STCD1020, STCD1030, STCD1040 Multichannel clock distribution circuit Features ■ 2, 3 or 4 outputs buffered clock distribution ■ Single-ended sine wave or square wave clock input and output ■ Individual clock enable for each output ■ Lower fan-out on clock source ■ No AC coupling capacitor needed at the input ■ Ultra-low phase noise and standby current ■ 2.5 V to 3.6 V supply voltage(a) ■ 10 pF typical load driving capability ■ Available in TDFN packages – STCD1020 - 8-lead (2 mm x 2 mm) – STCD1030 - 10-lead (2 mm x 2.5 mm) – STCD1040 - 12-lead (2 mm x 3 mm) ■ Operating temperature : –40 °C to 85 °C TDFN (8-, 10- or 12- lead) Applications ■ Multimode RF clock reference ■ Baseband peripheral devices clock reference a. For the 1.65 to 2.75 V version, please contact local ST sales office. Table 1. Device summary Order code Operating temperature range Channel Supply Package STCD1020RDG6E –40 °C to 85 °C 2 2.8 V TDFN8 STCD1030RDH6E(1) –40 °C to 85 °C 3 2.8 V TDFN10 STCD1040RDM6F –40 °C to 85 °C 4 2.8 V TDFN12 1. Contact local ST sales office for availability. May 2010 Doc ID 13823 Rev 6 1/40 www.st.com 1 Contents STCD1020, STCD1030, STCD1040 Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.1 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.2 Connection of the source clock to MCLK . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 7 Typical operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 9 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 2/40 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin names and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Truth table for enable signals (EN 1-4) and output clocks (CLK1-4) . . . . . . . . . . . . . . . . . 11 Absolute maximum ratings (1.8 V supply) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Absolute maximum ratings (2.8 V supply) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Operating and AC measurement conditions (1.8 V supply) . . . . . . . . . . . . . . . . . . . . . . . . 16 DC and AC characteristics (1.8 V supply) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Operating and AC measurement conditions (2.8 V supply) . . . . . . . . . . . . . . . . . . . . . . . . 17 DC and AC characteristics (2.8 V supply) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 TDFN - 8-lead (2 x 2 mm) package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 TDFN - 10-lead (2 x 2.5 mm) package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . 33 TDFN - 12-lead (2 x 3 mm) package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Carrier tape dimensions for TDFN8, TDFN10, and TDFN12 packages . . . . . . . . . . . . . . . 35 STCD10x0 top marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Landing pattern parameters (TDFN8, TDFN10, TDFN12) . . . . . . . . . . . . . . . . . . . . . . . . . 37 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Doc ID 13823 Rev 6 3/40 List of figures STCD1020, STCD1030, STCD1040 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. 4/40 Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Connections diagram (STCD1020, 2-channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Connections diagram (STCD1030, 3-channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Connections diagram (STCD1040, 4-channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Hardware hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical application circuit using STCD1040 for RF ends of TD-SCDMA/GSM dual-mode mobile phone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Typical application circuit using STCD1040 for baseband peripherals in mobile phone . . 13 Direct connection of the source clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Connection of the DC-CUT capacitor and bias. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Quiescent current (IQ) vs. supply voltage (VCC) (STCD1040, 2.8 V version, EN1=EN2=EN3=EN4=1, no master clock input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Quiescent current (IQ) vs. temperature (STCD1040, 2.8 V version, EN1=EN2=EN3=EN4=1, CL = 30 pF, no master clock input) . . . . . . . . . . . . . . . . . . . . . . . 