MICROCHIP TC72

M
TC72
Digital Temperature Sensor with SPI™ Interface
Features
General Description
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The TC72 is a digital temperature sensor capable of
reading temperatures from -55°C to +125°C. This sensor features a serial interface that allows communication with a host controller or other peripherals. The
TC72 interface is compatible with the SPI protocol. The
TC72 does not require any additional external components. However, it is recommended that a decoupling
capacitor of 0.01 µF to 0.1 µF be provided between the
VDD and GND pins.
Temperature-to-Digital Converter
SPI™ Compatible Interface
10-Bit Resolution (0.25°C/Bit)
±2°C (max.) Accuracy from -40°C to +85°C
±3°C (max.) Accuracy from -55°C to +125°C
2.65V to 5.5V Operating Range
Low Power Consumption:
- 250 µA (typ.) Continuous Temperature
Conversion Mode
- 1 µA (max.) Shutdown Mode
• Power Saving One-Shot Temperature
Measurement
• Industry Standard 8-Pin MSOP Package
• Space Saving 8-Pin DFN (3x3 mm) Package
Typical Applications
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Personal Computers and Servers
Hard Disk Drives and Other PC Peripherals
Entertainment Systems
Office Equipment
Datacom Equipment
Mobile Phones
General Purpose Temperature Monitoring
The TC72 can be used either in a Continuous Temperature Conversion mode or a One-Shot Conversion
mode. The Continuous Conversion mode measures
the temperature approximately every 150 ms and
stores the data in the temperature registers. In contrast, the One-Shot mode performs a single temperature measurement and returns to the power saving
shutdown mode.
The TC72 features high temperature accuracy, easeof-use and is the ideal solution for implementing thermal management in a variety of systems. The device is
available in both 8-pin MSOP and 8-pin DFN spacesaving packages. The TC72 also features a shutdown
mode for low power operation.
Block Diagram
VDD
Package Types
Internal
Diode
Temperature
Sensor
MSOP
8 VDD
CE 2
7 NC
SCK 3
TC72
NC 1
GND 4
6 SDI
5 SDO
10-Bit
Sigma Delta
A/D Converter
DFN
8 VDD
SCK 2
7 NC
TC72
NC 1
CE 3
GND 4
6 SDO
Temperature
Register
5 SDI
GND
 2002 Microchip Technology Inc.
TC72
Manufacturer
ID Register
Serial
Port
Interface
CE
SCK
SDO
SDI
Control
Register
DS21743A-page 1
TC72
Typical Application
VDD
0.1µF
VDD
TC72
PICmicro®
MCU
CE
AN0
SCK
SCK
SDO
SDI
SDI
SDO
GND
DS21743A-page 2
 2002 Microchip Technology Inc.
TC72
1.0
1.1
ELECTRICAL
CHARACTERISTICS
PIN FUNCTION TABLE
Name
Maximum Ratings†
VDD........................................................................ 6.0V
All inputs and outputs w.r.t. GND ...-0.3V to VDD +0.3V
Storage temperature .......................... -65°C to +150°C
Ambient temp. with power applied ..... -55°C to +125°C
Junction Temperature ........................................ 150°C
ESD protection on all pins:
Human Body Model (HBM)............................. > 4 kV
Man Machine Model (MM)............................. > 400V
Function
NC
No Internal Connection
CE
Chip Enable Input, the device is selected
when this input is high
SCK
Serial Clock Input
GND
Ground
SDO
Serial Data Output
SDI
Serial Data Input
NC
No Internal Connection
VDD
Power Supply
Latch-Up Current at each pin ........................ ±200 mA
Maximum Power Dissipation........................... 250 mW
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply at V DD = 2.65V to 5.5V, TA = -55°C to +125 °C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Power Supply
Operating Voltage Range
Operating Current:
Normal Mode, ADC Active
Shut-Down Supply Current
V DD
2.65
—
5.5
V
Note 1
IDD-CON
—
250
400
µA
Continuous temp. conversion mode
(Shutdown Bit = ‘0’)
ISHD
—
0.1
1.0
µA
Shutdown Mode (Shutdown Bit = ‘1’)
—
+2.0
°C
-40°C < TA < +85°C
-3.0
—
+3.0
—
10
—
Bits
tCONV
—
150
200
ms
Temperature Sensor and Analog-to-Digital Converter
Temperature Accuracy
(Note 1)
TACY
Resolution
ADC Conversion Time
-2.0
-55°C < TA < +125°C
Note 4
Digital Input / Output
High Level Input Voltage
VIH
0.7 VDD
—
—
V
Low Level Input Voltage
V IL
—
—
0.2 VDD
V
High Level Output Voltage
VOH
0.7 VDD
—
—
V
IOH = 1 mA
Low Level Output Voltage
VOL
—
—
0.2 VDD
V
IOL = 4 mA
Input Resistance
RIN
1.0
—
—
MΩ
Pin Capacitance
CIN
—
15
—
pF
COUT
—
50
—
Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the
TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V,
3.3V and 5.0V respectively. As VDD varies from the nominal operating value, the accuracy may be degraded. Refer to
Figure 2-5 and Figure 2-6.
