SEMTECH RCLAMP2402B

RClamp2402B
Ultra-Low Capacitance TVS
for ESD and CDE Protection
PROTECTION PRODUCTS - RailClamp®
Description
Features
‹ Transient protection for high-speed data lines to
RailClamps are ultra low capacitance TVS arrays
designed to protect high speed data interfaces. This
series has been specifically designed to protect sensitive components which are connected to high-speed
data and transmission lines from overvoltage caused
by ESD (electrostatic discharge), CDE (Cable Discharge
Events), and EFT (electrical fast transients).
The RClampTM2402B has a typical capacitance of only
0.60pF (pin 1 to 2). This means it can be used on
circuits operating in excess of 3GHz without signal
attenuation. They may be used to meet the ESD
immunity requirements of IEC 61000-4-2, Level 4
(±15kV air, ±8kV contact discharge). Each device can
be configured to protect one bidirectional line or two
unidirectional lines.
These devices are in a small SC-75 (SOT-523) package
and feature a lead-free, matte tin finish. They are compatible with both lead free and SnPb assembly techniques. They are designed for use in applications where
board space is at a premium. The combination of small
size, low capacitance, and high level of ESD protection
makes them a flexible solution for applications such as
HDMI, antenna circuits, Automatic Test Equipment,
USB 2.0, and Infiniband circuits.
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IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Designed to replace polymer TVS
Protects up to two I/O lines
Ultra-Low Line-to-Line capacitance (<0.5pF Typical)
No insertion loss to >3.0GHz
Low profile (<1mm)
Low leakage current and clamping voltage
Low operating voltage: 24.0V
Solid-state silicon-avalanche technology
Mechanical Characteristics
‹
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SC-75 (SOT-523) package
Lead Finish: Matte Tin
RoHS/WEEE Compliant
Molding compound flammability rating: UL 94V-0
Marking: P7
Packaging: Tape and Reel per EIA 481
Applications
‹
‹
‹
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Dimensions
High-Definition Multimedia Interface (HDMI)
USB 2.0 & Firewire Ports
GaAs Photodetector Protection
HBT Power Amp Protection
Infiniband Transceiver Protection
Schematic & PIN Configuration
1.60
0.50 BSC
3
0.80
1
1.60
2
1.00
BSC
0.75
Nominal Dimensions (mm)
Revision 04/13/2006
SC-75 3L (Top View)
1
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RClamp2402B
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
200
Watts
Peak Pulse Current (tp = 8/20μs)
IP P
4
A
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
VESD
25
15
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Of f Voltage
VRWM
Pin 1 or Pin 2 to Pin 3
and Between Pins 1 and 2
Reverse Breakdown Voltage
VBR
It = 1mA
Pin 1 or Pin 2 to Pin 3
and Between Pins 1 and 2
Reverse Leakage Current
IR
VRWM = 24V, T=25°C
Pin 1 or Pin 2 to Pin 3
and Between Pins 1 and 2
1
μA
Clamping Voltage
VC
IPP = 1A, tp = 8/20μs
Pin 1 to Pin 2
45
V
Clamping Voltage
VC
IPP = 4A, tp = 8/20μs
Pin 1 or Pin 2 to Pin 3
50
V
Clamping Voltage
VC
IPP = 4A, tp = 8/20μs
Pin 1 to Pin 2
55
V
Junction Capacitance
Cj
VR = 0V, f = 1MHz
Pin 1 to Pin 2
0.9
pF
Junction Capacitance
Cj
VR = 0V, f = 1MHz
Pin 1 or Pin 2 to Pin 3
1 .5
pF
© 2006 Semtech Corp.
2
Minimum
Typical
Maximum
Units
24
V
26.7
V
0.60
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RClamp2402B
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
90
% of Rated Power or IPP
Peak Pulse Power - PPP (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
0
1000
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Pulse Duration - tp (μs)
Clamping Voltage vs. Peak Pulse Current
Pin 1 to Pin 2
Clamping Voltage vs. Peak Pulse Current
Pin 1 or Pin 2 to Pin 3
45
50
43
41
Clamping Voltage - VC (V)
Clamping Voltage - VC (V)
40
30
20
Waveform
Parameters:
tr = 8μs
td = 20μs
10
39
37
35
33
31
Waveform
Parameters:
tr = 8μs
td = 20μs
29
27
25
0
0
1
2
3
4
Peak Pulse Current - IPP (A)
5
0
6
Normalized Capacitance vs. Reverse Voltage
Pin 1 or Pin 2 to Pin 3
1
2
3
4
Peak Pulse Current - IPP (A)
5
6
Normalized Capacitance vs. Reverse Voltage
Pin 1 to Pin 2
2
2.5
1.6
Normalized Capacitance - Cj
Normalized Capacitance - Cj
1.8
1.4
1.2
1
0.8
0.6
0.4
f = 1 MHz
0.2
2
1.5
1
0.5
f = 1 MHz
0
0
5
© 2006 Semtech Corp.