19 Standby current (ISB) vs. supply voltage (VCC) (STCD1040, 2.8 V version, EN1=EN2=EN3=EN4=0, no master clock input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Active current (IACT) vs. supply voltage (VCC) (STCD1040, 2.8 V version, . . . . . . . . . . . . . . EN1=EN2=EN3=EN4=1, 26 MHz sine wave master clock input from TCXO) . . . . . . . . . . 20 Active current (IACT) vs. master clock input voltage level (Vpp) (STCD1040, 2.8 V version, EN1=EN2=EN3=EN4=1, 26 MHz sine wave master clock input) . . . . . . . . . . . . . . . . . . . . 21 Active current (IACT) vs. input frequency (STCD1040, 2.8 V version, EN1=EN2=EN3=EN4=1, master clock input Vpp = 1 V) . . . . . . . . . . . . . . . . . . . . . . . . . . 21 STCD10x0 recovery time from standby to active (STCD1040, 2.8 V version, EN2=EN3=EN4=0, measure CLK1 when EN1 from 0 to 1) . . . . . . . . . . . . . . . . . . . . . . . . 22 STCD10x0 buffer recovery time from off to on (STCD1040, 2.8 V version, EN2=EN3=EN4=1, measure CLK1 when EN1 from 0 to 1) . . . . . . . . . . . . . . . . . . . . . . . . 22 Sine wave input clock vs. output clock (STCD1040, 2.8 V version, 26 MHz sine wave master clock input from TCXO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Rise and fall time for square wave output (STCD1040, 2.8 V, 10 MHz square wave master clock input, CL = 20 pF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Input clock phase noise (STCD1040, 2.8 V version, 26 MHz master clock input from TCXO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Output clock phase noise (STCD1040, 2.8V version, this phase noise includes the additive phase noise from TCXO and STCD1040) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Clock bandwidth (STCD1040, 2.8 V version, CL = 10 pF) . . . . . . . . . . . . . . . . . . . . . . . . . 25 Quiescent current (IQ) vs. supply voltage (VCC) (STCD1040, 1.8 V version, EN1=EN2=EN3=EN4=1, no master clock input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Quiescent current (IQ) vs. temperature (STCD1040, 1.8 V version, EN1=EN2=EN3=EN4=1, CL = 30 pF, no master clock input) . . . . . . . . . . . . . . . . . . . . . . 25 Standby current (ISB) vs. supply voltage (VCC) (STCD1040, 1.8 V version, EN1=EN2=EN3=EN4=0, no master clock input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Active current (IACT) vs. supply voltage (VCC) (STCD1040, 1.8 V version, EN1=EN2=EN3=EN4=1, 26 MHz sine wave master clock input from TCXO) . . . . . . . . . . 26 Active current (IACT) vs. master clock input voltage level (Vpp) (STCD1040, 1.8 V version, EN1=EN2=EN3=EN4=1, 26 MHz sine wave master clock input) . . . . . . . . . . . . . . . . . . . . 26 Active current (IACT) vs. input frequency (STCD1040, 1.8 V version, EN1=EN2=EN3=EN4=1, master clock input Vpp=1 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. List of figures STCD10x0 recovery time from standby to active (STCD1040, 1.8 V version, EN2=EN3=EN4=0, measure CLK1 when EN1 from 0 to 1) . . . . . . . . . . . . . . . . . . . . . . . . 27 STCD10x0 buffer recovery time from off to on (STCD1040, 1.8 V version, EN2 =EN3=EN4=1, measure CLK1 when EN1 from 0 to 1). . . . . . . . . . . . . . . . . . . . . . . . 28 Sine wave input clock vs. output clock (STCD1040, 1.8 V version, 26 MHz sine wave master clock input from TCXO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Rise and fall time for square wave output (STCD1040, 1.8 V version, 10 MHz square wave master clock input, CL = 20 pF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Input clock phase noise (STCD1040, 1.8 V version, 26 MHz master clock input from TCXO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Output clock phase noise (STCD1040, 1.8 V version, this phase noise includes the additive phase noise from TCXO and STCD1040) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Clock bandwidth (STCD1040, 1.8 V version, CL = 10 pF) . . . . . . . . . . . . . . . . . . . . . . . . . 30 TDFN - 8-lead, 2 x 2 mm package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 TDFN - 10-lead, 2 x 2.5 mm package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 TDFN - 12-lead, 2 x 3 mm package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Carrier tape for TDFN8, TDFN10, and TDFN12 packages. . . . . . . . . . . . . . . . . . . . . . . . . 