2: Measured with a load of CL = 50 pF on the SDO output pin of the TC72.
3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times.
The rise and fall times are defined as the 10% to 90% transition time.
4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (210) = 256/1024 = 0.25°C/Bit
 2002 Microchip Technology Inc.
DS21743A-page 3
TC72
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, all parameters apply at V DD = 2.65V to 5.5V, TA = -55°C to +125 °C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Serial Port AC Timing (Note 2, 3)
Clock Frequency
fCLK
DC
—
7.5
MHz
SCK Low Time
tCL
65
—
—
ns
SCK High Time
tCH
65
—
—
ns
CE to SCK Setup
tCC
400
—
—
ns
SCK to Data Out Valid
tCDD
—
—
55
ns
CE to Output Tri-state
tCDZ
—
—
40
ns
SCK to Data Hold Time
tCDH
35
—
—
ns
tDC
35
—
—
ns
tCCH
100
—
—
ns
tR
—
—
200
ns
Data to SCK Set-up Time
SCK to CE Hold Time
SCK Rise Time
tF
—
—
200
ns
tCWH
400
—
—
ns
Thermal Resistance, MSOP-8
θJA
—
206
—
°C/W
Thermal Resistance, DFN-8
θJA
—
60.5
—
°C/W
SCK Fall Time
CE Inactive Time
Thermal Package Resistance
Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the
TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V,
3.3V and 5.0V respectively. As VDD varies from the nominal operating value, the accuracy may be degraded. Refer to
Figure 2-5 and Figure 2-6.
2: Measured with a load of CL = 50 pF on the SDO output pin of the TC72.
3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times.
The rise and fall times are defined as the 10% to 90% transition time.
4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (210) = 256/1024 = 0.25°C/Bit
DS21743A-page 4
 2002 Microchip Technology Inc.
TC72
SPI READ DATA TRANSFER
(CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 0)
tCWH
CE
tCCH
1/fCLK
tCC
SCK
SDI
tDC
tCDH
A7
MSb
tF
tR
tCH
A0
tCL
LSb
tCDD
SDO
HIGH Z
tCDZ
D7
MSb
D0
LSb
HIGH Z
SPI WRITE DATA TRANSFER
(CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 1)
tCWH
CE
1/fCLK
tCC
tCCH
SCK
tF
SDI
A7 = 1 MSb
Note:
FIGURE 1-1:
tR
tCH
A0 LSb
tDC
tCDH
D7
MSb
tCL
D0
LSb
The timing diagram is drawn with CP = 0. The TC72 also functions with CP = 1;
however, the edges of SCK are reversed as defined in Table 3-3 and Figure 3-2.
Serial Port Timing Diagrams.
 2002 Microchip Technology Inc.
DS21743A-page 5
TC72
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
3.5
3
2.5
2
1.5
1
0.5
0
-0.5
-1
-1.5
-2
-2.5
-3
-3.5
0.20
Upper Specification Limit
Mean
Mean + 3V
Mean - 3V
Lower Specification Limit
Shutdown Current (µA)
Temperature Error (°C)
Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C.
0.15
TC72-3.3MXX
TC72-5.0MXX
VDD = 3.3V
VDD = 5.0V
TC72-5.0MXX
VDD = 2.8V
0.10
0.05
0.00
-55
-25
5
35
65
95
-55
125
-25
5
Reference Temperature (°C)
FIGURE 2-1:
(TC72-X.XMXX).
