropriate
period register.
Set the PWM duty cycle by writing to the OCxRS
register.
Configure the output compare module for PWM
operation.
Set the TMRx prescale value and enable the
Timer, TON (TxCON<15>) = 1.
12.4.1
INPUT PIN FAULT PROTECTION
FOR PWM
When control bits OCM<2:0> (OCxCON<2:0>) = 111,
the selected output compare channel is again configured for the PWM mode of operation with the additional
feature of input Fault protection. While in this mode, if
a logic ‘0’ is detected on the OCFA/B pin, the respective
PWM output pin is placed in the high impedance input
state. The OCFLT bit (OCxCON<4>) indicates whether
a Fault condition has occurred. This state is maintained
until both of the following events have occurred:
• The external Fault condition has been removed.
• The PWM mode has been re-enabled by writing
to the appropriate control bits.
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
12.4.2
PWM PERIOD
When the selected TMRx is equal to its respective
period register, PRx, the following four events occur on
the next increment cycle:
The PWM period is specified by writing to the PRx
register. The PWM period can be calculated using
Equation 12-1.
• TMRx is cleared.
• The OCx pin is set.
- Exception 1: If PWM duty cycle is 0x0000,
the OCx pin remains low.
- Exception 2: If duty cycle is greater than PRx,
the pin remains high.
• The PWM duty cycle is latched from OCxRS into
OCxR.
• The corresponding timer interrupt flag is set.
EQUATION 12-1:
PWM period = [(PRx) + 1] • 4 • TOSC •
(TMRx prescale value)
PWM frequency is defined as 1/[PWM period].
See Figure 12-2 for key PWM period comparisons.
Timer3 is referred to in Figure 12-2 for clarity.
FIGURE 12-2:
PWM OUTPUT TIMING
Period
Duty Cycle
TMR3 = PR3
T3IF = 1
(Interrupt Flag)
OCxR = OCxRS
TMR3 = PR3
T3IF = 1
(Interrupt Flag)
OCxR = OCxRS
TMR3 = Duty Cycle
(OCxR)
12.5
Output Compare Operation During
CPU Sleep Mode
When the CPU enters Sleep mode, all internal clocks
are stopped. Therefore, when the CPU enters the
Sleep state, the output compare channel drives the pin
to the active state that was observed prior to entering
the CPU Sleep state.
For example, if the pin was high when the CPU entered
the Sleep state, the pin remains high. Likewise, if the
pin was low when the CPU entered the Sleep state, the
pin remains low. In either case, the output compare
module resumes operation when the device wakes up.
12.6
Output Compare Operation During
CPU Idle Mode
When the CPU enters the Idle mode, the output
compare module can operate with full functionality.
The output compare channel operates during the CPU
Idle mode if the OCSIDL bit (OCxCON<13>) is at logic
‘0’ and the selected time base (Timer2 or Timer3) is
enabled and the TSIDL bit of the selected timer is set
to logic ‘0’.
© 2006 Microchip Technology Inc.
TMR3 = Duty Cycle
(OCxR)
12.7
Output Compare Interrupts
The output compare channels have the ability to generate an interrupt on a compare match, for whichever
Match mode has been selected.
For all modes except the PWM mode, when a compare
event occurs, the respective interrupt flag (OCxIF) is
asserted and an interrupt is generated if enabled. The
OCxIF bit is located in the corresponding IFS register
and must be cleared in software. The interrupt is
enabled via the respective compare interrupt enable
(OCxIE) bit located in the corresponding IEC Control
register.
For the PWM mode, when an event occurs, the respective timer interrupt flag (T2IF or T3IF) is asserted and
an interrupt is generated if enabled. The IF bit is
located in the IFS0 register and must be cleared in software. The interrupt is enabled via the respective timer
interrupt enable bit (T2IE or T3IE) located in the IEC0
Control register. The output compare interrupt flag is
never set during the PWM mode of operation.
DS70139E-page 87
SFR Name
Addr.
OC1RS
0180
OC1R
0182
OC1CON
0184
OUTPUT COMPARE REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
—
OCSIDL
—
—
—
—
—
—
—
0186
Output Compare 2 Secondary Register
OC2R
0188
Output Compare 2 Main Register
OC2CON
018A
Note:
Bit 3
Bit 2
Bit 1
—
—
OCSIDL
—
—
—
—
—
—
u = uninitialized bit
Refer to “dsPIC30F Family Reference Manual “ (DS70046) for descriptions of register bit fields.
—
Bit 0
Reset State
0000 0000 0000 0000
Output Compare 1 Main Register
—
OC2RS
Legend:
Bit 4
Output Compare 1 Secondary Register
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
dsPIC30F2011/2012/3012/3013
DS70139E-page 88
TABLE 12-1:
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
13.0
SPI MODULE
• SS1 (active-low slave select).
In Master mode operation, SCK1 is a clock output. In
Slave mode, it is a clock input.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual “ (DS70046).
A series of eight (8) or sixteen (16) clock pulses shift
out bits from the SPI1SR to SDO1 pin and simultaneously shift in data from SDI1 pin. An interrupt is
generated when the transfer is complete and the
interrupt flag bit (SPI1IF) is set. This interrupt can be
disabled through the interrupt enable bit, SPI1IE.
The Serial Peripheral Interface (SPI) module is a synchronous serial interface. It is useful for communicating
with other peripheral devices, such as EEPROMs, shift
registers, display drivers and A/D converters, or other
microcontrollers. It is compatible with Motorola's SPI
and SIOP interfaces. The dsPIC30F2011/2012/3012/
3013 devices feature one SPI module, SPI1.
13.1
The receive operation is double-buffered. When a complete byte is received, it is transferred from SPI1SR to
SPI1BUF.
If the receive buffer is full when new data is being transferred from SPI1SR to SPI1BUF, the module will set the
SPIROV bit indicating an overflow condition. The transfer of the data from SPI1SR to SPI1BUF is not completed and the new data is lost. The module will not
respond to SCL transitions while SPIROV is ‘1’, effectively disabling the module until SPI1BUF is read by
user software.
Operating Function Description
Figure 13-1 is a simplified block diagram of the SPI
module, which consists of a 16-bit shift register,
SPI1SR , used for shifting data in and out, and a buffer
register, SPI1BUF. Control register SPI1CON (not
shown) configures the module. Additionally, status register SPI1STAT (not shown) indicates various status
conditions.
Note:
Transmit writes are also double-buffered. The user
writes to SPI1BUF. When the master or slave transfer
is completed, the contents of the shift register
(SPI1SR) are moved to the receive buffer. If any transmit data has been written to the buffer register, the contents of the transmit buffer are moved to SPI1SR. The
received data is thus placed in SPI1BUF and the transmit data in SPI1SR is ready for the next transfer.
See “dsPIC30F Family Reference Manual” (DS70046) for detailed information on
the control and status registers.
Four I/O pins comprise the serial interface:
• SDI1 (serial data input)
• SDO1 (serial data output)
• SCK1 (shift clock input or output)
FIGURE 13-1:
Note:
Both the transmit buffer (SPI1TXB) and
the receive buffer (SPI1RXB) are mapped
to the same register address, SPI1BUF.
SPI BLOCK DIAGRAM
Internal
Data Bus
Read
Write
SPIxBUF
SPIxBUF
Receive
Transmit
SPI1SR
SDI1
bit 0
SDO1
SS1
Shift
Clock
SS & FSYNC
Control
SCK1
Clock
Control
Edge
Select
Secondary
Prescaler
1:1 – 1:8
Primary
Prescaler
1, 4, 16, 64
FCY
Enable Master Clock
© 2006 Microchip Technology Inc.
DS70139E-page 89
dsPIC30F2011/2012/3012/3013
Figure 13-2 depicts the a master/slave connection
between two processors. In Master mode, the clock is
generated by prescaling the system clock. Data is
transmitted as soon as a value is written to SPI1BUF.
The interrupt is generated at the middle of the transfer
of the last bit.
In Slave mode, data is transmitted and received as
external clock pulses appear on SCK. Again, the interrupt is generated when the last bit is latched. If SS1
control is enabled, then transmission and reception are
enabled only when SS1 = low. The SDO1 output will be
disabled in SS1 mode with SS1 high.
The clock provided to the module is (FOSC/4). This
clock is then prescaled by the primary (PPRE<1:0>)
and the secondary (SPRE<2:0>) prescale factors. The
CKE bit determines whether transmit occurs on transition from active clock state to Idle clock state, or vice
versa. The CKP bit selects the Idle state (high or low)
for the clock.
13.1.1
WORD AND BYTE
COMMUNICATION
A control bit, MODE16 (SPI1CON<10>), allows the
module to communicate in either 16-bit or 8-bit mode.
16-bit operation is identical to 8-bit operation except
that the number of bits transmitted is 16 instead of 8.
FIGURE 13-2:
The user software must disable the module prior to
changing the MODE16 bit. The SPI module is reset
when the MODE16 bit is changed by the user.
A basic difference between 8-bit and 16-bit operation is
that the data is transmitted out of bit 7 of the SPI1SR
for 8-bit operation, and data is transmitted out of bit 15
of the SPI1SR for 16-bit operation. In both modes, data
is shifted into bit 0 of the SPI1SR.
13.1.2
SDO1 DISABLE
A control bit, DISSDO, is provided to the SPI1CON register to allow the SDO1 output to be disabled. This will
allow the SPI module to be connected in an input only
configuration. SDO1 can also be used for general
purpose I/O.
13.2
Framed SPI Support
The module supports a basic framed SPI protocol in
Master or Slave mode. The control bit, FRMEN,
enables framed SPI support and causes the SS1 pin to
perform the Frame Synchronization Pulse (FSYNC)
function. The control bit, SPIFSD, determines whether
the SS1 pin is an input or an output (i.e., whether the
module receives or generates the Frame Synchronization Pulse). The frame pulse is an active-high pulse for
a single SPI clock cycle. When Frame Synchronization
is enabled, the data transmission starts only on the
subsequent transmit edge of the SPI clock.
SPI MASTER/SLAVE CONNECTION
SPI Master
SPI Slave
SDO1
SDI1
Serial Input Buffer
(SPI1BUF)
SDI1
Shift Register
(SPI1SR)
MSb
Serial Input Buffer
(SPI1BUF)
LSb
DS70139E-page 90
Shift Register
(SPI1SR)
MSb
SCK1
PROCESSOR 1
SDO1
Serial Clock
LSb
SCK1
PROCESSOR 2
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
13.3
Slave Select Synchronization
The SS1 pin allows a Synchronous Slave mode. The
SPI must be configured in SPI Slave mode with SS1
pin control enabled (SSEN = 1). When the SS1 pin is
low, transmission and reception are enabled and the
SDOx pin is driven. When SS1 pin goes high, the
SDOx pin is no longer driven. Also, the SPI module is
resynchronized, and all counters/control circuitry are
reset. Therefore, when the SS1 pin is asserted low
again, transmission/reception will begin at the MSb
even if SS1 had been de-asserted in the middle of a
transmit/receive.
13.4
13.5
SPI Operation During CPU Idle
Mode
When the device enters Idle mode, all clock sources
remain functional. The SPISIDL bit (SPI1STAT<13>)
selects if the SPI module will stop or continue on idle. If
SPISIDL = 0, the module will continue to operate when
the CPU enters Idle mode. If SPISIDL = 1, the module
will stop when the CPU enters Idle mode.
SPI Operation During CPU Sleep
Mode
During Sleep mode, the SPI module is shut down. If the
CPU enters Sleep mode while an SPI transaction is in
progress, then the transmission and reception is
aborted.
The transmitter and receiver will stop in Sleep mode.
However, register contents are not affected by entering
or exiting Sleep mode.
© 2006 Microchip Technology Inc.
DS70139E-page 91
SPI1 REGISTER MAP
SFR
Name
Addr.
Bit 15
SPI1STAT
0220
SPI1CON
0222
SPI1BUF
0224
Note:
Bit 14
Bit 13
Bit 12
SPIEN
—
SPISIDL
—
—
FRMEN
SPIFSD
—
Bit 11
Bit 10
—
—
DISSDO MODE16
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
—
—
—
SPIROV
—
—
—
—
SPITBF
SPIRBF 0000 0000 0000 0000
SMP
CKE
SSEN
CKP
MSTEN
SPRE2
SPRE1
SPRE0
PPRE1
PPRE0
Transmit and Receive Buffer
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
0000 0000 0000 0000
0000 0000 0000 0000
dsPIC30F2011/2012/3012/3013
DS70139E-page 92
TABLE 13-1:
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
14.0
I2C™ MODULE
14.1.1
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
2
The following types of I2C operation are supported:
•
•
•
I2C slave operation with 7-bit address
I2C slave operation with 10-bit address
I2C master operation with 7 or 10-bit address
See the I2C programmer’s model (Figure 14-1).
TM
The Inter-Integrated Circuit (I C ) module provides
complete hardware support for both Slave and MultiMaster modes of the I2C serial communication
standard, with a 16-bit interface.
This module offers the following key features:
• I2C interface supporting both master and slave
operation.
• I2C Slave mode supports 7 and 10-bit address.
• I2C Master mode supports 7 and 10-bit address.
• I2C port allows bidirectional transfers between
master and slaves.
• Serial clock synchronization for I2C port can be
used as a handshake mechanism to suspend and
resume serial transfer (SCLREL control).
• I2C supports multi-master operation; detects bus
collision and will arbitrate accordingly.
14.1
Operating Function Description
The hardware fully implements all the master and slave
functions of the I2C Standard and Fast mode
specifications, as well as 7 and 10-bit addressing.
Thus, the I2C module can operate either as a slave or
a master on an I2C bus.
14.1.2
PIN CONFIGURATION IN I2C MODE
I2C has a 2-pin interface: the SCL pin is clock and the
SDA pin is data.
14.1.3
I2C REGISTERS
I2CCON and I2CSTAT are control and status registers,
respectively. The I2CCON register is readable and writable. The lower 6 bits of I2CSTAT are read-only. The
remaining bits of the I2CSTAT are read/write.
I2CRSR is the shift register used for shifting data,
whereas I2CRCV is the buffer register to which data
bytes are written, or from which data bytes are read.
I2CRCV is the receive buffer as shown in Figure 14-1.
I2CTRN is the transmit register to which bytes are
written during a transmit operation, as shown in
Figure 14-2.
The I2CADD register holds the slave address. A Status
bit, ADD10, indicates 10-bit Address mode. The
I2CBRG acts as the Baud Rate Generator reload
value.
In receive operations, I2CRSR and I2CRCV together
form a double-buffered receiver. When I2CRSR
receives a complete byte, it is transferred to I2CRCV
and an interrupt pulse is generated. During
transmission, the I2CTRN is not double-buffered.
Note:
FIGURE 14-1:
VARIOUS I2C MODES
Following a Restart condition in 10-bit
mode, the user only needs to match the
first 7-bit address.
PROGRAMMER’S MODEL
I2CRCV (8 bits)
Bit 7
Bit 0
Bit 7
Bit 0
I2CTRN (8 bits)
I2CBRG (9 bits)
Bit 8
Bit 0
I2CCON (16 bits)
Bit 15
Bit 0
Bit 15
Bit 0
I2CSTAT (16 bits)
I2CADD (10 bits)
Bit 9
© 2006 Microchip Technology Inc.
Bit 0
DS70139E-page 93
dsPIC30F2011/2012/3012/3013
FIGURE 14-2:
I2C™ BLOCK DIAGRAM
Internal
Data Bus
I2CRCV
Read
SCL
Shift
Clock
I2CRSR
LSB
SDA
Addr_Match
Match Detect
Write
I2CADD
Read
Start and
Stop bit Detect
I2CSTAT
Write
Control Logic
Start, Restart,
Stop bit Generate
Write
I2CCON
Collision
Detect
Acknowledge
Generation
Clock
Stretching
Read
Read
Write
I2CTRN
LSB
Shift
Clock
Read
Reload
Control
BRG Down
Counter
DS70139E-page 94
Write
I2CBRG
FCY
Read
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
14.2
I2C Module Addresses
The I2CADD register contains the Slave mode
addresses. The register is a 10-bit register.
If the A10M bit (I2CCON<10>) is ‘0’, the address is
interpreted by the module as a 7-bit address. When an
address is received, it is compared to the 7 LSb of the
I2CADD register.
If the A10M bit is ‘1’, the address is assumed to be a
10-bit address. When an address is received, it will be
compared with the binary value ‘11110 A9 A8’ (where
A9 and A8 are two Most Significant bits of I2CADD). If
that value matches, the next address will be compared
with the Least Significant 8 bits of I2CADD, as specified
in the 10-bit addressing protocol.
14.3.2
If the R_W bit received is a ‘0’ during an address
match, then Receive mode is initiated. Incoming bits
are sampled on the rising edge of SCL. After 8 bits are
received, if I2CRCV is not full or I2COV is not set,
I2CRSR is transferred to I2CRCV. ACK is sent on the
ninth clock.
If the RBF flag is set, indicating that I2CRCV is still
holding data from a previous operation (RBF = 1), then
ACK is not sent; however, the interrupt pulse is generated. In the case of an overflow, the contents of the
I2CRSR are not loaded into the I2CRCV.
Note:
The 7-bit I2C Slave Addresses supported by the
dsPIC30F are shown in Table 14-1.
TABLE 14-1:
7-BIT I2C™ SLAVE
ADDRESSES
0x00
General call address or start byte
0x01-0x03
Reserved
0x04-0x07
Hs-mode Master codes
0x04-0x77
Valid 7-bit addresses
0x78-0x7b
Valid 10-bit addresses (lower 7
bits)
0x7c-0x7f
Reserved
14.3
I2C 7-bit Slave Mode Operation
Once enabled (I2CEN = 1), the slave module will wait
for a Start bit to occur (i.e., the I2C module is ‘Idle’). Following the detection of a Start bit, 8 bits are shifted into
I2CRSR and the address is compared against
I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0>
are compared against I2CRSR<7:1> and I2CRSR<0>
is the R_W bit. All incoming bits are sampled on the rising edge of SCL.
If an address match occurs, an acknowledgement will
be sent, and the slave event interrupt flag (SI2CIF) is
set on the falling edge of the ninth (ACK) bit. The
address match does not affect the contents of the
I2CRCV buffer or the RBF bit.
14.3.1
SLAVE TRANSMISSION
If the R_W bit received is a ‘1’, then the serial port will
go into Transmit mode. It will send ACK on the ninth bit
and then hold SCL to ‘0’ until the CPU responds by writing to I2CTRN. SCL is released by setting the SCLREL
bit, and 8 bits of data are shifted out. Data bits are
shifted out on the falling edge of SCL, such that SDA is
valid during SCL high. The interrupt pulse is sent on the
falling edge of the ninth clock pulse, regardless of the
status of the ACK received from the master.
© 2006 Microchip Technology Inc.
SLAVE RECEPTION
14.4
The I2CRCV will be loaded if the I2COV
bit = 1 and the RBF flag = 0. In this case,
a read of the I2CRCV was performed but
the user did not clear the state of the
I2COV bit before the next receive
occurred. The acknowledgement is not
sent (ACK = 1) and the I2CRCV is
updated.
I2C 10-bit Slave Mode Operation
In 10-bit mode, the basic receive and transmit operations are the same as in the 7-bit mode. However, the
criteria for address match is more complex.
The I2C specification dictates that a slave must be
addressed for a write operation with two address bytes
following a Start bit.
The A10M bit is a control bit that signifies that the
address in I2CADD is a 10-bit address rather than a 7-bit
address. The address detection protocol for the first byte
of a message address is identical for 7-bit and 10-bit
messages, but the bits being compared are different.
I2CADD holds the entire 10-bit address. Upon receiving an address following a Start bit, I2CRSR <7:3> is
compared against a literal ‘11110’ (the default 10-bit
address) and I2CRSR<2:1> are compared against
I2CADD<9:8>. If a match occurs and if R_W = 0, the
interrupt pulse is sent. The ADD10 bit will be cleared to
indicate a partial address match. If a match fails or
R_W = 1, the ADD10 bit is cleared and the module
returns to the Idle state.
The low byte of the address is then received and compared with I2CADD<7:0>. If an address match occurs,
the interrupt pulse is generated and the ADD10 bit is
set, indicating a complete 10-bit address match. If an
address match did not occur, the ADD10 bit is cleared
and the module returns to the Idle state.
DS70139E-page 95
dsPIC30F2011/2012/3012/3013
14.4.1
10-BIT MODE SLAVE
TRANSMISSION
Once a slave is addressed in this fashion with the full
10-bit address (we will refer to this state as
“PRIOR_ADDR_MATCH”), the master can begin
sending data bytes for a slave reception operation.
14.4.2
10-BIT MODE SLAVE RECEPTION
Once addressed, the master can generate a Repeated
Start, reset the high byte of the address and set the
R_W bit without generating a Stop bit, thus initiating a
slave transmit operation.
14.5
Automatic Clock Stretch
In the Slave modes, the module can synchronize buffer
reads and write to the master device by clock stretching.
14.5.1
Clock stretching takes place following the ninth clock of
the receive sequence. On the falling edge of the ninth
clock at the end of the ACK sequence, if the RBF bit is
set, the SCLREL bit is automatically cleared, forcing
the SCL output to be held low. The user’s ISR must set
the SCLREL bit before reception is allowed to continue.
By holding the SCL line low, the user has time to service the ISR and read the contents of the I2CRCV
before the master device can initiate another receive
sequence. This will prevent buffer overruns from
occurring.
Note 1: If the user reads the contents of the
I2CRCV, clearing the RBF bit before the
falling edge of the ninth clock, the
SCLREL bit will not be cleared and clock
stretching will not occur.
2: The SCLREL bit can be set in software
regardless of the state of the RBF bit. The
user should be careful to clear the RBF bit
in the ISR before the next receive
sequence in order to prevent an overflow
condition.
TRANSMIT CLOCK STRETCHING
Both 10-bit and 7-bit Transmit modes implement clock
stretching by asserting the SCLREL bit after the falling
edge of the ninth clock, if the TBF bit is cleared, indicating the buffer is empty.
In Slave Transmit modes, clock stretching is always
performed irrespective of the STREN bit.
14.5.4
Clock synchronization takes place following the ninth
clock of the transmit sequence. If the device samples
an ACK on the falling edge of the ninth clock and if the
TBF bit is still clear, then the SCLREL bit is automatically cleared. The SCLREL being cleared to ‘0’ will
assert the SCL line low. The user’s ISR must set the
SCLREL bit before transmission is allowed to continue.
By holding the SCL line low, the user has time to service the ISR and load the contents of the I2CTRN
before the master device can initiate another transmit
sequence.
Clock stretching takes place automatically during the
addressing sequence. Because this module has a
register for the entire address, it is not necessary for
the protocol to wait for the address to be updated.
Note 1: If the user loads the contents of I2CTRN,
setting the TBF bit before the falling edge
of the ninth clock, the SCLREL bit will not
be cleared and clock stretching will not
occur.
2: The SCLREL bit can be set in software,
regardless of the state of the TBF bit.
14.5.2
RECEIVE CLOCK STRETCHING
The STREN bit in the I2CCON register can be used to
enable clock stretching in Slave Receive mode. When
the STREN bit is set, the SCL pin will be held low at the
end of each data receive sequence.
14.5.3
CLOCK STRETCHING DURING
7-BIT ADDRESSING (STREN = 1)
CLOCK STRETCHING DURING
10-BIT ADDRESSING (STREN = 1)
After the address phase is complete, clock stretching
will occur on each data receive or transmit sequence as
was described earlier.
14.6
Software Controlled Clock
Stretching (STREN = 1)
When the STREN bit is ‘1’, the SCLREL bit may be
cleared by software to allow software to control the
clock stretching. The logic will synchronize writes to the
SCLREL bit with the SCL clock. Clearing the SCLREL
bit will not assert the SCL output until the module
detects a falling edge on the SCL output and SCL is
sampled low. If the SCLREL bit is cleared by the user
while the SCL line has been sampled low, the SCL output will be asserted (held low). The SCL output will
remain low until the SCLREL bit is set, and all other
devices on the I2C bus have de-asserted SCL. This
ensures that a write to the SCLREL bit will not violate
the minimum high time requirement for SCL.
If the STREN bit is ‘0’, a software write to the SCLREL
bit will be disregarded and have no effect on the
SCLREL bit.
When the STREN bit is set in Slave Receive mode, the
SCL line is held low when the buffer register is full. The
method for stretching the SCL output is the same for
both 7 and 10-bit addressing modes.
DS70139E-page 96
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
14.7
Interrupts
The I2C module generates two interrupt flags, MI2CIF
(I2C Master Interrupt Flag) and SI2CIF (I2C Slave Interrupt Flag). The MI2CIF interrupt flag is activated on
completion of a master message event. The SI2CIF
interrupt flag is activated on detection of a message
directed to the slave.
14.8
Slope Control
2
The I C standard requires slope control on the SDA
and SCL signals for Fast mode (400 kHz). The control
bit, DISSLW, enables the user to disable slew rate control if desired. It is necessary to disable the slew rate
control for 1 MHz mode.
14.9
IPMI Support
The control bit, IPMIEN, enables the module to support
Intelligent Peripheral Management Interface (IPMI).
When this bit is set, the module accepts and acts upon
all addresses.
14.10 General Call Address Support
The general call address can address all devices.
When this address is used, all devices should, in
theory, respond with an acknowledgement.
The general call address is one of eight addresses
reserved for specific purposes by the I2C protocol. It
consists of all ‘0’s with R_W = 0.
The general call address is recognized when the General Call Enable (GCEN) bit is set (I2CCON<7> = 1).
Following a Start bit detection, 8 bits are shifted into
I2CRSR and the address is compared with I2CADD,
and is also compared with the general call address
which is fixed in hardware.
If a general call address match occurs, the I2CRSR is
transferred to the I2CRCV after the eighth clock, the
RBF flag is set and on the falling edge of the ninth bit
(ACK bit), the master event interrupt flag (MI2CIF) is
set.
When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the
I2CRCV to determine if the address was device
specific or a general call address.
© 2006 Microchip Technology Inc.
14.11 I2C Master Support
As a master device, six operations are supported:
• Assert a Start condition on SDA and SCL.
• Assert a Restart condition on SDA and SCL.
• Write to the I2CTRN register initiating
transmission of data/address.
• Generate a Stop condition on SDA and SCL.
• Configure the I2C port to receive data.
• Generate an ACK condition at the end of a
received byte of data.
14.12 I2C Master Operation
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the data direction bit. In
this case, the data direction bit (R_W) is logic ‘0’. Serial
data is transmitted 8 bits at a time. After each byte is
transmitted, an ACK bit is received. Start and Stop conditions are output to indicate the beginning and the end
of a serial transfer.
In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device
(7 bits) and the data direction bit. In this case, the data
direction bit (R_W) is logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address, followed by a ‘1’ to indicate receive bit. Serial data is received via SDA while
SCL outputs the serial clock. Serial data is received
8 bits at a time. After each byte is received, an ACK bit
is transmitted. Start and Stop conditions indicate the
beginning and end of transmission.
14.12.1
I2C MASTER TRANSMISSION
Transmission of a data byte, a 7-bit address, or the second half of a 10-bit address, is accomplished by simply
writing a value to I2CTRN register. The user should
only write to I2CTRN when the module is in a WAIT
state. This action will set the Buffer Full Flag (TBF) and
allow the Baud Rate Generator to begin counting and
start the next transmission. Each bit of address/data
will be shifted out onto the SDA pin after the falling
edge of SCL is asserted. The Transmit Status Flag,
TRSTAT (I2CSTAT<14>), indicates that a master
transmit is in progress.
DS70139E-page 97
dsPIC30F2011/2012/3012/3013
14.12.2
I2C MASTER RECEPTION
Master mode reception is enabled by programming the
Receive Enable bit, RCEN (I2CCON<3>). The I2C
module must be Idle before the RCEN bit is set, otherwise the RCEN bit will be disregarded. The Baud Rate
Generator begins counting and on each rollover, the
state of the SCL pin ACK and data are shifted into the
I2CRSR on the rising edge of each clock.
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the TBF flag is
cleared, the SDA and SCL lines are de-asserted and a
value can now be written to I2CTRN. When the user
services the I2C master event Interrupt Service Routine, if the I2C bus is free (i.e., the P bit is set), the user
can resume communication by asserting a Start
condition.
In I2C Master mode, the reload value for the BRG is
located in the I2CBRG register. When the BRG is
loaded with this value, the BRG counts down to ‘0’ and
stops until another reload has taken place. If clock arbitration is taking place, for instance, the BRG is reloaded
when the SCL pin is sampled high.
If a Start, Restart, Stop or Acknowledge condition was
in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are de-asserted,
and the respective control bits in the I2CCON register
are cleared to ‘0’. When the user services the bus collision Interrupt Service Routine, and if the I2C bus is
free, the user can resume communication by asserting
a Start condition.
As per the I2C standard, FSCK may be 100 kHz or
400 kHz. However, the user can specify any baud rate
up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal.
The master will continue to monitor the SDA and SCL
pins, and if a Stop condition occurs, the MI2CIF bit will
be set.
