TC2054/2055/2186 50 mA, 100 mA, and 150 mA CMOS LDOs with Shutdown and Error Output Features General Description • Low Supply Current (55 µA Typical) for Longer Battery Life • Low Dropout Voltage: 140 mV (Typical) @ 150 mA • High Output Voltage Accuracy: ±0.4% (Typical) • Standard or Custom Output Voltages • Power-Saving Shutdown Mode • ERROR Output Can Be Used as a Low Battery Detector or Processor Reset Generator • Fast Shutdown Reponse Time: 60 µs (Typical) • Overcurrent and Overtemperature Protection • Space-Saving 5-Pin SOT-23A Package • Pin Compatible Upgrades for Bipolar Regulators • Standard Output Voltage Options: - 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V, 5.0V The TC2054, TC2055 and TC2186 are high accuracy (typically ±0.4%) CMOS upgrades for older (bipolar) low dropout regulators. Designed specifically for battery-operated systems, the devices’ total supply current is typically 55 µA at full load (20 to 60 times lower than in bipolar regulators). Applications • • • • • • Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular / GSMS / PHS Phones Pagers VIN 5-Pin SOT-23A Top View VOUT 5 3 VOUT ERROR 5 4 VOUT TC2054 TC2055 TC2186 1 µF 1 µF 2 The TC2054, TC2055 and TC2186 are stable with a low esr ceramic output capacitor of 1 µF and have a maximum output current of 50 mA, 100 mA and 150 mA, respectively. This LDO Family also features a fast response time (60 µs typically) when released from shutdown. Package Type Typical Application 1 V IN The devices’ key features include low noise operation, low dropout voltage – typically 45 mV (TC2054); 90 mV (TC2055); and 140 mV (TC2186) at full load - and fast response to step changes in load. An error output (ERROR) is asserted when the devices are out-of-regulation (due to a low input voltage or excessive output current). Supply current is reduced to 0.5 µA (maximum) and both VOUT and ERROR are disabled when the shutdown input is low. The devices also incorporate overcurrent and overtemperature protection. 1 GND TC2054 TC2055 TC2186 SHDN ERROR 2 3 1M VIN 4 GND SHDN ERROR Shutdown Control (from Power Control Logic) © 2009 Microchip Technology Inc. DS21663D-page 1 TC2054/2055/2186 NOTES: DS21663D-page 2 © 2009 Microchip Technology Inc. TC2054/2055/2186 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage ......................................................... 6.5V Output Voltage ............................... (-0.3) to (VIN + 0.3) † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods my affect device reliability. Operating Temperature .................. -40°C < TJ< 125°C Storage Temperature ......................... -65°C to +150°C Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V ELECTRICAL SPECIFICATIONS Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. BOLDFACE type specifications apply for junction temperature of -40°C to +125°C. Parameter Sym Min Typ Max Units VIN 2.7 — 6.0 V Note 1 mA TC2054 Input Operating Voltage Maximum Output Current Output Voltage IOUTMAX VOUT VOUT Temperature Coefficient TCVOUT Line Regulation Load Regulation Conditions 50 — — 100 — — TC2055 150 — — TC2186 VR - 2.0% VR ± 0.4% VR + 2.0% V Note 2 — 20 — ppm/°C Note 3 — 40 — ΔVOUT/ ΔVIN — 0.05 0.5 % (VR + 1V) < VIN < 6V ΔVOUT/ VOUT -1.0 0.33 +1.0 % TC2054;TC2055 IL = 0.1 mA to IOUTMAX -2.0 0.43 +2.0 TC2186 IL = 0.1 mA to IOUTMAX Note 6 Dropout Voltage, Note 7 VIN – VOUT — 2 — — 45 70 mV IL = 100 µA IL = 50 mA — 90 140 TC2015; TC2185 IL = 100 mA — 140 210 TC2185 IL = 150 mA Note 7 Supply Current IIN — 55 80 µA SHDN = VIH, IL=0 IINSD — 0.05 0.5 µA SHDN = 0V Power Supply Rejection Ratio PSRR — 50 — dB FRE ≤ 100 kHz Output Short Circuit Current IOUTSC 160 300 — mA VOUT = 0V Shutdown Supply Current Note 1: 2: 3: 4: 5: 6: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V. TCVOUT = 6 (V –V ) × 10 OUTMAX OUTMIN ----------------------------------------------------------------------------------------V × ΔT OUT Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 7: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 8: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms. 9: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). 