FIGURE 2-4:
Temperature.
Temperature Change (°C)
Supply Current (µA)
Accuracy vs. Temperature
TC72-X.XMXX
250
TA = +25°C
240
230
220
TA = -55°C
210
TA = +125°C
200
2.5
3.0
3.5
4.5
5.0
0.3
TC72-2.8MXX
0.2
TA = +85°C
0.1
0.0
-0.1
-0.2
2.6
2.7
TC72-2.8MXX
VDD = 2.8V
50
0
-55
-25
5
35
65
95
Temperature (°C)
FIGURE 2-3:
Temperature.
DS21743A-page 6
2.9
3.0
Supply Current vs.
FIGURE 2-5:
Temperature Accuracy vs.
Supply Voltage (TC72-2.8MXX).
Temperature Change (°C)
Supply Current (uA)
TC72-3.3MXX
VDD = 3.3V
200
100
2.8
Supply Voltage (V)
250
150
TA = -25°C
TA = +25°C
-0.3
5.5
Supply Current vs. Supply
TC72-5.0MXX
VDD = 5.0V
300
125
-0.4
4.0
400
350
95
Shutdown Current vs.
Supply Voltage (V)
FIGURE 2-2:
Voltage.
65
Temperature (°C)
0.4
260
35
125
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
TC72-5.0MXX
TA = +85°C
T A = -25°C
TA = +25°C
4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5
Supply Voltage (V)
FIGURE 2-6:
Temperature Accuracy vs.
Supply Voltage (TC72-5.0MXX).
 2002 Microchip Technology Inc.
TC72
TC72-X.XMXX
Sample Size = 166
TA = +65°C
50
40
30
20
10
Temperature Error (°C)
Percentage of Occurances (%)
40
30
20
10
0
1.5
2
-2
-1.5
1.50
1.25
1.00
0.75
0.25
0.00
-0.25
0.50
1
1.5
2
Temperature Error (°C)
FIGURE 2-9:
Histogram of Temperature
Accuracy at +25 Degrees C.
25
20
15
10
5
3
0
2.5
1.50
1.25
1.00
0.75
0.50
0.25
0.00
-0.25
-0.50
-0.75
-1.00
0
30
-2
10
-1.25
0.5
TC72-X.XMXX
Sample Size = 166
TA = +125°C
35
-3
20
40
-2.5
30
 2002 Microchip Technology Inc.
0
FIGURE 2-11:
Histogram of Temperature
Accuracy at +85 Degrees C.
Percentage of Occurances (%)
40
TC72-X.XMXX
Sample Size = 166
TA = +25°C
-1.50
Percentage of Occurances (%)
50
-0.5
Temperature Error (°C)
FIGURE 2-8:
Histogram of Temperature
Accuracy at -40 Degrees C.
60
-1
2
1
1.5
0.5
1
0
0.5
-0.5
Temperature Error (°C)
0
-1
-0.5
-1.5
TC72-X.XMXX
Sample Size = 166
TA = +85°C
-1
-2
50
45
40
35
30
25
20
15
10
5
0
-1.5
Percentage of Occurances (%)
FIGURE 2-10:
Histogram of Temperature
Accuracy at +65 Degrees C.
TC72-X.XMXX
Sample Size = 166
TA = -40°C
50
-0.50
Temperature Error (°C)
FIGURE 2-7:
Histogram of Temperature
Accuracy at -55 Degrees C.
60
-0.75
-1.00
-1.25
0
-1.50
Percentage of Occurances (%)
60
3
2
2.5
1
0
0.5
-0.5
-1
-2
-1.5
-3
1.5
TC72-X.XMXX
Sample Size = 166
TA = -55°C
50
45
40
35
30
25
20
15
10
5
0
-2.5
Percentage of Occurances (%)
Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C.
Temperature Error (°C)
FIGURE 2-12:
Histogram of Temperature
Accuracy at +125 Degrees C.
DS21743A-page 7
TC72
3.0
FUNCTIONAL DESCRIPTION
The Continuous Conversion mode measures the temperature approximately every 150 ms and stores the
data in the temperature registers. The TC72 has an
internal clock generator that controls the automatic
temperature conversion sequence. The automatic temperature sampling operation is repeated indefinitely
until the TC72 is placed in a shutdown mode by a write
operation to the Control register. The TC72 will remain
in the shutdown mode until the shutdown bit in the
Control register is reset.