35 DG package topside marking information (TDFN8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 DH and DM package topside marking information (TDFN10 and TDFN12). . . . . . . . . . . . 36 Landing pattern – TDFN8 2 x 2 mm, TDFN10 2 x 2.5 mm, TDFN12 2 x 3 mm . . . . . . . . . 37 Doc ID 13823 Rev 6 5/40 Description 1 STCD1020, STCD1030, STCD1040 Description The STCD1020, STCD1030 and STCD1040 are 2, 3 or 4 outputs unity gain clock distribution circuits, which are used to provide a common frequency clock to multimode mobile RF applications. It can also be used for those baseband peripheral applications in a mobile phone such as WLAN, Bluetooth, GPS and DVB-H as a clock reference. The STCD1020, STCD1030 and STCD1040 isolate each device driven by their clock outputs and minimize interference between the devices. Each of the clock buffers can be disabled to lower the power consumption if the connected device does not need the clock. The STCD1020, STCD1030 and STCD1040 accept commonly used mobile master clock frequencies ranging from 10 MHz to 52 MHz. The STCD1020, STCD1030 and STCD1040 are available in 2 mm x 2 mm 8-lead, 2 mm x 2.5 mm 10-lead and 2 mm x 3 mm 12-lead TDFN packages and can be operated with a single 2.8 V (or 1.8 V) supply. The operating temperature is –40 °C to +85 °C. 6/40 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 2 Device overview Device overview Figure 1. Logic diagram V CC MCLK CLK1 STCD1040 EN1 EN2 CLK2 Clock distribution EN3 CLK3 CLK4 EN4 GND Note: ai13948 No EN3, EN4, CLK3 nor CLK4 for STCD1020 and no EN4 nor CLK4 for STCD1030. Figure 2. Connections diagram (STCD1020, 2-channel) V CC 1 MCLK 2 EN1 3 EN2 4 STCD1020 TDFN8 8 GND 7 NC 6 CLK1 5 CLK2 ai13949 Doc ID 13823 Rev 6 7/40 Device overview Figure 3. STCD1020, STCD1030, STCD1040 Connections diagram (STCD1030, 3-channel) VCC 1 MCLK 2 EN1 3 EN2 EN3 10 GND 9 NC 8 CLK1 4 7 CLK2 5 6 CLK3 STCK1030 TDFN10 ai13950 Figure 4. Connections diagram (STCD1040, 4-channel) V CC 1 12 GND MCLK 2 11 NC EN1 3 10 CLK1 EN2 4 9 CLK2 EN3 5 8 CLK3 EN4 6 7 CLK4 STCD1040 TDFN12 ai13951 8/40 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 Table 2. Device overview Pin names and functions Pin Type CLK1, CLK2, CLK3, CLK4 Output Clock output channel #1, #2, #3, #4. A 0.001 µF DC cut capacitor needed outside. EN1, EN2, EN3, EN4 Input Clock output channel #1, #2, #3, #4 enable, active high MCLK Input Master clock input VCC Supply Supply voltage. Bypass to GND with a 0.1 µF capacitor. GND Supply Supply ground NC Figure 5. Function Not connected Block diagram VCC EN4 STCD1040 4 CLK4 3 CLK3 EN3 MCLK EN2 2 CLK2 EN1 1 GND Doc ID 13823 Rev 6 CLK1 ai13952 9/40 Device overview Figure 6. STCD1020, STCD1030, STCD1040 Hardware hookup VCC Clock enable control VCC STCD1040 Master Clock input MCLK EN4 CLK4 EN3 CLK3 EN2 CLK2 GND EN1 CLK1 Clock #4 output Clock #3 output Clock #2 output Clock #1 output ai13953 10/40 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 3 Device operation Device operation The STCD1020, STCD1030 and STCD1040 are 2, 3 or 4 buffered unity gain clock distribution circuits. They accept the clock input from an external clock source and send 2, 3 or 4 buffered outputs to different devices. Each clock output of the STCD1020, STCD1030 and STCD1040 can be enabled for the device connected to it. If the device connected is in standby and does not require a clock, the buffer can be disabled to save power consumption. If all the devices connected are in standby, the STCD1020, STCD1030 and STCD1040 will also be put into standby mode for further power consumption saving. The enable signals and output clock signals truth table are given in Table 3. The input DC cut capacitor is embedded in STCD1020, STCD1030 and STCD1040. A capacitor outside is needed for each of the clock outputs. The STCD1020, STCD1030 and STCD1040 are internally biased at 1/2 VCC DC voltage level at the outputs. Table 3. Note: Truth table for enable signals (EN 1-4) and output clocks (CLK1-4) EN1 EN2 EN3 EN4 CLK1 CLK2 CLK3 CLK4 0 0 0 0 NO CLOCK NO CLOCK NO CLOCK NO CLOCK 1 0 0 0 CLOCK NO CLOCK NO CLOCK NO CLOCK 1 1 0 0 CLOCK CLOCK NO CLOCK NO CLOCK ... ... ... ... ... ... ... ... 