MMSZ4686 MMSZ4686 General Description Features Half watt, General purpose, Medium Current Surface Mount Zener in the SOD-123 package. The SOD-123 package has the same footprint as the glass mini-melf (LL34) package & provides a convenient alternative to the Leadless package. • Compact surface mount with same footprint as mini-melf • 500mW rating on FR-4 or FR-5 board. • Class 3 ESD rating (>16kV) per Human Body Model Ordering • 7 inch reel (178mm); 8mm Tape; 3,000 units per reel. Absolute Maximum Ratings (note 1) TA=25°C unless otherwise noted Symbol TSTG Storage Temperature Parameter Value -55 ~ 150 Units °C TJ Maximum Junction Temperature -55 ~ 150 °C PD Total Power Dissipation at 25°C Derate above 25°C 500 6.7 mW mW/°C RQJA Thermal Resistance Junction to Ambient 340 °C/W RQJL Thermal Resistance Junction to Lead 150 °C/W ∆VZ Maximum Voltage Change (note 2) 970 mV Lead Solder Temperature (Max 10 second duration) 260 °C Nominal Zener Voltage (VZ) at 50µA 3.9 V Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. Note 2: Voltage change is equal to the difference between VZ at 100µA and VZ at 10µA. Top Mark: CN 1: Cathode 2: Anode 1 2 Electrical Characteristics TA=25°C unless otherwise noted Symbol VZ Characteristics Zener Voltage Test Conditions IZT = 50µA D.C IR Reverse Leakage VR = 2.0V 5.0 µA VF Forward Voltage IF = 10mA 900 mV ∆VZ Delta Zener Voltage (Note 2) IZT = 100µA to 10µA 970 mV ©2003 Fairchild Semiconductor Corporation Min. 3.71 Max. 4.10 Units V MMSZ4692, Rev. A MMSZ4686 SOD-123 PACKAGE PACKAGE CODE = (D6) Fairchild Semiconductor's Criteria Corrected March 11, 1998 MIN (mils) Actual Size DIM A 1 2 B D MAX (mils) MIN (mm) MAX (mm) A 55 71 1.400 1.800 B 100 112 2.550 2.850 C 34.6 46 0.880 1.180 D 141.7 153.5 3.600 3.900 E ---- ---- ------- ------- F 21.5 27.5 0.546 0.70 G 0.5 4 H 12.7 ---- 0.0135 0.1015 0.322 ------- I 3.7 7.7 0.095 0.195 A C I F H G 1.2 2 mm 48 mils 0.91 mm 2.36 mm 0.91 mm 36 mils 93 mils 36 mils 4.19 mm 165 mils SOD-123 LAND PADS ©2003 Fairchild Semiconductor Corporation MMSZ4692, Rev. A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx FACT ActiveArray FACT Quiet Series Bottomless FASTâ CoolFET FASTr CROSSVOLT FRFET DOME GlobalOptoisolator EcoSPARK GTO E2CMOSTM HiSeC EnSignaTM I2C Across the board. Around the world. The Power Franchise Programmable Active Droop ImpliedDisconnect PACMAN POP ISOPLANAR Power247 LittleFET PowerTrenchâ MicroFET QFET MicroPak QS MICROWIRE QT Optoelectronics MSX Quiet Series MSXPro RapidConfigure OCX RapidConnect OCXPro SILENT SWITCHERâ OPTOLOGICâ SMART START OPTOPLANAR SPM Stealth SuperSOT-3 SuperSOT-6 SuperSOT-8 SyncFET TinyLogicâ TruTranslation UHC UltraFETâ VCX DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I2