10
15
Reverse Voltage - VR (V)
20
0
25
0
3
5
10
15
Reverse Voltage - VR (V)
20
25
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RClamp2402B
PROTECTION PRODUCTS
Typical Characteristics
Insertion Loss S21 (Pin 1 to Pin 2)
CH1 S21
LOG
Insertion Loss S21 (Pin 1 or Pin 2 to Pin 3)
6 dB / REF 0 dB
CH1 S21
LOG
6 dB / REF 0 dB
1: .0592 dB
900 MHz
1: .16030 dB
900 MHz
2: -.0650 dB
1.8 GHz
2: -.1632 dB
1.8 GHz
3: -.2696 dB
2.5 GHz
3: -.7027 dB
2.5 GHz
3
3
0 dB
0 dB
1
1
2
-6 dB
-6 dB
-12 dB
-12 dB
-18 dB
-18 dB
-24 dB
-24 dB
-30 dB
-30 dB
-36 dB
1
MHz
10
MHz
100
MHz
-36 dB
3
1
GHz GHz
STOP 3000. 000000 MHz
START . 030 MHz
1
MHz
START . 030 MHz
ESD Response (4kV Contact per IEC 61000-4-2)
10
MHz
100
MHz
2
3
1
GHz GHz
STOP 3000. 000000 MHz
ESD Response (8kV Contact per IEC 61000-4-2)
Analog Crosstalk
CH1 S21
LOG
START. 030 MHz
© 2006 Semtech Corp.
20 dB /REF 0 dB
STOP 3000. 000000 MHz
4
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RClamp2402B
PROTECTION PRODUCTS
Applications Information
Figure 1. Pin Configuration
Device Connection Options
This device is optimized for protection of 1 line
operating in excess of 3GHz. It may also be used to
protect two lines operating in excess of 2.0GHz. The
device is connected as follows:
Protection for one line with <1pF capacitance can be
achieved by connecting one data line to either pin 1 or
pin 2 with the other pin connected to ground. Pin 3 is
not connected. The connection to ground should be
made directly to a ground plane. The path length
should also be kept as short as possible to minimize
parasitic inductance.
Protection of two lines is achieved by connecting data
lines at pins 1 & 2. Pin 3 is connected to ground. The
connection to ground should be made directly to a
ground plane. The path length should also be kept as
short as possible to minimize parasitic inductance.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small compared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
© 2006 Semtech Corp.
5
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RClamp2402B
PROTECTION PRODUCTS
Applications Information - Spice Model
RClamp2402B Spice Model
Table 1 - R Clamp2402B Spice Parameters
© 2006 Semtech Corp.
Parameter
Unit
D1 (T VS)
D2 (T VS)
IS
Amp
1.93E-14
1.93E-14
BV
Volt
32.4
32.4
VJ
Volt
0.68
0.68
RS
Ohm
2.04
2.04
IB V
Amp
1.0E-3
1.0E-3
CJO
Farad
0.73E-12
0.73E-12
TT
sec
2.541E-9
2.541E-9
M
--
0.412
0.412
N
--
1.1
1.1
EG
eV
1.11
1.11
6
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RClamp2402B
PROTECTION PRODUCTS
Outline Drawing -SC-75 (SOT-523)
A
D
DIM
e1
B
A
A1
A2
b
c
D
E
E1
e
e1
L
N
0
aaa
bbb
3
E
E1
1
2
bxN
bbb
e
A
C A B
A2
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.023
.035
.000
.004
.023 .030 .031
.005
.012
.003
.008
.059 .063 .067
.057 .063 .069
.029 .031 .033
.039 BSC
.020 BSC
(.009)
3
0°
8°
.004
.008
0.60
0.00
0.60
0.15
0.10
1.50
1.45
0.75
0.75
-
0.90
0.10
0.80
0.30
0.20
1.60 1.70
1.60 1.75
0.80 0.85
1.00 BSC
0.50 BSC
(0.22)
3
0°
8°
0.10
0.20
aaa C
SEATING PLANE
A1
C
H
SEE DETAIL A
0
SEATING
PLANE
C
SIDE VIEW
c
L
DETAIL A
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B-
TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
Land Pattern -SC-75 (SOT-523)
X
Y
Z
C
DIM
C
P
p1
G
X
Y
Z
G
Y
DIMENSIONS
INCHES
MILLIMETERS
(.055)
.039
.020
.024
.016
.031
.087
(1.40)
1.00
0.50
0.60
0.40
0.80
2.20
p1
P
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2006 Semtech Corp.
7
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RClamp2402B
PROTECTION PRODUCTS
Marking
Ordering Information
P7
Part Number
Lead
Finish
Qty per
Reel
Reel
Size
RClamp 2402B.TCT
Pb Free
3,000
7 Inch
RailClamp and RClamp are registered marks of Semtech Corporation
Tape and Reel Specification
Device Orientation in Tape
Tape
Width
B, (Max)
D
D1
( M IN )
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
1.0 mm
(.039)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
3.5±0.05
mm
(.138±.002)
2.4 mm
(.094)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
8.3 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2006 Semtech Corp.
8
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