1 1 1 1 CLOCK CLOCK CLOCK CLOCK "0" means logic low and "1" means logic high. When NO CLOCK outputs, the CLKx pins stay at high impedance. Doc ID 13823 Rev 6 11/40 Application information STCD1020, STCD1030, STCD1040 4 Application information 4.1 Typical applications The STCD1020, STCD1030 and STCD1040 distribute a source clock (for example, from VCTCXO) to 2, 3 or 4 channel outputs. The typical application circuits using STCD1040 are shown in Figure 7 and Figure 8 below. In Figure 7, the clock from VCTCXO is distributed to the TD-SCDMA transmitter and receiver and GSM transceiver separately. In Figure 8, the buffer #4 output is fed into the Bluetooth system. In order to allow minimum power consumption, a Bluetooth system always has a clock request feature. If the Bluetooth system does not require the clock, the clock request will disable the clock output. The enable pins can also be connected to logic high to let the channel output always on. If the channels of STCD1020, STCD1030 and STCD1040 are not used in the application, the enable pins of the channels should be connected to ground on PCB. Figure 7. Typical application circuit using STCD1040 for RF ends of TDSCDMA/GSM dual-mode mobile phone VCC Mode selection VCC VCTCXO STCD1040 EN4 CLK4 EN3 CLK3 MCLK EN2 CLK2 GND TD-SCDMA transmitter TD-SCDMA receiver EN1 CLK1 GSM transceiver ai13954 12/40 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 Figure 8. Application information Typical application circuit using STCD1040 for baseband peripherals in mobile phone VCC BT_External_Req Internal_Req VCC VCTCXO Bluetooth STCD1040 EN4 CLK4 EN3 CLK3 MCLK WLAN EN2 CLK2 GND GPS EN1 CLK1 Other device ai13955 4.2 Connection of the source clock to MCLK If the output of the clock source voltage level is within the supply rails of the STCD1020, STCD1030 and STCD1040, the output of the source clock should be connected directly to the MCLK of the clock distribution circuits. This is described in Figure 9. The direct connection of the source clock is the common case and a DC-CUT capacitor is saved on PCB. Figure 9. Direct connection of the source clock VCC OUT MCLK VCTCXO STCD1020 STCD1030 STCD1040 ai13956 Note: The input clock voltage level of the STCD1020, STCD1030, and STCD1040 cannot exceed the supply rails when it is directly connected to the source clock. If it is needed to connect a source clock with the voltage level exceeds the supply rails of the clock distribution circuits, the user needs to connect a DC-CUT capacitor serially as shown in Figure 10. A voltage divider formed by a resistor string is also needed to set a proper DC bias for the clock input Doc ID 13823 Rev 6 13/40 Application information STCD1020, STCD1030, STCD1040 of the STCD1020, STCD1030 and STCD1040. The proper DC voltage is around half of the supply. The connection of the DC-CUT capacitor and bias for the STCD1020, STCD1030 and STCD1040 is only needed when the output of VCTCXO voltage level exceeds the supply of the clock distribution circuit (see Figure 10). Figure 10. Connection of the DC-CUT capacitor and bias VCC R1 VCTCXO OUT 0.1μF DC-CUT MCLK R2 STCD1020 STCD1030 STCD1040 ai13957 14/40 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 5 Maximum ratings Maximum ratings Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 4. Absolute maximum ratings (1.8 V supply) Symbol TSTG TSLD(1) TJ Parameter Value Unit Lead solder temperature for 10 seconds 260 Maximum junction temperature 150 °C °C °C Storage temperature (VCC off) –55 to 150 VCC Supply voltage –0.3 to 3.6 V VIN Input voltage level –0.3 to 3.6 V VEN Voltage on enable pins –0.3 to 3.6 V θJA Thermal resistance (junction to ambient) TDFN8 149.0 TDFN10 136.6 TDFN12 132.4 °C/W °C/W °C/W 1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds. Table 5. Absolute maximum ratings (2.8 V supply) Symbol TSTG TSLD (1) TJ Parameter Value Unit Lead solder temperature for 10 seconds 260 Maximum junction temperature 150 °C °C °C Storage temperature (VCC off) –55 to 150 VCC Supply voltage –0.3 to 6 V VIN Input voltage level –0.3 to 6 V VEN Voltage on enable pins –0.3 to 6 V θJA Thermal resistance (junction to ambient) TDFN8 149.0 TDFN10 136.6 TDFN12 132.4 °C/W °C/W °C/W 1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds. Doc ID 13823 Rev 6 15/40 DC and AC parameters 6 STCD1020, STCD1030, STCD1040 DC and AC parameters This section summarizes the operating measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC characteristics tables that follow are derived from tests performed under the measurement conditions summarized in Table 6. Designers should check that the operating conditions in their circuit match the operating conditions when relying on the quoted parameters. Table 6. Operating and AC measurement conditions (1.8 V supply) Parameter Condition Unit 1.65 to 2.75 V Output clock voltage (CLK1…CLK4) 0 to VCC V Device enable voltage (EN1…EN4) 0 to VCC V Ambient operating temperature (TA) –40 to +85 °C VCC supply Table 7. DC and AC characteristics (1.8 V supply) Symbol fMCLK VCC Parameter Master clock (eg. from VCTCXO) Input clock voltage level Vout Output gain level(3) IACT Min Typ Max Unit Sine wave/square wave 10 26 52 MHz 1.65 1.8 2.75 V 0.75 1 Vpp –1.5 –0.5 dB Supply voltage Vin IQ Condition(1) Quiescent current(4) Active current(5) (2) CL = 10 pF 2 buffers version 1.6 2.6 3 buffers version 2.0 3.3 4 buffers version 2.6 4 1 channel enabled 1.7 2 channels enabled 2.2 3 channels enabled 2.7 4 channels enabled 3.2 mA mA μA ISB Standby current All buffers disabled RIN Input resistance At DC level >100 CIN Input capacitance f = 26 MHz 3 4 pF tr/f Rise/fall time(6) Vin = 1 Vpp, CL = 10 pF Square wave input/output 2 5 ns Vin = 1 Vpp, –1 dB, CL = 10 pF Sine wave input/output 52 BW Signal bandwidth(3) VENH Enable voltage high(7) EN1~EN4 VENL Enable voltage low(7) EN1~EN4 16/40 Doc ID 13823 Rev 6 1 kΩ MHz 1.2 V 0.6 V STCD1020, STCD1030, STCD1040 Table 7. DC and AC characteristics (1.8 V supply) Symbol PN DC and AC parameters Condition(1) Parameter Additive phase noise(3)(8) Min Typ Max Unit at 1 kHz offset –135 at 10 kHz offset –145 at 100 kHz offset –150 STCD10x0 active 20 µs µs tRECB Buffer recovery time from off to on tRECC STCD10x0 active recovery time from standby to active 50 CL Capacitive load for each channel 10 RL Resistive load for each channel dBc/ Hz 20 pF 10 kΩ 1. Valid for ambient operating temperature: TA = –40 °C to 85 °C; VCC = 1.65 V to 2.75 V; typical TA = 25 °C; Load capacitance = 10 pF (except where noted). 2. Clock input voltage level should not exceed supply rails. 3. Simulated and determined via design and NOT 100% tested. 4. The quiescent current is measured when the enable pins are active, but without input master clock signal (fmclk = 0 Hz). 5. The active current is dependent on the master clock input Vpp and frequency and the capacitive load condition. The typical test condition is 26 MHz sine wave with 1 Vpp master clock input, CL = 10 pF. 6. The rise time is measured when clock edge transfers from 10% VCC to 90% VCC. The fall time is measured when clock edge transfers from 90% VCC to 10% VCC. 7. Other test results are under test condition VENH = 1.8 V and VENL = 0 V. 8. Guaranteed with the supply noise of 30 µ Vrms from 300 Hz to 50 kHz. Table 8. Operating and AC measurement conditions (2.8 V supply) Parameter Condition Unit VCC supply 2.5 to 3.6 V Output clock voltage (CLK1…CLK4) 0 to VCC V Device enable voltage (EN1…EN4) 0 to VCC V Ambient operating temperature (TA) –40 to +85 °C Table 9. DC and AC characteristics (2.8 V supply) Symbol fMCLK Parameter Master clock (eg. from VCTCXO) Condition(1) Min Typ Max Unit Sine wave/square wave 10 26 52 MHz 3.6 V VCC Supply voltage 2.5 2.8 Vin Input clock voltage level(2) 0.75 1 Vpp –1.5 –0.5 dB Vout IQ Output gain level(3) Quiescent current(4) CL = 10 pF 2 buffers version 1.7 2.6 3 buffers version 2.2 3.3 4 buffers version 2.8 4 Doc ID 13823 Rev 6 mA 17/40 DC and AC parameters Table 9. Symbol IACT STCD1020, STCD1030, STCD1040 DC and AC characteristics (2.8 V supply) (continued) Condition(1) Parameter Active current(5) Min Typ 1 channel enabled 1.8 2 channels enabled 2.3 3 channels enabled 2.85 4 channels enabled 3.4 Max Unit mA μA ISB Standby current All buffers disabled RIN Input resistance At DC level >100 CIN Input capacitance f = 26 MHz 3 4 pF tr/f Rise/fall times(6) Vin = 1Vpp, CL = 10 pF Square wave input/output 2 5 ns Vin =1 Vpp, -1dB, CL = 10 pF Sine wave input/output 52 BW VENH VENL PN Signal bandwidth(3) Enable voltage high(7) Enable voltage low(7) Additive phase noise(3)(8) EN1~EN4 1 kΩ MHz 1.2 V EN1~EN4 0.6 V at 1 kHz offset –135 at 10 kHz offset –145 at 100 kHz offset –150 STCD10x0 active 20 µs µs tRECB Buffer recovery time from off to on tRECC STCD10x0 active recovery time from standby to active 50 CL Capacitive load for each channel 10 RL Resistive load for each channel dBc/ Hz 20 10 pF kΩ 1. Valid for ambient operating temperature: TA = –40 °C to 85 °C; VCC = 2.5 V to 3.6 V; typical TA = 25 °C; Load capacitance = 10 pF (except where noted). 