EQUATION 14-1:
A write to the I2CTRN will start the transmission of data
at the first data bit regardless of where the transmitter
left off when bus collision occurred.
14.12.3
BAUD RATE GENERATOR
I2CBRG =
14.12.4
SERIAL CLOCK RATE
CY
( FFSCL
–
FCY
1,111,111
)
–1
CLOCK ARBITRATION
Clock arbitration occurs when the master de-asserts
the SCL pin (SCL allowed to float high) during any
receive, transmit, or Restart/Stop condition. When the
SCL pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCL
pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with
the contents of I2CBRG and begins counting. This
ensures that the SCL high time will always be at least
one BRG rollover count in the event that the clock is
held low by an external device.
14.12.5
MULTI-MASTER COMMUNICATION,
BUS COLLISION, AND BUS
ARBITRATION
Multi-master operation support is achieved by bus arbitration. When the master outputs address/data bits
onto the SDA pin, arbitration takes place when the
master outputs a ‘1’ on SDA by letting SDA float high
while another master asserts a ‘0’. When the SCL pin
floats high, data should be stable. If the expected data
on SDA is a ‘1’ and the data sampled on the SDA
pin = 0, then a bus collision has taken place. The
master will set the MI2CIF pulse and reset the master
portion of the I2C port to its Idle state.
DS70139E-page 98
In a multi-master environment, the interrupt generation
on the detection of Start and Stop conditions allows the
determination of when the bus is free. Control of the I2C
bus can be taken when the P bit is set in the I2CSTAT
register, or the bus is Idle and the S and P bits are
cleared.
14.13 I2C Module Operation During CPU
Sleep and Idle Modes
14.13.1
I2C OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shut down and stay at logic ‘0’. If
Sleep occurs in the middle of a transmission and the
state machine is partially into a transmission as the
clocks stop, then the transmission is aborted. Similarly,
if Sleep occurs in the middle of a reception, then the
reception is aborted.
14.13.2
I2C OPERATION DURING CPU IDLE
MODE
For the I2C, the I2CSIDL bit selects if the module will
stop on Idle or continue on Idle. If I2CSIDL = 0, the
module will continue operation on assertion of the Idle
mode. If I2CSIDL = 1, the module will stop on Idle.
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 14-2:
SFR Name Addr.
I2C REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
I2CRCV
0200
—
—
—
—
—
—
—
—
Receive Register
0000 0000 0000 0000
I2CTRN
0202
—
—
—
—
—
—
—
—
Transmit Register
0000 0000 1111 1111
I2CBRG
0204
—
—
—
—
—
—
—
I2CCON
0206
I2CEN
—
A10M
DISSLW
SMEN
GCEN
STREN
I2CSTAT
0208
ACKSTAT
TRSTAT
—
—
—
BCL
GCSTAT
ADD10
IWCOL
I2COV
I2CADD
020A
—
—
—
—
—
—
Note:
I2CSIDL SCLREL IPMIEN
Baud Rate Generator
0000 0000 0000 0000
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
0001 0000 0000 0000
D_A
P
S
R_W
RBF
TBF
0000 0000 0000 0000
Address Register
0000 0000 0000 0000
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F2011/2012/3012/3013
DS70139E-page 99
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 100
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
15.0
UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART) MODULE
15.1
The key features of the UART module are:
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
This section describes the Universal Asynchronous
Receiver/Transmitter Communications module. The
dsPIC30F2011/2012/3012 processors have one UART
module (UART1). The dsPIC30F3013 processor has
two UART modules (UART1 and UART2).
•
•
•
•
•
•
•
•
•
•
•
•
FIGURE 15-1:
UART Module Overview
Full-duplex, 8 or 9-bit data communication
Even, odd or no parity options (for 8-bit data)
One or two Stop bits
Fully integrated Baud Rate Generator with 16-bit
prescaler
Baud rates range from 38 bps to 1.875 Mbps at a
30 MHz instruction rate
4-word deep transmit data buffer
4-word deep receive data buffer
Parity, framing and buffer overrun error detection
Support for interrupt only on address detect
(9th bit = 1)
Separate transmit and receive interrupts
Loopback mode for diagnostic support
Alternate receive and transmit pins for UART1
UART TRANSMITTER BLOCK DIAGRAM
Internal Data Bus
Control and Status bits
Write
UTX8
Write
UxTXREG Low Byte
Transmit Control
– Control TSR
– Control Buffer
– Generate Flags
– Generate Interrupt
Load TSR
UxTXIF
UTXBRK
Data
Transmit Shift Register (UxTSR)
‘0’ (Start)
UxTX
‘1’ (Stop)
Parity
Parity
Generator
16 Divider
16x Baud Clock
from Baud Rate
Generator
Control
Signals
Note:
x = 1 or 2.
© 2006 Microchip Technology Inc.
DS70139E-page 101
dsPIC30F2011/2012/3012/3013
FIGURE 15-2:
UART RECEIVER BLOCK DIAGRAM
Internal Data Bus
16
Write
Read
Read Read
UxMODE
Write
UxSTA
URX8 UxRXREG Low Byte
Receive Buffer Control
– Generate Flags
– Generate Interrupt
– Shift Data Characters
0
· Start bit Detect
· Parity Check
· Stop bit Detect
· Shift Clock Generation
· Wake Logic
Load RSR
to Buffer
Receive Shift Register
(UxRSR)
Control
Signals
FERR
UxRX
8-9
PERR
LPBACK
From UxTX
1
16 Divider
16x Baud Clock from
Baud Rate Generator
UxRXIF
DS70139E-page 102
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
15.2
15.2.1
Enabling and Setting Up UART
ENABLING THE UART
The UART module is enabled by setting the UARTEN
bit in the UxMODE register (where x = 1 or 2). Once
enabled, the UxTX and UxRX pins are configured as an
output and an input respectively, overriding the TRIS
and LAT register bit settings for the corresponding I/O
port pins. The UxTX pin is at logic ‘1’ when no
transmission is taking place.
15.2.2
15.3
15.3.1
Disabling the UART module resets the buffers to empty
states. Any data characters in the buffers are lost and
the baud rate counter is reset.
1.
2.
3.
4.
All error and status flags associated with the UART
module are reset when the module is disabled. The
URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and
UTXBF bits are cleared, whereas RIDLE and TRMT
are set. Other control bits, including ADDEN,
URXISEL<1:0>, UTXISEL, as well as the UxMODE
and UxBRG registers, are not affected.
Clearing the UARTEN bit while the UART is active will
abort all pending transmissions and receptions and
reset the module as defined above. Re-enabling the
UART will restart the UART in the same configuration.
15.2.3
15.2.4
5.
Set up the UART:
First, the data length, parity and number of Stop
bits must be selected. Then, the transmit and
receive interrupt enable and priority bits are
setup in the UxMODE and UxSTA registers.
Also, the appropriate baud rate value must be
written to the UxBRG register.
Enable the UART by setting the UARTEN bit
(UxMODE<15>).
Set the UTXEN bit (UxSTA<10>), thereby
enabling a transmission.
Write the byte to be transmitted to the lower byte
of UxTXREG. The value will be transferred to the
Transmit Shift register (UxTSR) immediately
and the serial bit stream will start shifting out
during the next rising edge of the baud clock.
Alternatively, the data byte may be written while
UTXEN = 0, following which, the user may set
UTXEN. This will cause the serial bit stream to
begin immediately because the baud clock will
start from a cleared state.
A transmit interrupt will be generated, depending on the value of the interrupt control bit
UTXISEL (UxSTA<15>).
15.3.2
ALTERNATE I/O
The alternate I/O function is enabled by setting the
ALTIO bit (UxMODE<10>). If ALTIO = 1, the UxATX
and UxARX pins (alternate transmit and alternate
receive pins, respectively) are used by the UART module instead of the UxTX and UxRX pins. If ALTIO = 0,
the UxTX and UxRX pins are used by the UART
module.
SETTING UP DATA, PARITY AND
STOP BIT SELECTIONS
Control bits PDSEL<1:0> in the UxMODE register are
used to select the data length and parity used in the
transmission. The data length may either be 8 bits with
even, odd or no parity, or 9 bits with no parity.
The STSEL bit determines whether one or two Stop bits
will be used during data transmission.
The default (power-on) setting of the UART is 8 bits, no
parity and 1 Stop bit (typically represented as 8, N, 1).
© 2006 Microchip Technology Inc.
TRANSMITTING IN 8-BIT DATA
MODE
The following steps must be performed in order to
transmit 8-bit data:
DISABLING THE UART
The UART module is disabled by clearing the UARTEN
bit in the UxMODE register. This is the default state
after any Reset. If the UART is disabled, all I/O pins
operate as port pins under the control of the LAT and
TRIS bits of the corresponding port pins.
Transmitting Data
TRANSMITTING IN 9-BIT DATA
MODE
The sequence of steps involved in the transmission of
9-bit data is similar to 8-bit transmission, except that a
16-bit data word (of which the upper 7 bits are always
clear) must be written to the UxTXREG register.
15.3.3
TRANSMIT BUFFER (UXTXB)
The transmit buffer is 9 bits wide and 4 characters
deep. Including the Transmit Shift register (UxTSR),
the user effectively has a 5-deep FIFO (First-In, FirstOut) buffer. The UTXBF bit (UxSTA<9>) indicates
whether the transmit buffer is full.
If a user attempts to write to a full buffer, the new data
will not be accepted into the FIFO and no data shift will
occur within the buffer. This enables recovery from a
buffer overrun condition.
The FIFO is reset during any device Reset, but is not
affected when the device enters or wakes up from a
Power Saving mode.
DS70139E-page 103
dsPIC30F2011/2012/3012/3013
15.3.4
TRANSMIT INTERRUPT
The transmit interrupt flag (U1TXIF or U2TXIF) is
located in the corresponding interrupt flag register.
The transmitter generates an edge to set the UxTXIF
bit. The condition for generating the interrupt depends
on the UTXISEL control bit:
a)
b)
If UTXISEL = 0, an interrupt is generated when
a word is transferred from the transmit buffer to
the Transmit Shift register (UxTSR). This means
that the transmit buffer has at least one empty
word.
If UTXISEL = 1, an interrupt is generated when
a word is transferred from the transmit buffer to
the Transmit Shift register (UxTSR) and the
transmit buffer is empty.
Switching between the two Interrupt modes during
operation is possible and sometimes offers more
flexibility.
15.3.5
TRANSMIT BREAK
15.4.2
The receive buffer is 4 words deep. Including the
Receive Shift register (UxRSR), the user effectively
has a 5-word deep FIFO buffer.
URXDA (UxSTA<0>) = 1 indicates that the receive
buffer has data available. URXDA = 0 implies that the
buffer is empty. If a user attempts to read an empty
buffer, the old values in the buffer will be read and no
data shift will occur within the FIFO.
The FIFO is reset during any device Reset. It is not
affected when the device enters or wakes up from a
Power Saving mode.
15.4.3
a)
To send a Break character, the UTXBRK bit must be set
by software and must remain set for a minimum of 13
baud clock cycles. The UTXBRK bit is then cleared by
software to generate Stop bits. The user must wait for
a duration of at least one or two baud clock cycles in
order to ensure a valid Stop bit(s) before reloading the
UxTXB, or starting other transmitter activity. Transmission of a Break character does not generate a transmit
interrupt.
b)
15.4.1
Receiving Data
RECEIVING IN 8-BIT OR 9-BIT
DATA MODE
The following steps must be performed while receiving
8-bit or 9-bit data:
1.
2.
3.
4.
5.
Set up the UART (see Section 15.3.1 “Transmitting in 8-bit data mode”).
Enable the UART (see Section 15.3.1 “Transmitting in 8-bit data mode”).
A receive interrupt will be generated when one
or more data words have been received,
depending on the receive interrupt settings
specified by the URXISEL bits (UxSTA<7:6>).
Read the OERR bit to determine if an overrun
error has occurred. The OERR bit must be reset
in software.
Read the received data from UxRXREG. The act
of reading UxRXREG will move the next word to
the top of the receive FIFO, and the PERR and
FERR values will be updated.
DS70139E-page 104
RECEIVE INTERRUPT
The receive interrupt flag (U1RXIF or U2RXIF) can be
read from the corresponding interrupt flag register. The
interrupt flag is set by an edge generated by the
receiver. The condition for setting the receive interrupt
flag depends on the settings specified by the
URXISEL<1:0> (UxSTA<7:6>) control bits.
Setting the UTXBRK bit (UxSTA<11>) will cause the
UxTX line to be driven to logic ‘0’. The UTXBRK bit
overrides all transmission activity. Therefore, the user
should generally wait for the transmitter to be Idle
before setting UTXBRK.
15.4
RECEIVE BUFFER (UXRXB)
c)
If URXISEL<1:0> = 00 or 01, an interrupt is generated every time a data word is transferred
from the Receive Shift register (UxRSR) to the
receive buffer. There may be one or more
characters in the receive buffer.
If URXISEL<1:0> = 10, an interrupt is generated
when a word is transferred from the Receive Shift
register (UxRSR) to the receive buffer, which as a
result of the transfer, contains 3 characters.
If URXISEL<1:0> = 11, an interrupt is set when
a word is transferred from the Receive Shift register (UxRSR) to the receive buffer, which as a
result of the transfer, contains 4 characters (i.e.,
becomes full).
Switching between the Interrupt modes during operation is possible, though generally not advisable during
normal operation.
15.5
15.5.1
Reception Error Handling
RECEIVE BUFFER OVERRUN
ERROR (OERR BIT)
The OERR bit (UxSTA<1>) is set if all of the following
conditions occur:
a)
b)
c)
The receive buffer is full.
The Receive Shift register is full, but unable to
transfer the character to the receive buffer.
The Stop bit of the character in the UxRSR is
detected, indicating that the UxRSR needs to
transfer the character to the buffer.
Once OERR is set, no further data is shifted in UxRSR
(until the OERR bit is cleared in software or a Reset
occurs). The data held in UxRSR and UxRXREG
remains valid.
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
15.5.2
FRAMING ERROR (FERR)
The FERR bit (UxSTA<2>) is set if a ‘0’ is detected
instead of a Stop bit. If two Stop bits are selected, both
Stop bits must be ‘1’, otherwise FERR will be set. The
read-only FERR bit is buffered along with the received
data. It is cleared on any Reset.
15.5.3
PARITY ERROR (PERR)
The PERR bit (UxSTA<3>) is set if the parity of the
received word is incorrect. This error bit is applicable
only if a Parity mode (odd or even) is selected. The
read-only PERR bit is buffered along with the received
data bytes. It is cleared on any Reset.
15.5.4
IDLE STATUS
When the receiver is active (i.e., between the initial
detection of the Start bit and the completion of the Stop
bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between the completion of the Stop bit and detection of the next Start bit,
the RIDLE bit is ‘1’, indicating that the UART is Idle.
15.5.5
RECEIVE BREAK
The receiver will count and expect a certain number of
bit times based on the values programmed in the
PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>)
bits.
15.6
Address Detect Mode
Setting the ADDEN bit (UxSTA<5>) enables this special mode in which a 9th bit (URX8) value of ‘1’ identifies the received word as an address, rather than data.
This mode is only applicable for 9-bit data communication. The URXISEL control bit does not have any
impact on interrupt generation in this mode since an
interrupt (if enabled) will be generated every time the
received word has the 9th bit set.
15.7
Loopback Mode
Setting the LPBACK bit enables this special mode in
which the UxTX pin is internally connected to the UxRX
pin. When configured for the Loopback mode, the
UxRX pin is disconnected from the internal UART
receive logic. However, the UxTX pin still functions as
in a normal operation.
To select this mode:
a)
b)
c)
Configure UART for desired mode of operation.
Set LPBACK = 1 to enable Loopback mode.
Enable transmission as defined in Section 15.3
“Transmitting Data”.
15.8
Baud Rate Generator
If the break is longer than 13 bit times, the reception is
considered complete after the number of bit times
specified by PDSEL and STSEL. The URXDA bit is set,
FERR is set, zeros are loaded into the receive FIFO,
interrupts are generated if appropriate and the RIDLE
bit is set.
The UART has a 16-bit Baud Rate Generator to allow
maximum flexibility in baud rate generation. The Baud
Rate Generator register (UxBRG) is readable and
writable. The baud rate is computed as follows:
When the module receives a long break signal and the
receiver has detected the Start bit, the data bits and the
invalid Stop bit (which sets the FERR), the receiver
must wait for a valid Stop bit before looking for the next
Start bit. It cannot assume that the break condition on
the line is the next Start bit.
FCY = Instruction Clock Rate (1/TCY)
Break is regarded as a character containing all ‘0’s with
the FERR bit set. The Break character is loaded into
the buffer. No further reception can occur until a Stop bit
is received. Note that RIDLE goes high when the Stop
bit has not yet been received.
BRG = 16-bit value held in UxBRG register
(0 through 65535)
The baud rate is given by Equation 15-1.
EQUATION 15-1:
BAUD RATE
Baud Rate = FCY / (16*(BRG+1))
Therefore, the maximum baud rate possible is:
FCY /16 (if BRG = 0),
and the minimum baud rate possible is:
FCY / (16* 65536).
With a full 16-bit Baud Rate Generator at 30 MIPS
operation, the minimum baud rate achievable is
28.5 bps.
© 2006 Microchip Technology Inc.
DS70139E-page 105
dsPIC30F2011/2012/3012/3013
15.9
Auto-Baud Support
To allow the system to determine baud rates of
received characters, the input can be optionally linked
to a selected capture input (IC1 for UART1 and IC2 for
UART2). To enable this mode, you must program the
input capture module to detect the falling and rising
edges of the Start bit.
15.10.2
UART OPERATION DURING CPU
IDLE MODE
For the UART, the USIDL bit selects if the module will
stop operation when the device enters Idle mode or
whether the module will continue on Idle. If USIDL = 0,
the module will continue operation during Idle mode. If
USIDL = 1, the module will stop on Idle.
15.10 UART Operation During CPU
Sleep and Idle Modes
15.10.1
UART OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shut down and stay at logic ‘0’. If
entry into Sleep mode occurs while a transmission is in
progress, then the transmission is aborted. The UxTX
pin is driven to logic ‘1’. Similarly, if entry into Sleep
mode occurs while a reception is in progress, then the
reception is aborted. The UxSTA, UxMODE, transmit
and receive registers and buffers, and the UxBRG
register are not affected by Sleep mode.
If the WAKE bit (UxMODE<7>) is set before the device
enters Sleep mode, then a falling edge on the UxRX pin
will generate a receive interrupt. The Receive Interrupt
Select mode bit (URXISEL) has no effect for this function. If the receive interrupt is enabled, then this will
wake-up the device from Sleep. The UARTEN bit must
be set in order to generate a wake-up interrupt.
DS70139E-page 106
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 15-1:
UART1 REGISTER MAP FOR dsPIC30F2011/2012/3012/3013
SFR Name Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
—
ALTIO
U1MODE
020C
UARTEN
—
USIDL
—
U1STA
020E
UTXISEL
—
—
—
U1TXREG
0210
—
—
—
—
—
U1RXREG
0212
—
—
—
—
—
U1BRG
0214
Legend:
u = uninitialized bit
TABLE 15-2:
SFR
Name
Addr.
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
WAKE
LPBACK
ABAUD
Bit 3
—
PERR
Bit 0
Reset State
—
—
TRMT
—
—
UTX8
Transmit Register
0000 000u uuuu uuuu
—
—
URX8
Receive Register
0000 0000 0000 0000
URXISEL1 URXISEL0 ADDEN
—
Bit 1
UTXBF
UTXBRK UTXEN
RIDLE
Bit 2
PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000
FERR
OERR
URXDA 0000 0001 0001 0000
Baud Rate Generator Prescaler
0000 0000 0000 0000
UART2 REGISTER MAP FOR dsPIC30F3013(1)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 10
—
ALTIO
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
WAKE
LPBACK
ABAUD
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
U2MODE
0216
UARTEN
—
USIDL
—
U2STA
0218
UTXISEL
—
—
—
U2TXREG
021A
—
—
—
—
—
—
—
UTX8
Transmit Register
0000 000u uuuu uuuu
U2RXREG
021C
—
—
—
—
—
—
—
URX8
Receive Register
0000 0000 0000 0000
U2BRG
021E
Legend:
u = uninitialized bit
Note
UART2 is not available on the dsPIC30F2011/2012/3012
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
1:
2:
UTXBRK UTXEN
—
—
UTXBF
TRMT
URXISEL1 URXISEL0 ADDEN
Baud Rate Generator Prescaler
—
—
RIDLE
PERR
PDSEL1 PDSEL0
FERR
OERR
STSEL 0000 0000 0000 0000
URXDA 0000 0001 0001 0000
0000 0000 0000 0000
DS70139E-page 107
dsPIC30F2011/2012/3012/3013
Bit 11
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 108
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
16.0
12-BIT ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
The ADC module has six 16-bit registers:
•
•
•
•
•
•
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
The ADCON1, ADCON2 and ADCON3 registers
control the operation of the ADC module. The ADCHS
register selects the input channels to be converted. The
ADPCFG register configures the port pins as analog
inputs or as digital I/O. The ADCSSL register selects
inputs for scanning.
The 12-bit Analog-to-Digital Converter allows conversion of an analog input signal to a 12-bit digital number.
This module is based on a Successive Approximation
Register (SAR) architecture and provides a maximum
sampling rate of 200 ksps. The ADC module has up to
10 analog inputs which are multiplexed into a sample
and hold amplifier. The output of the sample and hold
is the input into the converter which generates the
result. The analog reference voltage is software selectable to either the device supply voltage (AVDD/AVSS) or
the voltage level on the (VREF+/VREF-) pin. The ADC
has a unique feature of being able to operate while the
device is in Sleep mode with RC oscillator selection.
FIGURE 16-1:
A/D Control Register 1 (ADCON1)
A/D Control Register 2 (ADCON2)
A/D Control Register 3 (ADCON3)
A/D Input Select Register (ADCHS)
A/D Port Configuration Register (ADPCFG)
A/D Input Scan Selection Register (ADCSSL)
Note:
The SSRC<2:0>, ASAM, SMPI<3:0>,
BUFM and ALTS bits, as well as the
ADCON3 and ADCSSL registers, must
not be written to while ADON = 1. This
would lead to indeterminate results.
The block diagram of the 12-bit ADC module is shown
in Figure 16-1.
12-BIT ADC FUNCTIONAL BLOCK DIAGRAM
AVDD/VREF+
AVSS/VREFComparator
0000
0001
AN2
0010
AN3
0011
AN4
0100
AN5
0101
AN6
0110
AN7
0111
AN8
1000
AN9
1001
12-bit SAR
16-word, 12-bit
Dual Port
Buffer
Sample/Sequence
Control
Sample
S/H
© 2006 Microchip Technology Inc.
Conversion Logic
CH0
Input
Switches
Bus Interface
AN1
DAC
Data Format
AN0
Input MUX
Control
DS70139E-page 109
dsPIC30F2011/2012/3012/3013
16.1
A/D Result Buffer
16.3
Selecting the Conversion
Sequence
The module contains a 16-word dual port read-only
buffer, called ADCBUF0...ADCBUFF, to buffer the A/D
results. The RAM is 12 bits wide but the data obtained
is represented in one of four different 16-bit data formats. The contents of the sixteen A/D Conversion
Result Buffer registers, ADCBUF0 through ADCBUFF,
cannot be written by user software.
Several groups of control bits select the sequence in
which the A/D connects inputs to the sample/hold
channel, converts a channel, writes the buffer memory
and generates interrupts.
16.2
The SMPI bits select the number of acquisition/
conversion sequences that would be performed before
an interrupt occurs. This can vary from 1 sample per
interrupt to 16 samples per interrupt.
Conversion Operation
After the ADC module has been configured, the sample
acquisition is started by setting the SAMP bit. Various
sources, such as a programmable bit, timer time-outs
and external events, will terminate acquisition and start
a conversion. When the A/D conversion is complete,
the result is loaded into ADCBUF0...ADCBUFF, and
the DONE bit and the A/D interrupt flag, ADIF, are set
after the number of samples specified by the SMPI bit.
The ADC module can be configured for different interrupt rates as described in Section 16.3 “Selecting the
Conversion Sequence”.
The following steps should be followed for doing an
A/D conversion:
1.
2.
3.
4.
5.
6.
7.
Configure the ADC module:
• Configure analog pins, voltage reference and
digital I/O
• Select A/D input channels
• Select A/D conversion clock
• Select A/D conversion trigger
• Turn on ADC module
Configure A/D interrupt (if required):
• Clear ADIF bit
• Select A/D interrupt priority
Start sampling
Wait the required acquisition time
Trigger acquisition end, start conversion
Wait for A/D conversion to complete, by either:
• Waiting for the A/D interrupt, or
• Waiting for the DONE bit to get set
Read A/D result buffer; clear ADIF if required
DS70139E-page 110
The sequence is controlled by the sampling clocks.
The BUFM bit will split the 16-word results buffer into
two 8-word groups. Writing to the 8-word buffers will be
alternated on each interrupt event.
Use of the BUFM bit will depend on how much time is
available for the moving of the buffers after the
interrupt.
If the processor can quickly unload a full buffer within
the time it takes to acquire and convert one channel,
the BUFM bit can be ‘0’ and up to 16 conversions (corresponding to the 16 input channels) may be done per
interrupt. The processor will have one acquisition and
conversion time to move the sixteen conversions.
If the processor cannot unload the buffer within the
acquisition and conversion time, the BUFM bit should be
‘1’. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111,
then eight conversions will be loaded into 1/2 of the
buffer, following which an interrupt occurs. The next
eight conversions will be loaded into the other 1/2 of the
buffer. The processor will have the entire time between
interrupts to move the eight conversions.
The ALTS bit can be used to alternate the inputs
selected during the sampling sequence. The input
multiplexer has two sets of sample inputs: MUX A and
MUX B. If the ALTS bit is ‘0’, only the MUX A inputs are
selected for sampling. If the ALTS bit is ‘1’ and
SMPI<3:0> = 0000 on the first sample/convert
sequence, the MUX A inputs are selected and on the
next acquire/convert sequence, the MUX B inputs are
selected.
The CSCNA bit (ADCON2<10>) will allow the multiplexer input to be alternately scanned across a
selected number of analog inputs for the MUX A group.
The inputs are selected by the ADCSSL register. If a
particular bit in the ADCSSL register is ‘1’, the corresponding input is selected. The inputs are always
scanned from lower to higher numbered inputs, starting
after each interrupt. If the number of inputs selected is
greater than the number of samples taken per interrupt,
the higher numbered inputs are unused.
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
16.4
Programming the Start of
Conversion Trigger
The conversion trigger will terminate acquisition and
start the requested conversions.
The SSRC<2:0> bits select the source of the conversion trigger. The SSRC bits provide for up to 4 alternate
sources of conversion trigger.
When SSRC<2:0> = 000, the conversion trigger is
under software control. Clearing the SAMP bit will
cause the conversion trigger.
When SSRC<2:0> = 111 (Auto-Start mode), the conversion trigger is under A/D clock control. The SAMC
bits select the number of A/D clocks between the start
of acquisition and the start of conversion. This provides
the fastest conversion rates on multiple channels.
SAMC must always be at least 1 clock cycle.
Other trigger sources can come from timer modules or
external interrupts.
16.5
For correct ADC conversions, the ADC conversion
clock (TAD) must be selected to ensure a minimum TAD
time of 334 nsec (for VDD = 5V). Refer to Section 20.0
“Electrical Characteristics” for minimum TAD under
other operating conditions.
Example 16-1 shows a sample calculation for the
ADCS<5:0> bits, assuming a device operating speed
of 30 MIPS.
EXAMPLE 16-1:
If the clearing of the ADON bit coincides with an autostart, the clearing has a higher priority and a new
conversion will not start.
After the A/D conversion is aborted, a 2 TAD wait is
required before the next sampling may be started by
setting the SAMP bit.
Selecting the ADC Conversion
Clock
The ADC conversion requires 14 TAD. The source of
the ADC conversion clock is software selected, using a
six-bit counter. There are 64 possible options for TAD.
EQUATION 16-1:
ADC CONVERSION
CLOCK AND SAMPLING
RATE CALCULATION
Minimum TAD = 334 nsec
TCY = 33 .33 nsec (30 MIPS)
TAD
–1
TCY
334 nsec
=2•
33.33 nsec
= 19.04
ADCS<5:0> = 2
Aborting a Conversion
Clearing the ADON bit during a conversion will abort
the current conversion and stop the sampling sequencing until the next sampling trigger. The ADCBUF will not
be updated with the partially completed A/D conversion
sample. That is, the ADCBUF will continue to contain
the value of the last completed conversion (or the last
value written to the ADCBUF register).
16.6
The internal RC oscillator is selected by setting the
ADRC bit.