The TC72 consists of a band-gap type temperature
sensor, a 10-bit Sigma Delta Analog-to-Digital Converter (ADC), an internal conversion oscillator and a
double buffer digital output port. The 10-bit ADC is
scaled from -128°C to +127°C; therefore, the resolution
is 0.25°C per bit. The ambient temperature operating
range of the TC72 is specified from -55°C to +125°C.
This device features a four-wire serial interface that is
fully compatible with the SPI specification and, therefore, allows simple communications with common
microcontrollers and processors. The TC72 can be
used either in a Continuous Temperature Conversion
mode or a One-Shot Conversion mode. The TC72 temperature measurements are performed in the background and, therefore, reading the temperature via the
serial I/O lines does not affect the measurement in
progress.
MSB
LSB
0111 1101 / 0000 0000
In contrast, the One-Shot mode performs a single temperature measurement and returns to the power-saving shut down mode. This mode is especially useful for
low power applications.
Output
Code
+25°C
+0.25°C
MSB
LSB
0001 1001 / 0000 0000
MSB
LSB
0000 0000 / 0100 0000
MSB
LSB
0°C
0000 0000 / 0000 0000
Temp
-55°C
MSB
LSB
1111 1111 / 1100 0000
Temp
+125°C
MSB
LSB
1110 0111 / 0000 0000
-0.125°C
-25°C
MSB
LSB
1100 1001 / 0000 0000
Note:
FIGURE 3-1:
DS21743A-page 8
The ADC converter is scaled from -128°C to -127°C, but the operating range of the
TC72 is specified from -55°C to +125°C.
Temperature-To-Digital Transfer Function (Non-linear Scale).
 2002 Microchip Technology Inc.
TC72
3.1
Temperature Data Format
3.3
Serial Bus Interface
Temperature data is represented by a 10-bit two’s complement word with a resolution of 0.25°C per bit. The
temperature data is stored in the Temperature registers
in a two’s complement format. The ADC converter is
scaled from -128°C to +127°C, but the operating range
of the TC72 is specified from -55°C to +125°C.
The serial interface consists of the Chip Enable (CE),
Serial Clock (SCK), Serial Data Input (SDI) and Serial
Data Output (SDO) signals. The TC72 operates as a
slave and is compatible with the SPI bus specifications.
The serial interface is designed to be compatible with
the Microchip PICmicro® family of microcontrollers.
Example:
The CE input is used to select the TC72 when multiple
devices are connected to the serial clock and data
lines. The CE is active-high, and data is written to or
read from the device, when CE is equal to a logic high
voltage. The SCK input is disabled when CE is low. The
rising edge of the CE line initiates a read or write operation, while the falling edge of CE completes a read or
write operation.
Temperature
= 41.5°C
MSB Temperature Register=
=
=
00101001b
25 + 23 + 20
32 + 8 + 1 = 41
LSB Temperature Register = 10000000b = 2-1 = 0.5
TABLE 3-1:
TC72 TEMPERATURE
OUTPUT DATA
Temperature
Binary
MSB / LSB
Hex
+125°C
0111 1101/0000 0000
7D00
+25°C
0001 1001/0000 0000
1900
+0.5°C
0000 0000/1000 0000
0080
+0.25°C
0000 0000/0100 0000
0040
0°C
0000 0000/0000 0000
0000
-0.25°C
1111 1111/1100 0000
FFC0
-25°C
1110 0111/0000 0000
E700
-55°C
1100 1001/0000 0000
C900
TABLE 3-2:
TEMPERATURE REGISTER
D7
D6
D5
D4
D3
D2
D1
D0
Address/
Register
Sign
26
25
24
23
23
21
20
02H
Temp. MSB
2-1
2-2
0
0
0
0
0
0
01H
Temp. LSB
3.2
Power-Up And Power-Down
The TC72 is in the low power consumption shutdown
mode at power-up. The Continuous Temperature Conversion mode is selected by performing a Write operation to the Control register, as described in Section 4.0,
“Internal Register Structure”.
The SCK input is provided by the external microcontroller and is used to synchronize the data on the SDI and
SDO lines. The SDI input writes data into the TC72’s
Control register, while the SDO outputs the temperature data from the Temperature register and the status
of Shutdown bit of the Control register.