2. Clock input voltage level should not exceed supply rails. 3. Simulated and determined via design and NOT 100% tested. 4. The quiescent current is measured when the enable pins are active, but without input master clock signal (fMCLK = 0 Hz). 5. The active current is dependent on the master clock input Vpp and frequency and the capacitive load condition. The typical test condition is 26 MHz sine wave with 1 Vpp master clock input, CL = 10 pF. 6. The rise time is measured when clock edge transfers from 10% VCC to 90% VCC. The fall time is measured when clock edge transfers from 90% VCC to 10% VCC. 7. Other test results are under test condition VENH = 1.8 V and VENL = 0 V. 8. Guaranteed with the supply noise of 30 µ Vrms from 300 Hz to 50 kHz. 18/40 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 Typical operating characteristics Typical operating characteristics of STCD1040 are VCC = 2.8 V; TA = 25 °C; load capacitance = 10 pF, 26 MHz TCXO ENE3127B from NDK (except where noted). Figure 11. Quiescent current (IQ) vs. supply voltage (VCC) (STCD1040, 2.8 V version, EN1=EN2=EN3=EN4=1, no master clock input) 3 2.9 10pF 2.8 20pF 2.7 30pF 2.6 2.5 3. 6 3. 4 3. 2 3 2. 8 2. 6 2.4 2. 4 Quiescent current (mA) 3.1 Supply voltage (V) AM03039v1 Figure 12. Quiescent current (IQ) vs. temperature (STCD1040, 2.8 V version, EN1=EN2=EN3=EN4=1, CL = 30 pF, no master clock input) Quiescent current (mA) 7 Typical operating characteristics 3.2 3 2.8 2.6 2.4 2.2 2 -50 -30 -10 10 30 50 70 90 Temperature (ºC) AM03040v1 Doc ID 13823 Rev 6 19/40 Typical operating characteristics STCD1020, STCD1030, STCD1040 Figure 13. Standby current (ISB) vs. supply voltage (VCC) (STCD1040, 2.8 V version, EN1=EN2=EN3=EN4=0, no master clock input) Standby current (µA) 1 0.5 0 -0.5 -1 2.4 2.5 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 Supply voltage (V) AM03041v1 Figure 14. Active current (IACT) vs. supply voltage (VCC) (STCD1040, 2.8 V version, EN1=EN2=EN3=EN4=1, 26 MHz sine wave master clock input from TCXO) Active current (mA) 6 4 10pF 2 20pF 30pF 0 2.4 2.5 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 Supply voltage (V) AM03042v1 20/40 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 Typical operating characteristics Figure 15. Active current (IACT) vs. master clock input voltage level (Vpp) (STCD1040, 2.8 V version, EN1=EN2=EN3=EN4=1, 26 MHz sine wave master clock input) Active current (mA) 6 5 4 3 2 10pF 1 20pF 30pF 1. 3 1. 2 1. 1 1 0. 9 0. 8 0. 7 0 Master clock voltage level Vpp(V) AM03043v1 Figure 16. Active current (IACT) vs. input frequency (STCD1040, 2.8 V version, EN1=EN2=EN3=EN4=1, master clock input Vpp = 1 V) Active current (mA) 10 8 6 4 10pF 2 20pF 30pF 0 1 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 Frequency (MHZ) Doc ID 13823 Rev 6 AM03044v1 21/40 Typical operating characteristics STCD1020, STCD1030, STCD1040 Figure 17. STCD10x0 recovery time from standby to active (STCD1040, 2.8 V version, EN2=EN3=EN4=0, measure CLK1 when EN1 from 0 to 1) Figure 18. STCD10x0 buffer recovery time from off to on (STCD1040, 2.8 V version, EN2=EN3=EN4=1, measure CLK1 when EN1 from 0 to 1) 22/40 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 Typical operating characteristics Figure 19. Sine wave input clock vs. output clock (STCD1040, 2.8 V version, 26 MHz sine wave master clock input from TCXO) Figure 20. Rise and fall time for square wave output (STCD1040, 2.8 V, 10 MHz square wave master clock input, CL = 20 pF) Doc ID 13823 Rev 6 23/40 Typical operating characteristics STCD1020, STCD1030, STCD1040 Figure 21. Input clock phase noise (STCD1040, 2.8 V version, 26 MHz master clock input from TCXO) Figure 22. Output clock phase noise (STCD1040, 2.8V version, this phase noise includes the additive phase noise from TCXO and STCD1040) 24/40 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 Typical operating characteristics Figure 23. Clock bandwidth (STCD1040, 2.8 V version, CL = 10 pF) Output gain (dB) 0.00 -1.00 -2.00 -3.00 -4.00 -5.00 -6.00 -7.00 -8.00 0 1 10 Input frequency (MHz) 100 AM03051v1 Figure 24. Quiescent current (IQ) vs. supply voltage (VCC) (STCD1040, 1.8 V version, EN1=EN2=EN3=EN4=1, no master clock input) 2.8 2.6 2.4 10pF 2.2 20pF 2 2. 