–1
Therefore,
Set ADCS<5:0> = 19
TCY
(ADCS<5:0> + 1)
2
33.33 nsec
=
(19 + 1)
2
Actual TAD =
= 334 nsec
If SSRC<2:0> = ‘111’ and SAMC<4:0> = ‘00001’
Since,
Sampling Time = Acquisition Time + Conversion Time
= 1 TAD + 14 TAD
= 15 x 334 nsec
Therefore,
Sampling Rate =
1
(15 x 334 nsec)
= ~200 kHz
ADC CONVERSION
CLOCK
TAD = TCY * (0.5*(ADCS<5:0> + 1))
© 2006 Microchip Technology Inc.
DS70139E-page 111
dsPIC30F2011/2012/3012/3013
16.7
ADC Speeds
The dsPIC30F 12-bit ADC specifications permit a maximum of 200 ksps sampling rate. Table 16-1 summarizes the conversion speeds for the dsPIC30F 12-bit
ADC and the required operating conditions.
Figure 16-2 depicts the recommended circuit for the
conversion rates above 200 ksps. The dsPIC30F2011
is shown as an example.
TABLE 16-1:
12-BIT ADC EXTENDED CONVERSION RATES
dsPIC30F 12-bit ADC Conversion Rates
Speed
TAD
Sampling
Minimum Time Min
Up to 200
ksps(1)
334 ns
1 TAD
Rs Max
VDD
Temperature
2.5 kΩ
4.5V to 5.5V
-40°C to +85°C
Channels Configuration
VREF- VREF+
CHX
ANx
S/H
Up to 100
ksps
668 ns
1 TAD
2.5 kΩ
3.0V to 5.5V
ADC
-40°C to +125°C
VREF- VREF+
or
or
AVSS AVDD
CHX
ANx
S/H
ADC
ANx or VREF-
Note 1: External VREF- and VREF+ pins must be used for correct operation. See Figure 16-2 for recommended
circuit.
FIGURE 16-2:
ADC VOLTAGE REFERENCE SCHEMATIC
VDD
See Note 1:
R2
10
C8
1 μF
VDD
C1
0.01 μF
R1
10
VDD
C7
0.1 μF
VDD
C6
0.01 μF
VREF27
26
AVDD
VSS
23
22
C2
0.1 μF
VDD
VDD
8
9
VDD
11
12
13
14
1
21
2
20
19
3
4 dsPIC30F2011 18
VDD
VSS
6
VSS
7
15
AVDD
C5
1 μF
AVDD
C4
0.1 μF
AVDD
C3
0.01 μF
VDD
Note 1: Ensure adequate bypass capacitors are provided on each VDD pin.
DS70139E-page 112
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
The configuration procedures below give the required
setup values for the conversion speeds above 100
ksps.
16.7.1
200 KSPS CONFIGURATION
GUIDELINE
The following configuration items are required to
achieve a 200 ksps conversion rate.
• Comply with conditions provided in Table 16-1.
• Connect external VREF+ and VREF- pins following
the recommended circuit shown in Figure 16-2.
• Set SSRC<2.0> = 111 in the ADCON1 register to
enable the auto convert option.
• Enable automatic sampling by setting the ASAM
control bit in the ADCON1 register.
• Write the SMPI<3.0> control bits in the ADCON2
register for the desired number of conversions
between interrupts.
• Configure the ADC clock period to be:
1
(14 + 1) x 200,000
= 334 ns
by writing to the ADCS<5:0> control bits in the
ADCON3 register.
• Configure the sampling time to be 1 TAD by
writing: SAMC<4:0> = 00001.
FIGURE 16-3:
The following figure shows the timing diagram of the
ADC running at 200 ksps. The TAD selection in conjunction with the guidelines described above allows a conversion speed of 200 ksps. See Example 16-1 for code
example.
16.8
A/D Acquisition Requirements
The analog input model of the 12-bit ADC is shown in
Figure 16-3. The total sampling time for the A/D is a
function of the internal amplifier settling time and the
holding capacitor charge time.
For the ADC to meet its specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the voltage level on the analog input pin. The
source impedance (RS), the interconnect impedance
(RIC), and the internal sampling switch (RSS) impedance combine to directly affect the time required to
charge the capacitor CHOLD. The combined impedance of the analog sources must therefore be small
enough to fully charge the holding capacitor within the
chosen sample time. To minimize the effects of pin
leakage currents on the accuracy of the ADC, the maximum recommended source impedance, RS, is 2.5 kΩ.
After the analog input channel is selected (changed),
this sampling function must be completed prior to starting the conversion. The internal holding capacitor will
be in a discharged state prior to each sample operation.
12-BIT A/D CONVERTER ANALOG INPUT MODEL
VDD
Rs
VA
ANx
RIC ≤ 250Ω
VT = 0.6V
Sampling
Switch
RSS ≤ 3 kΩ
RSS
CPIN
VT = 0.6V
I leakage
± 500 nA
CHOLD
= DAC capacitance
= 18 pF
VSS
Legend: CPIN
= input capacitance
VT
= threshold voltage
I leakage = leakage current at the pin due to
various junctions
RIC
= interconnect resistance
RSS
= sampling switch resistance
CHOLD
= sample/hold capacitance (from DAC)
Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 2.5 kΩ.
© 2006 Microchip Technology Inc.
DS70139E-page 113
dsPIC30F2011/2012/3012/3013
16.9
Module Power-Down Modes
inates all digital switching noise from the conversion.
When the conversion is complete, the CONV bit will be
cleared and the result loaded into the ADCBUF register.
The module has 2 internal power modes.
When the ADON bit is ‘1’, the module is in Active mode;
it is fully powered and functional.
When ADON is ‘0’, the module is in Off mode. The digital and analog portions of the circuit are disabled for
maximum current savings.
In order to return to the Active mode from Off mode, the
user must wait for the ADC circuitry to stabilize.
16.10.2
A/D OPERATION DURING CPU IDLE
MODE
The ADSIDL bit selects if the module will stop on Idle or
continue on Idle. If ADSIDL = 0, the module will continue operation on assertion of Idle mode. If ADSIDL =
1, the module will stop on Idle.
16.10 A/D Operation During CPU Sleep
and Idle Modes
16.10.1
If the A/D interrupt is enabled, the device will wake-up
from Sleep. If the A/D interrupt is not enabled, the ADC
module will then be turned off, although the ADON bit
will remain set.
A/D OPERATION DURING CPU
SLEEP MODE
16.11 Effects of a Reset
When the device enters Sleep mode, all clock sources
to the module are shut down and stay at logic ‘0’.
If Sleep occurs in the middle of a conversion, the conversion is aborted. The converter will not continue with
a partially completed conversion on exit from Sleep
mode.
A device Reset forces all registers to their Reset state.
This forces the ADC module to be turned off, and any
conversion and sampling sequence is aborted. The values that are in the ADCBUF registers are not modified.
The A/D Result register will contain unknown data after
a Power-on Reset.
Register contents are not affected by the device
entering or leaving Sleep mode.
16.12 Output Formats
The ADC module can operate during Sleep mode if the
A/D clock source is set to RC (ADRC = 1). When the RC
clock source is selected, the ADC module waits one
instruction cycle before starting the conversion. This
allows the SLEEP instruction to be executed which elim-
The A/D result is 12 bits wide. The data buffer RAM is
also 12 bits wide. The 12-bit data can be read in one of
four different formats. The FORM<1:0> bits select the
format. Each of the output formats translates to a 16-bit
result on the data bus.
FIGURE 16-4:
A/D OUTPUT DATA FORMATS
RAM Contents:
d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
Read to Bus:
Signed Fractional
d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
0
0
0
0
Fractional
d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
0
0
0
0
Signed Integer
Integer
DS70139E-page 114
d11 d11 d11 d11 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
0
0
0
0
d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
16.13 Configuring Analog Port Pins
16.14 Connection Considerations
The use of the ADPCFG and TRIS registers control the
operation of the A/D port pins. The port pins that are
desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be
converted.
The analog inputs have diodes to VDD and VSS as ESD
protection. This requires that the analog input be
between VDD and VSS. If the input voltage exceeds this
range by greater than 0.3V (either direction), one of the
diodes becomes forward biased and it may damage the
device if the input current specification is exceeded.
The A/D operation is independent of the state of the
CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits.
An external RC filter is sometimes added for antialiasing of the input signal. The R component should be
selected to ensure that the sampling time requirements
are satisfied. Any external components connected (via
high-impedance) to an analog input pin (capacitor,
zener diode, etc.) should have very little leakage
current at the pin.
When reading the PORT register, all pins configured as
analog input channels will read as cleared.
Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a
digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.
© 2006 Microchip Technology Inc.
DS70139E-page 115
A/D CONVERTER REGISTER MAP FOR dsPIC30F2011/3012
SFR
Name
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
ADCBUF0
0280
—
—
—
—
ADC Data Buffer 0
0000 uuuu uuuu uuuu
ADCBUF1
0282
—
—
—
—
ADC Data Buffer 1
0000 uuuu uuuu uuuu
ADCBUF2
0284
—
—
—
—
ADC Data Buffer 2
0000 uuuu uuuu uuuu
ADCBUF3
0286
—
—
—
—
ADC Data Buffer 3
0000 uuuu uuuu uuuu
ADCBUF4
0288
—
—
—
—
ADC Data Buffer 4
0000 uuuu uuuu uuuu
ADCBUF5
028A
—
—
—
—
ADC Data Buffer 5
0000 uuuu uuuu uuuu
ADCBUF6
028C
—
—
—
—
ADC Data Buffer 6
0000 uuuu uuuu uuuu
ADCBUF7
028E
—
—
—
—
ADC Data Buffer 7
0000 uuuu uuuu uuuu
ADCBUF8
0290
—
—
—
—
ADC Data Buffer 8
0000 uuuu uuuu uuuu
ADCBUF9
0292
—
—
—
—
ADC Data Buffer 9
0000 uuuu uuuu uuuu
ADCBUFA
0294
—
—
—
—
ADC Data Buffer 10
0000 uuuu uuuu uuuu
ADCBUFB
0296
—
—
—
—
ADC Data Buffer 11
0000 uuuu uuuu uuuu
ADCBUFC 0298
—
—
—
—
ADC Data Buffer 12
0000 uuuu uuuu uuuu
ADCBUFD 029A
—
—
—
—
ADC Data Buffer 13
0000 uuuu uuuu uuuu
ADCBUFE 029C
—
—
—
—
ADC Data Buffer 14
0000 uuuu uuuu uuuu
ADCBUFF
029E
—
—
—
—
ADC Data Buffer 15
ADCON1
02A0
ADON
—
ADSIDL
—
—
—
—
Bit 10
—
Bit 9
Bit 8
Bit 7
FORM<1:0>
Bit 6
Bit 5
SSRC<2:0>
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
0000 uuuu uuuu uuuu
—
—
ASAM
SAMP
DONE
0000 0000 0000 0000
BUFM
ALTS
0000 0000 0000 0000
ADCON2
02A2
ADCON3
02A4
—
—
—
ADCHS
02A6
—
—
—
CH0NB
ADPCFG
02A8
—
—
—
—
—
—
—
—
PCFG7
PCFG6 PCFG5
PCFG4
PCFG3 PCFG2 PCFG1
PCFG0
0000 0000 0000 0000
ADCSSL
02AA
—
—
—
—
—
—
—
—
CSSL7
CSSL6
CSSL4
CSSL3
CSSL0
0000 0000 0000 0000
Legend:
Note:
VCFG<2:0>
Bit 11
CSCNA
—
—
SAMC<4:0>
CH0SB<3:0>
BUFS
—
ADRC
—
—
—
u = uninitialized bit
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
SMPI<3:0>
ADCS<5:0>
—
CSSL5
CH0NA
0000 0000 0000 0000
CH0SA<3:0>
CSSL2
CSSL1
0000 0000 0000 0000
dsPIC30F2011/2012/3012/3013
DS70139E-page 116
TABLE 16-2:
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 16-3:
A/D CONVERTER REGISTER MAP FOR dsPIC30F2012/3013
SFR
Name
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
ADCBUF0
0280
—
—
—
—
ADC Data Buffer 0
0000 uuuu uuuu uuuu
ADCBUF1
0282
—
—
—
—
ADC Data Buffer 1
0000 uuuu uuuu uuuu
ADCBUF2
0284
—
—
—
—
ADC Data Buffer 2
0000 uuuu uuuu uuuu
ADCBUF3
0286
—
—
—
—
ADC Data Buffer 3
0000 uuuu uuuu uuuu
ADCBUF4
0288
—
—
—
—
ADC Data Buffer 4
0000 uuuu uuuu uuuu
ADCBUF5
028A
—
—
—
—
ADC Data Buffer 5
0000 uuuu uuuu uuuu
ADCBUF6
028C
—
—
—
—
ADC Data Buffer 6
0000 uuuu uuuu uuuu
ADCBUF7
028E
—
—
—
—
ADC Data Buffer 7
0000 uuuu uuuu uuuu
ADCBUF8
0290
—
—
—
—
ADC Data Buffer 8
0000 uuuu uuuu uuuu
ADCBUF9
0292
—
—
—
—
ADC Data Buffer 9
0000 uuuu uuuu uuuu
ADCBUFA
0294
—
—
—
—
ADC Data Buffer 10
0000 uuuu uuuu uuuu
ADCBUFB
0296
—
—
—
—
ADC Data Buffer 11
0000 uuuu uuuu uuuu
ADCBUFC 0298
—
—
—
—
ADC Data Buffer 12
0000 uuuu uuuu uuuu
ADCBUFD 029A
—
—
—
—
ADC Data Buffer 13
0000 uuuu uuuu uuuu
ADCBUFE 029C
—
—
—
—
ADC Data Buffer 14
0000 uuuu uuuu uuuu
ADCBUFF
029E
—
—
—
—
ADC Data Buffer 15
ADCON1
02A0
ADON
—
ADSIDL
—
—
—
—
Bit 10
Bit 8
Bit 7
FORM<1:0>
Bit 6
Bit 5
SSRC<2:0>
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
0000 uuuu uuuu uuuu
—
—
ASAM
SAMP
DONE
0000 0000 0000 0000
BUFM
ALTS
0000 0000 0000 0000
ADCON2
02A2
02A4
—
—
—
ADCHS
02A6
—
—
—
CH0NB
ADPCFG
02A8
—
—
—
—
—
—
PCFG9 PCFG8 PCFG7
PCFG6 PCFG5
PCFG4
PCFG3 PCFG2 PCFG1
PCFG0
0000 0000 0000 0000
ADCSSL
02AA
—
—
—
—
—
—
CSSL9
CSSL6
CSSL4
CSSL3
CSSL0
0000 0000 0000 0000
Note:
CSCNA
—
—
SAMC<4:0>
CH0SB<3:0>
CSSL8
BUFS
—
ADRC
—
—
—
CSSL7
u = uninitialized bit
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
SMPI<3:0>
ADCS<5:0>
—
CSSL5
CH0NA
0000 0000 0000 0000
CH0SA<3:0>
CSSL2
CSSL1
0000 0000 0000 0000
DS70139E-page 117
dsPIC30F2011/2012/3012/3013
—
Bit 9
ADCON3
Legend:
VCFG<2:0>
Bit 11
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 118
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
17.0
SYSTEM INTEGRATION
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
There are several features intended to maximize system reliability, minimize cost through elimination of
external components, provide Power Saving Operating
modes and offer code protection:
• Oscillator Selection
• Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Programmable Brown-out Reset (BOR)
• Watchdog Timer (WDT)
• Low-Voltage Detect
• Power-Saving Modes (Sleep and Idle)
• Code Protection
• Unit ID Locations
• In-Circuit Serial Programming (ICSP)
17.1
Oscillator System Overview
The dsPIC30F oscillator system has the following
modules and features:
• Various external and internal oscillator options as
clock sources
• An on-chip PLL to boost internal operating
frequency
• A clock switching mechanism between various
clock sources
• Programmable clock postscaler for system power
savings
• A Fail-Safe Clock Monitor (FSCM) that detects
clock failure and takes fail-safe measures
• Clock Control register (OSCCON)
• Configuration bits for main oscillator selection
Configuration bits determine the clock source upon
Power-on Reset (POR) and Brown-out Reset (BOR).
Thereafter, the clock source can be changed between
permissible clock sources. The OSCCON register controls the clock switching and reflects system clock
related status bits.
Table 17-1 provides a summary of the dsPIC30F Oscillator Operating modes. A simplified diagram of the
oscillator system is shown in Figure 17-1.
dsPIC30F devices have a Watchdog Timer which is
permanently enabled via the Configuration bits or can
be software controlled. It runs off its own RC oscillator
for added reliability. There are two timers that offer
necessary delays on power-up. One is the Oscillator
Start-up Timer (OST), intended to keep the chip in
Reset until the crystal oscillator is stable. The other is
the Power-up Timer (PWRT) which provides a delay on
power-up only, designed to keep the part in Reset while
the power supply stabilizes. With these two timers
on-chip, most applications need no external Reset
circuitry.
Sleep mode is designed to offer a very low current
Power-Down mode. The user can wake-up from Sleep
through external Reset, Watchdog Timer Wake-up, or
through an interrupt. Several oscillator options are also
made available to allow the part to fit a wide variety of
applications. In the Idle mode, the clock sources are
still active but the CPU is shut-off. The RC oscillator
option saves system cost while the LP crystal option
saves power.
© 2006 Microchip Technology Inc.
DS70139E-page 119
dsPIC30F2011/2012/3012/3013
TABLE 17-1:
OSCILLATOR OPERATING MODES
Oscillator Mode
Description
XTL
200 kHz-4 MHz crystal on OSC1:OSC2.
XT
4 MHz-10 MHz crystal on OSC1:OSC2.
XT w/PLL 4x
4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled.
XT w/PLL 8x
4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled.
XT w/PLL 16x
4 MHz-7.5 MHz crystal on OSC1:OSC2, 16x PLL enabled(1).
LP
32 kHz crystal on SOSCO:SOSCI(2).
HS
10 MHz-25 MHz crystal.
HS/2 w/PLL 4x
10 MHz -20 MHz crystal, divide by 2, 4x PLL enabled.
HS/2 w/PLL 8x
10 MHz-20 MHz crystal, divide by 2, 8x PLL enabled.
HS/2 w/PLL 16x
10 MHz-15 MHz crystal, divide by 2, 16x PLL enabled(1).
HS/3 w/PLL 4x
12 MHz-25 MHz crystal, divide by 3, 4x PLL enabled.
HS/3 w/PLL 8x
12 MHz-25 MHz crystal, divide by 3, 8x PLL enabled.
HS/3 w/PLL 16x
12 MHz-22.5 MHz crystal, divide by 3, 16x PLL enabled(1).
EC
External clock input (0-40 MHz).
ECIO
External clock input (0-40 MHz), OSC2 pin is I/O.
EC w/PLL 4x
External clock input (4-10 MHz), OSC2 pin is I/O, 4x PLL enabled.
EC w/PLL 8x
External clock input (4-10 MHz), OSC2 pin is I/O, 8x PLL enabled.
EC w/PLL 16x
External clock input (4-7.5 MHz), OSC2 pin is I/O, 16x PLL enabled(1).
ERC
External RC oscillator, OSC2 pin is FOSC/4 output(3).
ERCIO
External RC oscillator, OSC2 pin is I/O(3).
FRC
7.37 MHz internal RC oscillator.
FRC w/PLL 4x
7.37 MHz Internal RC oscillator, 4x PLL enabled.
FRC w/PLL 8x
7.37 MHz Internal RC oscillator, 8x PLL enabled.
FRC w/PLL 16x
7.37 MHz Internal RC oscillator, 16x PLL enabled.
LPRC
512 kHz internal RC oscillator.
Note 1:
2:
3:
dsPIC30F maximum operating frequency of 120 MHz must be met.
LP oscillator can be conveniently shared as system clock, as well as real-time clock for Timer1.
Requires external R and C. Frequency operation up to 4 MHz.
DS70139E-page 120
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 17-1:
OSCILLATOR SYSTEM BLOCK DIAGRAM
Oscillator Configuration bits
PWRSAV Instruction
Wake-up Request
FPLL
OSC1
OSC2
Primary
Oscillator
PLL
PLL
x4, x8, x16
Lock
Primary Osc
COSC<2:0>
Internal FRC Osc
Internal Fast RC
Oscillator (FRC)
POR Done
NOSC<2:0>
Primary
Oscillator
OSWEN
Stability Detector
Oscillator
Start-up
Timer
Clock
Secondary Osc
Switching
and Control
Block
SOSCO
SOSCI
32 kHz LP
Oscillator
Secondary
Oscillator
Stability Detector
Internal Low
Power RC
Oscillator (LPRC)
FCKSM<1:0>
2
Programmable
Clock Divider System
Clock
2
POST<1:0>
LPRC
Fail-Safe Clock
Monitor (FSCM)
CF
Oscillator Trap
To Timer1
© 2006 Microchip Technology Inc.
DS70139E-page 121
dsPIC30F2011/2012/3012/3013
17.2
17.2.1
17.2.2
Oscillator Configurations
INITIAL CLOCK SOURCE
SELECTION
While coming out of Power-on Reset or Brown-out
Reset, the device selects its clock source based on:
a)
b)
FOS<2:0> Configuration bits that select one of
four oscillator groups,
and FPR<4:0> Configuration bits that select one
of 15 oscillator choices within the primary group.
The selection is as shown in Table 17-2.
TABLE 17-2:
OSCILLATOR START-UP TIMER
(OST)
In order to ensure that a crystal oscillator (or ceramic
resonator) has started and stabilized, an Oscillator
Start-up Timer is included. It is a simple 10-bit counter
that counts 1024 TOSC cycles before releasing the
oscillator clock to the rest of the system. The time-out
period is designated as TOST.
The TOST time is involved every time the oscillator has
to restart (i.e., on POR, BOR and wake-up from Sleep).
The Oscillator Start-up Timer is applied to the LP oscillator, XT, XTL and HS modes (upon wake-up from
Sleep, POR and BOR) for the primary oscillator.
CONFIGURATION BIT VALUES FOR CLOCK SELECTION
Oscillator Mode
Oscillator
Source
FOS<2:0>
FPR<4:0>
OSC2
Function
1
1
1
0
1
1
0
1
I/O
ECIO w/PLL 4x
PLL
ECIO wPLL 8x
PLL
1
1
1
0
1
1
1
0
I/O
ECIO w/ PLL 16x
PLL
1
1
1
0
1
1
1
1
I/O
FRC w/PLL 4X
PLL
1
1
1
0
0
0
0
1
I/O
FRC w/PLL 8x
PLL
1
1
1
0
1
0
1
0
I/O
FRC w/PLL 16x
PLL
1
1
1
0
0
0
1
1
I/O
XT wPLL 4x
PLL
1
1
1
0
0
1
0
1
OSC2
XT w/PLL 8x
PLL
1
1
1
0
0
1
1
0
OSC2
XT w/PLL 16x
PLL
1
1
1
0
0
1
1
1
OSC2
HS2 w/PLL 4x
PLL
1
1
1
1
0
0
0
1
OSC2
HS2 wPLL 8x
PLL
1
1
1
1
0
0
1
0
OSC2
HS2 w/ PLL 16x
PLL
1
1
1
1
0
0
1
1
OSC2
HS3 w/PLL 4x
PLL
1
1
1
1
0
1
0
1
OSC2
HS3 w/PLL 8x
PLL
1
1
1
1
0
1
1
0
OSC2
HS3 w/PLL 16x
PLL
1
1
1
1
0
1
1
1
OSC2
ECIO
External
0
1
1
0
1
1
0
0
I/O
XT
External
0
1
1
0
0
1
0
0
OSC2
0
1
1
0
0
0
1
0
OSC2
HS
External
EC
External
0
1
1
0
1
0
1
1
CLKO
0
1
1
0
1
0
0
1
CLKO
ERC
External
ERCIO
External
0
1
1
0
1
0
0
0
I/O
XTL
External
0
1
1
0
0
0
0
0
OSC2
0
0
0
X
X
X
X
X
(Note 1, 2)
LP
Secondary
FRC
Internal FRC
0
0
1
X
X
X
X
X
(Note 1, 2)
LPRC
Internal LPRC
0
1
0
X
X
X
X
X
(Note 1, 2)
Note 1: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<4:0>).
2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is
selected at all times.
DS70139E-page 122
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
17.2.3
LP OSCILLATOR CONTROL
Note:
When a 16x PLL is used, the FRC frequency must not be tuned to a frequency
greater than 7.5 MHz.
Enabling the LP oscillator is controlled with two elements:
1.
2.
The current oscillator group bits COSC<2:0>.
The LPOSCEN bit (OSCCON register).
The LP oscillator is on (even during Sleep mode) if
LPOSCEN = 1. The LP oscillator is the device clock if:
• COSC<2:0> = 000 (LP selected as main oscillator)
and
• LPOSCEN = 1
Keeping the LP oscillator on at all times allows for a fast
switch to the 32 kHz system clock for lower power operation. Returning to the faster main oscillator will still
require a start-up time
17.2.4
PHASE LOCKED LOOP (PLL)
The PLL multiplies the clock which is generated by the
primary oscillator or Fast RC oscillator. The PLL is
selectable to have either gains of x4, x8, and x16. Input
and output frequency ranges are summarized in
Table 17-3.
TABLE 17-3:
PLL FREQUENCY RANGE
FIN
PLL
Multiplier
FOUT
4 MHz-10 MHz
x4
16 MHz-40 MHz
4 MHz-10 MHz
x8
32 MHz-80 MHz
4 MHz-7.5 MHz
x16
64 MHz-120 MHz
The PLL features a lock output which is asserted when
the PLL enters a phase locked state. Should the loop
fall out of lock (e.g., due to noise), the lock signal will be
rescinded. The state of this signal is reflected in the
read-only LOCK bit in the OSCCON register.
17.2.5
FAST RC OSCILLATOR (FRC)
The FRC oscillator is a fast (7.37 MHz ±2% nominal)
internal RC oscillator. This oscillator is intended to provide reasonable device operating speeds without the
use of an external crystal, ceramic resonator, or RC
network. The FRC oscillator can be used with the PLL
to obtain higher clock frequencies.
The dsPIC30F operates from the FRC oscillator whenever the current oscillator selection control bits in the
OSCCON register (OSCCON<14:12>) are set to ‘001’.
The four bit field specified by TUN<3:0> (OSCTUN
<3:0>) allows the user to tune the internal fast RC
oscillator (nominal 7.37 MHz). The user can tune the
FRC oscillator within a range of +10.5% (840 kHz)
and -12% (960 kHz) in steps of 1.50% around the
factory-calibrated setting, see Table 17-4.
If OSCCON<14:12> are set to ‘111’ and FPR<4:0> are
set to ‘00001’, ‘01010’ or ‘00011’, then a PLL
multiplier of 4, 8 or 16 (respectively) is applied.
© 2006 Microchip Technology Inc.
TABLE 17-4:
TUN<3:0>
Bits
0111
0110
0101
0100
0011
0010
0001
0000
1111
1110
1101
1100
1011
1010
1001
1000
17.2.6
FRC TUNING
FRC Frequency
+ 10.5%
+ 9.0%
+ 7.5%
+ 6.0%
+ 4.5%
+ 3.0%
+ 1.5%
Center Frequency (oscillator is
running at calibrated frequency)
- 1.5%
- 3.0%
- 4.5%
- 6.0%
- 7.5%
- 9.0%
- 10.5%
- 12.0%
LOW-POWER RC OSCILLATOR
(LPRC)
The LPRC oscillator is a component of the Watchdog
Timer (WDT) and oscillates at a nominal frequency of
512 kHz. The LPRC oscillator is the clock source for
the Power-up Timer (PWRT) circuit, WDT and clock
monitor circuits. It may also be used to provide a lowfrequency clock source option for applications where
power consumption is critical and timing accuracy is
not required.
The LPRC oscillator is always enabled at a Power-on
Reset because it is the clock source for the PWRT.
After the PWRT expires, the LPRC oscillator will
remain on if one of the following is true:
• The Fail-Safe Clock Monitor is enabled
• The WDT is enabled
• The LPRC oscillator is selected as the system
clock via the COSC<2:0> control bits in the
OSCCON register
If one of the above conditions is not true, the LPRC will
shut-off after the PWRT expires.
Note 1: OSC2 pin function is determined by the
Primary Oscillator mode selection
(FPR<4:0>).
2: OSC1 pin cannot be used as an I/O pin
even if the secondary oscillator or an
internal clock source is selected at all
times.
DS70139E-page 123
dsPIC30F2011/2012/3012/3013
17.2.7
FAIL-SAFE CLOCK MONITOR
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue to operate even in the event of an oscillator
failure. The FSCM function is enabled by appropriately
programming the FCKSM Configuration bits (clock
switch and monitor selection bits) in the FOSC Device
Configuration register. If the FSCM function is enabled,
the LPRC internal oscillator will run at all times (except
during Sleep mode) and will not be subject to control by
the SWDTEN bit.
In the event of an oscillator failure, the FSCM will generate a clock failure trap event and will switch the system clock over to the FRC oscillator. The user will then
have the option to either attempt to restart the oscillator
or execute a controlled shutdown. The user may decide
to treat the trap as a warm Reset by simply loading the
Reset address into the oscillator fail trap vector. In this
event, the CF (Clock Fail) bit (OSCCON<3>) is also set
whenever a clock failure is recognized.