The TC72 has the capability to function with either an
active-high or low SCK input. The SCK inactive state is
detected when the CE signal goes high, while the
polarity of the clock input (CP) determines whether the
data is clocked and shifted on either the rising or falling
edge of the system clock, as shown in Figure 3-2.
Table 3-3 gives the appropriate clock edge used to
transfer data into and out of the registers. Each data bit
is transferred at each clock pulse, and the data bits are
clocked in groups of eight bits, as shown in Figure 3-3.
The address byte is transferred first, followed by the
data. A7, the MSb of the address, determines whether
a read or write operation will occur. If A7 = ‘0’, one or
more read cycles will occur; otherwise, if A7 = ‘1’, one
or more write cycles will occur.
Data can be transferred either in a single byte or a
multi-byte packet, as shown in Figure 3-3. In the 3-byte
packet, the data sequence consists of the MSb temperature data, LSb temperature data, followed by the Control register data. The multi-byte read feature is initiated
by writing the highest address of the desired packet to
registers. The TC72 will automatically send the register
addressed and all of the lower address registers, as
long as the Chip Enable pin is held active.
A supply voltage lower than 1.6V (typical) is considered
a power-down state for the TC72. If the supply voltage
drops below the 1.6V threshold, the internal registers
are reset to the power-up default state.
 2002 Microchip Technology Inc.
DS21743A-page 9
TC72
TABLE 3-3:
OPERATIONAL MODES
Mode
CE
SCK (Note 1)
SDI
SDO
Disable
L
Input Disabled
Input Disabled
High Z
Data Bit Latch
High Z
X
Next data bit shift,
Note 2
Write (A7 = 1)
H
CP=1, Data Shifted on Falling Edge,
Data Clocked on Rising Edge
CP=0, Data Shifted on Rising Edge,
Data Clocked on Falling Edge
Read (A7 = 0)
H
CP=1, Data Shifted on Falling Edge,
Data Clocked on Rising Edge
CP=0, Data Shifted on Rising Edge,
Data Clocked on Falling Edge
Note 1: CP is the Clock Polarity of the microcontroller system clock. If the inactive state of SCK is logic level high,
CP is equal to ‘1’; otherwise, if the inactive state of SCK is low, CP is equal to ‘0’.
2: During a Read operation, SDO remains at a high impedance (High Z) level until the eight bits of data begin
to be shifted out of the Temperature register.
3.4
Read Operation
The temperature and control register data is outputted
from the TC72 using the CE, SCK and SDO lines.
Figure 3-3 shows a timing diagram of the read operation. Communication is initiated by the chip enable (CE)
going high. The SDO line remains at the voltage level
of the LSb bit that is outputted and goes to the tri-state
level when the CE line goes to a logic low level.
3.5
CP = 0
CE
SCK
Write Operation
Data is clocked into the Control register in order to
enable the TC72’s power saving shutdown mode. The
write operation is shown in Figure 3-3 and is
accomplished using the CE, SCK and SDI line.
SHIFT
EDGE
CLOCK
EDGE
CP = 1
CE
SCK
SHIFT
EDGE
FIGURE 3-2:
Operation.
DS21743A-page 10
CLOCK
EDGE
Serial Clock Polarity (CP)
 2002 Microchip Technology Inc.
TC72
Single Byte Write Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1)
CE
SCK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A7=1
A
7
SDI
A
6
A
5
A
4
A
3
A
2
A
1
A
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
MSb
SDO
D
0
LSb
High Z
Single Byte Read Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0)
CE
SCK
2
1
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A7=0
A
7
SDI
A
6
A
5
A
4
A
3
SDO
A
2
A
1
A
0
High Z
D
7
D
0
MSb
LSb
High Z
SPI Multiple Byte Transfer
CE
SCK
Write Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1)
SDI
Address Byte = 80hex
A7
A0
Control Byte
D7
D0
High Z
SDO
Read Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0)
SDI
Address Byte = 02hex
A0
A7
SDO
MSB Temp. Byte
High Z
FIGURE 3-3:
D7
Control Byte
LSB Temp. Byte
D0
D7
D0
D7
D0
High Z
Serial Interface Timing Diagrams (CP=0).
