TI SN74LS05NSR

 The SN5405 is obsolete
and no longer is supplied.
SDLS030A − DECEMBER 1983 − REVISED NOVEMBER 2003
D Package Options Include Plastic
D Dependable Texas Instrument Quality and
Reliability
1A
1Y
2A
2Y
3A
3Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
6A
6Y
5A
5Y
4A
4Y
1A
2Y
2A
1
14
2
13
3
12
VCC
3A
3Y
4A
4
11
5
10
6
9
7
8
1Y
6A
6Y
GND
5Y
5A
4Y
SN54LS05, SN54S05 . . . FK PACKAGE
(TOP VIEW)
1Y
1A
NC
VCC
6A
SN5405, SN54LS05, SN54S05 . . . J PACKAGE
SN7405 . . . N PACKAGE
SN74LS05 . . . D, DB, N, OR NS PACKAGE
SN74S05 . . . D, N, OR NS PACKAGE
SN54LS05, SN54S05 . . . W PACKAGE
(TOP VIEW)
(TOP VIEW)
2A
NC
2Y
NC
3A
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
6Y
NC
5A
NC
5Y
3Y
GND
NC
4Y
4A
Small-Outline (D, NS), Shrink Small-Outline
(DB), and Ceramic Flat (W) Packages,
Ceramic Chip Carriers (FK), and Standard
Plastic (N) and Ceramic (J) DIPs
NC − No internal connection
description/ordering information
These devices contain six independent inverters. To perform correctly, the open-collector outputs require pullup
resistors. These devices may be connected to other open-collector outputs to implement active-low wired-OR
or active-high wire-AND functions. Open-collector devices often are used to generate high VOH levels.
ORDERING INFORMATION
PDIP − N
0°C to 70°C
−55°C to 125°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC − D
Tube
SN7405N
SN74LS05N
SN74LS05N
SN74S05N
SN74S05N
SN74LS05D
Tape and reel
SN74LS05DR
Tube
SN74S05D
Tape and reel
SN74S05DR
Tape and reel
SSOP − DB
Tape and reel
CDIP − J
Tube
CDIP − W
Tube
LCCC − FK
SN7405N
Tube
SOP − NS
Tube
TOP-SIDE
MARKING
LS05
S05
SN74LS05NSR
74LS05
SN74S05NSR
74S05
SN74LS05DBR
LS05
SNJ54LS05J
SNJ54LS05J
SNJ54S05J
SNJ54S05J
SNJ54LS05W
SNJ54LS05W
SNJ54S05W
SNJ54S05W
SNJ54LS05FK
SNJ54LS05FK
SNJ54S05FK
SNJ54S05FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
! "#$ ! %#&'" ($)
(#"! " !%$""! %$ *$ $! $+! !#$!
!(( ,-) (#" %"$!!. ($! $"$!!'- "'#($
$!. '' %$$!)
%(#"! "%' /0121 '' %$$! $ $!$(
#'$!! *$,!$ $() '' *$ %(#"! %(#"
%"$!!. ($! $"$!!'- "'#($ $!. '' %$$!)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
The SN5405 is obsolete
and no longer is supplied.
SDLS030A − DECEMBER 1983 − REVISED NOVEMBER 2003
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
logic diagram (positive logic)
1A
1
2
1Y
2A
3
4
2Y
3A
5
6
3Y
4A
9
8
4Y
5A
11
10
5Y
6A
13
12
6Y
Y=A
Pin numbers shown are for the D, DB, J, N, and NS packages.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
The SN5405 is obsolete
and no longer is supplied.
SDLS030A − DECEMBER 1983 − REVISED NOVEMBER 2003
schematic (each inverter)
’05
’LS05
VCC
4 kΩ
VCC
1.6 kΩ
8 kΩ
20 kΩ
Input
A
Input
A
Output
Y
1 kΩ
Output
Y
4.5 kΩ
GND
GND
’S05
VCC
2.8 kΩ
900 Ω
Input
A
Output
Y
250 Ω
500 Ω
Resistor values shown are nominal.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VCC (see Note 1): ’05, ’LS05, ’S05 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI: ’05, ’S05 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
’LS05 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Off-state output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
The SN5405 is obsolete
and no longer is supplied.
SDLS030A − DECEMBER 1983 − REVISED NOVEMBER 2003
recommended operating conditions
SN5405
SN7405
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.75
5
5.25
UNIT
VCC
VIH
Supply voltage
VIL
VOH
Low-level input voltage
0.8
0.8
High-level output voltage
5.5
5.5
V
IOL
TA
Low-level output current
16
16
mA
70
°C
High-level input voltage
2
Operating free-air temperature
2
−55
125
V
V
0
V
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TEST CONDITIONS†
PARAMETER
VIK
VCC = MIN,
MIN
SN5405
TYP‡
MAX
II = −12 mA
IOH
VCC = MIN,
VOH = 5.5 V
VOL
II
VCC = MIN,
VCC = MAX,
VIH = 2 V,
VI = 5.5 V
IIH
IIL
VCC = MAX,
VCC = MAX,
VI = 2.4 V
VI = 0.4 V
ICCH
ICCL
VCC = MAX,
VCC = MAX,
VI = 0 V
VI = 4.5 V
MIN
SN7405
TYP‡
−1.5
VIL = 0.8 V
VIL = 0.7 V
MAX
−1.5
UNIT
V
0.25
mA
0.25
IOL = 16 mA
0.2
0.4
0.2
0.4
V
1
1
mA
40
40
µA
−1.6
−1.6
mA
6
12
mA
18
33
18
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
‡ All typical values are at VCC = 5 V, TA = 25°C.
33
mA
6
12
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1)
PARAMETER
tPLH
tPHL
4
FROM
(INPUT)
TO
(OUTPUT)
A
Y
POST OFFICE BOX 655303
TEST CONDITIONS
RL = 4 kΩ
RL = 400 Ω
• DALLAS, TEXAS 75265
CL = 15 pF
MIN
TYP
MAX
40
55
8
15
UNIT
ns
The SN5405 is obsolete
and no longer is supplied.
SDLS030A − DECEMBER 1983 − REVISED NOVEMBER 2003
recommended operating conditions
SN54LS05
SN74LS05
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.75
5
5.25
UNIT
VCC
VIH
Supply voltage
VIL
VOH
Low-level input voltage
0.7
0.8
High-level output voltage
5.5
5.5
IOL
TA
Low-level output current
4
8
mA
70
°C
High-level input voltage
2
Operating free-air temperature
2
−55
125
V
V
0
V
V
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LS05
TYP‡
MAX
TEST CONDITIONS†
PARAMETER
VIK
IOH
VCC = MIN,
VCC = MIN,
II = −18 mA
VIL = MAX,
VOL
VCC = MIN,
VIH = 2 V
II
IIH
VCC = MAX,
VCC = MAX,
VI = 7 V
VI = 2.7 V
IIL
ICCH
VCC = MAX,
VCC = MAX,
VI = 0.4 V
VI = 0 V
MIN
VOH = 5.5 V
IOL = 4 mA
SN74LS05
TYP‡
MAX
MIN
UNIT
−1.5
−1.5
V
0.1
0.1
mA
0.25
0.4
IOL = 8 mA
0.25
0.4
0.35
0.5
V
0.1
0.1
mA
20
20
µA
−0.4
−0.4
mA
1.2
2.4
mA
ICCL
VCC = MAX,
VI = 4.5 V
3.6
6.6
3.6
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
‡ All typical values are at VCC = 5 V, TA = 25°C.
6.6
mA
1.2
2.4
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 2)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
POST OFFICE BOX 655303
TEST CONDITIONS
RL = 2 kΩ,
CL = 15 pF
• DALLAS, TEXAS 75265
MIN
TYP
MAX
17
32
15
28
UNIT
ns
5
The SN5405 is obsolete
and no longer is supplied.