10: Hysteresis voltage is referenced by VR. 11: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. © 2009 Microchip Technology Inc. DS21663D-page 3 TC2054/2055/2186 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. BOLDFACE type specifications apply for junction temperature of -40°C to +125°C. Parameter Sym Min Typ Max Units ΔVOUT/ΔPD — 0.04 — V/W Thermal Shutdown Die Temperature TSD — 160 — °C Output Noise eN — 600 — nV / √Hz IL = IOUTMAX, F = 10 kHz Response Time (from Shutdown Mode) tR — 60 — µs VIN = 4V CIN = 1 µF, COUT = 10 µF IL = 0.1 mA, Note 11 SHDN Input High Threshold VIH 60 — — %VIN VIN = 2.5V to 6.0V SHDN Input Low Threshold VIL — — 15 %VIN VIN = 2.5V to 6.0V VINMIN 1.0 — — V Output Logic Low Voltage VOL — — 400 mV ERROR Threshold Voltage VTH — 0.95 x VR — V ERROR Positive Hysteresis VHYS — 50 — mV Note 10 VOUT to ERROR Delay tDELAY — 2 — ms VOUT from VR = 3V to 2.8V RERROR — 126 — Ω VDD = 2.5V, VOUT = 2.5V Thermal Regulation Conditions Note 8 SHDN Input ERROR OUTPUT Minimum VIN Operating Voltage Resistance from ERROR to GND Note 1: 2: 3: 4: 5: 6: IOL = 0.1 mA 1 mA Flows to ERROR, IOL = 1 mA, VIN = 2V See Figure 4-2 The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V. TCVOUT = 6 (V –V ) × 10 OUTMAX OUTMIN ----------------------------------------------------------------------------------------V OUT × ΔT Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 7: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 8: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms. 9: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). 10: Hysteresis voltage is referenced by VR. 11: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VDD = +2.7V to +6.0V and VSS = GND. Parameters Sym Min Typ Max Units Extended Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C θJA — 255 — °C/W Conditions Temperature Ranges: Thermal Package Resistances: Thermal Resistance, 5L-SOT-23 DS21663D-page 4 © 2009 Microchip Technology Inc. TC2054/2055/2186 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C. 0 VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V -20 PSRR (dB) PSRR (dB) -20 0 IOUT = 100 µA COUT = 1 µF Ceramic -40 -60 VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V -40 -60 -80 -80 IOUT = 150 mA COUT = 10 µF Ceramic -100 -100 10 10 100 100 1000 1,000 10k 10,000 100k 100,000 10 10 1M 1,000,000 100 100 1000 1,000 FIGURE 2-4: Ratio. VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V -20 PSRR (dB) -20 PSRR (dB) Power Supply Rejection 0 0 -40 -60 -80 100k 100,000 1M 1,000,000 f (Hz) f (Hz) FIGURE 2-1: Ratio. 10k 10,000 Power Supply Rejection VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V -40 -60 -80 IOUT = 150 mA COUT = 1 µF Ceramic IOUT = 150 mA COUT = 10 µF Tantalum -100 -100 10 10 100 100 1,000 1000 10,000 10k 100,000 100k 10 10 1,000,000 1M 100 100 1000 1,000 f (Hz) FIGURE 2-2: Ratio. 10k 10,000 100k 100,000 1M 1,000,000 f (Hz) Power Supply Rejection FIGURE 2-5: Ratio. Power Supply Rejection 0.160 VOUT = 1.8V 0.140 0.120 1 0.100 COUT = 1 µF DOV (V) Noise (µV/√Hz) 10 0.1 T = 25°C T = 130°C 0.080 T = -45°C 0.060 0.01 0.001 0.01 FIGURE 2-3: 0.040 0.020 0.1 1 10 Frequency (kHz) 100 1000 Output Noise vs. Frequency. © 2009 Microchip Technology Inc. 0.000 0 100 50 150 ILOAD (mA) FIGURE 2-6: Dropout Voltage vs. ILOAD. DS21663D-page 5 TC2054/2055/2186 Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C. 65.00 1.9 VOUT = 1.8V 1.88 63.00 1.86 1.84 59.00 VOUT (V) IDD (μA) 61.00 VIN = 2.8V 1.82 VIN = 2.8V 1.8 1.78 57.00 1.76 1.74 55.00 1.72 1.7 53.00 -45 5 55 105 0 155 15 30 45 60 FIGURE 2-7: IDD vs. Temperature. FIGURE 2-10: Current. 