In the event of a clock failure, the WDT is unaffected
and continues to run on the LPRC clock.
If the oscillator has a very slow start-up time coming out
of POR, BOR or Sleep, it is possible that the PWRT
timer will expire before the oscillator has started. In
such cases, the FSCM will be activated and the FSCM
will initiate a clock failure trap, and the COSC<2:0> bits
are loaded with FRC oscillator selection. This will effectively shut-off the original oscillator that was trying to
start.
The OSCCON register holds the Control and Status
bits related to clock switching.
• COSC<2:0>: Read-only bits always reflect the
current oscillator group in effect.
• NOSC<2:0>: Control bits which are written to
indicate the new oscillator group of choice.
- On POR and BOR, COSC<2:0> and
NOSC<2:0> are both loaded with the Configuration bit values FOS<2:0>.
• LOCK: The LOCK bit indicates a PLL lock.
• CF: Read-only bit indicating if a clock fail detect
has occurred.
• OSWEN: Control bit changes from a ‘0’ to a ‘1’
when a clock transition sequence is initiated.
Clearing the OSWEN control bit will abort a clock
transition in progress (used for hang-up
situations).
If Configuration bits FCKSM<1:0> = 1x, then the clock
switching and Fail-Safe Clock monitoring functions are
disabled. This is the default Configuration bit setting.
If clock switching is disabled, then the FOS<2:0> and
FPR<4:0> bits directly control the oscillator selection
and the COSC<2:0> bits do not control the clock selection. However, these bits will reflect the clock source
selection.
Note:
The user may detect this situation and restart the
oscillator in the clock fail trap ISR.
Upon a clock failure detection, the FSCM module will
initiate a clock switch to the FRC oscillator as follows:
1.
2.
3.
The COSC bits (OSCCON<14:12>) are loaded
with the FRC oscillator selection value.
CF bit is set (OSCCON<3>).
OSWEN control bit (OSCCON<0>) is cleared.
For the purpose of clock switching, the clock sources
are sectioned into four groups:
1.
2.
3.
4.
Primary (with or without PLL)
Secondary
Internal FRC
Internal LPRC
The user can switch between these functional groups
but cannot switch between options within a group. If the
primary group is selected, then the choice within the
group is always determined by the FPR<4:0> Configuration bits.
17.2.8
The application should not attempt to
switch to a clock of frequency lower than
100 kHz when the Fail-Safe Clock Monitor
is enabled. If such clock switching is
performed, the device may generate an
oscillator fail trap and switch to the Fast RC
oscillator.
PROTECTION AGAINST
ACCIDENTAL WRITES TO OSCCON
A write to the OSCCON register is intentionally made
difficult because it controls clock switching and clock
scaling.
To write to the OSCCON low byte, the following code
sequence must be executed without any other
instructions in between:
Byte Write “0x46” to OSCCON low
Byte Write “0x57” to OSCCON low
Byte write is allowed for one instruction cycle. Write the
desired value or use bit manipulation instruction.
To write to the OSCCON high byte, the following
instructions must be executed without any other
instructions in between:
Byte Write “0x78” to OSCCON high
Byte Write “0x9A” to OSCCON high
Byte write is allowed for one instruction cycle. Write the
desired value or use bit manipulation instruction.
DS70139E-page 124
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
17.3
Reset
The PIC18F1220/1320 differentiates between various
kinds of Reset:
a)
b)
c)
d)
e)
f)
g)
h)
Power-on Reset (POR)
MCLR Reset during normal operation
MCLR Reset during Sleep
Watchdog Timer (WDT) Reset (during normal
operation)
Programmable Brown-out Reset (BOR)
RESET Instruction
Reset caused by trap lockup (TRAPR)
Reset caused by illegal opcode or by using an
uninitialized W register as an address pointer
(IOPUWR)
FIGURE 17-2:
Different registers are affected in different ways by various Reset conditions. Most registers are not affected
by a WDT wake-up since this is viewed as the resumption of normal operation. Status bits from the RCON
register are set or cleared differently in different Reset
situations, as indicated in Table 17-5. These bits are
used in software to determine the nature of the Reset.
A block diagram of the On-Chip Reset Circuit is shown
in Figure 17-2.
A MCLR noise filter is provided in the MCLR Reset
path. The filter detects and ignores small pulses.
Internally generated Resets do not drive MCLR pin low.
RESET SYSTEM BLOCK DIAGRAM
RESET
Instruction
Digital
Glitch Filter
MCLR
Sleep or Idle
WDT
Module
POR
VDD Rise
Detect
S
VDD
Brown-out
Reset
BOR
BOREN
R
Q
SYSRST
Trap Conflict
Illegal Opcode/
Uninitialized W Register
17.3.1
POR: POWER-ON RESET
A power-on event will generate an internal POR pulse
when a VDD rise is detected. The Reset pulse will occur
at the POR circuit threshold voltage (VPOR) which is
nominally 1.85V. The device supply voltage characteristics must meet specified starting voltage and rise rate
requirements. The POR pulse will reset a POR timer
and place the device in the Reset state. The POR also
selects the device clock source identified by the
oscillator configuration fuses.
The POR circuit inserts a small delay, TPOR, which is
nominally 10 μs and ensures that the device bias circuits are stable. Furthermore, a user selected powerup time-out (TPWRT) is applied. The TPWRT parameter
is based on device Configuration bits and can be 0 ms
(no delay), 4 ms, 16 ms or 64 ms. The total delay is at
device power-up, TPOR + TPWRT. When these delays
have expired, SYSRST will be negated on the next
leading edge of the Q1 clock and the PC will jump to the
Reset vector.
The timing for the SYSRST signal is shown in
Figure 17-3 through Figure 17-5.
© 2006 Microchip Technology Inc.
DS70139E-page 125
dsPIC30F2011/2012/3012/3013
FIGURE 17-3:
TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)
VDD
MCLR
INTERNAL POR
TOST
OST TIME-OUT
TPWRT
PWRT TIME-OUT
INTERNAL Reset
FIGURE 17-4:
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1
VDD
MCLR
INTERNAL POR
TOST
OST TIME-OUT
TPWRT
PWRT TIME-OUT
INTERNAL Reset
FIGURE 17-5:
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
VDD
MCLR
INTERNAL POR
TOST
OST TIME-OUT
TPWRT
PWRT TIME-OUT
INTERNAL Reset
DS70139E-page 126
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
17.3.1.1
POR with Long Crystal Start-up Time
(with FSCM Enabled)
The oscillator start-up circuitry is not linked to the POR
circuitry. Some crystal circuits (especially low frequency crystals) will have a relatively long start-up
time. Therefore, one or more of the following conditions
is possible after the POR timer and the PWRT have
expired:
• The oscillator circuit has not begun to oscillate.
• The Oscillator Start-up Timer has not expired (if a
crystal oscillator is used).
• The PLL has not achieved a LOCK (if PLL is
used).
If the FSCM is enabled and one of the above conditions
is true, then a clock failure trap will occur. The device
will automatically switch to the FRC oscillator and the
user can switch to the desired crystal oscillator in the
trap ISR.
17.3.1.2
selected, the BOR will activate the Oscillator Start-up
Timer (OST). The system clock is held until OST
expires. If the PLL is used, then the clock will be held
until the LOCK bit (OSCCON<5>) is ‘1’.
Concurrently, the POR time-out (TPOR) and the PWRT
time-out (TPWRT) will be applied before the internal Reset
is released. If TPWRT = 0 and a crystal oscillator is being
used, then a nominal delay of TFSCM = 100 μs is applied.
The total delay in this case is (TPOR + TFSCM).
The BOR Status bit (RCON<1>) will be set to indicate
that a BOR has occurred. The BOR circuit, if enabled,
will continue to operate while in Sleep or Idle modes
and will reset the device should VDD fall below the BOR
threshold voltage.
FIGURE 17-6:
VDD
Operating without FSCM and PWRT
If the FSCM is disabled and the Power-up Timer
(PWRT) is also disabled, then the device will exit rapidly from Reset on power-up. If the clock source is
FRC, LPRC, ERC or EC, it will be active immediately.
If the FSCM is disabled and the system clock has not
started, the device will be in a frozen state at the Reset
vector until the system clock starts. From the user’s
perspective, the device will appear to be in Reset until
a system clock is available.
17.3.2
BOR: PROGRAMMABLE
BROWN-OUT RESET
The BOR (Brown-out Reset) module is based on an
internal voltage reference circuit. The main purpose of
the BOR module is to generate a device Reset when a
brown-out condition occurs. Brown-out conditions are
generally caused by glitches on the AC mains (i.e.,
missing portions of the AC cycle waveform due to bad
power transmission lines, or voltage sags due to excessive current draw when a large inductive load is turned
on).
The BOR module allows selection of one of the
following voltage trip points (see Table 20-11):
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
D
R
R1
C
Note 1:
2:
3:
Note:
MCLR
dsPIC30F
External Power-on Reset circuit is required
only if the VDD power-up slope is too slow.
The diode D helps discharge the capacitor
quickly when VDD powers down.
R should be suitably chosen so as to make
sure that the voltage drop across R does not
violate the device’s electrical specifications.
R1 should be suitably chosen so as to limit
any current flowing into MCLR from external
capacitor C, in the event of MCLR/VPP pin
breakdown due to Electrostatic Discharge
(ESD) or Electrical Overstress (EOS).
Dedicated supervisory devices, such as
the MCP1XX and MCP8XX, may also be
used as an external Power-on Reset
circuit.
• 2.6V-2.71V
• 4.1V-4.4V
• 4.58V-4.73V
Note:
The BOR voltage trip points indicated here
are nominal values provided for design
guidance only. Refer to the Electrical
Specifications in the specific device data
sheet for BOR voltage limit specifications.
A BOR will generate a Reset pulse which will reset the
device. The BOR will select the clock source based on
the device Configuration bit values (FOS<2:0> and
FPR<4:0>). Furthermore, if an Oscillator mode is
© 2006 Microchip Technology Inc.
DS70139E-page 127
dsPIC30F2011/2012/3012/3013
Table 17-5 shows the Reset conditions for the RCON
register. Since the control bits within the RCON register
are R/W, the information in the table means that all the
bits are negated prior to the action specified in the
condition column.
TABLE 17-5:
INITIALIZATION CONDITION FOR RCON REGISTER: CASE 1
Condition
Program
Counter
TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR
Power-on Reset
Brown-out Reset
0x000000
0x000000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
1
MCLR Reset during normal
operation
Software Reset during
normal operation
0x000000
0
0
1
0
0
0
0
0
0
0x000000
0
0
0
1
0
0
0
0
0
MCLR Reset during Sleep
0x000000
0
0
1
0
0
0
1
0
0
MCLR Reset during Idle
WDT Time-out Reset
WDT Wake-up
0x000000
0x000000
PC + 2
0
0
0
0
0
0
1
0
0
0
0
0
0
1
1
1
0
0
0
0
1
0
0
0
0
0
0
Interrupt Wake-up from
PC + 2(1)
0
0
0
0
0
0
1
0
0
Sleep
Clock Failure Trap
0x000004
0
0
0
0
0
0
0
0
0
Trap Reset
0x000000
1
0
0
0
0
0
0
0
0
Illegal Operation Trap
0x000000
0
1
0
0
0
0
0
0
0
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’
Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.
Table 17-6 shows a second example of the bit
conditions for the RCON register. In this case, it is not
assumed the user has set/cleared specific bits prior to
action specified in the condition column.
TABLE 17-6:
INITIALIZATION CONDITION FOR RCON REGISTER: CASE 2
Condition
Program
Counter
TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR
Power-on Reset
Brown-out Reset
0x000000
0x000000
0
u
0
u
0
u
0
u
0
u
0
u
0
u
1
0
1
1
MCLR Reset during normal
operation
Software Reset during
normal operation
0x000000
u
u
1
0
0
0
0
u
u
0x000000
u
u
0
1
0
0
0
u
u
MCLR Reset during Sleep
0x000000
u
u
1
u
0
0
1
u
u
MCLR Reset during Idle
WDT Time-out Reset
WDT Wake-up
0x000000
0x000000
PC + 2
u
u
u
u
u
u
1
0
u
u
0
u
0
1
1
1
0
u
0
0
1
u
u
u
u
u
u
Interrupt Wake-up from
Sleep
Clock Failure Trap
Trap Reset
PC + 2(1)
u
u
u
u
u
u
1
u
u
0x000004
u
u
u
u
u
u
u
u
u
0x000000
1
u
u
u
u
u
u
u
u
Illegal Operation Reset
0x000000
u
1
u
u
u
u
u
u
u
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’
Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.
DS70139E-page 128
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
17.4
17.4.1
Watchdog Timer (WDT)
WATCHDOG TIMER OPERATION
The primary function of the Watchdog Timer (WDT) is
to reset the processor in the event of a software malfunction. The WDT is a free-running timer which runs
off an on-chip RC oscillator, requiring no external component. Therefore, the WDT timer will continue to operate even if the main processor clock (e.g., the crystal
oscillator) fails.
17.4.2
ENABLING AND DISABLING
THE WDT
The Watchdog Timer can be “Enabled” or “Disabled”
only through a Configuration bit (FWDTEN) in the
Configuration register, FWDT.
Setting FWDTEN = 1 enables the Watchdog Timer. The
enabling is done when programming the device. By
default, after chip erase, FWDTEN bit = 1. Any device
programmer capable of programming dsPIC30F
devices allows programming of this and other Configuration bits.
If enabled, the WDT will increment until it overflows or
“times out”. A WDT time-out will force a device Reset
(except during Sleep). To prevent a WDT time-out, the
user must clear the Watchdog Timer using a CLRWDT
instruction.
If a WDT times out during Sleep, the device will wakeup. The WDTO bit in the RCON register will be cleared
to indicate a wake-up resulting from a WDT time-out.
Setting FWDTEN = 0 allows user software to enable/
disable the Watchdog Timer via the SWDTEN
(RCON<5>) control bit.
17.6
There are two power-saving states that can be entered
through the execution of a special instruction, PWRSAV;
these are Sleep and Idle.
The format of the PWRSAV instruction is as follows:
PWRSAV <parameter>, where ‘parameter’ defines
Idle or Sleep mode.
17.6.1
Low Voltage Detect
The Low Voltage Detect (LVD) module is used to detect
when the VDD of the device drops below a threshold
value, VLVD, which is determined by the LVDL<3:0>
bits (RCON<11:8>) and is thus user programmable.
The internal voltage reference circuitry requires a nominal amount of time to stabilize, and the BGST bit
(RCON<13>) indicates when the voltage reference has
stabilized.
In some devices, the LVD threshold voltage may be
applied externally on the LVDIN pin.
The LVD module is enabled by setting the LVDEN bit
(RCON<12>).
© 2006 Microchip Technology Inc.
SLEEP MODE
In Sleep mode, the clock to the CPU and peripherals is
shut down. If an on-chip oscillator is being used, it is
shut down.
The Fail-Safe Clock Monitor is not functional during
Sleep since there is no clock to monitor. However,
LPRC clock remains active if WDT is operational during
Sleep.
The brown-out protection circuit and the Low-Voltage
Detect circuit, if enabled, will remain functional during
Sleep.
The processor wakes up from Sleep if at least one of
the following conditions has occurred:
• any interrupt that is individually enabled and
meets the required priority level
• any Reset (POR, BOR and MCLR)
• WDT time-out
On waking up from Sleep mode, the processor will
restart the same clock that was active prior to entry into
Sleep mode. When clock switching is enabled, bits
COSC<2:0> will determine the oscillator source that
will be used on wake-up. If clock switch is disabled,
then there is only one system clock.
Note:
17.5
Power-Saving Modes
If a POR or BOR occurred, the selection of
the oscillator is based on the FOS<2:0>
and FPR<4:0> Configuration bits.
If the clock source is an oscillator, the clock to the
device will be held off until OST times out (indicating a
stable oscillator). If PLL is used, the system clock is
held off until LOCK = 1 (indicating that the PLL is
stable). In either case, TPOR, TLOCK and TPWRT delays
are applied.
If EC, FRC, LPRC or ERC oscillators are used, then a
delay of TPOR (~ 10 μs) is applied. This is the smallest
delay possible on wake-up from Sleep.
Moreover, if LP oscillator was active during Sleep and
LP is the oscillator used on wake-up, then the start-up
delay will be equal to TPOR. PWRT delay and OST
timer delay are not applied. In order to have the smallest possible start-up delay when waking up from Sleep,
one of these faster wake-up options should be selected
before entering Sleep.
DS70139E-page 129
dsPIC30F2011/2012/3012/3013
Any interrupt that is individually enabled (using the corresponding IE bit) and meets the prevailing priority level
will be able to wake-up the processor. The processor will
process the interrupt and branch to the ISR. The Sleep
Status bit in the RCON register is set upon wake-up.
Note:
In spite of various delays applied (TPOR,
TLOCK and TPWRT), the crystal oscillator
(and PLL) may not be active at the end of
the time-out (e.g., for low-frequency crystals). In such cases, if FSCM is enabled,
then the device will detect this as a clock
failure and process the clock failure trap, the
FRC oscillator will be enabled and the user
will have to re-enable the crystal oscillator. If
FSCM is not enabled, then the device will
simply suspend execution of code until the
clock is stable and will remain in Sleep until
the oscillator clock has started.
All Resets will wake-up the processor from Sleep
mode. Any Reset, other than POR, will set the Sleep
Status bit. In a POR, the Sleep bit is cleared.
If the Watchdog Timer is enabled, then the processor
will wake-up from Sleep mode upon WDT time-out. The
Sleep and WDTO Status bits are both set.
17.6.2
IDLE MODE
In Idle mode, the clock to the CPU is shut down while
peripherals keep running. Unlike Sleep mode, the clock
source remains active.
Any interrupt that is individually enabled (using IE bit)
and meets the prevailing priority level will be able to
wake-up the processor. The processor will process the
interrupt and branch to the ISR. The Idle Status bit in
the RCON register is set upon wake-up.
Any Reset other than POR will set the Idle Status bit.
On a POR, the Idle bit is cleared.
If Watchdog Timer is enabled, then the processor will
wake-up from Idle mode upon WDT time-out. The Idle
and WDTO Status bits are both set.
Unlike wake-up from Sleep, there are no time delays
involved in wake-up from Idle.
17.7
Device Configuration Registers
The Configuration bits in each device Configuration
register specify some of the device modes and are
programmed by a device programmer, or by using the
In-Circuit Serial Programming™ (ICSP™) feature of
the device. Each device Configuration register is a
24-bit register, but only the lower 16 bits of each register are used to hold configuration data. There are four
device Configuration registers available to the user:
1.
2.
3.
FOSC (0xF80000): Oscillator Configuration
Register
FWDT (0xF80002): Watchdog Timer
Configuration Register
FBORPOR (0xF80004): BOR and POR
Configuration Register
FGS (0xF8000A): General Code Segment
Configuration Register
Several peripherals have a control bit in each module
that allows them to operate during Idle.
4.
LPRC Fail-Safe Clock remains active if clock failure
detect is enabled.
The placement of the Configuration bits is automatically handled when you select the device in your device
programmer. The desired state of the Configuration bits
may be specified in the source code (dependent on the
language tool used), or through the programming
interface. After the device has been programmed, the
application software may read the Configuration bit
values through the table read instructions. For additional information, please refer to the Programming
Specifications of the device.
The processor wakes up from Idle if at least one of the
following conditions has occurred:
• any interrupt that is individually enabled (IE bit is
‘1’) and meets the required priority level
• any Reset (POR, BOR, MCLR)
• WDT time-out
Upon wake-up from Idle mode, the clock is re-applied
to the CPU and instruction execution begins immediately, starting with the instruction following the PWRSAV
instruction.
DS70139E-page 130
Note:
If the code protection Configuration fuse
bits (FGS<GCP> and FGS<GWRP>)
have been programmed, an erase of the
entire code-protected device is only
possible at voltages VDD ≥ 4.5V.
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
17.8
Peripheral Module Disable (PMD)
Registers
The Peripheral Module Disable (PMD) registers provide a method to disable a peripheral module by stopping all clock sources supplied to that module. When a
peripheral is disabled via the appropriate PMD control
bit, the peripheral is in a minimum power consumption
state. The Control and Status registers associated with
the peripheral will also be disabled so writes to those
registers will have no effect and read values will be
invalid.
A peripheral module will only be enabled if both the
associated bit in the the PMD register is cleared and
the peripheral is supported by the specific dsPIC DSC
variant. If the peripheral is present in the device, it is
enabled in the PMD register by default.
Note:
If a PMD bit is set, the corresponding module is disabled after a delay of 1 instruction
cycle. Similarly, if a PMD bit is cleared, the
corresponding module is enabled after a
delay of 1 instruction cycle (assuming the
module Control registers are already
configured to enable module operation).
17.9
When MPLAB® ICD2 is selected as a Debugger, the InCircuit Debugging functionality is enabled. This function allows simple debugging functions when used with
MPLAB IDE. When the device has this feature enabled,
some of the resources are not available for general
use. These resources include the first 80 bytes of Data
RAM and two I/O pins.
One of four pairs of Debug I/O pins may be selected by
the user using configuration options in MPLAB IDE.
These pin pairs are named EMUD/EMUC, EMUD1/
EMUC1, EMUD2/EMUC2 and EMUD3/EMUC3.
In each case, the selected EMUD pin is the Emulation/
Debug Data line, and the EMUC pin is the Emulation/
Debug Clock line. These pins will interface to the
MPLAB ICD 2 module available from Microchip. The
selected pair of Debug I/O pins is used by MPLAB
ICD 2 to send commands and receive responses, as
well as to send and receive data. To use the In-Circuit
Debugger function of the device, the design must
implement ICSP connections to MCLR, VDD, VSS,
PGC, PGD and the selected EMUDx/EMUCx pin pair.
This gives rise to two possibilities:
1.
Note:
In the dsPIC30F2011, dsPIC30F3012 and
dsPIC30F2012 devices, the U2MD bit is
readable and writable and will be read as
‘1’ when set.
© 2006 Microchip Technology Inc.
In-Circuit Debugger
2.
If EMUD/EMUC is selected as the Debug I/O pin
pair, then only a 5-pin interface is required, as
the EMUD and EMUC pin functions are multiplexed with the PGD and PGC pin functions in
all dsPIC30F devices.
If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/
EMUC3 is selected as the Debug I/O pin pair,
then a 7-pin interface is required, as the
EMUDx/EMUCx pin functions (x = 1, 2 or 3) are
not multiplexed with the PGD and PGC pin
functions.
DS70139E-page 131
SFR Name
SYSTEM INTEGRATION REGISTER MAP
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
IOPUWR
BGST
LVDEN
Bit 11
Bit 10
Bit 9
Bit 8
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
EXTR
SWR
SWDTEN
WDTO
SLEEP
IDLE
LOCK
—
CF
—
Bit 1
Bit 0
Reset State
BOR
POR
(Note 1)
LPOSCEN
OSWEN
(Note 2)
TUN1
TUN0
(Note 2)
RCON
0740
TRAPR
OSCCON
0742
—
OSCTUN
0744
—
—
—
—
—
—
—
—
—
—
—
—
TUN3
TUN2
PMD1
0770
—
—
T3MD
T2MD
T1MD
—
—
—
I2CMD
U2MD(3)
U1MD
—
SPI1MD
—
—
ADCMD
0000 0000 0000 0000
PMD2
0772
—
—
—
—
—
—
—
—
—
—
—
—
OC2MD
OC1MD
0000 0000 0000 0000
Note
1:
2:
3:
File Name
—
NOSC<2:0>
POST<1:0>
IC2MD IC1MD
Reset state depends on type of Reset.
Reset state depends on Configuration bits.
Only available on dsPIC30F3013.
TABLE 17-8:
FOSC
COSC<2:0>
LVDL<3:0>
Bit 7
DEVICE CONFIGURATION REGISTER MAP
Addr.
Bits 23-16
F80000
—
Bit 15
Bit 14
FCKSM<1:0>
Bit 13
Bit 12
Bit 11
—
—
—
Bit 10
Bit 9
Bit 8
FOS<2:0>
Bit 7
Bit 6
Bit 5
—
—
—
Bit 4
Bit 3
Bit 2
FWDT
F80002
—
FWDTEN
—
—
—
—
—
—
—
—
—
FWPSA<1:0>
FBORPOR
F80004
—
MCLREN
—
—
—
—
Reserved(1)
Reserved(1)
Reserved(1)
BOREN
—
BORV<1:0>
—
—
FGS
F8000A
—
—
—
—
—
—
—
—
—
—
—
—
—
Reserved(1)
Note:
Note
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
1: Always reads as ‘1’.
Bit 1
Bit 0
FPR<4:0>
—
FWPSB<3:0>
FPWRT<1:0>
GCP
GWRP
dsPIC30F2011/2012/3012/3013
DS70139E-page 132
TABLE 17-7:
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
18.0
INSTRUCTION SET SUMMARY
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F
Programmer’s Reference Manual” (DS70030).
The dsPIC30F instruction set adds many
enhancements to the previous PIC® MCU instruction
sets, while maintaining an easy migration from
PIC
MCU instruction sets.
Most instructions are a single program memory word
(24 bits). Only three instructions require two program
memory locations.
Each single-word instruction is a 24-bit word divided
into an 8-bit opcode which specifies the instruction
type, and one or more operands which further specify
the operation of the instruction.
The instruction set is highly orthogonal and is grouped
into five basic categories:
•
•
•
•
•
Word or byte-oriented operations
Bit-oriented operations
Literal operations
DSP operations
Control operations
Table 18-1 shows the general symbols used in
describing the instructions.
The dsPIC30F instruction set summary in Table 18-2
lists all the instructions, along with the status flags
affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have three
operands:
• The first source operand which is typically a
register ‘Wb’ without any address modifier
• The second source operand which is typically a
register ‘Ws’ with or without an address modifier
• The destination of the result which is typically a
register ‘Wd’ with or without an address modifier
However, word or byte-oriented file register instructions
have two operands:
• The file register specified by the value ‘f’
• The destination, which could either be the file
register ‘f’ or the W0 register, which is denoted as
‘WREG’
© 2006 Microchip Technology Inc.
Most bit-oriented instructions (including simple rotate/
shift instructions) have two operands:
• The W register (with or without an address
modifier) or file register (specified by the value of
‘Ws’ or ‘f’)
• The bit in the W register or file register
(specified by a literal value or indirectly by the
contents of register ‘Wb’)
The literal instructions that involve data movement may
use some of the following operands:
• A literal value to be loaded into a W register or file
register (specified by the value of ‘k’)
• The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
• The first source operand which is a register ‘Wb’
without any address modifier
• The second source operand which is a literal
value
• The destination of the result (only if not the same
as the first source operand) which is typically a
register ‘Wd’ with or without an address modifier
The MAC class of DSP instructions may use some of the
following operands:
• The accumulator (A or B) to be used (required
operand)
• The W registers to be used as the two operands
• The X and Y address space prefetch operations
• The X and Y address space prefetch destinations
• The accumulator write-back destination
The other DSP instructions do not involve any
multiplication, and may include:
• The accumulator to be used (required)
• The source or destination operand (designated as
Wso or Wdo, respectively) with or without an
address modifier
• The amount of shift specified by a W register ‘Wn’
or a literal value
The control instructions may use some of the following
operands:
• A program memory address
• The mode of the table read and table write
instructions
DS70139E-page 133
dsPIC30F2011/2012/3012/3013
All instructions are a single word, except for certain
double-word instructions, which were made doubleword instructions so that all the required information is
available in these 48 bits. In the second word, the
8 MSbs are ‘0’s. If this second word is executed as an
instruction (by itself), it will execute as a NOP.
Most single-word instructions are executed in a single
instruction cycle, unless a conditional test is true or the
program counter is changed as a result of the instruction. In these cases, the execution takes two instruction
cycles with the additional instruction cycle(s) executed
as a NOP. Notable exceptions are the BRA (unconditional/computed branch), indirect CALL/GOTO, all table
reads and writes, and RETURN/RETFIE instructions,
TABLE 18-1:
which are single-word instructions but take two or three
cycles. Certain instructions that involve skipping over
the subsequent instruction require either two or three
cycles if the skip is performed, depending on whether
the instruction being skipped is a single-word or twoword instruction. Moreover, double-word moves
require two cycles. The double-word instructions
execute in two instruction cycles.
Note:
For more details on the instruction set,
refer to the Programmer’s Reference
Manual.