 2002 Microchip Technology Inc.
DS21743A-page 11
TC72
4.0
INTERNAL REGISTER
STRUCTURE
The TC72 registers are listed below.
TABLE 4-1:
REGISTERS FOR TC72
Read
Address
Write
Address
Bit
7
Bit
6
Bit
5
Bit
4
Control
00hex
80hex
0
0
0
One-Shot
(OS)
LSB Temperature
01hex
N/A
T1
T0
0
MSB Temperature
02hex
N/A
T9
T8
T7
Manufacturer ID
03hex
N/A
0
1
0
1
Register
4.1
Control Register
The Control register is both a read and a write register
that is used to select either the Shutdown, Continuous
or One-Shot Conversion operating mode. The Temperature Conversion mode selection logic is shown in
Table 4-2. The Shutdown (SHDN) bit is stored in bit 0
of the Control register. If SHDN is equal to ‘1’, the TC72
will go into the power-saving shutdown mode. If SHDN
is equal to ‘0’, the TC72 will perform a temperature
conversion approximately every 150 ms.
At power-up, the SHDN bit is set to ‘1’. Thus, the TC72
is in the shutdown operating mode at startup. The Continuous Temperature Conversion mode is selected by
writing a ‘0’ to the SHDN bit of the Control register.
The Shutdown mode can be used to minimize the
power consumption of the TC72 when active temperature monitoring is not required. The shutdown mode
disables the temperature conversion circuitry; however, the serial I/O communication port remains active.
A temperature conversion will be initialized by a Write
operation to the Control register to select either the
Continuous Temperature Conversion or the One-Shot
operating mode. The temperature data will be available
in the MSB and LSB Temperature registers approximately 150 ms after the Control register Write
operation.
Bit Bit Bit
3 2 1
Bit
0
Value on
POR/BOR
Shutdown
(SHDN)
05hex
0
1
0
0
0
0
0
0
00hex
T6
T5 T4 T3
T2
00hex
0
0
54hex
1
0
The One-Shot mode is selected by writing a ‘1’ into bit
4 of the Control register. The One-Shot mode performs
a single temperature measurement and returns to the
power-saving shutdown mode. After completion of the
temperature conversion, the One-Shot bit (OS) is reset
to ‘0’ (i.e. “OFF”). The user must set the One-Shot bit
to ‘1’ to initiate another temperature conversion.
Bits 1, 3, 5, 6 and 7 of the Control register are not used
by the TC72. Bit 2 is set to a logic ‘1’. Any write operation to these bit locations will have no affect on the
operation of the TC72.
4.2
Temperature Register
The Temperature register is a read-only register and
contains a 10-bit two’s complement representation of
the temperature measurement. Bit 0 through Bit 5 of
the LSB Temperature register are always set to a logic
‘0’.
At Power-On Reset (POR) or a Brown-Out Reset
(BOR) low voltage occurrence, the temperature register is reset to all zeroes, which corresponds to a temperature value of 0°C. A V DD power supply less than
1.6V is considered a reset event and will reset the
Temperature register to the power-up state.
4.3
Manufacturer ID Register
The Manufacturer Identification (ID) register is a readonly register used to identify the temperature sensor as
a Microchip component.
TABLE 4-2:
CONTROL REGISTER TEMPERATURE CONVERSION MODE SELECTION
Operational Mode
One-Shot (OS) Bit 4
Shutdown (SHDN) Bit 0
Continuous Temperature Conversion
0
0
Shutdown
0
1
Continuous Temperature Conversion
(One-Shot Command is ignored if SHDN = ‘0’)
1
0
One-Shot
1
1
DS21743A-page 12
 2002 Microchip Technology Inc.
TC72
5.0
APPLICATIONS INFORMATION
The TC72 does not require any additional components
in order to measure temperature; however, it is recommended that a decoupling capacitor of 0.1mF to 1mF
be provided between the VDD and GND pins. Although
the current consumption of the TC72 is modest
(250 mA, typical), the TC72 contains an on chip data
acquisition with internal digital switching circuitry. Thus,
it is considered good design practice to use an external
decoupling capacitor with the sensor. A high frequency
ceramic capacitor should be used and be located as
close as possible to the IC power pins in order to
provide effective noise protection to the TC72.