7 2. 5 2. 3 2. 1 1. 9 1. 7 30pF 1. 5 Quiescent current (mA) 3 Supply voltage (V) AM03052v1 Quiescent current (mA) Figure 25. Quiescent current (IQ) vs. temperature (STCD1040, 1.8 V version, EN1=EN2=EN3=EN4=1, CL = 30 pF, no master clock input) 2.9 2.7 2.5 2.3 2.1 1.9 1.7 1.5 -50 -30 -10 10 30 Temperature (°C) Doc ID 13823 Rev 6 50 70 90 AM03053v1 25/40 Typical operating characteristics STCD1020, STCD1030, STCD1040 Figure 26. Standby current (ISB) vs. supply voltage (VCC) (STCD1040, 1.8 V version, EN1=EN2=EN3=EN4=0, no master clock input) Standby current (µA) 1 0.5 0 -0.5 2. 7 2. 5 2. 3 2. 1 1. 9 1. 5 1. 7 -1 Supply voltage (V) AM03054v1 Figure 27. Active current (IACT) vs. supply voltage (VCC) (STCD1040, 1.8 V version, EN1=EN2=EN3=EN4=1, 26 MHz sine wave master clock input from TCXO) Active current (mA) 6 4 10pF 2 20pF 30pF 0 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 Supply voltage (V) AM03055v1 Figure 28. Active current (IACT) vs. master clock input voltage level (Vpp) (STCD1040, 1.8 V version, EN1=EN2=EN3=EN4=1, 26 MHz sine wave master clock input) Active current (mA) 6 5 4 3 10pF 2 20pF 1 30pF 1. 3 1. 2 1. 1 1 0. 9 0. 8 0. 7 0 Master clock voltage level Vpp(V) 26/40 Doc ID 13823 Rev 6 AM03056v1 STCD1020, STCD1030, STCD1040 Typical operating characteristics Figure 29. Active current (IACT) vs. input frequency (STCD1040, 1.8 V version, EN1=EN2=EN3=EN4=1, master clock input Vpp=1 V) Active current (mA) 12 10 8 6 10pF 4 20pF 2 30pF 0 1 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 Frequency (MHZ) AM03057v1 Figure 30. STCD10x0 recovery time from standby to active (STCD1040, 1.8 V version, EN2=EN3=EN4=0, measure CLK1 when EN1 from 0 to 1) Doc ID 13823 Rev 6 27/40 Typical operating characteristics STCD1020, STCD1030, STCD1040 Figure 31. STCD10x0 buffer recovery time from off to on (STCD1040, 1.8 V version, EN2 =EN3=EN4=1, measure CLK1 when EN1 from 0 to 1) Figure 32. Sine wave input clock vs. output clock (STCD1040, 1.8 V version, 26 MHz sine wave master clock input from TCXO) 28/40 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 Typical operating characteristics Figure 33. Rise and fall time for square wave output (STCD1040, 1.8 V version, 10 MHz square wave master clock input, CL = 20 pF) Figure 34. Input clock phase noise (STCD1040, 1.8 V version, 26 MHz master clock input from TCXO) Doc ID 13823 Rev 6 29/40 Typical operating characteristics STCD1020, STCD1030, STCD1040 Figure 35. Output clock phase noise (STCD1040, 1.8 V version, this phase noise includes the additive phase noise from TCXO and STCD1040) Output gain(db) Figure 36. Clock bandwidth (STCD1040, 1.8 V version, CL = 10 pF) 30/40 0 -0.5 -1 -1.5 -2 -2.5 -3 -3.5 0 1 10 Input frequency(MHz) Doc ID 13823 Rev 6 100 AM03064v1 STCD1020, STCD1030, STCD1040 8 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Doc ID 13823 Rev 6 31/40 Package mechanical data STCD1020, STCD1030, STCD1040 Figure 37. TDFN - 8-lead, 2 x 2 mm package outline D A B 0.10 C 2x E PIN 1 INDEX AREA 0.10 C 2x TOP VIEW A A1 0.10 C C SEAT ING PLANE SIDE VIEW 0.08 C e b PIN 1 INDEX AREA 1 0.10 4 C A B L Pin#1 ID 5 8 BOTTOM VIEW 8070540_A Table 10. TDFN - 8-lead (2 x 2 mm) package mechanical data mm inches Symbol Min. Typ. Max. Min. Typ. Max. A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 2.00 BSC 0.079 BSC E 2.00 BSC 0.079 BSC e 0.50 0.020 L 32/40 0.45 0.55 0.65 Doc ID 13823 Rev 6 0.018 0.022 0.026 STCD1020, STCD1030, STCD1040 Package mechanical data Figure 38. TDFN - 10-lead, 2 x 2.5 mm package outline D A B 0.10 C 2x E PIN 1 INDEX AREA 0.10 C 2x TOP VIEW A A1 0.10 C SEATING PLANE SIDE VIEW 0.08 C e b PIN 1 INDEX AREA 0.10 C A B L Pin#1 ID BOTTOM VIEW Table 11. 