SCLS396I − APRIL 1998 − REVISED APRIL 2005
D 2-V to 5.5-V VCC Operation
D Max tpd of 7.5 ns at 5 V
D Support Mixed-Mode Voltage Operation on
D
All Ports
Designed Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
Incorporate Two Enable Inputs to Simplify
Cascading and/or Data Reception
SN54LV139A . . . J OR W PACKAGE
SN74LV139A . . . D, DB, DGV, NS,
OR PW PACKAGE
(TOP VIEW)
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
2G
2A
2B
2Y0
2Y1
2Y2
2Y3
1A
1B
1Y0
1Y1
1Y2
1Y3
16
1A
1G
NC
VCC
2G
1
2
15
3
14
4
13
5
12
6
11
10
7
8
9
1B
1Y0
NC
1Y1
1Y2
2G
2A
2B
2Y0
2Y1
2Y2
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
2A
2B
NC
2Y0
2Y1
1Y3
GND
NC
2Y3
2Y2
16
2
VCC
1
SN54LV139A . . . FK PACKAGE
(TOP VIEW)
SN74LV139A . . . RGY PACKAGE
(TOP VIEW)
2Y3
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
GND
D
1G
D
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
GND
D
D Ioff Supports Partial-Power-Down Mode
NC − No internal connection
description/ordering information
The ’LV139A devices are dual 2-line to 4-line decoders/demultiplexers designed for 2-V to 5.5-V VCC operation.
ORDERING INFORMATION
QFN − RGY
SN74LV139ARGYR
Tube of 40
SN74LV139AD
Reel of 2500
SN74LV139ADR
SOP − NS
Reel of 2000
SN74LV139ANSR
74LV139A
SSOP − DB
Reel of 2000
SN74LV139ADBR
LV139A
Tube of 90
SN74LV139APW
Reel of 2000
SN74LV139APWR
Reel of 250
SN74LV139APWT
TVSOP − DGV
Reel of 2000
SN74LV139ADGVR
LV139A
CDIP − J
Tube of 25
SNJ54LV139AJ
SNJ54LV139AJ
CFP − W
Tube of 150
SNJ54LV139AW
SNJ54LV139AW
LCCC − FK
Tube of 55
SNJ54LV139AFK
TSSOP − PW
−55°C
125°C
−55
C to 125
C
TOP-SIDE
MARKING
Reel of 1000
SOIC − D
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV139A
LV139A
LV139A
SNJ54LV139AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2005, Texas Instruments Incorporated
! "#$%&'( $#()(! (*#+&)#( $%++'( )! #* ,%-.$)#( ")'/ +#"%$! $#(*#+& #
!,'$*$)#(! ,'+ ' '+&! #* '0)! (!+%&'(! !)(")+" 1)++)(2/
+#"%$#( ,+#$'!!(3 "#'! (# ('$'!!)+.2 ($.%"' '!(3 #* )..
,)+)&''+!/
POST OFFICE BOX 655303
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1
SCLS396I − APRIL 1998 − REVISED APRIL 2005
description/ordering information (continued)
These devices are designed for high-performance memory-decoding or data-routing applications requiring very
short propagation delay times. In high-performance memory systems, these decoders can minimize the effects
of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay time
of these decoders and the enable time of the memory usually are less than the typical access time of the
memory. This means that the effective system delay introduced by the decoders is negligible.
The ’LV139A devices comprise two individual 2-line to 4-line decoders in a single package. The active-low
enable (G) input can be used as a data line in demultiplexing applications. These decoders/demultiplexers
feature fully buffered inputs, each of which represents only one normalized load to its driving circuit.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
FUNCTION TABLE
INPUTS
OUTPUTS
SELECT
G
2
B
A
Y0
Y1
Y2
Y3
H
X
X
H
H
H
H
L
L
L
L
H
H
H
L
L
H
H
L
H
H
L
H
L
H
H
L
H
L
H
H
H
H
H
L
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SCLS396I − APRIL 1998 − REVISED APRIL 2005
logic diagram (positive logic)
4
1G
1
1Y0
5
1Y1
6
1Y2
2
1A
7
1B
1Y3
3
12
2Y0
15
11
2G
2Y1
10
2Y2
2A
14
9
13
2Y3
2B
Pin numbers shown are for the D, DB, DGV, J, NS, PW, RGY, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
(see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
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3
SCLS396I − APRIL 1998 − REVISED APRIL 2005
recommended operating conditions (see Note 5)
SN54LV139A
VCC
VIH
High-level input voltage
VIL
Low-level input voltage
VI
VO
Input voltage
IOH
IOL
∆t/∆v
MIN
MAX
2
5.5
Supply voltage
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
1.5
2
5.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
Output voltage
UNIT
V
V
0.5
0.5
VCC × 0.3
VCC × 0.3
VCC × 0.3
VCC × 0.3
VCC × 0.3
5.5
0
0
0
VCC
−50
VCC = 2 V
VCC = 2.3 V to 2.7 V
V
VCC
−50
µA
0
V
−2
−6
−6
−12
−12
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
6
6
12
12
200
200
100
100
20
20
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
V
VCC × 0.3
5.5
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Input transition rise or fall rate
MAX
VCC × 0.7
VCC × 0.7
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Low-level output current
MIN
1.5
VCC = 2 V
VCC = 2.3 V to 2.7 V
High-level output current
SN74LV139A
mA
µA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV139A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
IOL = 6 mA
IOL = 12 mA
Ioff
Ci
VI or VO = 0 to 5.5 V
VI = VCC or GND