The TC72 measures temperature by monitoring the
voltage of a diode located on the IC die. The IC pins of
the TC72 provide a low impedance thermal path
between the die and the PCB, allowing the TC72 to
effectively monitor the temperature of the PCB board.
The thermal path between the ambient air is not as efficient because the plastic IC housing package functions
as a thermal insulator. Thus the ambient air temperature (assuming that a large temperature gradient exists
between the air and PCB) has only a small effect on the
temperature measured by the TC72.
Note that the exposed metal center pad on the bottom
of the DFN package is connected to the silicon substrate. The center pad should be connected to either
the PCB ground plane or treated as a “No Connect” pin.
The mechanical dimensions of the center pad are given
in Section 6.0, “Packaging Information”, of this
datasheet.
A potential for self-heating errors can exist if the TC72
SPI communication lines are heavily loaded. Typically,
the self-heating error is negligible because of the relatively small current consumption of the TC72. A temperature accuracy error of approximately 0.5°C will
result from self-heating if the SPI communication pins
sink/source the maximum current specified for the
TC72. Thus to maximize the temperature accuracy, the
output loading of the SPI signals should be minimized.
 2002 Microchip Technology Inc.
DS21743A-page 13
TC72
6.0
PACKAGING INFORMATION
6.1
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
User Direction of Feed
PIN 1
W
PIN 1
Standard Reel Component Orientation
for TR Suffix Device
P
Reverse Reel Component Orientation
for RT Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin MSOP
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
Tape and Reel information for the 8-Lead DFN package will be available TBD.
DS21743A-page 14
 2002 Microchip Technology Inc.
TC72
6.2
Package Marking Information
Example:
8-Lead MSOP
TC722M
221067
XXXXXX
YWWNNN
Example:
8-Lead DFN
XXXXXXXX
MYWW
NNN
Legend:
Note:
*
XX...X
YY
WW
NNN
7228
8221
067
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
 2002 Microchip Technology Inc.
DS21743A-page 15
TC72
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
p
E1
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Number of Pins
Pitch
Dimension Limits
n
p
Overall Height
NOM
MAX
8
0.65
.026
A
.044
.030
Standoff
A1
.002
E
.184
Molded Package Width
MIN
8
A2
Overall Width
MAX
NOM
Molded Package Thickness
§
MILLIMETERS*
INCHES
MIN
1.18
.038
0.76
.006
0.05
.193
.200
.034
0.86
0.97
4.67
4.90
.5.08
0.15
E1
.114
.118
.122
2.90
3.00
3.10
Overall Length
D
.114
.118
.122
2.90
3.00
3.10
Foot Length
L
.016
.022
.028
0.40
0.55
0.70
Footprint (Reference)
.035
.037
.039
0.90
0.95
1.00
Foot Angle
F
φ
6
0
Lead Thickness
c
.004
.006
.008
0.10
0.15
0.20
Lead Width
B
α
.010
.012
.016
0.25
0.30
0.40
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
6
7
7
7
7
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Drawing No. C04-111
DS21743A-page 16
 2002 Microchip Technology Inc.
TC72
8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)
E
p
b
n
L
D
D2
EXPOSED
METAL
PAD
2
1
E2
TOP VIEW
PIN 1
ID INDEX
AREA
(NOTE 2)
BOTTOM VIEW
A1
A3
A
EXPOSED
TIE BAR
(NOTE 1)
Number of Pins
Pitch
Overall Height
Standoff
Lead Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Lead Width
Lead Length
Units
Dimension Limits
n
p
(Note 4)
(Note 4)
A
A1
A3
E
E2
D
D2
b
L
MIN
.031
.000
INCHES
NOM
8
.026 BSC
.035
.001
.008 REF.
