Photomicrosensor (Reflective)
EE-SY193
■ Dimensions
■ Features
• Ultra-compact model.
• PCB surface mounting type.
• RoHS Compliant.
Note: All units are in millimeters unless otherwise indicated.
■ Absolute Maximum Ratings (Ta = 25°C)
Symbol
Rated value
IF
25 mA (see note 1)
Pulse forward current IFP
100 mA (see note 2)
Reverse voltage
VR
6V
Detector
Collector–Emitter
VCEO
18 V
voltage
Emitter–Collector
VECO
4V
voltage
Collector current
IC
20 mA
75 mW (see note 1)
Collector dissipation PC
Ambient
Operating
Topr
–30°C to 80°C
temperature Storage
Tstg
–40°C to 85°C
Reflow soldering
Tsol
220°C (see note 3)
Manual soldering
Tsol
300°C (see note 3)
Emitter
Internal Circuit
Recommended
soldering patterns
C
A
E
K
Terminal No.
Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25°C.
2. Duty: 1/100; Pulse width: 0.1 ms
3. Complete soldering within 10 seconds for reflow soldering
and within 3 seconds for manual soldering.
Name
A
K
Anode
Cathode
C
E
Collector
Emitter
Item
Forward current
Unless otherwise specified, the
tolerances are ±0.2 mm.
■ Ordering Information
Description
Model
Photomicrosensor (reflective)
EE-SY193
■ Electrical and Optical Characteristics (Ta = 25°C)
Item
Emitter
Forward voltage
Symbol
Value
Condition
VF
1.1 V typ., 1.3 V max.
IF = 4 mA
Reverse current
IR
10 µA max.
VR = 6 V
Peak emission wavelength
λP
940 nm typ.
IF = 20 mA
Light current
IL
100 µA min., 150 µA typ.,
360 µA max.
Aluminum-deposited surface,
IF = 4 mA, VCE = 2 V, d = 1 mm
(see note)
Dark current
ID
100 nA max.
VCE = 10 V, 0 lx
Leakage current
ILEAK
1 µA max.
IF = 4 mA, VCE = 2 V
Collector–Emitter saturated
voltage
VCE (sat)
---
---
Peak spectral sensitivity
wavelength
λP
900 nm typ.
---
Rising time
tr
25 µs typ.
VCC = 2 V, RL = 1 kΩ,
Falling time
tf
30 µs typ.
VCC = 2 V, RL = 1 kΩ,
Detector
Note: The letter “d” indicates the distance between the top surface of the sensor and the sensing object.
302
Photomicrosensor (Reflective) EE-SY193
■ Engineering Data
Light current IL (mA)
Sensing Distance Characteristics
(Typical)
Relative light current IL (%)
Response time tr, tf (µs)
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Collector−Emitter voltage VCE (V)
Load resistance RL (kΩ)
Aluminum deposited
surface
Dark Current vs. Ambient Temperature Characteristics (Typical)
Dark Current ID (nA)
Light current IL (mA)
Relative light current IL (%)
Light Current vs. Collector−Emitter Relative Light Current vs. Ambient
Voltage Characteristics (Typical)
Temperature Characteristics (Typical)
Aluminum deposited
surface
Aluminum deposited
surface
Forward current IF (mA)
Forward current IF (mA)
Ambient temperature Ta (°C)
Response Time vs. Load Resistance Characteristics (Typical)
Light Current vs. Forward Current
Characteristics (Typical)
Sensing Position Characteristics
(Typical)
Relative light current IL (%)
Forward current IF (mA)
Light current IL (µA)
Forward Current vs. Forward
Voltage Characteristics (Typical)
Collector dissipation Pc (mW)
Forward Current vs. Collector
Dissipation Temperature Rating
Aluminum deposited
surface
1 mm
Distance d (mm)
Response Time Measurement
Circuit
Input
Output
90 %
10 %
Input
Output
Photomicrosensor (Reflective) EE-SY193
303
Unit: mm (inch)
■ Tape and Reel
Reel
Tape
Tape configuration
Terminating part
(40 mm min.)
Parts mounted
Pull-out direction
Tape quantity
3,000 pcs./reel
304
Photomicrosensor (Reflective) EE-SY193
Leading part
(400 mm min.)
Empty
(40 mm min.)
Precautions
■ Soldering Information
Reflow soldering
• The following soldering paste is recommended:
Melting temperature: 178 to 192°C
• The recommended thickness of the metal mask for screen printing
is between 0.2 and 0.25 mm.
• Set the reflow oven so that the temperature profile shown in the
following chart is obtained for the upper surface of the product
being soldered.
10 sec. max.
Temperature
220°C max.
4°C/s max.
40 sec. max.
140 to 160°C
60 to 120 sec
4°C/s max.
Time
Manual soldering
• Use “Sn 60” (60% tin and 40% lead) or solder with silver content.
• Use a soldering iron of less than 25 W, and keep the temperature of
the iron tip at 300°C or below.
• Solder each point for a maximum of three seconds.
• After soldering, allow the product to return to room temperature
before handling it.
Storage
To protect the product from the effects of humidity until the package
is opened, dry-box storage is recommended. If this is not possible,
store the product under the following conditions:
Temperature: 10 to 30°C
Humidity: 60% max.
The product is packed in a humidity-proof envelope. Reflow soldering
must be done within 48 hours after opening the envelope, during
which time the product must be stored under 30°C at 80% maximum
humidity.
If it is necessary to store the product after opening the envelope, use
dry-box storage or reseal the envelope.
Baking
If a product has remained packed in a humidity-proof envelope for six
months or more, or if more than 48 hours have lapsed since the
envelope was opened, bake the product under the following conditions before use:
Reel:60°C for 24 hours or more
Bulk:80°C for 24 hours or more
Photomicrosensor (Reflective) EE-SY193
305
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ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.
To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527.
OMRON ELECTRONIC
COMPONENTS LLC
55 E. Commerce Drive, Suite B
Schaumburg, IL 60173
847-882-2288
Cat. No. JB301-E3-01
3/05
OMRON CANADA, INC.
OMRON ON-LINE
885 Milner Avenue
Toronto, Ontario M1B 5V8
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416-286-6465
Specifications subject to change without notice
Printed in USA