IO = 0
TYP
MIN
VCC−0.1
2
3V
2.48
2.48
4.5 V
3.8
TYP
MAX
UNIT
V
3.8
2 V to 5.5 V
0.1
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
20
20
µA
0
5
5
µA
3.3 V
1.9
(*#+&)#( $#($'+(! ,+#"%$! ( ' *#+&)4' #+
"'!3( ,)!' #* "'4'.#,&'(/ )+)$'+!$ ")) )(" #'+
!,'$*$)#(! )+' "'!3( 3#).!/ '0)! (!+%&'(! +'!'+4'! ' +3 #
$)(3' #+ "!$#((%' '!' ,+#"%$! 1#% (#$'/
4
SN74LV139A
MAX
VCC−0.1
2
2.3 V
IOL = 50 µA
IOL = 2 mA
VI = 5.5 V or GND
VI = VCC or GND,
MIN
2 V to 5.5 V
IOH = −6 mA
IOH = −12 mA
II
ICC
VCC
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• DALLAS, TEXAS 75265
1.9
pF
SCLS396I − APRIL 1998 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
tpd
FROM
(INPUT)
TO
(OUTPUT)
A or B
Y
G
Y
A or B
Y
G
Y
LOAD
CAPACITANCE
MIN
free-air
TA = 25°C
TYP
MAX
CL = 15 pF
CL = 50 pF
temperature
SN54LV139A
range,
SN74LV139A
MIN
MAX
MIN
MAX
7.7*
17.6*
1*
21*
1
21
7.4*
15.8*
1*
19*
1
19
10.2
22.5
1
26.5
1
26.5
9.9
20.2
1
24
1
24
UNIT
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
tpd
FROM
(INPUT)
TO
(OUTPUT)
A or B
Y
G
Y
A or B
Y
G
Y
LOAD
CAPACITANCE
MIN
free-air
TA = 25°C
TYP
MAX
CL = 15 pF
CL = 50 pF
temperature
SN54LV139A
range,
SN74LV139A
MIN
MAX
MIN
MAX
5.3*
11*
1*
13*
1
13
5.1*
9.2*
1*
11*
1
11
7.3
14.5
1
16.5
1
16.5
7
12.7
1
14.5
1
14.5
UNIT
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
tpd
FROM
(INPUT)
TO
(OUTPUT)
A or B
Y
G
Y
A or B
Y
G
Y
LOAD
CAPACITANCE
MIN
free-air
TA = 25°C
TYP
MAX
CL = 15 pF
CL = 50 pF
temperature
SN54LV139A
range,
SN74LV139A
MIN
MAX
MIN
MAX
3.7*
7.2*
1*
8.5*
1
8.5
3.5*
6.3*
1*
7.5*
1
7.5
5.2
9.2
1
10.5
1
10.5
4.9
8.3
1
9.5
1
9.5
VCC
3.3 V
TYP
5V
18.2
UNIT
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
f = 10 MHz
17.3
UNIT
pF
(*#+&)#( $#($'+(! ,+#"%$! ( ' *#+&)4' #+
"'!3( ,)!' #* "'4'.#,&'(/ )+)$'+!$ ")) )(" #'+
!,'$*$)#(! )+' "'!3( 3#).!/ '0)! (!+%&'(! +'!'+4'! ' +3 #
$)(3' #+ "!$#((%' '!' ,+#"%$! 1#% (#$'/
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5
SCLS396I − APRIL 1998 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
Input
50% VCC
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
0V
VOH
50% VCC
VOL
50% VCC
50% VCC
50% VCC
0V
tPLZ
tPZL
Output
Waveform 1
S1 at VCC
(see Note B)
tPLH
VOH
50% VCC
VOL
VC C
Output
Control
≈VCC
50% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
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PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV139AD
ACTIVE
SOIC
D
16
SN74LV139ADBR
ACTIVE
SSOP
DB
SN74LV139ADBRE4
ACTIVE
SSOP
SN74LV139ADBRG4
ACTIVE
SN74LV139ADE4
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139ADGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139ADGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139ADGVRG4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139ADR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139ADRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139ADRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139ANSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139ANSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139ANSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139APWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139APWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139APWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139APWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139APWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139APWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139APWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV139ARGYR
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LV139ARGYRG4
ACTIVE
QFN
RGY
Pins Package Eco Plan (2)
Qty
16
1000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
Level-2-260C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jan-2008
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LV139ADBR
DB
16
SITE 41
330
16
8.2
6.6
2.5
12
16
Q1
SN74LV139ADGVR
DGV
16
SITE 41
330
12
6.8
4.0
1.6
8
16
Q1
SN74LV139ADR
D
16
SITE 27
330
16
6.5
10.3
2.1
8
16
Q1
SN74LV139ANSR
NS
16
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
SN74LV139APWR
PW
16
SITE 41
330
12
7.0
5.6
1.6
8
12
Q1
SN74LV139ARGYR
RGY
16
SITE 41
180
12
3.8
4.3
1.5
8
12
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
12-Jan-2008
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LV139ADBR
DB
16
SITE 41
346.0
346.0
33.0
SN74LV139ADGVR
DGV
16
SITE 41
346.0
346.0
29.0
SN74LV139ADR
D
16
SITE 27
342.9
345.9
28.58
SN74LV139ANSR
NS
16
SITE 41
346.0
346.0
33.0
SN74LV139APWR
PW
16
SITE 41
346.0
346.0
29.0
SN74LV139ARGYR
RGY
16
SITE 41
190.5
212.7
31.75
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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