SYMBOLS USED IN OPCODE DESCRIPTIONS
Field
#text
Description
Means literal defined by “text”
(text)
Means “content of text”
[text]
Means “the location addressed by text”
{ }
Optional field or operation
<n:m>
Register bit field
.b
Byte mode selection
.d
Double-Word mode selection
.S
Shadow register select
.w
Word mode selection (default)
Acc
One of two accumulators {A, B}
AWB
Accumulator write-back destination address register ∈ {W13, [W13]+=2}
bit4
4-bit bit selection field (used in word addressed instructions) ∈ {0...15}
C, DC, N, OV, Z
MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero
Expr
Absolute address, label or expression (resolved by the linker)
f
File register address ∈ {0x0000...0x1FFF}
lit1
1-bit unsigned literal ∈ {0,1}
lit4
4-bit unsigned literal ∈ {0...15}
lit5
5-bit unsigned literal ∈ {0...31}
lit8
8-bit unsigned literal ∈ {0...255}
lit10
10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode
lit14
14-bit unsigned literal ∈ {0...16384}
lit16
16-bit unsigned literal ∈ {0...65535}
lit23
23-bit unsigned literal ∈ {0...8388608}; LSB must be 0
None
Field does not require an entry, may be blank
OA, OB, SA, SB
DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate
PC
Program Counter
Slit10
10-bit signed literal ∈ {-512...511}
Slit16
16-bit signed literal ∈ {-32768...32767}
Slit6
6-bit signed literal ∈ {-16...16}
DS70139E-page 134
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
TABLE 18-1:
SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field
Description
Wb
Base W register ∈ {W0..W15}
Wd
Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Wdo
Destination W register ∈
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Wm,Wn
Dividend, Divisor working register pair (direct addressing)
Wm*Wm
Multiplicand and Multiplier working register pair for Square instructions ∈
{W4*W4,W5*W5,W6*W6,W7*W7}
Wm*Wn
Multiplicand and Multiplier working register pair for DSP instructions ∈
{W4*W5,W4*W6,W4*W7,W5*W6,W5*W7,W6*W7}
Wn
One of 16 working registers ∈ {W0..W15}
Wnd
One of 16 destination working registers ∈ {W0..W15}
Wns
One of 16 source working registers ∈ {W0..W15}
WREG
W0 (working register used in file register instructions)
Ws
Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Wso
Source W register ∈
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
Wx
X data space prefetch address register for DSP instructions
∈ {[W8]+=6, [W8]+=4, [W8]+=2, [W8], [W8]-=6, [W8]-=4, [W8]-=2,
[W9]+=6, [W9]+=4, [W9]+=2, [W9], [W9]-=6, [W9]-=4, [W9]-=2,
[W9+W12],none}
Wxd
X data space prefetch destination register for DSP instructions ∈ {W4..W7}
Wy
Y data space prefetch address register for DSP instructions
∈ {[W10]+=6, [W10]+=4, [W10]+=2, [W10], [W10]-=6, [W10]-=4, [W10]-=2,
[W11]+=6, [W11]+=4, [W11]+=2, [W11], [W11]-=6, [W11]-=4, [W11]-=2,
[W11+W12], none}
Wyd
Y data space prefetch destination register for DSP instructions ∈ {W4..W7}
© 2006 Microchip Technology Inc.
DS70139E-page 135
dsPIC30F2011/2012/3012/3013
TABLE 18-2:
Base
Instr
#
1
2
3
4
5
6
INSTRUCTION SET OVERVIEW
Assembly
Mnemonic
ADD
ADDC
AND
ASR
BCLR
BRA
7
BSET
8
BSW
DS70139E-page 136
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
ADD
Acc
Add Accumulators
1
1
ADD
f
f = f + WREG
1
1
OA,OB,SA,SB
C,DC,N,OV,Z
ADD
f,WREG
WREG = f + WREG
1
1
C,DC,N,OV,Z
ADD
#lit10,Wn
Wd = lit10 + Wd
1
1
C,DC,N,OV,Z
ADD
Wb,Ws,Wd
Wd = Wb + Ws
1
1
C,DC,N,OV,Z
ADD
Wb,#lit5,Wd
Wd = Wb + lit5
1
1
C,DC,N,OV,Z
OA,OB,SA,SB
ADD
Wso,#Slit4,Acc
16-bit Signed Add to Accumulator
1
1
ADDC
f
f = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
f,WREG
WREG = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
#lit10,Wn
Wd = lit10 + Wd + (C)
1
1
C,DC,N,OV,Z
ADDC
Wb,Ws,Wd
Wd = Wb + Ws + (C)
1
1
C,DC,N,OV,Z
ADDC
Wb,#lit5,Wd
Wd = Wb + lit5 + (C)
1
1
C,DC,N,OV,Z
AND
f
f = f .AND. WREG
1
1
N,Z
AND
f,WREG
WREG = f .AND. WREG
1
1
N,Z
AND
#lit10,Wn
Wd = lit10 .AND. Wd
1
1
N,Z
AND
Wb,Ws,Wd
Wd = Wb .AND. Ws
1
1
N,Z
AND
Wb,#lit5,Wd
Wd = Wb .AND. lit5
1
1
N,Z
ASR
f
f = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
f,WREG
WREG = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
Ws,Wd
Wd = Arithmetic Right Shift Ws
1
1
C,N,OV,Z
ASR
Wb,Wns,Wnd
Wnd = Arithmetic Right Shift Wb by Wns
1
1
N,Z
ASR
Wb,#lit5,Wnd
Wnd = Arithmetic Right Shift Wb by lit5
1
1
N,Z
BCLR
f,#bit4
Bit Clear f
1
1
None
BCLR
Ws,#bit4
Bit Clear Ws
1
1
None
BRA
C,Expr
Branch if Carry
1
1 (2)
None
BRA
GE,Expr
Branch if greater than or equal
1
1 (2)
None
BRA
GEU,Expr
Branch if unsigned greater than or equal
1
1 (2)
None
BRA
GT,Expr
Branch if greater than
1
1 (2)
None
BRA
GTU,Expr
Branch if unsigned greater than
1
1 (2)
None
BRA
LE,Expr
Branch if less than or equal
1
1 (2)
None
BRA
LEU,Expr
Branch if unsigned less than or equal
1
1 (2)
None
BRA
LT,Expr
Branch if less than
1
1 (2)
None
BRA
LTU,Expr
Branch if unsigned less than
1
1 (2)
None
BRA
N,Expr
Branch if Negative
1
1 (2)
None
BRA
NC,Expr
Branch if Not Carry
1
1 (2)
None
BRA
NN,Expr
Branch if Not Negative
1
1 (2)
None
BRA
NOV,Expr
Branch if Not Overflow
1
1 (2)
None
BRA
NZ,Expr
Branch if Not Zero
1
1 (2)
None
BRA
OA,Expr
Branch if Accumulator A overflow
1
1 (2)
None
BRA
OB,Expr
Branch if Accumulator B overflow
1
1 (2)
None
BRA
OV,Expr
Branch if Overflow
1
1 (2)
None
BRA
SA,Expr
Branch if Accumulator A saturated
1
1 (2)
None
BRA
SB,Expr
Branch if Accumulator B saturated
1
1 (2)
None
BRA
Expr
Branch Unconditionally
1
2
None
BRA
Z,Expr
Branch if Zero
1
1 (2)
None
BRA
Wn
Computed Branch
1
2
None
BSET
f,#bit4
Bit Set f
1
1
None
BSET
Ws,#bit4
Bit Set Ws
1
1
None
BSW.C
Ws,Wb
Write C bit to Ws<Wb>
1
1
None
BSW.Z
Ws,Wb
Write Z bit to Ws<Wb>
1
1
None
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
TABLE 18-2:
Base
Instr
#
9
10
11
12
13
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
BTG
BTSC
BTSS
BTST
BTSTS
14
CALL
15
CLR
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
BTG
f,#bit4
Bit Toggle f
1
1
None
BTG
Ws,#bit4
Bit Toggle Ws
1
1
None
BTSC
f,#bit4
Bit Test f, Skip if Clear
1
1
(2 or 3)
None
BTSC
Ws,#bit4
Bit Test Ws, Skip if Clear
1
1
(2 or 3)
None
BTSS
f,#bit4
Bit Test f, Skip if Set
1
1
(2 or 3)
None
BTSS
Ws,#bit4
Bit Test Ws, Skip if Set
1
1
(2 or 3)
None
BTST
f,#bit4
Bit Test f
1
1
Z
BTST.C
Ws,#bit4
Bit Test Ws to C
1
1
C
BTST.Z
Ws,#bit4
Bit Test Ws to Z
1
1
Z
BTST.C
Ws,Wb
Bit Test Ws<Wb> to C
1
1
C
BTST.Z
Ws,Wb
Bit Test Ws<Wb> to Z
1
1
Z
BTSTS
f,#bit4
Bit Test then Set f
1
1
Z
BTSTS.C
Ws,#bit4
Bit Test Ws to C, then Set
1
1
C
BTSTS.Z
Ws,#bit4
Bit Test Ws to Z, then Set
1
1
Z
CALL
lit23
Call subroutine
2
2
None
CALL
Wn
Call indirect subroutine
1
2
None
CLR
f
f = 0x0000
1
1
None
CLR
WREG
WREG = 0x0000
1
1
None
CLR
Ws
Ws = 0x0000
1
1
None
CLR
Acc,Wx,Wxd,Wy,Wyd,AWB
Clear Accumulator
1
1
OA,OB,SA,SB
16
CLRWDT
CLRWDT
Clear Watchdog Timer
1
1
WDTO,Sleep
17
COM
COM
f
f=f
1
1
N,Z
COM
f,WREG
WREG = f
1
1
N,Z
COM
Ws,Wd
Wd = Ws
1
1
N,Z
CP
f
Compare f with WREG
1
1
C,DC,N,OV,Z
CP
Wb,#lit5
Compare Wb with lit5
1
1
C,DC,N,OV,Z
CP
Wb,Ws
Compare Wb with Ws (Wb - Ws)
1
1
C,DC,N,OV,Z
CP0
f
Compare f with 0x0000
1
1
C,DC,N,OV,Z
CP0
Ws
Compare Ws with 0x0000
1
1
C,DC,N,OV,Z
CPB
f
Compare f with WREG, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,#lit5
Compare Wb with lit5, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,Ws
Compare Wb with Ws, with Borrow
(Wb - Ws - C)
1
1
C,DC,N,OV,Z
18
19
20
CP
CP0
CPB
21
CPSEQ
CPSEQ
Wb, Wn
Compare Wb with Wn, skip if =
1
1
(2 or 3)
None
22
CPSGT
CPSGT
Wb, Wn
Compare Wb with Wn, skip if >
1
1
(2 or 3)
None
23
CPSLT
CPSLT
Wb, Wn
Compare Wb with Wn, skip if <
1
1
(2 or 3)
None
24
CPSNE
CPSNE
Wb, Wn
Compare Wb with Wn, skip if ≠
1
1
(2 or 3)
None
25
DAW
DAW
Wn
Wn = decimal adjust Wn
1
1
C
26
DEC
DEC
f
f = f -1
1
1
C,DC,N,OV,Z
DEC
f,WREG
WREG = f -1
1
1
C,DC,N,OV,Z
DEC
Ws,Wd
Wd = Ws - 1
1
1
C,DC,N,OV,Z
DEC2
f
f = f -2
1
1
C,DC,N,OV,Z
DEC2
f,WREG
WREG = f -2
1
1
C,DC,N,OV,Z
DEC2
Ws,Wd
Wd = Ws - 2
1
1
C,DC,N,OV,Z
DISI
#lit14
Disable Interrupts for k instruction cycles
1
1
None
27
28
DEC2
DISI
© 2006 Microchip Technology Inc.
DS70139E-page 137
dsPIC30F2011/2012/3012/3013
TABLE 18-2:
Base
Instr
#
29
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
DIV
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
DIV.S
Wm,Wn
Signed 16/16-bit Integer Divide
1
18
DIV.SD
Wm,Wn
Signed 32/16-bit Integer Divide
1
18
N,Z,C,OV
N,Z,C,OV
DIV.U
Wm,Wn
Unsigned 16/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.UD
Wm,Wn
Unsigned 32/16-bit Integer Divide
1
18
N,Z,C,OV
Signed 16/16-bit Fractional Divide
1
18
N,Z,C,OV
None
30
DIVF
DIVF
31
DO
DO
#lit14,Expr
Do code to PC+Expr, lit14+1 times
2
2
DO
Wn,Expr
Do code to PC+Expr, (Wn)+1 times
2
2
None
Wm,Wn
32
ED
ED
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance (no accumulate)
1
1
OA,OB,OAB,
SA,SB,SAB
33
EDAC
EDAC
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance
1
1
OA,OB,OAB,
SA,SB,SAB
34
EXCH
EXCH
Wns,Wnd
Swap Wns with Wnd
1
1
None
35
FBCL
FBCL
Ws,Wnd
Find Bit Change from Left (MSb) Side
1
1
C
36
FF1L
FF1L
Ws,Wnd
Find First One from Left (MSb) Side
1
1
C
37
FF1R
FF1R
Ws,Wnd
Find First One from Right (LSb) Side
1
1
C
38
GOTO
GOTO
Expr
Go to address
2
2
None
GOTO
Wn
Go to indirect
1
2
None
INC
f
f=f+1
1
1
C,DC,N,OV,Z
INC
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
INC
Ws,Wd
Wd = Ws + 1
1
1
C,DC,N,OV,Z
INC2
f
f=f+2
1
1
C,DC,N,OV,Z
INC2
f,WREG
WREG = f + 2
1
1
C,DC,N,OV,Z
INC2
Ws,Wd
Wd = Ws + 2
1
1
C,DC,N,OV,Z
IOR
f
f = f .IOR. WREG
1
1
N,Z
IOR
f,WREG
WREG = f .IOR. WREG
1
1
N,Z
IOR
#lit10,Wn
Wd = lit10 .IOR. Wd
1
1
N,Z
IOR
Wb,Ws,Wd
Wd = Wb .IOR. Ws
1
1
N,Z
IOR
Wb,#lit5,Wd
Wd = Wb .IOR. lit5
1
1
N,Z
LAC
LAC
Wso,#Slit4,Acc
Load Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
43
LNK
LNK
#lit14
Link frame pointer
1
1
None
44
LSR
LSR
f
f = Logical Right Shift f
1
1
C,N,OV,Z
LSR
f,WREG
WREG = Logical Right Shift f
1
1
C,N,OV,Z
LSR
Ws,Wd
Wd = Logical Right Shift Ws
1
1
C,N,OV,Z
LSR
Wb,Wns,Wnd
Wnd = Logical Right Shift Wb by Wns
1
1
N,Z
LSR
Wb,#lit5,Wnd
Wnd = Logical Right Shift Wb by lit5
1
1
N,Z
MAC
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
,
AWB
Multiply and Accumulate
1
1
OA,OB,OAB,
SA,SB,SAB
MAC
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square and Accumulate
1
1
OA,OB,OAB,
SA,SB,SAB
MOV
f,Wn
Move f to Wn
1
1
None
MOV
f
Move f to f
1
1
N,Z
MOV
f,WREG
Move f to WREG
1
1
N,Z
MOV
#lit16,Wn
Move 16-bit literal to Wn
1
1
None
MOV.b
#lit8,Wn
Move 8-bit literal to Wn
1
1
None
MOV
Wn,f
Move Wn to f
1
1
None
MOV
Wso,Wdo
Move Ws to Wd
1
1
None
MOV
WREG,f
39
40
41
42
45
46
INC
INC2
IOR
MAC
MOV
MOV.D
MOV.D
47
MOVSAC
DS70139E-page 138
MOVSAC
Move WREG to f
1
1
N,Z
Wns,Wd
Move Double from W(ns):W(ns+1) to Wd
1
2
None
Ws,Wnd
Move Double from Ws to W(nd+1):W(nd)
1
2
None
Prefetch and store accumulator
1
1
None
Acc,Wx,Wxd,Wy,Wyd,AWB
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
TABLE 18-2:
Base
Instr
#
48
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
MPY
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
MPY
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
Multiply Wm by Wn to Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
MPY
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square Wm to Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
49
MPY.N
MPY.N
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
-(Multiply Wm by Wn) to Accumulator
1
1
None
50
MSC
MSC
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
,
AWB
Multiply and Subtract from Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
51
MUL
52
53
54
NEG
NOP
POP
MUL.SS
Wb,Ws,Wnd
{Wnd+1, Wnd} = signed(Wb) * signed(Ws)
1
1
None
MUL.SU
Wb,Ws,Wnd
{Wnd+1, Wnd} = signed(Wb) * unsigned(Ws)
1
1
None
MUL.US
Wb,Ws,Wnd
{Wnd+1, Wnd} = unsigned(Wb) * signed(Ws)
1
1
None
MUL.UU
Wb,Ws,Wnd
{Wnd+1, Wnd} = unsigned(Wb) *
unsigned(Ws)
1
1
None
MUL.SU
Wb,#lit5,Wnd
{Wnd+1, Wnd} = signed(Wb) * unsigned(lit5)
1
1
None
MUL.UU
Wb,#lit5,Wnd
{Wnd+1, Wnd} = unsigned(Wb) *
unsigned(lit5)
1
1
None
MUL
f
W3:W2 = f * WREG
1
1
None
NEG
Acc
Negate Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
NEG
f
f=f+1
1
1
C,DC,N,OV,Z
NEG
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
NEG
Ws,Wd
Wd = Ws + 1
1
1
C,DC,N,OV,Z
NOP
No Operation
1
1
None
NOPR
No Operation
1
1
None
None
POP
f
Pop f from top-of-stack (TOS)
1
1
POP
Wdo
Pop from top-of-stack (TOS) to Wdo
1
1
None
POP.D
Wnd
Pop from top-of-stack (TOS) to
W(nd):W(nd+1)
1
2
None
Pop Shadow Registers
1
1
All
f
Push f to top-of-stack (TOS)
1
1
None
PUSH
Wso
Push Wso to top-of-stack (TOS)
1
1
None
PUSH.D
Wns
Push W(ns):W(ns+1) to top-of-stack (TOS)
1
2
None
Push Shadow Registers
1
1
None
POP.S
55
PUSH
PUSH
PUSH.S
56
PWRSAV
PWRSAV
Go into Sleep or Idle mode
1
1
WDTO,Sleep
57
RCALL
RCALL
Expr
Relative Call
1
2
None
RCALL
Wn
Computed Call
1
2
None
REPEAT
#lit14
Repeat Next Instruction lit14+1 times
1
1
None
REPEAT
Wn
Repeat Next Instruction (Wn)+1 times
1
1
None
None
58
REPEAT
#lit1
59
RESET
RESET
Software device Reset
1
1
60
RETFIE
RETFIE
Return from interrupt
1
3 (2)
None
61
RETLW
RETLW
Return with literal in Wn
1
3 (2)
None
62
RETURN
RETURN
Return from Subroutine
1
3 (2)
None
63
RLC
RLC
f
f = Rotate Left through Carry f
1
1
C,N,Z
RLC
f,WREG
WREG = Rotate Left through Carry f
1
1
C,N,Z
RLC
Ws,Wd
Wd = Rotate Left through Carry Ws
1
1
C,N,Z
RLNC
f
f = Rotate Left (No Carry) f
1
1
N,Z
RLNC
f,WREG
WREG = Rotate Left (No Carry) f
1
1
N,Z
RLNC
Ws,Wd
Wd = Rotate Left (No Carry) Ws
1
1
N,Z
RRC
f
f = Rotate Right through Carry f
1
1
C,N,Z
RRC
f,WREG
WREG = Rotate Right through Carry f
1
1
C,N,Z
RRC
Ws,Wd
Wd = Rotate Right through Carry Ws
1
1
C,N,Z
64
65
RLNC
RRC
#lit10,Wn
© 2006 Microchip Technology Inc.
DS70139E-page 139
dsPIC30F2011/2012/3012/3013
TABLE 18-2:
Base
Instr
#
66
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
RRNC
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
RRNC
f
f = Rotate Right (No Carry) f
1
1
N,Z
RRNC
f,WREG
WREG = Rotate Right (No Carry) f
1
1
N,Z
RRNC
Ws,Wd
Wd = Rotate Right (No Carry) Ws
1
1
N,Z
SAC
Acc,#Slit4,Wdo
Store Accumulator
1
1
None
67
SAC
SAC.R
Acc,#Slit4,Wdo
Store Rounded Accumulator
1
1
None
68
SE
SE
Ws,Wnd
Wnd = sign-extended Ws
1
1
C,N,Z
69
SETM
SETM
f
f = 0xFFFF
1
1
None
SETM
WREG
WREG = 0xFFFF
1
1
None
SETM
Ws
Ws = 0xFFFF
1
1
None
SFTAC
Acc,Wn
Arithmetic Shift Accumulator by (Wn)
1
1
OA,OB,OAB,
SA,SB,SAB
SFTAC
Acc,#Slit6
Arithmetic Shift Accumulator by Slit6
1
1
OA,OB,OAB,
SA,SB,SAB
SL
f
f = Left Shift f
1
1
C,N,OV,Z
SL
f,WREG
WREG = Left Shift f
1
1
C,N,OV,Z
SL
Ws,Wd
Wd = Left Shift Ws
1
1
C,N,OV,Z
SL
Wb,Wns,Wnd
Wnd = Left Shift Wb by Wns
1
1
N,Z
SL
Wb,#lit5,Wnd
Wnd = Left Shift Wb by lit5
1
1
N,Z
SUB
Acc
Subtract Accumulators
1
1
OA,OB,OAB,
SA,SB,SAB
SUB
f
f = f - WREG
1
1
C,DC,N,OV,Z
SUB
f,WREG
WREG = f - WREG
1
1
C,DC,N,OV,Z
SUB
#lit10,Wn
Wn = Wn - lit10
1
1
C,DC,N,OV,Z
SUB
Wb,Ws,Wd
Wd = Wb - Ws
1
1
C,DC,N,OV,Z
SUB
Wb,#lit5,Wd
Wd = Wb - lit5
1
1
C,DC,N,OV,Z
SUBB
f
f = f - WREG - (C)
1
1
C,DC,N,OV,Z
SUBB
f,WREG
WREG = f - WREG - (C)
1
1
C,DC,N,OV,Z
70
71
72
73
74
75
76
SFTAC
SL
SUB
SUBB
SUBR
SUBBR
SWAP
SUBB
#lit10,Wn
Wn = Wn - lit10 - (C)
1
1
C,DC,N,OV,Z
SUBB
Wb,Ws,Wd
Wd = Wb - Ws - (C)
1
1
C,DC,N,OV,Z
SUBB
Wb,#lit5,Wd
Wd = Wb - lit5 - (C)
1
1
SUBR
f
f = WREG - f
1
1
C,DC,N,OV,Z
SUBR
f,WREG
WREG = WREG - f
1
1
C,DC,N,OV,Z
SUBR
Wb,Ws,Wd
Wd = Ws - Wb
1
1
C,DC,N,OV,Z
SUBR
Wb,#lit5,Wd
Wd = lit5 - Wb
1
1
C,DC,N,OV,Z
SUBBR
f
f = WREG - f - (C)
1
1
C,DC,N,OV,Z
SUBBR
f,WREG
WREG = WREG -f - (C)
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
SUBBR
Wb,Ws,Wd
Wd = Ws - Wb - (C)
1
1
C,DC,N,OV,Z
SUBBR
Wb,#lit5,Wd
Wd = lit5 - Wb - (C)
1
1
C,DC,N,OV,Z
SWAP.b
Wn
Wn = nibble swap Wn
1
1
None
SWAP
Wn
Wn = byte swap Wn
1
1
None
None
77
TBLRDH
TBLRDH
Ws,Wd
Read Prog<23:16> to Wd<7:0>
1
2
78
TBLRDL
TBLRDL
Ws,Wd
Read Prog<15:0> to Wd
1
2
None
79
TBLWTH
TBLWTH
Ws,Wd
Write Ws<7:0> to Prog<23:16>
1
2
None
80
TBLWTL
TBLWTL
Ws,Wd
Write Ws to Prog<15:0>
1
2
None
81
ULNK
ULNK
Unlink frame pointer
1
1
None
82
XOR
XOR
f
f = f .XOR. WREG
1
1
N,Z
XOR
f,WREG
WREG = f .XOR. WREG
1
1
N,Z
XOR
#lit10,Wn
Wd = lit10 .XOR. Wd
1
1
N,Z
XOR
Wb,Ws,Wd
Wd = Wb .XOR. Ws
1
1
N,Z
XOR
Wb,#lit5,Wd
Wd = Wb .XOR. lit5
1
1
N,Z
ZE
Ws,Wnd
Wnd = Zero-extend Ws
1
1
C,Z,N
83
ZE
DS70139E-page 140
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
19.0
DEVELOPMENT SUPPORT
The PIC® microcontrollers are supported with a full
range of hardware and software development tools:
• Integrated Development Environment
- MPLAB® IDE Software
• Assemblers/Compilers/Linkers
- MPASMTM Assembler
- MPLAB C18 and MPLAB C30 C Compilers
- MPLINKTM Object Linker/
MPLIBTM Object Librarian
- MPLAB ASM30 Assembler/Linker/Library
• Simulators
- MPLAB SIM Software Simulator
• Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- MPLAB ICE 4000 In-Circuit Emulator
• In-Circuit Debugger
- MPLAB ICD 2
• Device Programmers
- PICSTART® Plus Development Programmer
- MPLAB PM3 Device Programmer
- PICkit™ 2 Development Programmer
• Low-Cost Demonstration and Development
Boards and Evaluation Kits
19.1
MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
• A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- Emulator (sold separately)
- In-Circuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High-level source code debugging
• Visual device initializer for easy register
initialization
• Mouse over variable inspection
• Drag and drop variables from source to watch
windows
• Extensive on-line help
• Integration of select third party tools, such as
HI-TECH Software C Compilers and IAR
C Compilers
The MPLAB IDE allows you to:
• Edit your source files (either assembly or C)
• One touch assemble (or compile) and download
to PIC MCU emulator and simulator tools
(automatically updates all project information)
• Debug using:
- Source files (assembly or C)
- Mixed assembly and C
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
© 2006 Microchip Technology Inc.
DS70139E-page 141
dsPIC30F2011/2012/3012/3013
19.2
MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for all PIC MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multi-purpose
source files
• Directives that allow complete control over the
assembly process
19.5
MPLAB ASM30 Assembler produces relocatable
machine code from symbolic assembly language for
dsPIC30F devices. MPLAB C30 C Compiler uses the
assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
•
•
•
•
•
•
Support for the entire dsPIC30F instruction set
Support for fixed-point and floating-point data
Command line interface
Rich directive set
Flexible macro language
MPLAB IDE compatibility
19.6
19.3
MPLAB C18 and MPLAB C30
C Compilers
The MPLAB C18 and MPLAB C30 Code Development
Systems are complete ANSI C compilers for
Microchip’s PIC18 family of microcontrollers and the
dsPIC30, dsPIC33 and PIC24 family of digital signal
controllers. These compilers provide powerful integration capabilities, superior code optimization and ease
of use not found with other compilers.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
19.4
MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
MPLAB ASM30 Assembler, Linker
and Librarian
MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C18 and
MPLAB C30 C Compilers, and the MPASM and
MPLAB ASM30 Assemblers. The software simulator
offers the flexibility to develop and debug code outside
of the hardware laboratory environment, making it an
excellent, economical software development tool.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
DS70139E-page 142
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
19.7
MPLAB ICE 2000
High-Performance
In-Circuit Emulator
The MPLAB ICE 2000 In-Circuit Emulator is intended
to provide the product development engineer with a
complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000
In-Circuit Emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from
a single environment.
The MPLAB ICE 2000 is a full-featured emulator
system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow
the system to be easily reconfigured for emulation of
different processors. The architecture of the MPLAB
ICE 2000 In-Circuit Emulator allows expansion to
support new PIC microcontrollers.
The MPLAB ICE 2000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft® Windows® 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
19.8
MPLAB ICE 4000
High-Performance
In-Circuit Emulator
The MPLAB ICE 4000 In-Circuit Emulator is intended to
provide the product development engineer with a
complete microcontroller design tool set for high-end
PIC MCUs and dsPIC DSCs. Software control of the
MPLAB ICE 4000 In-Circuit Emulator is provided by the
MPLAB Integrated Development Environment, which
allows editing, building, downloading and source
debugging from a single environment.
19.9
MPLAB ICD 2 In-Circuit Debugger
Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
powerful, low-cost, run-time development tool,
connecting to the host PC via an RS-232 or high-speed
USB interface. This tool is based on the Flash PIC
MCUs and can be used to develop for these and other
PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes
the in-circuit debugging capability built into the Flash
devices. This feature, along with Microchip’s In-Circuit
Serial ProgrammingTM (ICSPTM) protocol, offers costeffective, in-circuit Flash debugging from the graphical
user interface of the MPLAB Integrated Development
Environment. This enables a designer to develop and
debug source code by setting breakpoints, single stepping and watching variables, and CPU status and
peripheral registers. Running at full speed enables
testing hardware and applications in real time. MPLAB
ICD 2 also serves as a development programmer for
selected PIC devices.
19.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modular, detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an SD/MMC card for
file storage and secure data applications.
The MPLAB ICE 4000 is a premium emulator system,
providing the features of MPLAB ICE 2000, but with
increased emulation memory and high-speed performance for dsPIC30F and PIC18XXXX devices. Its
advanced emulator features include complex triggering
and timing, and up to 2 Mb of emulation memory.
The MPLAB ICE 4000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft Windows 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
© 2006 Microchip Technology Inc.
