This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736561000 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 3 Circuits, Gold (Au) 0.76µm (30µ") Documents: 3D Model Drawing (PDF) Product Specification PS-73670-9999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73656 Backplane Midplane Power Module Power Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Electrical 3 3 Black 250 No No None Beryllium Copper Gold Gold High Temperature Thermoplastic 1 Open Pin Field 3 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.000 In 0.00 mm 30 0.75 2 0.05 Yes No No -55°C to +105°C Through Hole - Compliant Pin EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email [email protected] For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 73656Series Mates With 73651 HDM® Board-to-Board Daughterboard Power Module Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # HDM® Backplane 0622005711 Power Module Loading Heads Current - Maximum per Contact Data Rate Shielded Voltage - Maximum 15A 1.0 Gbps No 500V AC Material Info Reference - Drawing Numbers Application Specification AS-73656-1998 Packaging Specification PK-70873-0819 Product Specification PS-73670-9999 Sales Drawing SDA-73656-*00* HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION