SCLS242K − OCTOBER 1995 − REVISED JANUARY 2004 D Operating Range 2-V to 5.5-V VCC D 3-State Outputs Directly Drive Bus Lines D Latch-Up Performance Exceeds 250 mA Per SN54AHC573 . . . J OR W PACKAGE SN74AHC573 . . . DB, DGV, DW, N, NS, OR PW PACKAGE (TOP VIEW) OE 1D 2D 3D 4D 5D 6D 7D 8D GND JESD 17 description/ordering information The ’AHC573 devices are octal transparent D-type latches designed for 2-V to 5.5-V VCC operation. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is low, the Q outputs are latched at the logic levels of the D inputs. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q LE 2D 1D OE VCC 3D 4D 5D 6D 7D 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 2Q 3Q 4Q 5Q 6Q 8D GND LE 8Q 7Q OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. 1Q SN54AHC573 . . . FK PACKAGE (TOP VIEW) A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PDIP − N SN74AHC573N Tube SN74AHC573DW Tape and reel SN74AHC573DWR SOP − NS Tape and reel SN74AHC573NSR AHC573 SSOP − DB Tape and reel SN74AHC573DBR HA573 Tube SN74AHC573PW Tape and reel SN74AHC573PWR TVSOP − DGV Tape and reel SN74AHC573DGVR HA573 CDIP − J Tube SNJ54AHC573J SNJ54AHC573J CFP − W Tube SNJ54AHC573W SNJ54AHC573W LCCC − FK Tube SNJ54AHC573FK SNJ54AHC573FK TSSOP − PW −55°C −55 C to 125 125°C C TOP-SIDE MARKING Tube SOIC − DW −40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA SN74AHC573N AHC573 HA573 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !"# $"%&! '#( '"! ! $#!! $# )# # #* "# '' +,( '"! $!#- '# #!#&, !&"'# #- && $##( $'"! !$& ./0 && $## # ##' "&# )#+# #'( && )# $'"! $'"! $!#- '# #!#&, !&"'# #- && $##( POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCLS242K − OCTOBER 1995 − REVISED JANUARY 2004 FUNCTION TABLE (each latch) INPUTS OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z logic diagram (positive logic) OE LE 1 11 C1 1D 2 1D 19 1Q To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS242K − OCTOBER 1995 − REVISED JANUARY 2004 recommended operating conditions (see Note 3) SN54AHC573 VCC VIH Supply voltage VCC = 2 V VCC = 3 V High-level input voltage VI VO IOH MAX 2 5.5 1.5 VCC = 5.5 V VCC = 2 V VIL MIN Output voltage ∆t/∆v 2.1 V V 0.5 0.9 0.9 1.65 1.65 V 0 5.5 0 5.5 V 0 VCC −50 0 VCC −50 mA VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V VCC = 3.3 V ± 0.3 V Input transition rise or fall rate 5.5 3.85 VCC = 2 V VCC = 3.3 V ± 0.3 V Low-level output current 2 UNIT 1.5 2.1 VCC = 5 V ± 0.5 V VCC = 2 V IOL MAX 0.5 Input voltage High-level output current MIN 3.85 VCC = 3 V VCC = 5.5 V Low-level input voltage SN74AHC573 VCC = 5 V ± 0.5 V −4 −4 −8 −8 50 50 4 4 8 8 100 100 20 20 V mA mA mA ns/V TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VCC MIN TA = 25°C TYP MAX 2V 1.9 2 1.9 1.9 3V 2.9 3 2.9 2.9 4.5 V 4.4 4.5 4.4 4.4 IOH = −4 mA 3V 2.58 2.48 2.48 IOH = −8 mA 4.5 V 3.94 3.8 3.8 TEST CONDITIONS IOH = −50 mA VOH IOL = 50 mA VOL IOL = 4 mA IOL = 8 mA II IOZ VI = 5.5 V or GND VI = VIL or VIH, VO = VCC or GND ICC Ci VI = VCC or GND, VI = VCC or GND IO = 0 SN54AHC573 MIN MAX SN74AHC573 MIN MAX UNIT V 2V 0.1 0.1 0.1 3V 0.1 0.1 0.1 4.5 V 0.1 0.1 0.1 3V 0.36 0.5 0.44 V 4.5 V 0.36 0.5 0.44 0 V to 5.5 V ±0.1 ±1* ±1 mA 5.5 V ±0.25 ±2.5 ±2.5 mA 5.5 V 4 40 40 mA 10 pF 5V 2.5 10 Co VO = VCC or GND 5V 3.5 * On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 pF 3 SCLS242K − OCTOBER 1995 − REVISED JANUARY 2004 timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) TA = 25°C MIN MAX SN54AHC573 MIN MAX SN74AHC573 MIN MAX UNIT tw Pulse duration, LE high 5 5 5 ns tsu Setup time, data before LE↓ 3.5 3.5 3.5 ns th Hold time, data after LE↓ 1.5 1.5 1.5 ns timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) TA = 25°C MIN MAX tw Pulse duration, LE high tsu th SN54AHC573 MIN MAX SN74AHC573 MIN MAX UNIT 5 5 5 ns Setup time, data before LE↓ 3.5 3.5 3.5 ns Hold time, data after LE↓ 1.5 1.5 1.5 ns switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE tPLH tPHL D Q CL = 15 pF tPLH tPHL LE Q CL = 15 pF tPZH tPZL OE Q CL = 15 pF tPHZ tPLZ OE Q CL = 15 pF tPLH tPHL D Q CL = 50 pF tPLH tPHL LE Q CL = 50 pF tPZH tPZL OE Q CL = 50 pF tPHZ tPLZ OE Q CL = 50 pF TA = 25°C MIN TYP MAX POST OFFICE BOX 655303 SN74AHC573 MIN MAX MIN MAX 7* 11* 1* 13* 1 13 7* 11* 1* 13* 1 13 7.6* 11.9* 1* 14* 1 14 7.6* 11.9* 1* 14* 1 14 7.3* 11.5* 1* 13.5* 1 13.5 7.3* 11.5* 1* 13.5* 1 13.5 8.3* 11* 1* 13* 1 13 8.3* 11* 1* 13* 1 13 9.5 14.5 1 16.5 1 16.5 9.5 14.5 1 16.5 1 16.5 10.1 15.4 1 17.5 1 17.5 10.1 15.4 1 17.5 1 17.5 9.8 15 1 17 1 17 9.8 15 1 17 1 17 10.7 14.5 1 16.5 1 16.5 10.7 14.5 1 16.5 1 16.5 tsk(o) CL = 50 pF ∗ On products compliant to MIL-PRF-38535, this parameter is not production tested. ∗∗ On products compliant to MIL-PRF-38535, this parameter does not apply. 4 SN54AHC573 • DALLAS, TEXAS 75265 1.5** 1.5 UNIT ns ns ns ns ns ns ns ns ns SCLS242K − OCTOBER 1995 − REVISED JANUARY 2004 switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE tPLH tPHL D Q CL = 15 pF tPLH tPHL LE Q CL = 15 pF tPZH tPZL OE Q CL = 15 pF tPHZ tPLZ OE Q CL = 15 pF tPLH tPHL D Q CL = 50 pF tPLH tPHL LE Q CL = 50 pF tPZH tPZL OE Q CL = 50 pF tPHZ tPLZ OE Q CL = 50 pF MIN TA = 25°C TYP MAX SN54AHC573 SN74AHC573 MIN MAX MIN MAX 4.5* 6.8* 1 8* 1 8 4.5* 6.8* 1 8* 1 8 5* 7.7* 1 9* 1 9 5* 7.7* 1 9* 1 9 5.2* 7.7* 1 9* 1 9 5.2* 7.7* 1 9* 1 9 5.2* 7.7* 1 9* 1 9 5.2* 7.7* 1 9* 1 9 6 8.8 1 10 1 10 6 8.8 1 10 1 10 6.5 9.7 1 11 1 11 6.5 9.7 1 11 1 11 6.7 9.7 1 11 1 11 6.7 9.7 1 11 1 11 6.7 9.7 1 11 1 11 6.7 9.7 1 11 1 11 tsk(o) CL = 50 pF ∗ On products compliant to MIL-PRF-38535, this parameter is not production tested. ∗∗ On products compliant to MIL-PRF-38535, this parameter does not apply. 1** 1 UNIT ns ns ns ns ns ns ns ns ns noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4) SN74AHC573 PARAMETER MIN MAX UNIT VOL(P) Quiet output, maximum dynamic VOL 1 V VOL(V) Quiet output, minimum dynamic VOL −0.8 V VOH(V) Quiet output, minimum dynamic VOH VIH(D) High-level dynamic input voltage VIL(D) Low-level dynamic input voltage 4 V 3.5 V 1.5 V TYP UNIT NOTE 4: Characteristics are for surface-mount packages only. operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz 16 pF 5 SCLS242K − OCTOBER 1995 − REVISED JANUARY 2004 PARAMETER MEASUREMENT INFORMATION From Output Under Test RL = 1 kΩ From Output Under Test Test Point S1 VCC Open TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input tw tsu VCC Input 50% VCC 50% VCC 0V th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VCC 50% VCC Input 50% VCC 0V tPLH In-Phase Output tPHL 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL VCC Output Control Output Waveform 1 S1 at VCC (see Note B) 50% VCC 0V tPZL 50% VCC tPLZ ≈VCC 50% VCC tPZH tPLH VOH 50% VCC VOL 50% VCC Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9685601Q2A ACTIVE LCCC FK 20 1 TBD 5962-9685601QRA ACTIVE CDIP J 20 1 TBD 1 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI 5962-9685601QSA ACTIVE CFP W 20 SN74AHC573DBLE OBSOLETE SSOP DB 20 SN74AHC573DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573DGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AHC573NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AHC573NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573PWLE OBSOLETE TSSOP PW 20 TBD Call TI SN74AHC573PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC573PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54AHC573FK ACTIVE LCCC FK 20 1 TBD SNJ54AHC573J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54AHC573W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type (1) Call TI Call TI POST-PLATE N / A for Pkg Type The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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