2.9 120 135 150 Output Voltage vs. Output Temp = +130˚C 2.8 VIN = 6.0V VIN = 3.8V 2.75 VOUT (V) 2.75 VOUT (V) 105 VOUT = 2.8V IOUT = 0.1mA 2.85 VIN = 6.5V 2.8 2.7 2.65 Temp = +25˚C Temp = -45˚C 2.7 2.65 2.6 2.6 2.55 2.55 2.5 2.5 -50 -35 -20 -5 10 25 40 55 70 85 100 115 130 3.5 145 4 4.5 5 FIGURE 2-8: Temperature. Output Voltage vs. FIGURE 2-11: Voltage. 1.9 6 6.5 7 Output Voltage vs. Supply 1.9 VOUT = 1.8V IOUT = 0.1mA 1.88 5.5 VIN (V) Temperature (˚C) VOUT = 1.8V IOUT = 0.1mA 1.88 1.86 1.86 1.84 VIN = 6.0V 1.84 VIN = 6.5V 1.82 VOUT (V) VOUT (V) 90 2.9 VOUT = 2.8V IOUT = 0.1mA 2.85 75 ILOAD (mA) Temperature (°C) 1.8 1.78 VIN = 2.8V Temp = +130˚C 1.82 1.8 1.78 Temp = +25˚C Temp = -45˚C 1.76 1.76 1.74 1.74 1.72 1.72 1.7 1.7 -50 -35 -20 -5 10 25 40 55 70 85 100 115 130 145 2.7 3.2 FIGURE 2-9: Temperature. DS21663D-page 6 Output Voltage vs. 3.7 4.2 4.7 5.2 5.7 6.2 6.7 VIN (V) Temperature (˚C) FIGURE 2-12: Voltage. Dropout Voltage vs. Supply © 2009 Microchip Technology Inc. TC2054/2055/2186 Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C. V IN = 3.8V VOUT = 2.8V C IN = 1 μF Ceramic V IN = 3.0V VOUT = 2.8V C IN = 1μF Ceramic C OUT= 1 μF Ceramic Frequency = 1 KHz C OUT= 10μF Ceramic Frequency = 10KHz V OUT 100mV/DIV V OUT 100mV / DIV Load Current Load Current 150mA Load 100μA FIGURE 2-13: Load Transient Response. 150mA Load 100μA FIGURE 2-16: Load Transient Response. Load Transient Response in Dropout Mode V IN = 4.0V VOUT = 3.0V C OUT = 10μF C BYP = 0.01μF I OUT = 100μA VOUT 100mV/DIV V SHDN 150mA VIN = 3.105V VOUT = 3.006V CIN = 1μF Ceramic COUT = 1μF Ceramic RLOAD = 20Ω FIGURE 2-14: Dropout Mode. 100μA V OUT Load Transient Response in FIGURE 2-17: VOUT = 2.8V C OUT= 1μF Ceramic C BYP = 470pF I OUT= 100μA Shutdown Delay. V SHDN 50mV / DIV V OUT 2V / DIV Input Voltage V OUT 6V 4V V IN = 4.0V VOUT = 3.0V C OUT = 10μF C BYP = 0.01μF I OUT = 100μA FIGURE 2-15: Line Transient Response. © 2009 Microchip Technology Inc. FIGURE 2-18: Shutdown Wake-up Time. DS21663D-page 7 TC2054/2055/2186 Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C. RPULLUP = 100kΩ IOUT = 0.3mA VIN 1V/Div 3.42V 2.8V VOUT 1V/Div 3.0V 2.8V VERROR 2V/Div 0V FIGURE 2-19: DS21663D-page 8 VOUT to ERROR Delay. © 2009 Microchip Technology Inc. TC2054/2055/2186 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Symbol 1 VIN 2 GND 3 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero, ERROR is open circuited and supply current is reduced to 0.5 µA (maximum). 4 ERROR Out-of-Regulation Flag. (Open-drain output). This output goes low when VOUT is out-of-tolerance by approximately -5%. 5 VOUT 3.1 Description Unregulated supply input. Ground terminal. Regulated voltage output. Unregulated Supply Input (VIN) 3.4 Out-of-Regulation Flag (ERROR) Connect the unregulated input supply to the VIN pin. If there is a large distance between the input supply and the LDO regulator, some input capacitance is necessary for proper operation. A 1 µF capacitor, connected from VIN to ground, is recommended for most applications. The open-drain ERROR flag provides indication that the regulator output voltage is not in regulation. The ERROR pin will be low when the output is typically below 5% of its specified value. 