DS70139E-page 143
dsPIC30F2011/2012/3012/3013
19.11 PICSTART Plus Development
Programmer
19.13 Demonstration, Development and
Evaluation Boards
The PICSTART Plus Development Programmer is an
easy-to-use, low-cost, prototype programmer. It
connects to the PC via a COM (RS-232) port. MPLAB
Integrated Development Environment software makes
using the programmer simple and efficient. The
PICSTART Plus Development Programmer supports
most PIC devices in DIP packages up to 40 pins.
Larger pin count devices, such as the PIC16C92X and
PIC17C76X, may be supported with an adapter socket.
The PICSTART Plus Development Programmer is CE
compliant.
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
19.12 PICkit 2 Development Programmer
The PICkit™ 2 Development Programmer is a low-cost
programmer with an easy-to-use interface for programming many of Microchip’s baseline, mid-range
and PIC18F families of Flash memory microcontrollers.
The PICkit 2 Starter Kit includes a prototyping development board, twelve sequential lessons, software and
HI-TECH’s PICC™ Lite C compiler, and is designed to
help get up to speed quickly using PIC® microcontrollers. The kit provides everything needed to
program, evaluate and develop applications using
Microchip’s powerful, mid-range Flash memory family
of microcontrollers.
DS70139E-page 144
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart® battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Check the Microchip web page (www.microchip.com)
and the latest “Product Selector Guide” (DS00148) for
the complete list of demonstration, development and
evaluation kits.
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
20.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future
revisions of this document as it becomes available.
For detailed information about the dsPIC30F architecture and core, refer to “dsPIC30F Family Reference Manual”
(DS70046).
Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions above
the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings(†)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD and MCLR) (Note 1) .................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V
Voltage on MCLR with respect to VSS........................................................................................................ 0V to +13.25V
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin (Note 2)................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD) .......................................................................................................... ±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ...................................................................................................±20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports (Note 2)....................................................................................................200 mA
Note 1: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather
than pulling this pin directly to VSS.
2: Maximum allowable current is a function of device maximum power dissipation. See Table 20-2 for PDMAX.
†NOTICE:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note:
20.1
All peripheral electrical characteristics are specified. For exact peripherals available on specific
devices, please refer to the Family Cross Reference Table.
DC Characteristics
TABLE 20-1:
OPERATING MIPS VS. VOLTAGE
Max MIPS
VDD Range
Temp Range
dsPIC30FXXX-30I
dsPIC30FXXX-20E
30
—
20
4.5-5.5V
-40°C to 85°C
4.5-5.5V
-40°C to 125°C
—
3.0-3.6V
-40°C to 85°C
20
—
3.0-3.6V
-40°C to 125°C
—
15
2.5-3.0V
-40°C to 85°C
10
—
© 2006 Microchip Technology Inc.
DS70139E-page 145
dsPIC30F2011/2012/3012/3013
TABLE 20-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Operating Junction Temperature Range
TJ
Operating Ambient Temperature Range
Typ
Max
Unit
-40
+125
°C
TA
-40
+85
°C
Operating Junction Temperature Range
TJ
-40
+150
°C
Operating Ambient Temperature Range
TA
-40
+125
°C
dsPIC30F201x-30I
dsPIC30F301x-30I
dsPIC30F201x-20E
dsPIC30F301x-20E
Power Dissipation:
Internal chip power dissipation:
P INT = VD D × ( I D D – ∑ I O H)
PD
PINT + PI/O
W
PDMAX
(TJ - TA) / θJA
W
I/O Pin power dissipation:
P I/O = ∑ ( { V D D – V O H } × I OH ) + ∑ ( VO L × I O L )
Maximum Allowed Power Dissipation
TABLE 20-3:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Notes
Package Thermal Resistance, 18-pin PDIP (P)
θJA
44
—
°C/W
1
Package Thermal Resistance, 18-pin SOIC (SO)
θJA
57
—
°C/W
1
Package Thermal Resistance, 28-pin SPDIP (SP)
θJA
42
—
°C/W
1
Package Thermal Resistance, 28-pin (SOIC)
θJA
49
—
°C/W
1
Package Thermal Resistance, 44-pin QFN
θJA
28
—
°C/W
1
Note 1:
Junction to ambient thermal resistance, Theta-ja
TABLE 20-4:
numbers are achieved by package simulations.
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
No.
(θJA)
Symbol
Characteristic
Min
Typ(1)
Max
Units
—
5.5
V
Industrial temperature
Extended temperature
Conditions
Operating Voltage(2)
DC10
VDD
Supply Voltage
2.5
DC11
VDD
Supply Voltage
3.0
—
5.5
V
DC12
VDR
RAM Data Retention Voltage(3)
—
1.5
—
V
DC16
VPOR
VDD Start Voltage (to ensure
internal Power-on Reset signal)
—
VSS
—
V
DC17
SVDD
VDD Rise Rate (to ensure
internal Power-on Reset signal)
0.05
Note 1:
2:
3:
V/ms 0-5V in 0.1 sec
0-3V in 60 ms
“Typ” column data is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which VDD can be lowered without losing RAM data.
DS70139E-page 146
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
TABLE 20-5:
DC CHARACTERISTICS: OPERATING CURRENT (IDD)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Operating Current (IDD)(2)
DC31a
DC31b
1.6
1.6
3.0
3.0
mA
mA
25°C
85°C
DC31c
DC31e
1.6
3.6
3.0
6.0
mA
mA
125°C
25°C
DC31f
DC31g
3.3
3.2
6.0
6.0
mA
mA
85°C
125°C
DC30a
DC30b
3.0
3.0
5.0
5.0
mA
mA
25°C
85°C
DC30c
DC30e
3.1
6.0
5.0
9.0
mA
mA
125°C
25°C
DC30f
DC30g
5.8
5.7
9.0
9.0
mA
mA
85°C
125°C
DC23a
DC23b
9.0
10.0
15.0
15.0
mA
mA
25°C
85°C
DC23c
DC23e
10.0
16.0
15.0
24.0
mA
mA
125°C
25°C
DC23f
DC23g
16.0
16.0
24.0
24.0
mA
mA
85°C
125°C
DC24a
22.0
33.0
mA
25°C
DC24b
DC24c
22.0
22.0
33.0
33.0
mA
mA
85°C
125°C
DC24e
DC24f
37.0
37.0
56.0
56.0
mA
mA
25°C
85°C
DC24g
DC27a
37.0
41.0
56.0
60.0
mA
mA
125°C
25°C
DC27b
DC27d
40.0
68.0
60.0
90.0
mA
mA
85°C
25°C
DC27e
DC27f
67.0
66.0
90.0
90.0
mA
mA
85°C
125°C
DC29a
DC29b
96.0
94.0
140.0
140.0
mA
mA
25°C
85°C
Note 1:
2:
3.3V
0.128 MIPS
LPRC ( 512 kHz)
5V
3.3V
(1.8 MIPS)
FRC (7.37 MHz)
5V
3.3V
4 MIPS
5V
3.3V
10 MIPS
5V
3.3V
20 MIPS
5V
5V
30 MIPS
Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1
driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD.
MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data
Memory are operational. No peripheral modules are operating.
© 2006 Microchip Technology Inc.
DS70139E-page 147
dsPIC30F2011/2012/3012/3013
TABLE 20-6:
DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Operating Current (IDD)(2)
DC51a
DC51b
1.3
1.3
2.5
2.5
mA
mA
25°C
85°C
DC51c
DC51e
1.2
3.2
2.5
5.0
mA
mA
125°C
25°C
DC51f
DC51g
2.9
2.8
5.0
5.0
mA
mA
85°C
125°C
DC50a
DC50b
3.0
3.0
5.0
5.0
mA
mA
25°C
85°C
DC50c
DC50e
3.0
6.0
5.0
9.0
mA
mA
125°C
25°C
DC50f
DC50g
5.8
5.7
9.0
9.0
mA
mA
85°C
125°C
DC43a
DC43b
5.2
5.3
8.0
8.0
mA
mA
25°C
85°C
DC43c
DC43e
5.4
9.7
8.0
15.0
mA
mA
125°C
25°C
DC43f
DC43g
9.6
9.5
15.0
15.0
mA
mA
85°C
125°C
DC44a
11.0
17.0
mA
25°C
DC44b
DC44c
11.0
11.0
17.0
17.0
mA
mA
85°C
125°C
DC44e
DC44f
19.0
19.0
29.0
29.0
mA
mA
25°C
85°C
DC44g
DC47a
20.0
20.0
30.0
35.0
mA
mA
125°C
25°C
DC47b
DC47d
21.0
35.0
35.0
50.0
mA
mA
85°C
25°C
DC47e
DC47f
36.0
36.0
50.0
50.0
mA
mA
85°C
125°C
DC49a
DC49b
51.0
51.0
70.0
70.0
mA
mA
25°C
85°C
Note 1:
2:
3.3V
0.128 MIPS
LPRC ( 512 kHz)
5V
3.3V
(1.8 MIPS)
FRC (7.37 MHz)
5V
3.3V
4 MIPS
5V
3.3V
10 MIPS
5V
3.3V
20 MIPS
5V
5V
30 MIPS
Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
Base IIDLE current is measured with Core off, Clock on and all modules turned off.
DS70139E-page 148
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
TABLE 20-7:
DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
0.3
—
μA
Conditions
Power-Down Current (IPD)(2)
DC60a
25°C
DC60b
1.3
30.0
μA
85°C
DC60c
16.0
60.0
μA
125°C
DC60e
0.5
—
μA
25°C
DC60f
3.7
45.0
μA
85°C
DC60g
25.0
90.0
μA
125°C
DC61a
6.0
9.0
μA
25°C
DC61b
6.0
9.0
μA
85°C
DC61c
6.0
9.0
μA
125°C
DC61e
13.0
20.0
μA
25°C
DC61f
12.0
20.0
μA
85°C
DC61g
12.0
20.0
μA
125°C
DC62a
4.0
10.0
μA
25°C
DC62b
5.0
10.0
μA
85°C
DC62c
4.0
10.0
μA
125°C
DC62e
4.0
15.0
μA
25°C
DC62f
6.0
15.0
μA
85°C
DC62g
5.0
15.0
μA
125°C
DC63a
33.0
53.0
μA
25°C
DC63b
35.0
53.0
μA
85°C
DC63c
19.0
53.0
μA
125°C
DC63e
38.0
62.0
μA
25°C
DC63f
41.0
62.0
μA
85°C
DC63g
41.0
62.0
μA
125°C
DC66a
21.0
40.0
μA
25°C
DC66b
26.0
40.0
μA
85°C
DC66c
27.0
40.0
μA
125°C
DC66e
25.0
44.0
μA
25°C
DC66f
27.0
44.0
μA
85°C
29.0
44.0
μA
125°C
DC66g
Note 1:
2:
3:
3.3V
Base Power-Down Current(3)
5V
3.3V
Watchdog Timer Current: ΔIWDT(3)
5V
3.3V
Timer1 w/32 kHz Crystal: ΔITI32(3)
5V
3.3V
BOR On: ΔIBOR(3)
5V
3.3V
Low-Voltage Detect: ΔILVD(3)
5V
Data in the Typical column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled high. LVD, BOR, WDT, etc. are all switched off.
The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
© 2006 Microchip Technology Inc.
DS70139E-page 149
dsPIC30F2011/2012/3012/3013
TABLE 20-8:
DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
VIL
Characteristic
Min
Typ(1)
Max
Units
Conditions
Input Low Voltage(2)
DI10
I/O pins:
with Schmitt Trigger buffer
VSS
—
0.2 VDD
V
DI15
MCLR
VSS
—
0.2 VDD
V
DI16
OSC1 (in XT, HS and LP modes)
VSS
—
0.2 VDD
V
DI17
OSC1 (in RC mode)(3)
VSS
—
0.3 VDD
V
DI18
SDA, SCL
VSS
—
0.3 VDD
V
SM bus disabled
DI19
SDA, SCL
VSS
—
0.2 VDD
V
SM bus enabled
I/O pins:
with Schmitt Trigger buffer
0.8 VDD
—
VDD
V
DI25
MCLR
0.8 VDD
—
VDD
V
DI26
OSC1 (in XT, HS and LP modes) 0.7 VDD
—
VDD
V
VIH
DI20
Input High Voltage
(2)
mode)(3)
DI27
OSC1 (in RC
0.9 VDD
—
VDD
V
DI28
SDA, SCL
0.7 VDD
—
VDD
V
SM bus disabled
SDA, SCL
VDD
—
VDD
V
SM bus enabled
50
250
400
μA
VDD = 5V, VPIN = VSS
DI29
0.8
Current(2)
ICNPU
CNXX Pull-up
IIL
Input Leakage Current(2)(4)(5)
DI30
DI50
I/O ports
—
0.01
±1
μA
VSS ≤ VPIN ≤ VDD,
Pin at high impedance
DI51
Analog input pins
—
0.50
—
μA
VSS ≤ VPIN ≤ VDD,
Pin at high impedance
DI55
MCLR
—
0.05
±5
μA
VSS ≤ VPIN ≤ VDD
DI56
OSC1
—
0.05
±5
μA
VSS ≤ VPIN ≤ VDD, XT, HS
and LP Osc mode
Note 1:
2:
3:
4:
5:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that
the dsPIC30F device be driven with an external clock while in RC mode.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
Negative current is defined as current sourced by the pin.
DS70139E-page 150
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
TABLE 20-9:
DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
VOL
DO10
Characteristic
VOH
Typ(1)
Max
Units
Conditions
Output Low Voltage(2)
I/O ports
DO16
Min
—
—
0.6
V
IOL = 8.5 mA, VDD = 5V
—
—
TBD
V
IOL = 2.0 mA, VDD = 3V
OSC2/CLKO
—
—
0.6
V
IOL = 1.6 mA, VDD = 5V
(RC or EC Osc mode)
—
—
TBD
V
IOL = 2.0 mA, VDD = 3V
(2)
Output High Voltage
DO20
I/O ports
VDD – 0.7
—
—
V
IOH = -3.0 mA, VDD = 5V
TBD
—
—
V
IOH = -2.0 mA, VDD = 3V
DO26
OSC2/CLKO
VDD – 0.7
—
—
V
IOH = -1.3 mA, VDD = 5V
TBD
—
—
V
IOH = -2.0 mA, VDD = 3V
15
pF
In XTL, XT, HS and LP modes
when external clock is used to
drive OSC1.
(RC or EC Osc mode)
Capacitive Loading Specs
on Output Pins(2)
DO50
COSC2
OSC2/SOSC2 pin
—
—
DO56
CIO
All I/O pins and OSC2
—
—
50
pF
RC or EC Osc mode
DO58
CB
SCL, SDA
—
—
400
pF
In I2C mode
Note 1:
2:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
© 2006 Microchip Technology Inc.
DS70139E-page 151
dsPIC30F2011/2012/3012/3013
FIGURE 20-1:
LOW-VOLTAGE DETECT CHARACTERISTICS
VDD
LV10
LVDIF
(LVDIF set by hardware)
TABLE 20-10: ELECTRICAL CHARACTERISTICS: LVDL
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
No.
LV10
Symbol
VPLVD
Characteristic(1)
Min
Typ
Max
Units
LVDL Voltage on VDD transition LVDL = 0000(2)
high-to-low
—
—
—
V
LVDL = 0001(2)
—
—
—
V
(2)
—
—
—
V
LVDL = 0011(2)
—
—
—
V
LVDL = 0100
2.50
—
2.65
V
LVDL = 0101
2.70
—
2.86
V
LVDL = 0110
2.80
—
2.97
V
LVDL = 0111
3.00
—
3.18
V
LVDL = 1000
3.30
—
3.50
V
LVDL = 1001
3.50
—
3.71
V
LVDL = 1010
3.60
—
3.82
V
LVDL = 1011
3.80
—
4.03
V
LVDL = 1100
4.00
—
4.24
V
LVDL = 1101
4.20
—
4.45
V
LVDL = 1110
4.50
—
4.77
V
LVDL = 1111
—
—
—
V
LVDL = 0010
LV15
Note 1:
2:
VLVDIN
External LVD input pin
threshold voltage
Conditions
These parameters are characterized but not tested in manufacturing.
These values not in usable operating range.
DS70139E-page 152
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 20-2:
BROWN-OUT RESET CHARACTERISTICS
VDD
(Device not in Brown-out Reset)
BO15
BO10
(Device in Brown-out Reset)
RESET (due to BOR)
Power-Up Time-out
TABLE 20-11: ELECTRICAL CHARACTERISTICS: BOR
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
No.
BO10
Symbol
VBOR
Min
Typ(1)
Max
Units
BORV = 11(3)
—
—
—
V
BORV = 10
2.6
—
2.71
V
BORV = 01
4.1
—
4.4
V
BORV = 00
4.58
—
4.73
V
—
5
—
mV
Characteristic
BOR Voltage(2) on
VDD transition high to
low
Conditions
Not in operating
range
BO15
VBHYS
Note 1:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
11 values not in usable operating range.
2:
3:
© 2006 Microchip Technology Inc.
DS70139E-page 153
dsPIC30F2011/2012/3012/3013
TABLE 20-12: DC CHARACTERISTICS: PROGRAM AND EEPROM
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ(1)
Max
Units
Conditions
Data EEPROM Memory(2)
-40°C ≤ TA ≤ +85°C
D120
ED
Byte Endurance
100K
1M
—
E/W
D121
VDRW
VDD for Read/Write
VMIN
—
5.5
V
D122
TDEW
Erase/Write Cycle Time
—
2
—
ms
D123
TRETD
Characteristic Retention
40
100
—
Year
Provided no other specifications
are violated
D124
IDEW
IDD During Programming
—
10
30
mA
Row Erase
Program Flash
Using EECON to Read/Write
VMIN = Minimum operating
voltage
Memory(2)
D130
EP
Cell Endurance
10K
100K
—
E/W
D131
VPR
VDD for Read
VMIN
—
5.5
V
-40°C ≤ TA ≤ +85°C
VMIN = Minimum operating
voltage
D132
VEB
VDD for Bulk Erase
4.5
—
5.5
V
D133
VPEW
VDD for Erase/Write
3.0
—
5.5
V
D134
TPEW
Erase/Write Cycle Time
—
2
—
ms
D135
TRETD
Characteristic Retention
40
100
—
Year
D136
TEB
ICSP™ Block Erase Time
—
4
—
ms
D137
IPEW
IDD During Programming
—
10
30
mA
Row Erase
D138
IEB
IDD During Programming
—
10
30
mA
Bulk Erase
Note 1:
2:
Provided no other specifications
are violated
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
These parameters are characterized but not tested in manufacturing.
DS70139E-page 154
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
20.2
AC Characteristics and Timing Parameters
The information contained in this section defines dsPIC30F AC characteristics and timing parameters.
TABLE 20-13: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Operating voltage VDD range as described in Section 20.0 “Electrical
Characteristics”.
AC CHARACTERISTICS
FIGURE 20-3:
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
Load Condition 1 — for all pins except OSC2
Load Condition 2 — for OSC2
VDD/2
CL
Pin
RL
VSS
CL
Pin
Legend:
RL = 464 Ω
CL = 50 pF for all pins except OSC2
5 pF for OSC2 output
VSS
FIGURE 20-4:
EXTERNAL CLOCK TIMING
Q4
Q1
Q2
Q3
Q4
Q1
OSC1
OS20
OS30
OS25
OS30
OS31
OS31
CLKO
OS40
© 2006 Microchip Technology Inc.
OS41
DS70139E-page 155
dsPIC30F2011/2012/3012/3013
TABLE 20-14: EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
OS10
FOSC
Characteristic
Min
Typ(1)
Max
Units
External CLKN Frequency(2)
(External clocks allowed only
in EC mode)
DC
4
4
4
—
—
—
—
40
10
10
7.5
MHz
MHz
MHz
MHz
EC
EC with 4x PLL
EC with 8x PLL
EC with 16x PLL
Oscillator Frequency(2)
DC
0.4
4
4
4
4
10
10
10
10
12
12
12
31
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
7.37
7.37
7.37
7.37
512
4
4
10
10
10
7.5
25
20
20
15
25
25
22.5
33
—
—
—
—
—
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
kHz
MHz
MHz
MHz
MHz
kHz
RC
XTL
XT
XT with 4x PLL
XT with 8x PLL
XT with 16x PLL
HS
HS/2 with 4x PLL
HS/2 with 8x PLL
HS/2 with 16x PLL
HS/3 with 4x PLL
HS/3 with 8x PLL
HS/3 with 16x PLL
LP
FRC internal
FRC internal w/4x PLL
FRC internal w/8x PLL
FRC internal w/16x PLL
LPRC internal
Conditions
OS20
TOSC
TOSC = 1/FOSC
—
—
—
—
See parameter OS10
for FOSC value
OS25
TCY
Instruction Cycle Time(2)(3)
33
—
DC
ns
See Table 20-17
(2)
OS30
TosL,
TosH
External Clock in (OSC1)
High or Low Time
.45 x
TOSC
—
—
ns
EC
OS31
TosR,
TosF
External Clock(2) in (OSC1)
Rise or Fall Time
—
—
20
ns
EC
OS40
TckR
CLKO Rise Time(2)(4)
—
—
—
ns
See parameter DO31
—
—
—
ns
See parameter DO32
OS41
TckF
Note 1:
2:
3:
4:
(2)(4)
CLKO Fall Time
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the
“Max.” cycle time limit is “DC” (no clock) for all devices.
Measurements are taken in EC or ERC modes. The CLKO signal is measured on the OSC2 pin. CLKO is
low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).
DS70139E-page 156
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
TABLE 20-15: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
OS50
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
FPLLI
PLL Input Frequency Range(2)
4
4
4
4
4
4
5(3)
5(3)
5(3)
4
4
4
—
—
—
—
—
—
—
—
—
—
—
—
10
10
7.5(4)
10
10
7.5(4)
10
10
7.5(4)
8.33(3)
8.33(3)
7.5(4)
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
EC with 4x PLL
EC with 8x PLL
EC with 16x PLL
XT with 4x PLL
XT with 8x PLL
XT with 16x PLL
HS/2 with 4x PLL
HS/2 with 8x PLL
HS/2 with 16x PLL
HS/3 with 4x PLL
HS/3 with 8x PLL
HS/3 with 16x PLL
OS51
FSYS
On-Chip PLL Output(2)
16
—
120
MHz
EC, XT, HS/2, HS/3
modes with PLL
OS52
TLOC
PLL Start-up Time (Lock Time)
—
20
50
μs
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Limited by oscillator frequency range.
Limited by device operating frequency range.
TABLE 20-16: PLL JITTER
AC CHARACTERISTICS
Param
No.
OS61
Characteristic
Min
Typ(1)
Max
Units
x4 PLL
—
0.251
0.413
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0 to 3.6V
—
0.251
0.413
%
-40°C ≤ TA ≤ +125°C
VDD = 3.0 to 3.6V
—
0.256
0.47
%
-40°C ≤ TA ≤ +85°C
VDD = 4.5 to 5.5V
—
0.256
0.47
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5 to 5.5V
—
0.355
0.584
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0 to 3.6V
≤ +125°C
VDD = 3.0 to 3.6V
x8 PLL
x16 PLL
Note 1:
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Conditions
—
0.355
0.584
%
-40°C ≤
—
0.362
0.664
%
-40°C ≤ TA ≤ +85°C
VDD = 4.5 to 5.5V
—
0.362
0.664
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5 to 5.5V
—
0.67
0.92
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0 to 3.6V
TA
—
0.632
0.956
%
-40°C ≤ TA ≤ +85°C
VDD = 4.5 to 5.5V
—
0.632
0.956
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5 to 5.5V
These parameters are characterized but not tested in manufacturing.
© 2006 Microchip Technology Inc.
DS70139E-page 157
dsPIC30F2011/2012/3012/3013
TABLE 20-17: INTERNAL CLOCK TIMING EXAMPLES
Clock
Oscillator
Mode
FOSC
(MHz)(1)
TCY (μsec)(2)
MIPS(3)
w/o PLL
MIPS(3)
w PLL x4
MIPS(3)
w PLL x8
MIPS(3)
w PLL x16
EC
0.200
20.0
0.05
—
—
—
XT
Note 1:
2:
3:
4
1.0
1.0
4.0
8.0
16.0
10
0.4
2.5
10.0
20.0
—
25
0.16
6.25
—
—
—
4
1.0
1.0
4.0
8.0
16.0
10
0.4
2.5
10.0
20.0
—
Assumption: Oscillator Postscaler is divide by 1.
Instruction Execution Cycle Time: TCY = 1/MIPS.
Instruction Execution Frequency: MIPS = (FOSC * PLLx)/4 [since there are 4 Q clocks per instruction
cycle].
DS70139E-page 158
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
TABLE 20-18: AC CHARACTERISTICS: INTERNAL RC ACCURACY(2)
AC CHARACTERISTICS
Param
No.
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Characteristic
Min
Typ
Max
Units
Conditions
Internal FRC Jitter @ FRC Freq. = 7.37 MHz(1)
OS62
FRC
FRC with 4x PLL
FRC with 8x PLL
FRC with 16x PLL
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0-3.6V
+0.23
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5-5.5V
+0.62
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0-3.6V
+0.77
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5-5.5V
+0.87
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0-3.6V
+0.48
+1.08
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5-5.5V
+0.71
+1.23
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5-5.5V
%
-40°C ≤ TA ≤ +125°C
VDD = 3.0-5.5V
—
+0.04
+0.16
—
+0.07
—
+0.31
—
+0.34
—
+0.44
—
—
(1)
Internal FRC Accuracy @ FRC Freq. = 7.37 MHz
OS63
FRC
—
—
Internal FRC Drift @ FRC Freq. = 7.37
OS64
Note 1:
2:
+1.50
MHz(1)
-0.7
—
0.5
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0-3.6V
-0.7
—
0.7
%
-40°C ≤ TA ≤ +125°C
VDD = 3.0-3.6V
-0.7
—
0.5
%
-40°C ≤ TA ≤ +85°C
VDD = 4.5-5.5V
-0.7
—
0.7
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5-5.5V
Frequency calibrated at 7.372 MHz ±2%, 25°C and 5V. TUN bits (OSCCON<3:0>) can be used to
compensate for temperature drift.
Overall FRC variation can be calculated by adding the absolute values of jitter, accuracy and drift
percentages.
TABLE 20-19: INTERNAL RC ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Min
Typ
Max
Units
Conditions
-35
—
+35
%
—
LPRC @ Freq. = 512 kHz(1)
OS65
Note 1:
Change of LPRC frequency as VDD changes.
© 2006 Microchip Technology Inc.
DS70139E-page 159
dsPIC30F2011/2012/3012/3013
FIGURE 20-5:
CLKO AND I/O TIMING CHARACTERISTICS
I/O Pin
(Input)
DI35
DI40
I/O Pin
(Output)
New Value
Old Value
DO31
DO32
Note: Refer to Figure 20-3 for load conditions.
TABLE 20-20: CLKO AND I/O TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)(2)(3)
Min
Typ(4)
Max
Units
Conditions
DO31
TIOR
Port output rise time
—
7
20
ns
—
DO32
TIOF
Port output fall time
—
7
20
ns
—
DI35
TINP
INTx pin high or low time (output)
20
—
—
ns
—
DI40
TRBP
CNx high or low time (input)
2 TCY
—
—
ns
—
Note 1:
2:
3:
4:
These parameters are asynchronous events not related to any internal clock edges
Measurements are taken in RC mode and EC mode where CLKO output is 4 x TOSC.
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
DS70139E-page 160
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 20-6:
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING CHARACTERISTICS
VDD
SY12
MCLR
SY10
Internal
POR
SY11
PWRT
Time-out
SY30
OSC
Time-out
Internal
RESET
Watchdog
Timer
RESET
SY20
SY13
SY13
I/O Pins
SY35
FSCM
Delay
Note: Refer to Figure 20-3 for load conditions.
TABLE 20-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SY10
TmcL
MCLR Pulse Width (low)
2
—
—
μs
-40°C to +85°C
SY11
TPWRT
Power-up Timer Period
3
12
50
4
16
64
6
22
90
ms
-40°C to +85°C
User programmable
SY12
TPOR
Power On Reset Delay
3
10
30
μs
-40°C to +85°C
SY13
TIOZ
I/O high impedance from MCLR
Low or Watchdog Timer Reset
—
0.8
1.0
μs
SY20
TWDT1
Watchdog Timer Time-out Period
(No Prescaler)
1.4
2.1
2.8
ms
1.4
2.1
2.8
ms
VDD = 3V, -40°C to +85°C
100
—
—
μs
VDD ≤ VBOR (D034)
TWDT2
VDD = 5V, -40°C to +85°C
SY25
TBOR
Brown-out Reset Pulse Width(3)
SY30
TOST
Oscillation Start-up Timer Period
—
1024 TOSC
—
—
TOSC = OSC1 period
SY35
TFSCM
Fail-Safe Clock Monitor Delay
—
500
900
μs
-40°C to +85°C
Note 1:
2:
3:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
Refer to Figure 20-2 and Table 20-11 for BOR.
© 2006 Microchip Technology Inc.