8070541_A TDFN - 10-lead (2 x 2.5 mm) package mechanical data mm inches Symbol Min. Typ. Max. Min. Typ. Max. A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 2.50 BSC 0.098 BSC E 2.00 BSC 0.079 BSC e 0.50 0.020 L 0.45 0.55 0.65 Doc ID 13823 Rev 6 0.018 0.022 0.026 33/40 Package mechanical data STCD1020, STCD1030, STCD1040 Figure 39. TDFN - 12-lead, 2 x 3 mm package outline D A B INDEX AREA 0.10 C 2x E (D/2xE/2) 0.10 C TOP VIEW A A1 0.10 C C SEATING PLANE SIDE VIEW 0.08 C e b 1 6 12 7 0.10 C A B PIN#1 ID INDEX AREA L (D/2xE/2) BOTTOM VIEW 8070542_A Table 12. TDFN - 12-lead (2 x 3 mm) package mechanical data mm inches Symbol Min. Typ. Max. Min. Typ. Max. A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 3.00 BSC 0.118 E 2.00 BSC 0.079 e 0.50 0.020 L 34/40 0.45 0.55 0.65 Doc ID 13823 Rev 6 0.018 0.022 0.026 STCD1020, STCD1030, STCD1040 Package mechanical data Figure 40. Carrier tape for TDFN8, TDFN10, and TDFN12 packages P0 E P2 D T A0 F TOP COVER TAPE W B0 P1 CENTER LINES OF CAVITY K0 USER DIRECTION OF FEED AM03073v1 Table 13. Carrier tape dimensions for TDFN8, TDFN10, and TDFN12 packages Package W TDFN8 8.00 +0.30/ –0.10 TDFN10 TDFN12 D E P0 P2 F B0 K0 1.50 1.75 4.00 2.00 3.50 +0.10/ ±0.10 ±0.10 ±0.10 ±0.05 –0.00 2.30 ±0.05 2.30 ±0.05 1.00 ±0.05 4.00 0.250 ±0.10 ±0.05 mm 3000 12.00 ±0.30 1.50 1.75 4.00 2.00 5.50 +0.10/ ±0.10 ±0.10 ±0.10 ±0.05 –0.00 2.30 ±0.10 2.80 ±0.10 1.10 ±0.01 4.00 0.30 ±0.10 ±0.05 mm 3000 12.00 ±0.30 1.50 1.75 4.00 2.00 5.50 +0.10/ ±0.10 ±0.10 ±0.10 ±0.05 –0.00 2.30 ±0.10 3.20 ±0.10 1.10 ±0.01 4.00 0.30 ±0.10 ±0.05 mm 3000 Doc ID 13823 Rev 6 P1 T Unit Bulk A0 qty. 35/40 Package mechanical data STCD1020, STCD1030, STCD1040 Figure 41. DG package topside marking information (TDFN8) (1) PPYWW AM03065v1 1. Traceability codes PP = Assembly plant Y = Assembly year WW = Assembly week Figure 42. DH and DM package topside marking information (TDFN10 and TDFN12) PPYWW(1) AM03066v1 1. Traceability codes PP = Assembly plant Y = Assembly year WW = Assembly week Table 14. 36/40 STCD10x0 top marking information Part number Marking STCD1020RDG CD20 STCD1020PDG CD2L STCD1030RDH CD30 STCD1030PDH CD3L STCD1040RDM CD40 STCD1040PDM CD4L Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 Package mechanical data Figure 43. Landing pattern – TDFN8 2 x 2 mm, TDFN10 2 x 2.5 mm, TDFN12 2 x 3 mm D3 D2 D1 P E E1 L b AM03072v1 Table 15. Landing pattern parameters (TDFN8, TDFN10, TDFN12) Dimension (mm) Parameter Description Min Nom Max L Contact length 1.05 - 1.15 b Contact width 0.25 - 0.30 E Max landing pattern Y-direction - 2.75 - E1 Contact gap spacing - 0.65 - TDFN8 - 1.75 - TDFN10 - 2.25 - TDFN12 - 2.75 - - 0.5 - D1 D2 Max landing pattern X-direction D3 P Contact pitch Doc ID 13823 Rev 6 37/40 Part numbering 9 STCD1020, STCD1030, STCD1040 Part numbering Table 16. Ordering information scheme Example: STCD 1020 R DG 6 E Device type STCD = clock distribution Channels 1020 = 2-channel 1030 = 3-channel(1) 1040 = 4-channel Operating voltage R = 2.5 to 3.6 V P = 1.65 to 2.75 V(1) Package DG = TDFN8 (2-channel) DH = TDFN10 (3-channel) DM = TDFN12 (4-channel) Temperature range 6 = –40 °C to +85 °C Shipping method E = ECOPACK® package, tubes F = ECOPACK® package, tape & reel 1. Contact local ST sales office for availability. For other options, or for more information on any aspect of this device, please contact the ST sales office nearest you. 38/40 Doc ID 13823 Rev 6 STCD1020, STCD1030, STCD1040 10 Revision history Revision history Table 17. Document revision history Date Revision Changes 08-Aug-2007 1 Initial release. 08-Oct-2007 2 Addition of footnote 4 in Table 7: DC and AC characteristics (1.8 V supply); updated Vout in Table 7 and Table 9; minor text changes. 03-Apr-2008 3 Updated cover page, Table 2, 5, 7, 9, 16, Figure 1, 6, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, Section 3 and 7; added Figure 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36. 08-May-2008 4 Updated cover page, Table 7, 8, Figure 14, 15, 27, 28, and Section 7; datasheet status upgraded to full datasheet. 07-Sep-2009 5 Added tape and reel specifications (Figure 40, Table 13), top marking information (Figure 41, 42, Table 14) and landing pattern (Figure 43, Table 15); updated cover page, Table 4, 5, 16 and text in Section 8: Package mechanical data; reformatted document. 14-May-2010 6 Updated Figure 42; minor textual changes. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 40/40 Doc ID 13823 Rev 6