3.2 Connect the output load to VOUT of the LDO. Also connect one side of the LDO output decoupling capacitor as close as possible to the VOUT pin. Ground Terminal (GND) Connect the unregulated input supply ground return to GND. Also connect one side of the 1 µF typical input decoupling capacitor close to this pin and one side of the output capacitor COUT to this pin. 3.3 3.5 Regulated Voltage Output (VOUT) Shutdown Control Input (SHDN) The regulator is fully enabled when a logic-high is applied to SHDN. The regulator enters shutdown when a logic-low is applied to this input. During shutdown, the output voltage falls to zero and the supply current is reduced to 0.5 µA (maximum). © 2009 Microchip Technology Inc. DS21663D-page 9 TC2054/2055/2186 NOTES: DS21663D-page 10 © 2009 Microchip Technology Inc. TC2054/2055/2186 4.0 DETAILED DESCRIPTION The TC2054, TC2055 and TC2186 are precision fixed output voltage regulators. (If an adjustable version is desired, refer to the TC1070/TC1071/TC1187 data sheet (DS21353). Unlike bipolar regulators, the TC2054, TC2055 and TC2186 supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0 mA to maximum output current operating load range. Figure 4-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 µA (typical), VOUT falls to zero volts, and ERROR is open-circuited. VIN VOUT BATTERY VOUT 1 µF C1 1 µF TC2054 GND TC2055 TC2186 V+ SHDN 4.1 HYSTERESIS (VHYS) VTH ERROR VIH VOL FIGURE 4-2: 4.2 Error Output Operation. Output Capacitor A 1 µF (minimum) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance of 0.01Ω. to 5Ω for VOUT = 2.5V, and 0.05Ω. to 5Ω for VOUT < 2.5V. Ceramic, tantalum and aluminum electrolytic capacitors can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. ERROR Shutdown Control (to CMOS Logic or Tie C2 Required Only to VIN if unused) if ERROR is used as a Processor RESET Signal (See Text) FIGURE 4-1: VOUT R1 1MΩ BATTLOW or RESET 0.2 µF C2 Typical Application Circuit. ERROR Open-Drain Output ERROR is driven low whenever VOUT falls out of regulation by more than -5% (typical). This condition may be caused by low input voltage, output current limiting or thermal limiting. The ERROR threshold is 5% below rated VOUT regardless of the programmed output voltage value (e.g. ERROR = VOL at 4.75V (typical) for a 5.0V regulator and 2.85V (typical) for a 3.0V regulator). ERROR output operation is shown in Figure 4-2. 4.3 Input Capacitor A 1 µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and this AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitors can be used (since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalum are recommended for applications operating below -25°C). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. Note that ERROR is active when VOUT falls to VTH, and inactive when VOUT rises above VTH by VHYS. As shown in Figure 4-1, ERROR can be used as a battery low flag or as a processor RESET signal (with the addition of timing capacitor C2). R1 x C2 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200 ms to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V). The ERROR pin sink current is self-limiting to approximately 18 mA. © 2009 Microchip Technology Inc. DS21663D-page 11 TC2054/2055/2186 NOTES: DS21663D-page 12 © 2009 Microchip Technology Inc. TC2054/2055/2186 5.0 THERMAL CONSIDERATIONS 5.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when the die temperature exceeds approximately 160°C. The regulator remains off until the die temperature cools to approximatley 150°C. Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.0V +10% VOUTMIN = 2.7V – 2.5% ILOADMAX = 40 mA 5.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. TAMAX Find: 1. Actual power dissipation Equation 5-1 is used to calculate worst case power dissipation: EQUATION 5-1: = +55°C 2. Maximum allowable dissipation Actual power dissipation: P D ≈ ( V INMAX – V OUTMIN )I LOADMAX P D = ( V INMAX – V OUTMIN )I LOADMAX Where: = [ ( 3.0 × 1.1 ) – ( 2.7 × 0.975 ) ]40 × 10 PD = Worst-case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage = 26.7mW Maximum allowable power dissipation: ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125 °C) and the thermal resistance from junction-to-air (θJA). The 5-Pin SOT-23A package has a θJA of approximately 220°C/Watt when mounted on a typical two layer FR4 dielectric copper clad PC board. EQUATION 5-2: T JMAX – T AMAX P DMAX = -------------------------------------θ JA Where all terms are previously defined. © 2009 Microchip Technology Inc. –3 T JMAX – T AMAX P DMAX = -------------------------------------θ JA – 55= 125 -------------------220 = 318mW In this example, the TC2054 dissipates a maximum of only 26.7 mW; far below the allowable limit of 318 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. 