DS70139E-page 161
dsPIC30F2011/2012/3012/3013
FIGURE 20-7:
BAND GAP START-UP TIME CHARACTERISTICS
VBGAP
0V
Enable Band Gap
(see Note)
Band Gap
Stable
SY40
Note: Set LVDEN bit (RCON<12>) or FBORPOR<7>set.
TABLE 20-22: BAND GAP START-UP TIME REQUIREMENTS
AC CHARACTERISTICS
Param
No.
SY40
Note 1:
2:
Symbol
TBGAP
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
Band Gap Start-up Time
—
40
65
µs
Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable.
RCON<13> bit
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
DS70139E-page 162
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 20-8:
TYPE A, B AND C TIMER EXTERNAL CLOCK TIMING CHARACTERISTICS
TxCK
Tx11
Tx10
Tx15
Tx20
OS60
TMRX
Note: Refer to Figure 20-3 for load conditions.
TABLE 20-23: TYPE A TIMER (TIMER1) EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
TA10
TA11
TA15
Symbol
TTXH
TTXL
TTXP
Characteristic
TxCK High Time
TxCK Low Time
Min
Typ
Max
Units
Conditions
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Must also meet
parameter TA15
Synchronous,
with prescaler
10
—
—
ns
Asynchronous
10
—
—
ns
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Synchronous,
with prescaler
10
—
—
ns
Asynchronous
10
—
—
ns
TCY + 10
—
—
ns
Greater of:
20 ns or
(TCY + 40)/N
—
—
—
TxCK Input Period Synchronous,
no prescaler
Synchronous,
with prescaler
Asynchronous
OS60
Ft1
TA20
TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
Note:
SOSC1/T1CK oscillator input
frequency range (oscillator enabled
by setting bit TCS (T1CON, bit 1))
20
—
—
ns
DC
—
50
kHz
0.5 TCY
—
1.5 TCY
—
Must also meet
parameter TA15
N = prescale
value
(1, 8, 64, 256)
Timer1 is a Type A.
© 2006 Microchip Technology Inc.
DS70139E-page 163
dsPIC30F2011/2012/3012/3013
TABLE 20-24: TYPE B TIMER (TIMER2 AND TIMER4) EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
TB10
TB11
TB15
Symbol
TtxH
TtxL
TtxP
Characteristic
TxCK High Time
TxCK Low Time
Min
Typ
Max
Units
Conditions
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Must also meet
parameter TB15
Synchronous,
with prescaler
10
—
—
ns
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Synchronous,
with prescaler
10
—
—
ns
TCY + 10
—
—
ns
—
1.5 TCY
—
TxCK Input Period Synchronous,
no prescaler
Synchronous,
with prescaler
TB20
Note:
TCKEXTMRL
Delay from External TxCK Clock
Edge to Timer Increment
Greater of:
20 ns or
(TCY + 40)/N
0.5 TCY
Must also meet
parameter TB15
N = prescale
value
(1, 8, 64, 256)
Timer2 and Timer4 are Type B.
TABLE 20-25: TYPE C TIMER (TIMER3 AND TIMER5) EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
TC10
TtxH
TxCK High Time
Synchronous
0.5 TCY + 20
—
—
ns
Must also meet
parameter TC15
TC11
TtxL
TxCK Low Time
Synchronous
0.5 TCY + 20
—
—
ns
Must also meet
parameter TC15
TC15
TtxP
TxCK Input Period Synchronous,
no prescaler
TCY + 10
—
—
ns
N = prescale
value
(1, 8, 64, 256)
—
1.5
TCY
—
Synchronous,
with prescaler
TC20
Note:
TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
Greater of:
20 ns or
(TCY + 40)/N
0.5 TCY
Timer3 and Timer5 are Type C.
DS70139E-page 164
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 20-9:
INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS
ICX
IC10
IC11
IC15
Note: Refer to Figure 20-3 for load conditions.
TABLE 20-26: INPUT CAPTURE TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
IC10
TccL
Characteristic(1)
ICx Input Low Time
No Prescaler
With Prescaler
IC11
TccH
ICx Input High Time
No Prescaler
With Prescaler
IC15
Note 1:
TccP
ICx Input Period
Min
Max
Units
0.5 TCY + 20
—
ns
10
—
ns
0.5 TCY + 20
—
ns
10
—
ns
(2 TCY + 40)/N
—
ns
Conditions
N = prescale
value (1, 4, 16)
These parameters are characterized but not tested in manufacturing.
© 2006 Microchip Technology Inc.
DS70139E-page 165
dsPIC30F2011/2012/3012/3013
FIGURE 20-10:
OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS
OCx
(Output Compare
or PWM Mode)
OC10
OC11
Note: Refer to Figure 20-3 for load conditions.
TABLE 20-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Min
Typ(2)
Max
Units
Conditions
OC10
TccF
OCx Output Fall Time
—
—
—
ns
See Parameter DO32
OC11
TccR
OCx Output Rise Time
—
—
—
ns
See Parameter DO31
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
DS70139E-page 166
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 20-11:
OC/PWM MODULE TIMING CHARACTERISTICS
OC20
OCFA/OCFB
OC15
OCx
TABLE 20-28: SIMPLE OC/PWM MODE TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
OC15
TFD
Fault Input to PWM I/O
Change
—
—
50
ns
—
OC15
OC20
TFLT
Fault Input Pulse Width
50
—
—
ns
—
OC20
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
© 2006 Microchip Technology Inc.
DS70139E-page 167
dsPIC30F2011/2012/3012/3013
FIGURE 20-12:
SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS
SCKx
(CKP = 0)
SP11
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
MSb
SDOx
BIT 14 - - - - - -1
SP31
SDIx
LSb
SP30
MSb IN
LSb IN
BIT 14 - - - -1
SP40 SP41
Note: Refer to Figure 20-3 for load conditions.
TABLE 20-29: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP10
TscL
SCKX Output Low Time(3)
TCY/2
—
—
ns
—
SP11
TscH
SCKX Output High Time(3)
TCY/2
—
—
ns
—
—
—
—
ns
See parameter
DO32
Time(4
SP20
TscF
SCKX Output Fall
SP21
TscR
SCKX Output Rise Time(4)
—
—
—
ns
See parameter
DO31
SP30
TdoF
SDOX Data Output Fall Time(4)
—
—
—
ns
See parameter
DO32
SP31
TdoR
SDOX Data Output Rise Time(4)
—
—
—
ns
See parameter
DO31
SP35
TscH2doV,
TscL2doV
SDOX Data Output Valid after
SCKX Edge
—
—
30
ns
—
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
—
SP41
TscH2diL,
TscL2diL
Hold Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
—
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
DS70139E-page 168
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 20-13:
SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS
SP36
SCKX
(CKP = 0)
SP11
SP10
SP21
SP20
SP20
SP21
SCKX
(CKP = 1)
SP35
BIT 14 - - - - - -1
MSb
SDOX
SP40
SDIX
LSb
SP30,SP31
MSb IN
BIT 14 - - - -1
SP41
LSb IN
Note: Refer to Figure 20-3 for load conditions.
TABLE 20-30: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
SP10
Symbol
TscL
Characteristic(1)
SCKX output low time(3)
time(3)
Min
Typ(2)
Max
Units
Conditions
TCY/2
—
—
ns
—
SP11
TscH
SCKX output high
TCY/2
—
—
ns
—
SP20
TscF
SCKX output fall time(4)
—
—
—
ns
See parameter
DO32
SP21
TscR
SCKX output rise time(4)
—
—
—
ns
See parameter
DO31
SP30
TdoF
SDOX data output fall time(4)
—
—
—
ns
See parameter
DO32
SP31
TdoR
SDOX data output rise time(4)
—
—
—
ns
See parameter
DO31
SP35
TscH2doV, SDOX data output valid after
TscL2doV SCKX edge
—
—
30
ns
—
SP36
TdoV2sc, SDOX data output setup to
TdoV2scL first SCKX edge
30
—
—
ns
—
SP40
TdiV2scH, Setup time of SDIX data input
TdiV2scL to SCKX edge
20
—
—
ns
—
SP41
TscH2diL,
TscL2diL
20
—
—
ns
—
Note 1:
2:
3:
4:
Hold time of SDIX data input
to SCKX edge
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
© 2006 Microchip Technology Inc.
DS70139E-page 169
dsPIC30F2011/2012/3012/3013
FIGURE 20-14:
SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SSX
SP52
SP50
SCKX
(CKP = 0)
SP71
SP70
SP73
SP72
SP72
SP73
BIT 14 - - - - - -1
LSb
SCKX
(CKP = 1)
SP35
MSb
SDOX
SP51
SP30,SP31
SDIX
MSb IN
BIT 14 - - - -1
LSb IN
SP41
SP40
Note: Refer to Figure 20-3 for load conditions.
TABLE 20-31: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
—
—
ns
—
SP70
TscL
SCKX Input Low Time
30
SP71
TscH
SCKX Input High Time
30
—
—
ns
—
SP72
TscF
SCKX Input Fall Time(3)
—
10
25
ns
—
—
10
25
ns
—
—
—
—
ns
See DO32
Time(3)
SP73
TscR
SCKX Input Rise
SP30
TdoF
SDOX Data Output Fall Time(3)
SP31
TdoR
SDOX Data Output Rise Time(3)
—
—
—
ns
See DO31
SP35
TscH2doV,
TscL2doV
SDOX Data Output Valid after
SCKX Edge
—
—
30
ns
—
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
—
SP41
TscH2diL,
TscL2diL
Hold Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
—
SP50
TssL2scH,
TssL2scL
SSX↓ to SCKX↑ or SCKX↓ Input
120
—
—
ns
—
SP51
TssH2doZ
SSX↑ to SDOX Output
high impedance(3)
10
—
50
ns
—
1.5 TCY
+40
—
—
ns
—
SP52
TscH2ssH
TscL2ssH
Note 1:
2:
3:
SSX after SCK Edge
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Assumes 50 pF load on all SPI pins.
DS70139E-page 170
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 20-15:
SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SP60
SSX
SP52
SP50
SCKX
(CKP = 0)
SP71
SP70
SP73
SP72
SP72
SP73
SCKX
(CKP = 1)
SP35
SP52
MSb
SDOX
BIT 14 - - - - - -1
LSb
SP30,SP31
SDIX
MSb IN
BIT 14 - - - -1
SP51
LSb IN
SP41
SP40
Note: Refer to Figure 20-3 for load conditions.
© 2006 Microchip Technology Inc.
DS70139E-page 171
dsPIC30F2011/2012/3012/3013
TABLE 20-32: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP70
TscL
SCKX Input Low Time
30
—
—
ns
—
SP71
TscH
SCKX Input High Time
30
—
—
ns
—
—
10
25
ns
—
—
10
25
ns
—
(3)
SP72
TscF
SCKX Input Fall Time
SP73
TscR
SCKX Input Rise Time(3)
(3)
SP30
TdoF
SDOX Data Output Fall Time
—
—
—
ns
See parameter
DO32
SP31
TdoR
SDOX Data Output Rise Time(3)
—
—
—
ns
See parameter
DO31
SP35
TscH2doV, SDOX Data Output Valid after
TscL2doV SCKX Edge
—
—
30
ns
—
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
—
SP41
TscH2diL,
TscL2diL
Hold Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
—
SP50
TssL2scH,
TssL2scL
SSX↓ to SCKX↓ or SCKX↑ input
120
—
—
ns
—
SP51
TssH2doZ
SS↑ to SDOX Output
high impedance(4)
10
—
50
ns
—
SP52
TscH2ssH
TscL2ssH
SSX↑ after SCKX Edge
1.5 TCY + 40
—
—
ns
—
SP60
TssL2doV
SDOX Data Output Valid after
SCKX Edge
—
—
50
ns
—
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
DS70139E-page 172
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 20-16:
I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)
SCL
IM31
IM34
IM30
IM33
SDA
Stop
Condition
Start
Condition
Note: Refer to Figure 20-3 for load conditions.
FIGURE 20-17:
I2C™ BUS DATA TIMING CHARACTERISTICS (MASTER MODE)
IM20
IM21
IM11
IM10
SCL
IM11
IM26
IM10
IM25
IM33
SDA
In
IM40
IM40
IM45
SDA
Out
Note: Refer to Figure 20-3 for load conditions.
© 2006 Microchip Technology Inc.
DS70139E-page 173
dsPIC30F2011/2012/3012/3013
TABLE 20-33: I2C™ BUS DATA TIMING REQUIREMENTS (MASTER MODE)
I
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Min(1)
Max
Units
Conditions
TCY/2 (BRG + 1)
—
μs
—
400 kHz mode
TCY/2 (BRG + 1)
—
μs
—
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
—
Clock High Time 100 kHz mode
TCY/2 (BRG + 1)
—
μs
—
400 kHz mode
TCY/2 (BRG + 1)
—
μs
—
(2)
Characteristic
TLO:SCL Clock Low Time 100 kHz mode
IM10
IM11
THI:SCL
TCY/2 (BRG + 1)
—
μs
100 kHz mode
—
300
ns
400 kHz mode
20 + 0.1 CB
300
ns
1 MHz mode(2)
—
100
ns
100 kHz mode
—
1000
ns
400 kHz mode
20 + 0.1 CB
300
ns
1 MHz mode(2)
—
300
ns
100 kHz mode
250
—
ns
1 MHz mode
IM20
TF:SCL
IM21
TR:SCL
IM25
SDA and SCL
Fall Time
SDA and SCL
Rise Time
TSU:DAT Data Input
Setup Time
IM26
THD:DAT Data Input
Hold Time
IM30
TSU:STA
IM31
Start Condition
Setup Time
THD:STA Start Condition
Hold Time
TSU:STO Stop Condition
Setup Time
IM33
IM34
THD:STO Stop Condition
Hold Time
IM40
TAA:SCL
IM45
Output Valid
From Clock
TBF:SDA Bus Free Time
IM50
CB
Note 1:
2:
400 kHz mode
100
—
ns
1 MHz mode(2)
TBD
—
ns
100 kHz mode
0
—
ns
400 kHz mode
0
0.9
μs
1 MHz mode(2)
TBD
—
ns
100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
—
CB is specified to be
from 10 to 400 pF
CB is specified to be
from 10 to 400 pF
—
—
Only relevant for
Repeated Start
condition
After this period the
first clock pulse is
generated
—
100 kHz mode
TCY/2 (BRG + 1)
—
ns
400 kHz mode
TCY/2 (BRG + 1)
—
ns
1 MHz mode(2)
TCY/2 (BRG + 1)
—
ns
100 kHz mode
—
3500
ns
400 kHz mode
—
1000
ns
—
1 MHz mode(2)
—
—
ns
—
Time the bus must be
free before a new
transmission can start
100 kHz mode
4.7
—
μs
400 kHz mode
1.3
—
μs
1 MHz mode(2)
TBD
—
μs
—
400
pF
Bus Capacitive Loading
—
—
BRG is the value of the I2C Baud Rate Generator. Refer to Section 21 “Inter-Integrated Circuit™ (I2C)”
in the “dsPIC30F Family Reference Manual” (DS70046).
Maximum pin capacitance = 10 pF for all I2C™ pins (for 1 MHz mode only).
DS70139E-page 174
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 20-18:
I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)
SCL
IS34
IS31
IS30
IS33
SDA
Stop
Condition
Start
Condition
FIGURE 20-19:
I2C™ BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
IS20
IS21
IS11
IS10
SCL
IS30
IS26
IS31
IS33
IS25
SDA
In
IS45
IS40
IS40
SDA
Out
TABLE 20-34: I2C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
IS10
IS11
IS20
Symbol
TLO:SCL
THI:SCL
TF:SCL
Characteristic
Clock Low Time
Clock High Time
SDA and SCL
Fall Time
Min
Max
Units
100 kHz mode
4.7
—
μs
Device must operate at a
minimum of 1.5 MHz
400 kHz mode
1.3
—
μs
Device must operate at a
minimum of 10 MHz.
1 MHz mode(1)
0.5
—
μs
100 kHz mode
4.0
—
μs
Device must operate at a
minimum of 1.5 MHz
400 kHz mode
0.6
—
μs
Device must operate at a
minimum of 10 MHz
1 MHz mode(1)
0.5
—
μs
100 kHz mode
—
300
ns
400 kHz mode
20 + 0.1 CB
300
ns
—
100
ns
100 kHz mode
—
1000
ns
400 kHz mode
20 + 0.1 CB
300
ns
1 MHz mode(1)
—
300
ns
1 MHz
IS21
Note 1:
TR:SCL
SDA and SCL
Rise Time
mode(1)
Conditions
—
—
CB is specified to be from
10 to 400 pF
CB is specified to be from
10 to 400 pF
Maximum pin capacitance = 10 pF for all I2C™ pins (for 1 MHz mode only).
© 2006 Microchip Technology Inc.
DS70139E-page 175
dsPIC30F2011/2012/3012/3013
TABLE 20-34: I2C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE) (CONTINUED)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
IS25
IS26
IS30
IS31
IS33
IS34
IS40
IS45
IS50
Note 1:
Symbol
TSU:DAT
THD:DAT
TSU:STA
THD:STA
TSU:STO
THD:STO
TAA:SCL
TBF:SDA
CB
Characteristic
Data Input
Setup Time
Data Input
Hold Time
Start Condition
Setup Time
Start Condition
Hold Time
Stop Condition
Setup Time
Min
Max
Units
Conditions
100 kHz mode
250
—
ns
—
400 kHz mode
100
—
ns
1 MHz mode(1)
100
—
ns
100 kHz mode
0
—
ns
400 kHz mode
0
0.9
μs
1 MHz mode(1)
0
0.3
μs
100 kHz mode
4.7
—
μs
400 kHz mode
0.6
—
μs
1 MHz mode(1)
0.25
—
μs
100 kHz mode
4.0
—
μs
400 kHz mode
0.6
—
μs
1 MHz mode(1)
0.25
—
μs
100 kHz mode
4.7
—
μs
400 kHz mode
0.6
—
μs
1 MHz mode(1)
0.6
—
μs
Stop Condition
100 kHz mode
4000
—
ns
Hold Time
400 kHz mode
600
—
ns
1 MHz mode(1)
250
100 kHz mode
0
3500
400 kHz mode
0
1000
ns
1 MHz mode(1)
0
350
ns
Output Valid
From Clock
Bus Free Time
Bus Capacitive
Loading
—
Only relevant for Repeated
Start condition
After this period the first
clock pulse is generated
—
—
ns
ns
100 kHz mode
4.7
—
μs
400 kHz mode
1.3
—
μs
1 MHz mode(1)
0.5
—
μs
—
400
pF
—
Time the bus must be free
before a new transmission
can start
—
Maximum pin capacitance = 10 pF for all I2C™ pins (for 1 MHz mode only).
DS70139E-page 176
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
FIGURE 20-20:
CXTX Pin
(output)
CAN MODULE I/O TIMING CHARACTERISTICS
New Value
Old Value
CA10 CA11
CXRX Pin
(input)
CA20
TABLE 20-35: CAN MODULE I/O TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Characteristic(1)
Symbol
Min
Typ(2)
Max
Units
Conditions
—
10
25
ns
—
CA10
TioF
Port Output Fall Time
CA11
TioR
Port Output Rise Time
—
10
25
ns
—
CA20
Tcwf
Pulse Width to Trigger
CAN Wake-up Filter
500
—
—
ns
—
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
© 2006 Microchip Technology Inc.
DS70139E-page 177
dsPIC30F2011/2012/3012/3013
TABLE 20-36: 12-BIT ADC MODULE SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
Device Supply
AD01
AVDD
Module VDD Supply
Greater of
VDD - 0.3
or 2.7
—
Lesser of
VDD + 0.3
or 5.5
V
—
AD02
AVSS
Module VSS Supply
VSS - 0.3
—
VSS + 0.3
V
—
Reference Inputs
AD05
VREFH
Reference Voltage High
AVSS + 2.7
—
AVDD
V
—
AD06
VREFL
Reference Voltage Low
AVSS
—
AVDD - 2.7
V
—
AD07
VREF
Absolute Reference
Voltage
AVSS - 0.3
—
AVDD + 0.3
V
—
AD08
IREF
Current Drain
—
200
.001
300
2
μA
μA
A/D operating
A/D off
AD10
VINH-VINL
Full-Scale Input Span
VREFL
—
VREFH
V
See Note 1
AD11
VIN
Absolute Input Voltage
AVSS - 0.3
—
AVDD + 0.3
V
AD12
—
Leakage Current
—
±0.001
±0.610
μA
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
Source Impedance =
2.5 kΩ
AD13
—
Leakage Current
—
±0.001
±0.610
μA
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
Source Impedance =
2.5 kΩ
AD15
RSS
Switch Resistance
—
3.2K
—
Ω
AD16
CSAMPLE
Sample Capacitor
—
18
AD17
RIN
Recommended Impedance
of Analog Voltage Source
—
—
Analog Input
2.5K
—
—
pF
—
Ω
—
DC Accuracy(2)
AD20
Nr
Resolution
AD21
INL
Integral Nonlinearity
—
—
<±1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
AD21A INL
Integral Nonlinearity
—
—
<±1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
AD22
DNL
Differential Nonlinearity
—
—
<±1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
AD22A DNL
Differential Nonlinearity
—
—
<±1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
AD23
GERR
Gain Error
+1.25
+1.5
+3
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
AD23A GERR
Gain Error
+1.25
+1.5
+3
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
Note 1:
2:
12 data bits
bits
The A/D conversion result never decreases with an increase in the input voltage, and has no missing
codes.
Measurements taken with external VREF+ and VREF- used as the ADC voltage references.
DS70139E-page 178
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
TABLE 20-36: 12-BIT ADC MODULE SPECIFICATIONS (CONTINUED)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
AD24
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
EOFF
Offset Error
-2
-1.5
-1.25
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
AD24A EOFF
Offset Error
-2
-1.5
-1.25
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
AD25
—
Monotonicity(1)
—
—
—
—
AD30
THD
Total Harmonic Distortion
—
-71
—
dB
—
AD31
SINAD
Signal to Noise and
Distortion
—
68
—
dB
—
AD32
SFDR
Spurious Free Dynamic
Range
—
83
—
dB
—
AD33
FNYQ
Input Signal Bandwidth
—
—
100
kHz
—
AD34
ENOB
Effective Number of Bits
10.95
11.1
—
bits
—
Guaranteed
Dynamic Performance
Note 1:
2:
The A/D conversion result never decreases with an increase in the input voltage, and has no missing
codes.
Measurements taken with external VREF+ and VREF- used as the ADC voltage references.
© 2006 Microchip Technology Inc.
DS70139E-page 179
dsPIC30F2011/2012/3012/3013
FIGURE 20-21:
12-BIT A/D CONVERSION TIMING CHARACTERISTICS
(ASAM = 0, SSRC = 000)
AD50
ADCLK
Instruction
Execution
Set SAMP
Clear SAMP
SAMP
ch0_dischrg
ch0_samp
eoc
AD61
AD60
TSAMP
AD55
DONE
ADIF
ADRES(0)
1
2
3
4
5
6
7
8
9
1 - Software sets ADCON. SAMP to start sampling.
2 - Sampling starts after discharge period.
TSAMP is described in the “dsPIC30F Family Reference Manual”, (DS70046), Section 18.
3 - Software clears ADCON. SAMP to Start conversion.
4 - Sampling ends, conversion sequence starts.
5 - Convert bit 11.
6 - Convert bit 10.
7 - Convert bit 1.
8 - Convert bit 0.
9 - One TAD for end of conversion.
DS70139E-page 180
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
TABLE 20-37: 12-BIT A/D CONVERSION TIMING REQUIREMENTS
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Param
No.
Symbol
TABLE 20-38: OPERATING TEMPERATURE-40°C ≤
TA ≤ +85°C FOR INDUSTRIAL
-40°C ≤ TA ≤ +125°C FOR EXTENDED
Characteristic
Min.
Typ
Max.
Units
Conditions
Clock Parameters
AD50
TAD
A/D Clock Period
—
334
—
ns
VDD = 3-5.5V (Note 1)
AD51
tRC
A/D Internal RC Oscillator Period
1.2
1.5
1.8
μs
—
AD55
tCONV
Conversion Time
—
14 TAD
AD56
FCNV
Throughput Rate
—
200
—
ksps
AD57
TSAMP
Sampling Time
—
1 TAD
—
ns
Conversion Rate
ns
—
VDD = VREF = 5V
VDD = 3-5.5V source
resistance
RS = 0-2.5 kΩ
Timing Parameters
AD60
tPCS
Conversion Start from Sample
Trigger
AD61
tPSS
AD62
AD63
Note 1:
2:
—
1 TAD
—
ns
—
Sample Start from Setting
Sample (SAMP) Bit
0.5 TAD
—
1.5
TAD
ns
—
tCSS
Conversion Completion to
Sample Start (ASAM = 1)
—
0.5 TAD
—
ns
—
tDPU
Time to Stabilize Analog Stage
from A/D Off to A/D On
—
20
—
μs
—
Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
These parameters are characterized but not tested in manufacturing.
© 2006 Microchip Technology Inc.
DS70139E-page 181
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 182
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
21.0
PACKAGING INFORMATION
21.1
Package Marking Information
18-Lead PDIP
Example
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
18-Lead SOIC
Example
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
dsPIC30F2011
30I/SO e3
0610017
28-Lead SPDIP
Example
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
dsPIC30F3012
30I/P e3
0610017
dsPIC30F2012
30I/SP e3
0610017
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2006 Microchip Technology Inc.
DS70139E-page 183
dsPIC30F2011/2012/3012/3013
21.2
Package Marking Information (Continued)
28-Lead SOIC (.300”)
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead QFN
Example
dsPIC30F3013
30I/SO e3
0610017
Example
XXXXXXX
XXXXXXX
30F2011
30I/MM e3
YYWWNNN
0610017
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
DS70139E-page 184
Example
dsPIC
30F3013
30I/ML e3
0610017
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
18-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
D
2
n
α
1
E
A2
A
L
c
A1
B1
β
p
B
eB
Units
Dimension Limits
n
p
INCHES*
NOM
18
.100
.155
.130
MAX
MILLIMETERS
NOM
18
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
22.61
22.80
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MAX
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
4.32
Molded Package Thickness
A2
.115
.145
3.68
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.313
.325
8.26
Molded Package Width
E1
.240
.250
.260
6.60
Overall Length
D
.890
.898
.905
22.99
Tip to Seating Plane
L
.125
.130
.135
3.43
c
Lead Thickness
.008
.012
.015
0.38
Upper Lead Width
B1
.045
.058
.070
1.78
Lower Lead Width
B
.014
.018
.022
0.56
Overall Row Spacing
§
eB
.310
.370
.430
10.92
α
Mold Draft Angle Top
5
10
15
15
β
Mold Draft Angle Bottom
5
10
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
© 2006 Microchip Technology Inc.
MIN
MIN
DS70139E-page 185
dsPIC30F2011/2012/3012/3013
18-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
p
E1
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
§
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.093
.088
.004
.394
.291
.446
.010
.016
0
.009
.014
0
0
A1
INCHES*
NOM
18
.050
.099
.091
.008
.407
.295
.454
.020
.033
4
.011
.017
12
12
MAX
.104
.094
.012
.420
.299
.462
.029
.050
8
.012
.020
15
15
MILLIMETERS
NOM
18
1.27
2.36
2.50
2.24
2.31
0.10
0.20
10.01
10.34
7.39
7.49
11.33
11.53
0.25
0.50
0.41
0.84
0
4
0.23
0.27
0.36
0.42
0
12
0
12
MIN
MAX
2.64
2.39
0.30
10.67
7.59
11.73
0.74
1.27
8
0.30
0.51
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
DS70139E-page 186
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
D
2
n
1
α
E
A2
A
L
c
β
B1
A1
eB
Units
Number of Pins
Pitch
p
B
Dimension Limits
n
p
INCHES*
MIN
NOM
MILLIMETERS
MAX
MIN
28
NOM
MAX
28
.100
2.54
Top to Seating Plane
A
.140
.150
.160
3.56
3.81
4.06
Molded Package Thickness
A2
.125
.130
.135
3.18
3.30
3.43
Base to Seating Plane
A1
.015
8.26
0.38
Shoulder to Shoulder Width
E
.300
.310
.325
7.62
7.87
Molded Package Width
E1
.275
.285
.295
6.99
7.24
7.49
Overall Length
D
1.345
1.365
1.385
34.16
34.67
35.18
Tip to Seating Plane
L
c
.125
.130
.135
3.18
3.30
3.43
.008
.012
.015
0.20
0.29
0.38
Upper Lead Width
B1
.040
.053
.065
1.02
1.33
1.65
Lower Lead Width
B
.016
.019
.022
0.41
0.48
0.56
eB
α
.320
.350
.430
8.13
8.89
10.92
Lead Thickness
Overall Row Spacing
Mold Draft Angle Top
§
5
10
15
5
10
15
β
Mold Draft Angle Bottom
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
© 2006 Microchip Technology Inc.
