[ /Title (CD74 HC273 , CD74 HCT27 3) /Subject (High Speed CMOS Logic Octal DType Flip- CD54HC273, CD74HC273, CD54HCT273, CD74HCT273 Data sheet acquired from Harris Semiconductor SCHS174B High-Speed CMOS Logic Octal D-Type Flip-Flop with Reset February 1998 - Revised May 2003 Features Description • Common Clock and Asynchronous Master Reset The ’HC273 and ’HCT273 high speed octal D-Type flip-flops with a direct clear input are manufactured with silicon-gate CMOS technology. They possess the low power consumption of standard CMOS integrated circuits. • Positive Edge Triggering • Buffered Inputs Information at the D inputis transferred to the Q outputs on the positive-going edge of the clock pulse. All eight flip-flops are controlled by a common clock (CP) and a common reset (MR). Resetting is accomplished by a low voltage level independent of the clock. All eight Q outputs are reset to a logic 0. • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times Ordering Information • Significant Power Reduction Compared to LSTTL Logic ICs PART NUMBER • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH TEMP. RANGE (oC) PACKAGE CD54HC273F3A -55 to 125 20 Ld CERDIP CD74HC273E -55 to 125 20 Ld PDIP CD74HC273M -55 to 125 20 Ld SOIC CD74HC273M96 -55 to 125 20 Ld SOIC CD54HCT273F3A -55 to 125 20 Ld CERDIP CD74HCT273E -55 to 125 20 Ld PDIP CD74HCT273M -55 to 125 20 Ld SOIC CD74HCT273M96 -55 to 125 20 Ld SOIC NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. Pinout CD54HC273, CD54HCT273 (CERDIP) CD74HC273, CD74HCT273 (PDIP, SOIC) TOP VIEW MR 1 20 VCC Q0 2 19 Q7 D0 3 18 D7 D1 4 17 D6 Q1 5 16 Q6 Q2 6 15 Q5 D2 7 14 D5 D3 8 13 D4 Q3 9 12 Q4 GND 10 11 CP CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54/74HC273, CD54/74HCT273 Functional Diagram CLOCK CP DATA INPUTS D0 Q0 D1 Q1 D2 Q2 D3 Q3 D4 Q4 D5 Q5 D6 Q6 D7 Q7 DATA OUTPUTS RESET MR TRUTH TABLE INPUTS OUTPUT RESET (MR) CLOCK CP DATA Dn Q L X X L H ↑ H H H ↑ L L H L X Q0 H = High Voltage Level, L = Low Voltage Level, X = Don’t Care, ↑ = Transition from Low to High Level, Q0 = Level Before the Indicated Steady-State Input Conditions Were Established. 2 CD54/74HC273, CD54/74HCT273 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1) θJC (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) VIH - 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 3 CD54/74HC273, CD54/74HCT273 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) High Level Input Voltage VIH - - Low Level Input Voltage VIL - High Level Output Voltage CMOS Loads VOH VIH or VIL PARAMETER 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 to 5.5 2 - - 2 - 2 - V - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads II VCC to GND 0 5.5 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC (Note 2) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS MR 1.5 Data 0.4 CP 1.5 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25oC. Prerequisite For Switching Specifications PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS fMAX - 2 6 - - 5 - 4 - MHz 4.5 30 - - 25 - 20 - MHz 6 35 - - 29 - 23 - MHz 2 60 - - 75 - 90 - ns HC TYPES Maximum Clock Frequency (Figure 1) MR Pulse Width (Figure 1) tW - 4.5 12 - - 15 - 18 - ns 6 10 - - 13 - 15 - ns 4 CD54/74HC273, CD54/74HCT273 Prerequisite For Switching Specifications PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tW - 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 60 - - 75 - 70 - ns 4.5 12 - - 15 - 18 - ns 6 10 - - 13 - 15 - ns 2 3 - - 3 - 3 - ns 4.5 3 - - 3 - 3 - ns 6 3 - - 3 - 3 - ns 2 50 - - 65 - 75 - ns 4.5 10 - - 13 - 15 - ns 6 9 - - 11 - 13 - ns Clock Pulse Width (Figure 1) Set-up Time Data to Clock (Figure 5) tSU Hold Time, Data to Clock (Figure 5) - tH Removal Time, MR to Clock (Continued) - tREM - HCT TYPES Maximum Clock Frequency (Figure 2) fMAX - 4.5 25 - - 20 - 16 - MHz tw - 4.5 12 - - 15 - 18 - ns MR Pulse Width (Figure 2) Clock Pulse Width (Figure 2) tw - 4.5 20 - - 25 - 30 - ns tSU - 4.5 12 - - 15 - 18 - ns tH - 4.5 3 - - 3 - 3 - ns tREM - 4.5 10 - - 13 - 15 - ns Set-up Time Data to Clock (Figure 6) Hold Time, Data to Clock (Figure 6) Removal Time, MR to Clock Switching Specifications PARAMETER Input tr, tf = 6ns SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) TYP MAX MAX MAX UNITS 2 - 150 190 225 ns 4.5 - 30 38 45 ns 6 - 26 30 38 ns CL = 15pF 5 12 - - - ns CL = 50pF 2 - 150 190 225 ns 4.5 - 30 38 45 ns 6 - 26 30 38 ns 2 - 75 95 110 ns 4.5 - 15 19 22 ns 6 - 13 16 19 ns - - 10 10 10 pF 5 60 - - - MHz HC TYPES Propagation Delay, Clock to Output (Figure 3) Propagation Delay, MR to Output (Figure 3) Output Transition Time (Figure 3) Input Capacitance Maximum Clock Frequency tPHL tTLH, tTHL CI fMAX CL = 50pF CL = 15pF 5 CD54/74HC273, CD54/74HCT273 Switching Specifications PARAMETER Input tr, tf = 6ns (Continued) 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) TYP MAX MAX MAX UNITS CPD - 5 25 - - - pF CL = 50pF 4.5 - 30 38 45 ns CL = 15pF 5 12 - - - ns Power Dissipation Capacitance (Notes 3, 4) HCT TYPES Propagation Delay, Clock to Output (Figure 4) tPLH, tPHL Propagation Delay, MR to Output (Figure 4) tPHL CL = 50pF 4.5 - 32 40 48 ns Output Transition Time tTLH, tTHL CL = 50pF 4.5 - 15 19 22 ns - - 10 10 10 pF 5 50 - - - MHz 5 25 - - - pF Input Capacitance CIN Maximum Clock Frequency fMAX Power Dissipation Capacitance (Notes 3, 4) CPD CL = 15pF - NOTES: 3. CPD is used to determine the dynamic power consumption, per flip-flop. 4. PD = CPD VCC2 fi + ∑ (CL VCC2 + fO) where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms tfCL trCL CLOCK tWL + tWH = 90% 10% I fCL CLOCK 50% 50% 1.3V 0.3V FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tf = 6ns tf = 6ns tr = 6ns VCC 90% 50% 10% GND tTLH GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL GND tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tr = 6ns 1.3V 1.3V tWL tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tPHL 2.7V 0.3V GND tWL INPUT tfCL = 6ns I fCL 3V VCC 50% 10% tWL + tWH = trCL = 6ns tTLH 90% 1.3V 10% INVERTING OUTPUT tPHL tPLH FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 6 CD54/74HC273, CD54/74HCT273 Test Circuits and Waveforms trCL tfCL trCL CLOCK INPUT (Continued) VCC 90% GND tH(H) GND tH(H) VCC DATA INPUT 50% tH(L) 3V 1.3V 1.3V 1.3V GND tSU(H) tSU(H) tSU(L) tTLH 90% OUTPUT tTHL 90% 50% 10% tTLH 90% 1.3V OUTPUT tREM 3V SET, RESET OR PRESET GND tTHL 1.3V 10% FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS tPHL 1.3V GND IC CL 50pF GND 90% tPLH 50% IC tSU(L) tPHL tPLH tREM VCC SET, RESET OR PRESET 1.3V 0.3V tH(L) DATA INPUT 3V 2.7V CLOCK INPUT 50% 10% tfCL CL 50pF FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 7 PACKAGE OPTION ADDENDUM www.ti.com 18-Mar-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-8772501RA ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC CD54HC273F ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC CD54HC273F3A ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC CD54HCT273F ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC CD54HCT273F3A ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC CD74HC273E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HC273M ACTIVE SOIC DW 20 25 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM CD74HC273M96 ACTIVE SOIC DW 20 2000 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM CD74HC273SM OBSOLETE SSOP DB 20 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD74HCT273E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HCT273M ACTIVE SOIC DW 20 25 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM CD74HCT273M96 ACTIVE SOIC DW 20 2000 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. 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