5.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and, therefore, increase the maximum allowable power dissipation limit. DS21663D-page 13 TC2054/2055/2186 NOTES: DS21663D-page 14 © 2009 Microchip Technology Inc. TC2054/2055/2186 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 5-Lead SOT-23 5 TABLE 6-1: 4 2 TC2054 TC2055 TC2186 1.8 SA TA VA 2.5 SB TB VB 2.6 SH TH VH 2.7 SC TC VC 2.8 SD TD VD 2.85 SE TE VE 3 Legend: XX...X NN 6.2 5 (V) XXNN 1 Example: PART NUMBER CODE AND TEMPERATURE RANGE 3.0 SF TF VF 3.3 SG TG VG 5.0 SK TJ VJ 4 SA25 1 2 3 Customer-specific information Alphanumeric traceability code Taping Information Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation for 713 Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size: Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8 mm 4 mm 3000 7 in. 5-Pin SOT-23A © 2009 Microchip Technology Inc. DS21663D-page 15 TC2054/2055/2186 . $ !$%$/"-!0!!$ 1/&$ $"$ $$+22--- 2/ b N E E1 3 2 1 e e1 D A2 A c φ A1 L L1 3$! ! 4 $! 5% 8 &1! 44## 5 56 7 5 4"1$ )* 6%$!"4"1$ 6,9$ : ""1//!! ; : $" && : 6,<"$ # : ""1/<"$ # : ; 6,4$ : . $4$ 4 : = . $$ 4 : ; . $ > : > 4"/!! ; : = )* 4"<"$ 8 : ! !"#" $%" "&! $%! ! "&! $%! !! $'" ! "$ #( )*+ )! ! $'$,%! --$ %$$ ! !" - *) DS21663D-page 16 © 2009 Microchip Technology Inc. TC2054/2055/2186 APPENDIX A: REVISION HISTORY Revision D (September 2009) The following is the list of modifications: 1. 2. 3. Added the 2.6V, and 5.0V option in Table 6-1 in Section 6.0 “Packaging Information”. Updated the package outline drawing. Added 2.6V option to Product Identification System section. Revision C (May 2006) The following is the list of modifications: 1. 2. 3. 4. 5. Added overtemperature to bullet for overcurrent protection in Features and General Description verbiage. Added “Thermal Shutdown Die Temperature” to the Electrical Specifications table. Changed condition for “Minimum VIN Operating Voltage”. Added Temperature Characteristics Table. Added Section 5.1 “Thermal Shutdown”. Updated the package outline drawing. Revision B (May 2002) • Data Sheet converted to Microchip standards. Revision A (May 2001) • Original Release of this Document under Telcom. © 2009 Microchip Technology Inc. DS21663D-page 13 TC2054/2055/2186 NOTES: DS21663D-page 14 © 2009 Microchip Technology Inc. TC2054/2055/2186 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. -XX X XXXX Device Output Voltage Temperature Range Package Device: TC2054: TC2055: TC2186: 50 mA LDO with Shutdown and ERROR Output 100 mA LDO with Shutdown and ERROR Output 150 mA LDO with Shutdown and ERROR Output Output Voltage: XX XX XX XX XX XX XX XX XX = = = = = = = = = Temperature Range: V = -40°C to +125°C Package: CTTR = Plastic Small Outline Transistor (SOT-23), 5-lead, Tape and Reel 1.8V 2.5V 2.6V 2.7V 2.8V 2.85V 3.0V 3.3V 5.0V © 2009 Microchip Technology Inc. Examples: a) TC2054-1.8VCTTR: 5LD SOT-23-A, 1.8V, Tape and Reel. b) TC2054-2.85VCTTR: 5LD SOT-23-A, 2.85V, Tape and Reel. c) TC2054-3.3VCTTR: 5LD SOT-23-A, 3.3V, Tape and Reel. a) TC2055-1.8VCTTR: 5LD SOT-23-A, 1.8V, Tape and Reel. b) TC2055-2.85VCTTR: 5LD SOT-23-A, 2.85V, Tape and Reel. c) TC2055-3.0VCTTR: 5LD SOT-23-A, 3.0V, Tape and Reel. a) TC2186-1.8VCTTR: 5LD SOT-23-A, 1.8V, Tape and Reel. b) TC2186-2.8VCTTR: 5LD SOT-23-A, 2.8V, Tape and Reel. DS21663D-page 15 TC2054/2055/2186 NOTES: DS21663D-page 16 © 2009 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2009 Microchip Technology Inc. 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