.118 BSC
MAX
.039
.002
.096
.055
.118 BSC
.047
.007
.012
.010
.019
.069
.015
.022
MILLIMETERS*
NOM
8
0.65 BSC
0.80
0.90
0.02
0.00
0.20 REF.
3.00 BSC
1.39
3.00 BSC
1.20
0.23
0.26
0.30
0.48
MIN
MAX
1.00
0.05
2.45
1.75
0.37
0.55
*Controlling Parameter
Notes:
1. Package may have one or more exposed tie bars at ends.
2. Pin 1 visual index feature may vary, but must be located within the hatched area.
3. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
4. Exposed pad dimensions vary with paddle size.
5. JEDEC equivalent: Pending
Drawing No. C04-062
 2002 Microchip Technology Inc.
DS21743A-page 17
TC72
8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)
p
X
P1
Y
Z
G
G2
CP
THERMAL VIAS
ON 4 LAYER
PC BOARD
0V
H
OPTIONAL FOUR LAYER
PCB LAND PATTERN
DFN LAND PATTERN
H2
OPTIONAL TWO LAYER
PCB LAND PATTERN
M (TYP)
Terminal Pitch
MILLIMETERS*
INCHES
Units
Dimension Limits
p
TYPCAL SOLDER MASKS
MIN
NOM
MAX
MIN
NOM
MAX
0.65 BSC
.026 BSC
Terminal Land Pattern O.D.
Z
.134
.157
3.40
4.00
Terminal Land Pattern I.D.
A1
.057
.060
1.45
1.53
Exposed Pad Clearance
CP
.006
Interior Lead Clearance
Z
.071
Terminal Land Width
X
.014
.017
0.35
0.42
Terminal Land Length
Y
.033
.035
0.85
0.88
Exposed Pad Length
H
.130
H2
.130
G2
.057
Optional Exposed Pad Length
Exposed Pad Width
(Note 1)
Termal Via Pitch
V
Minimum Solder Mask Clearance
M
1.80
3.30
3.30
.059
1.45
0.30
.012
.002
1.50
1.20
.047
P1
Thermal Via Diameter
0.15
0.05
*Controlling Parameter
Notes:
1. Exposed pad dimensions vary with paddle size.
Drawing No. C04-2062
DS21743A-page 18
 2002 Microchip Technology Inc.
TC72
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip
World Wide Web site.
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape® or Microsoft®
Internet Explorer. Files are also available for FTP
download from our FTP site.
Connecting to the Microchip Internet Web Site
The Microchip web site is available at the following
URL:
www.microchip.com
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits.The Hot Line
Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
092002
The file transfer site is available by using an FTP service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
 2002 Microchip Technology Inc.
DS21734A-page19
TC72
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
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RE:
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Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Device: TC72
Y
N
Literature Number: DS21734A
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21734A-page20
 2002 Microchip Technology Inc.
TC72
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
-X.X
X
XX
Device
Voltage
Range
Temperature
Range
Package
Examples:
a)
TC72-2.8MUA: Digital Temperature Sensor,
b)
TC72-2.8MUATR: Digital Temperature Sen-
2.8V, 8LD MSOP package.
sor, 2.8V, 8LD MSOP (tape and reel) package.
Device:
TC72:
Digital Temperature Sensor w/SPI Interface
Voltage Range:
2.8
3.3
5.0
= Accuracy Optimized for 2.8V
= Accuracy Optimized for 3.3V
= Accuracy Optimized for 5.0V
c)
TC72-2.8MMF: Digital Temperature Sensor,
2.8V, 8LD DFN package.
d)
TC72-3.3MUA: Digital Temperature Sensor,
e)
TC72-3.3MMF: Digital Temperature Sensor,
3.3V, 8LD MSOP package.
3.3V, 8LD DFN package.
Temperature Range:
M
= -55°C to +125°C
Package:
MF
= Dual, Flat, No Lead (DFN) (3x3mm), 8-lead
MFTR = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead
(Tape and Reel)
UA
= Plastic Micro Small Outline (MSOP), 8-lead
UATR = Plastic Micro Small Outline (MSOP), 8-lead
(Tape and Reel)
f)
TC72-5.0MUA: Digital Temperature Sensor,
5.0V, 8LD MSOP package.
g)
TC72-5.0MMF: Digital Temperature Sensor,
h)
TC72-5.0MMFTR: Digital Temperature Sen-
5.0V, 8LD DFN package.
sor, 5.0V, 8LD DFN (tape and reel) package.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
DS21743A-page21
TC72
NOTES:
DS21743A-page 22
 2002 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, K EELOQ,
MPLAB, PIC, PICmicro, PICSTART and PRO MATE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro ® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2002 Microchip Technology Inc.
DS21743A - page 23
M
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
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Tel: 44 118 921 5869 Fax: 44-118 921-5820
08/01/02
DS21743A-page 24
 2002 Microchip Technology Inc.