DS70139E-page 187
dsPIC30F2011/2012/3012/3013
28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
p
D
B
2
1
n
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
A1
INCHES*
NOM
28
.050
.099
.091
.008
.407
.295
.704
.020
.033
4
.011
.017
12
12
MAX
MILLIMETERS
NOM
28
1.27
2.36
2.50
2.24
2.31
0.10
0.20
10.01
10.34
7.32
7.49
17.65
17.87
0.25
0.50
0.41
0.84
0
4
0.23
0.28
0.36
0.42
0
12
0
12
MAX
Number of Pins
Pitch
Overall Height
A
.093
.104
2.64
Molded Package Thickness
A2
.088
.094
2.39
Standoff
§
A1
.004
.012
0.30
Overall Width
E
.394
.420
10.67
Molded Package Width
E1
.288
.299
7.59
Overall Length
D
.695
.712
18.08
Chamfer Distance
h
.010
.029
0.74
Foot Length
L
.016
.050
1.27
φ
Foot Angle Top
0
8
8
c
Lead Thickness
.009
.013
0.33
Lead Width
B
.014
.020
0.51
α
Mold Draft Angle Top
0
15
15
β
Mold Draft Angle Bottom
0
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
DS70139E-page 188
MIN
MIN
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
28-Lead Plastic Quad Flat, No Lead Package (MM) - 6x6x0.9 mm Body [QFN-S]
With 0.40 mm Contact Length
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D2
EXPOSED
PAD
e
E2
E
b
2
2
1
1
K
N
N
L
NOTE 1
TOP VIEW
BOTTOM VIEW
A
A1
A3
Units
Dimension Limits
Number of Pins
N
Pitch
e
Overall Height
A
Standoff
A1
Contact Thickness
A3
Overall Width
E
Exposed Pad Width
E2
Overall Length
D
Exposed Pad Length
D2
Contact Width
b
Contact Length §
L
Contact-to-Exposed Pad §
K
MIN
0.80
0.00
3.65
3.65
0.23
0.30
0.20
MILLIMETERS
NOM
28
0.65 BSC
0.90
0.02
0.20 REF
6.00 BSC
3.70
6.00 BSC
3.70
0.38
0.40
—
MAX
1.00
0.05
4.70
4.70
0.43
0.50
—
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–124, Sept. 8, 2006
© 2006 Microchip Technology Inc.
DS70139E-page 189
dsPIC30F2011/2012/3012/3013
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D2
EXPOSED
PAD
e
E
E2
b
2
1
N
2
1
NOTE 1
N
K
L
BOTTOM VIEW
TOP VIEW
A
A3
A1
Units
Dimension Limits
Number of Pins
N
Pitch
e
Overall Height
A
Standoff
A1
Contact Thickness
A3
Overall Width
E
Exposed Pad Width
E2
Overall Length
D
Exposed Pad Length
D2
Contact Width
b
Contact Length §
L
Contact-to-Exposed Pad §
K
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
MILLIMETERS
NOM
44
0.65 BSC
0.90
0.02
0.20 REF
8.00 BSC
6.45
8.00 BSC
6.45
0.30
0.40
—
MAX
1.00
0.05
6.80
6.80
0.38
0.50
—
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–103, Sept. 8, 2006
DS70139E-page 190
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
APPENDIX A:
REVISION HISTORY
Revision D (August 2006)
Previous versions of this data sheet contained
Advance or Preliminary Information. They were distributed with incomplete characterization data.
This revision reflects these updates:
• Supported I2C Slave Addresses
(see Table 14-1)
• ADC Conversion Clock selection to allow
200 kHz sampling rate (see Section 16.0 “12-bit
Analog-to-Digital Converter (ADC) Module”)
• Operating Current (IDD) Specifications
(see Table 20-5)
• Idle Current (IIDLE) Specifications
(see Table 20-6)
• Power-Down Current (IPD) Specifications
(see Table 20-7)
• I/O pin Input Specifications
(see Table 20-8)
• BOR voltage limits
(see Table 20-11)
• Watchdog Timer time-out limits
(see Table 20-21)
Revision E (December 2006)
This revision includes updates to the packaging
diagrams.
© 2006 Microchip Technology Inc.
DS70139E-page 191
dsPIC30F2011/2012/3012/3013
NOTES:
DS70139E-page 192
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
INDEX
Numerics
12-bit Analog-to-Digital Converter (A/D) Module .............. 109
A
A/D .................................................................................... 109
Aborting a Conversion .............................................. 111
ADCHS Register ....................................................... 109
ADCON1 Register..................................................... 109
ADCON2 Register..................................................... 109
ADCON3 Register..................................................... 109
ADCSSL Register ..................................................... 109
ADPCFG Register..................................................... 109
Configuring Analog Port Pins.............................. 58, 115
Connection Considerations....................................... 115
Conversion Operation ............................................... 110
Effects of a Reset...................................................... 114
Operation During CPU Idle Mode ............................. 114
Operation During CPU Sleep Mode.......................... 114
Output Formats ......................................................... 114
Power-Down Modes.................................................. 114
Programming the Sample Trigger............................. 111
Register Map............................................................. 117
Result Buffer ............................................................. 110
Sampling Requirements............................................ 113
Selecting the Conversion Sequence......................... 110
AC Characteristics ............................................................ 155
Load Conditions ........................................................ 155
AC Temperature and Voltage Specifications .................... 155
ADC
Selecting the Conversion Clock ................................ 111
ADC Conversion Speeds .................................................. 112
Address Generator Units .................................................... 41
Alternate Vector Table ........................................................ 67
Analog-to-Digital Converter. See ADC.
Assembler
MPASM Assembler................................................... 142
Automatic Clock Stretch...................................................... 96
During 10-bit Addressing (STREN = 1)....................... 96
During 7-bit Addressing (STREN = 1)......................... 96
Receive Mode ............................................................. 96
Transmit Mode ............................................................ 96
B
Bandgap Start-up Time
Requirements............................................................ 162
Timing Characteristics .............................................. 162
Barrel Shifter ....................................................................... 25
Bit-Reversed Addressing .................................................... 44
Example ...................................................................... 45
Implementation ........................................................... 44
Modifier Values Table ................................................. 45
Sequence Table (16-Entry)......................................... 45
Block Diagrams
12-bit ADC Functional............................................... 109
16-bit Timer1 Module .................................................. 71
16-bit Timer2............................................................... 77
16-bit Timer3............................................................... 77
32-bit Timer2/3............................................................ 76
DSP Engine ................................................................ 22
dsPIC30F2011 ............................................................ 10
dsPIC30F2012 ............................................................ 11
dsPIC30F3013 ............................................................ 13
External Power-on Reset Circuit............................... 127
© 2006 Microchip Technology Inc.
I2C .............................................................................. 94
Input Capture Mode.................................................... 81
Oscillator System...................................................... 121
Output Compare Mode ............................................... 85
Reset System ........................................................... 125
Shared Port Structure................................................. 57
SPI.............................................................................. 89
SPI Master/Slave Connection..................................... 90
UART Receiver......................................................... 102
UART Transmitter..................................................... 101
BOR Characteristics ......................................................... 153
BOR. See Brown-out Reset.
Brown-out Reset
Characteristics.......................................................... 153
Timing Requirements ............................................... 161
C
C Compilers
MPLAB C18.............................................................. 142
MPLAB C30.............................................................. 142
CAN Module
I/O Timing Characteristics ........................................ 177
I/O Timing Requirements.......................................... 177
CLKOUT and I/O Timing
Characteristics.......................................................... 160
Requirements ........................................................... 160
Code Examples
Data EEPROM Block Erase ....................................... 54
Data EEPROM Block Write ........................................ 56
Data EEPROM Read.................................................. 53
Data EEPROM Word Erase ....................................... 54
Data EEPROM Word Write ........................................ 55
Erasing a Row of Program Memory ........................... 49
Initiating a Programming Sequence ........................... 50
Loading Write Latches ................................................ 50
Code Protection ................................................................ 119
Control Registers ................................................................ 48
NVMADR .................................................................... 48
NVMADRU ................................................................. 48
NVMCON.................................................................... 48
NVMKEY .................................................................... 48
Core Architecture
Overview..................................................................... 17
CPU Architecture Overview ................................................ 17
Customer Change Notification Service............................. 199
Customer Notification Service .......................................... 199
Customer Support............................................................. 199
D
Data Accumulators and Adder/Subtractor .......................... 23
Data Space Write Saturation ...................................... 25
Overflow and Saturation ............................................. 23
Round Logic ............................................................... 24
Write-Back .................................................................. 24
Data Address Space........................................................... 33
Alignment.................................................................... 36
Alignment (Figure) ...................................................... 36
Effect of Invalid Memory Accesses (Table) ................ 36
MCU and DSP (MAC Class) Instructions Example .... 35
Memory Map......................................................... 33, 34
Near Data Space ........................................................ 37
Software Stack ........................................................... 37
Spaces........................................................................ 36
Width .......................................................................... 36
Data EEPROM Memory...................................................... 53
Erasing ....................................................................... 54
DS70139E-page 193
dsPIC30F2011/2012/3012/3013
Erasing, Block ............................................................. 54
Erasing, Word ............................................................. 54
Protection Against Spurious Write .............................. 56
Reading....................................................................... 53
Write Verify ................................................................. 56
Writing ......................................................................... 55
Writing, Block .............................................................. 55
Writing, Word .............................................................. 55
DC Characteristics ............................................................ 145
BOR .......................................................................... 153
Brown-out Reset ....................................................... 153
I/O Pin Input Specifications ....................................... 151
I/O Pin Output Specifications .................................... 151
Idle Current (IIDLE) .................................................... 148
Low-Voltage Detect................................................... 152
LVDL ......................................................................... 152
Operating Current (IDD)............................................. 147
Power-Down Current (IPD) ........................................ 149
Program and EEPROM............................................. 154
Temperature and Voltage Specifications .................. 145
Development Support ....................................................... 141
Device Configuration
Register Map............................................................. 132
Device Configuration Registers
FBORPOR ................................................................ 130
FGS........................................................................... 130
FOSC ........................................................................ 130
FWDT........................................................................ 130
Device Overview ............................................................. 9, 17
Disabling the UART........................................................... 103
Divide Support..................................................................... 20
Instructions (Table) ..................................................... 20
DSP Engine......................................................................... 21
Multiplier...................................................................... 23
Dual Output Compare Match Mode .................................... 86
Continuous Pulse Mode .............................................. 86
Single Pulse Mode ...................................................... 86
E
Electrical Characteristics
AC ............................................................................. 155
DC ............................................................................. 145
Enabling and Setting Up UART
Alternate I/O .............................................................. 103
Setting Up Data, Parity and Stop Bit Selections ....... 103
Enabling the UART ........................................................... 103
Equations
ADC Conversion Clock ............................................. 111
Baud Rate ................................................................. 105
Serial Clock Rate ........................................................ 98
Errata .................................................................................... 7
Exception Sequence
Trap Sources .............................................................. 65
External Clock Timing Characteristics
Type A, B and C Timer ............................................. 163
External Clock Timing Requirements................................ 156
Type A Timer ............................................................ 163
Type B Timer ............................................................ 164
Type C Timer ............................................................ 164
External Interrupt Requests ................................................ 68
F
Fast Context Saving............................................................ 68
Flash Program Memory....................................................... 47
DS70139E-page 194
I
I/O Pin Specifications
Input.......................................................................... 151
Output ....................................................................... 151
I/O Ports.............................................................................. 57
Parallel (PIO) .............................................................. 57
I2C 10-bit Slave Mode Operation........................................ 95
Reception ................................................................... 96
Transmission .............................................................. 96
I2C 7-bit Slave Mode Operation.......................................... 95
Reception ................................................................... 95
Transmission .............................................................. 95
I2C Master Mode Operation................................................ 97
Baud Rate Generator ................................................. 98
Clock Arbitration ......................................................... 98
Multi-Master Communication, Bus Collision and
Bus Arbitration .................................................... 98
Reception ................................................................... 98
Transmission .............................................................. 97
I2C Master Mode Support ................................................... 97
I2C Module
Addresses................................................................... 95
Bus Data Timing Characteristics
Master Mode..................................................... 173
Slave Mode....................................................... 175
Bus Data Timing Requirements
Master Mode..................................................... 174
Slave Mode....................................................... 175
Bus Start/Stop Bits Timing Characteristics
Master Mode..................................................... 173
Slave Mode....................................................... 175
General Call Address Support .................................... 97
Interrupts .................................................................... 97
IPMI Support............................................................... 97
Operating Function Description .................................. 93
Operation During CPU Sleep and Idle Modes ............ 98
Pin Configuration ........................................................ 93
Programmer’s Model .................................................. 93
Register Map .............................................................. 99
Registers .................................................................... 93
Slope Control .............................................................. 97
Software Controlled Clock Stretching (STREN = 1) ... 96
Various Modes............................................................ 93
Idle Current (IIDLE) ............................................................ 148
In-Circuit Serial Programming (ICSP)......................... 47, 119
Input Capture (CAPX) Timing Characteristics .................. 165
Input Capture Module ......................................................... 81
Interrupts .................................................................... 82
Register Map .............................................................. 83
Input Capture Operation During Sleep and Idle Modes...... 82
CPU Idle Mode ........................................................... 82
CPU Sleep Mode ........................................................ 82
Input Capture Timing Requirements................................. 165
Input Change Notification Module....................................... 61
dsPIC30F2012/3013 Register Map (Bits 7-0)............. 61
Instruction Addressing Modes ............................................ 41
File Register Instructions ............................................ 41
Fundamental Modes Supported ................................. 41
MAC Instructions ........................................................ 42
MCU Instructions ........................................................ 41
Move and Accumulator Instructions............................ 42
Other Instructions ....................................................... 42
Instruction Set
Overview................................................................... 136
Summary .................................................................. 133
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
Internal Clock Timing Examples ....................................... 158
Internet Address................................................................ 199
Interrupt Controller
Register Map......................................................... 69, 70
Interrupt Priority .................................................................. 64
Traps........................................................................... 65
Interrupt Sequence ............................................................. 67
Interrupt Stack Frame ................................................. 67
Interrupts ............................................................................. 63
L
Load Conditions ................................................................ 155
Low Voltage Detect (LVD) ................................................ 129
Low-Voltage Detect Characteristics .................................. 152
LVDL Characteristics ........................................................ 152
M
Memory Organization.......................................................... 27
Core Register Map...................................................... 37
Microchip Internet Web Site .............................................. 199
Modulo Addressing ............................................................. 42
Applicability ................................................................. 44
Incrementing Buffer Operation Example..................... 43
Start and End Address................................................ 43
W Address Register Selection .................................... 43
MPLAB ASM30 Assembler, Linker, Librarian ................... 142
MPLAB ICD 2 In-Circuit Debugger ................................... 143
MPLAB ICE 2000 High-Performance Universal
In-Circuit Emulator .................................................... 143
MPLAB ICE 4000 High-Performance Universal
In-Circuit Emulator .................................................... 143
MPLAB Integrated Development Environment Software .. 141
MPLAB PM3 Device Programmer .................................... 143
MPLINK Object Linker/MPLIB Object Librarian ................ 142
N
NVM
Register Map............................................................... 51
O
OC/PWM Module Timing Characteristics.......................... 167
Operating Current (IDD)..................................................... 147
Operating Frequency vs Voltage
dsPIC30FXXXX-20 (Extended)................................. 145
Oscillator
Configurations........................................................... 122
Fail-Safe Clock Monitor .................................... 124
Fast RC (FRC) .................................................. 123
Initial Clock Source Selection ........................... 122
Low-Power RC (LPRC)..................................... 123
LP Oscillator Control ......................................... 123
Phase Locked Loop (PLL) ................................ 123
Start-up Timer (OST) ........................................ 122
Operating Modes (Table) .......................................... 120
System Overview ...................................................... 119
Oscillator Selection ........................................................... 119
Oscillator Start-up Timer
Timing Characteristics .............................................. 161
Timing Requirements................................................ 161
Output Compare Interrupts ................................................. 87
Output Compare Module..................................................... 85
Register Map............................................................... 88
Timing Characteristics .............................................. 166
Timing Requirements................................................ 166
Output Compare Operation During CPU Idle Mode............ 87
Output Compare Sleep Mode Operation ............................ 87
© 2006 Microchip Technology Inc.
P
Packaging Information ...................................................... 183
Marking............................................................. 183, 184
Peripheral Module Disable (PMD) Registers .................... 131
PICSTART Plus Development Programmer..................... 144
Pinout Descriptions............................................................. 14
PLL Clock Timing Specifications ...................................... 157
POR. See Power-on Reset.
Port Write/Read Example ................................................... 58
PORTB
Register Map for dsPIC30F2011/3012 ....................... 59
Register Map for dsPIC30F2012/3013 ....................... 59
PORTC
Register Map for dsPIC30F2011/2012/3012/3013 ..... 59
PORTD
Register Map for dsPIC30F2011/3012 ....................... 59
Register Map for dsPIC30F2012/3013 ....................... 60
PORTF
Register Map for dsPIC30F2012/3013 ....................... 60
Power Saving Modes........................................................ 129
Idle............................................................................ 130
Sleep ........................................................................ 129
Sleep and Idle........................................................... 119
Power-Down Current (IPD)................................................ 149
Power-up Timer
Timing Characteristics .............................................. 161
Timing Requirements ............................................... 161
Program Address Space..................................................... 27
Construction ............................................................... 29
Data Access from Program Memory Using
Program Space Visibility..................................... 31
Data Access From Program Memory Using
Table Instructions ............................................... 30
Data Access from, Address Generation ..................... 29
Data Space Window into Operation ........................... 32
Data Table Access (LS Word) .................................... 30
Data Table Access (MS Byte) .................................... 31
Memory Map............................................................... 28
Table Instructions
TBLRDH ............................................................. 30
TBLRDL.............................................................. 30
TBLWTH............................................................. 30
TBLWTL ............................................................. 30
Program and EEPROM Characteristics............................ 154
Program Counter ................................................................ 18
Programmable .................................................................. 119
Programmer’s Model .......................................................... 18
Diagram ...................................................................... 19
Programming Operations.................................................... 49
Algorithm for Program Flash....................................... 49
Erasing a Row of Program Memory ........................... 49
Initiating the Programming Sequence ........................ 50
Loading Write Latches ................................................ 50
Protection Against Accidental Writes to OSCCON ........... 124
R
Reader Response............................................................. 200
Reset ........................................................................ 119, 125
BOR, Programmable ................................................ 127
Brown-out Reset (BOR)............................................ 119
Oscillator Start-up Timer (OST)................................ 119
POR
Operating without FSCM and PWRT................ 127
With Long Crystal Start-up Time ...................... 127
POR (Power-on Reset)............................................. 125
DS70139E-page 195
dsPIC30F2011/2012/3012/3013
Power-on Reset (POR) ............................................. 119
Power-up Timer (PWRT) .......................................... 119
Reset Sequence.................................................................. 65
Reset Sources ............................................................ 65
Reset Sources
Brown-out Reset (BOR) .............................................. 65
Illegal Instruction Trap................................................. 65
Trap Lockout ............................................................... 65
Uninitialized W Register Trap ..................................... 65
Watchdog Time-out..................................................... 65
Reset Timing Characteristics ............................................ 161
Reset Timing Requirements.............................................. 161
Run-Time Self-Programming (RTSP) ................................. 47
S
Simple Capture Event Mode ............................................... 81
Buffer Operation.......................................................... 82
Hall Sensor Mode ....................................................... 82
Prescaler ..................................................................... 81
Timer2 and Timer3 Selection Mode ............................ 82
Simple OC/PWM Mode Timing Requirements.................. 167
Simple Output Compare Match Mode................................. 86
Simple PWM Mode ............................................................. 86
Input Pin Fault Protection............................................ 86
Period.......................................................................... 87
Software Simulator (MPLAB SIM)..................................... 142
Software Stack Pointer, Frame Pointer............................... 18
CALL Stack Frame...................................................... 37
SPI Module.......................................................................... 89
Framed SPI Support ................................................... 90
Operating Function Description .................................. 89
Operation During CPU Idle Mode ............................... 91
Operation During CPU Sleep Mode ............................ 91
SDOx Disable ............................................................. 90
Slave Select Synchronization ..................................... 91
SPI1 Register Map ...................................................... 92
Timing Characteristics
Master Mode (CKE = 0) .................................... 168
Master Mode (CKE = 1) .................................... 169
Slave Mode (CKE = 1) .............................. 170, 171
Timing Requirements
Master Mode (CKE = 0) .................................... 168
Master Mode (CKE = 1) .................................... 169
Slave Mode (CKE = 0) ...................................... 170
Slave Mode (CKE = 1) ...................................... 172
Word and Byte Communication .................................. 90
Status Bits, Their Significance and the Initialization
Condition for RCON Register, Case 1 ...................... 128
Status Bits, Their Significance and the Initialization
Condition for RCON Register, Case 2 ...................... 128
Status Register.................................................................... 18
Symbols Used in Opcode Descriptions............................. 134
System Integration
Register Map............................................................. 132
T
Table Instruction Operation Summary ................................ 47
Temperature and Voltage Specifications
AC ............................................................................. 155
DC ............................................................................. 145
Timer 2/3 Module ................................................................ 75
Timer1 Module .................................................................... 71
16-bit Asynchronous Counter Mode ........................... 71
16-bit Synchronous Counter Mode ............................. 71
16-bit Timer Mode ....................................................... 71
Gate Operation ........................................................... 72
DS70139E-page 196
Interrupt ...................................................................... 72
Operation During Sleep Mode .................................... 72
Prescaler .................................................................... 72
Real-Time Clock ......................................................... 72
Interrupts ............................................................ 73
Oscillator Operation............................................ 73
Register Map .............................................................. 74
Timer2 and Timer3 Selection Mode.................................... 86
Timer2/3 Module
16-bit Timer Mode....................................................... 75
32-bit Synchronous Counter Mode ............................. 75
32-bit Timer Mode....................................................... 75
ADC Event Trigger...................................................... 78
Gate Operation ........................................................... 78
Interrupt ...................................................................... 78
Operation During Sleep Mode .................................... 78
Register Map .............................................................. 79
Timer Prescaler .......................................................... 78
Timing Characteristics
A/D Conversion
Low-speed (ASAM = 0, SSRC = 000) .............. 180
Bandgap Start-up Time............................................. 162
CAN Module I/O........................................................ 177
CLKOUT and I/O ...................................................... 160
External Clock........................................................... 155
I2C Bus Data
Master Mode..................................................... 173
Slave Mode....................................................... 175
I2C Bus Start/Stop Bits
Master Mode..................................................... 173
Slave Mode....................................................... 175
Input Capture (CAPX)............................................... 165
OC/PWM Module...................................................... 167
Oscillator Start-up Timer........................................... 161
Output Compare Module .......................................... 166
Power-up Timer ........................................................ 161
Reset ........................................................................ 161
SPI Module
Master Mode (CKE = 0).................................... 168
Master Mode (CKE = 1).................................... 169
Slave Mode (CKE = 0)...................................... 170
Slave Mode (CKE = 1)...................................... 171
Type A, B and C Timer External Clock ..................... 163
Watchdog Timer ....................................................... 161
Timing Diagrams
PWM Output Timing ................................................... 87
Time-out Sequence on Power-up (MCLR Not
Tied to VDD), Case 1 ........................................ 126
Time-out Sequence on Power-up (MCLR Not
Tied to VDD), Case 2 ........................................ 126
Time-out Sequence on Power-up (MCLR
Tied to VDD)...................................................... 126
Timing Diagrams and Specifications
DC Characteristics - Internal RC Accuracy............... 158
Timing Diagrams.See Timing Characteristics
Timing Requirements
A/D Conversion
Low-speed ........................................................ 181
Bandgap Start-up Time............................................. 162
Brown-out Reset ....................................................... 161
CAN Module I/O........................................................ 177
CLKOUT and I/O ...................................................... 160
External Clock........................................................... 156
I2C Bus Data (Master Mode) .................................... 174
I2C Bus Data (Slave Mode) ...................................... 175
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
Input Capture ............................................................ 165
Oscillator Start-up Timer ........................................... 161
Output Compare Module........................................... 166
Power-up Timer ........................................................ 161
Reset......................................................................... 161
Simple OC/PWM Mode............................................. 167
SPI Module
Master Mode (CKE = 0) .................................... 168
Master Mode (CKE = 1) .................................... 169
Slave Mode (CKE = 0) ...................................... 170
Slave Mode (CKE = 1) ...................................... 172
Type A Timer External Clock .................................... 163
Type B Timer External Clock .................................... 164
Type C Timer External Clock .................................... 164
Watchdog Timer........................................................ 161
Timing Specifications
PLL Clock.................................................................. 157
Trap Vectors ....................................................................... 67
U
UART Module
Address Detect Mode ............................................... 105
Auto-Baud Support ................................................... 106
Baud Rate Generator................................................ 105
Enabling and Setting Up ........................................... 103
Framing Error (FERR)............................................... 105
Idle Status ................................................................. 105
Loopback Mode ........................................................ 105
Operation During CPU Sleep and Idle Modes .......... 106
Overview ................................................................... 101
Parity Error (PERR) .................................................. 105
Receive Break........................................................... 105
Receive Buffer (UxRXB) ........................................... 104
Receive Buffer Overrun Error (OERR Bit) ................ 104
Receive Interrupt....................................................... 104
Receiving Data.......................................................... 104
Receiving in 8-bit or 9-bit Data Mode........................ 104
Reception Error Handling.......................................... 104
Transmit Break.......................................................... 104
Transmit Buffer (UxTXB)........................................... 103
Transmit Interrupt...................................................... 104
Transmitting Data...................................................... 103
Transmitting in 8-bit Data Mode................................ 103
Transmitting in 9-bit Data Mode................................ 103
UART1 Register Map................................................ 107
UART2 Register Map................................................ 107
UART Operation
Idle Mode .................................................................. 106
Sleep Mode............................................................... 106
Unit ID Locations............................................................... 119
Universal Asynchronous Receiver Transmitter
(UART) Module ......................................................... 101
W
Wake-up from Sleep ......................................................... 119
Wake-up from Sleep and Idle ............................................. 68
Watchdog Timer
Timing Characteristics .............................................. 161
Timing Requirements................................................ 161
Watchdog Timer (WDT) ............................................ 119, 129
Enabling and Disabling ............................................. 129
Operation .................................................................. 129
WWW Address.................................................................. 199
WWW, On-Line Support ....................................................... 7
© 2006 Microchip Technology Inc.
DS70139E-page 197
dsPIC30F2011/2012/3012/3013
DS70139E-page 198
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
THE MICROCHIP WEB SITE
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© 2006 Microchip Technology Inc.
DS70139E-page 199
dsPIC30F2011/2012/3012/3013
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
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Device: dsPIC30F2011/2012/3012/
Literature Number: DS70139E
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DS70139E-page 200
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
d s P I C 3 0 F 3 0 1 3 AT - 3 0 I / S P - E S
Custom ID (3 digits) or
Engineering Sample (ES)
Trademark
Architecture
Package
P = DIP
SO = SOIC
SP = SPDIP
ML = QFN (8x8)
Flash
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Device ID
Speed
20 = 20 MIPS
30 = 30 MIPS
T = Tape and Reel
A,B,C… = Revision Level
Example:
dsPIC30F3013AT-30I/SP = 30 MIPS, Industrial temp., SPDIP package, Rev. A
© 2006 Microchip Technology Inc.
DS70139E-page 201
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Fax: 60-4-646-5086
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Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
08/29/06
DS70139E-page 202
© 2006 Microchip Technology Inc.
dsPIC30F2011/2012/3012/3013
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 CPU Architecture Overview........................................................................................................................................................ 17
3.0 Memory Organization ................................................................................................................................................................. 27
4.0 Address Generator Units............................................................................................................................................................ 41
5.0 Flash Program Memory.............................................................................................................................................................. 47
6.0 Data EEPROM Memory ............................................................................................................................................................. 53
7.0 I/O Ports ..................................................................................................................................................................................... 57
8.0 Interrupts .................................................................................................................................................................................... 63
9.0 Timer1 Module ........................................................................................................................................................................... 71
10.0 Timer2/3 Module ........................................................................................................................................................................ 75
11.0 Input Capture Module................................................................................................................................................................. 81
12.0 Output Compare Module ............................................................................................................................................................ 85
13.0 SPI Module................................................................................................................................................................................. 89
14.0 I2C Module ................................................................................................................................................................................. 93
15.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 101
16.0 12-bit Analog-to-Digital Converter (ADC) Module .................................................................................................................... 109
17.0 System Integration ................................................................................................................................................................... 119
18.0 Instruction Set Summary .......................................................................................................................................................... 133
19.0 Development Support............................................................................................................................................................... 141
20.0 Electrical Characteristics .......................................................................................................................................................... 145
21.0 Packaging Information.............................................................................................................................................................. 183
Index .................................................................................................................................................................................................. 193
The Microchip Web Site ..................................................................................................................................................................... 199
Customer Change Notification Service .............................................................................................................................................. 199
Customer Support .............................................................................................................................................................................. 199
Reader Response .............................................................................................................................................................................. 200
Product Identification System ............................................................................................................................................................ 201
© 2006 Microchip Technology Inc.
DS70139E-page 1