SDLS030A − DECEMBER 1983 − REVISED NOVEMBER 2003
recommended operating conditions
SN54S05
SN74S05
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.75
5
5.25
UNIT
VCC
VIH
Supply voltage
VIL
VOH
Low-level input voltage
0.8
0.8
High-level output voltage
5.5
5.5
V
IOL
TA
Low-level output current
20
20
mA
70
°C
High-level input voltage
2
Operating free-air temperature
2
−55
125
V
V
0
V
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TEST CONDITIONS†
PARAMETER
VIK
VCC = MIN,
MIN
SN54S05
TYP‡
MAX
II = −18 mA
IOH
VCC = MIN,
VOH = 5.5 V
VOL
II
VCC = MIN,
VCC = MAX,
VIH = 2 V,
VI = 5.5 V
IIH
IIL
VCC = MAX,
VCC = MAX,
VI = 2.7 V
VI = 0.5 V
ICCH
ICCL
VCC = MAX,
VCC = MAX,
VI = 0 V
VI = 4.5 V
MIN
SN74S05
TYP‡
MAX
−1.2
VIL = 0.8 V
VIL = 0.7 V
−1.2
UNIT
V
0.25
mA
0.25
IOL = 20 mA
0.5
0.5
1
1
mA
50
50
µA
−2
V
−2
mA
9
19.8
mA
30
54
30
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
‡ All typical values are at VCC = 5 V, TA = 25°C.
54
mA
9
19.8
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1)
PARAMETER
tPLH
tPHL
tPLH
tPHL
6
FROM
(INPUT)
TO
(OUTPUT)
TEST CONDITIONS
CL = 15 pF
A
Y
RL = 280 Ω
• DALLAS, TEXAS 75265
TYP
MAX
2
5
7.5
2
4.5
7
UNIT
ns
7.5
CL = 50 pF
POST OFFICE BOX 655303
MIN
7
ns
The SN5405 is obsolete
and no longer is supplied.
SDLS030A − DECEMBER 1983 − REVISED NOVEMBER 2003
PARAMETER MEASUREMENT INFORMATION
SERIES 54/74 AND 54S/74S DEVICES
VCC
RL
From Output
Under Test
Test Point
CL
(see Note A)
LOAD CIRCUIT
3V
1.5 V
Input
1.5 V
0V
tPLH
High-Level
Pulse
1.5 V
VOH
In-Phase
Output
1.5 V
1.5 V
1.5 V
VOL
tPHL
tw
Low-Level
Pulse
tPHL
1.5 V
1.5 V
tPLH
VOH
Out-of-Phase
Output
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
PULSE WIDTHS
NOTES: A. CL includes probe and jig capacitance.
B. In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, and:
For Series 54/74, tr ≤ 7 ns, tf ≤ 7 ns.
For Series 54S/74S, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
The SN5405 is obsolete
and no longer is supplied.
SDLS030A − DECEMBER 1983 − REVISED NOVEMBER 2003
PARAMETER MEASUREMENT INFORMATION
SERIES 54LS/74LS DEVICES
VCC
RL
From Output
Under Test
Test Point
CL
(see Note A)
LOAD CIRCUIT
3V
1.3 V
Input
1.3 V
0V
tPLH
High-Level
Pulse
1.3 V
1.3 V
1.3 V
1.3 V
tPLH
VOH
Out-of-Phase
Output
1.3 V
1.3 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
CL includes probe and jig capacitance.
In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns.
The outputs are measured one at a time with one input transition per measurement.
Figure 2. Load Circuit and Voltage Waveforms
8
1.3 V
VOL
tPHL
VOLTAGE WAVEFORMS
PULSE WIDTHS
NOTES: A.
B.
C.
D.
VOH
In-Phase
Output
1.3 V
tw
Low-Level
Pulse
tPHL
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
JM38510/07003BDA
JM38510/07004BCA
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
Package
Type
Package
Drawing
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SN54LS05J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SN54S05J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SN7405D
OBSOLETE
SOIC
D
14
TBD
Call TI
Call TI
SN7405DR
OBSOLETE
SOIC
D
14
Call TI
SN7405N
ACTIVE
PDIP
N
14
TBD
Call TI
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN7405N3
OBSOLETE
PDIP
N
14
TBD
Call TI
SN7405NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS05D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS05DBLE
OBSOLETE
SSOP
DB
14
SN74LS05DBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS05DBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS05DBRG4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS05DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS05DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS05DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS05DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS05DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS05N
ACTIVE
PDIP
N
14
CU NIPDAU
N / A for Pkg Type
TBD
Call TI
Call TI
Call TI
25
Pb-Free
(RoHS)
TBD
Call TI
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS05N3
OBSOLETE
PDIP
N
14
SN74LS05NE4
ACTIVE
PDIP
N
14
SN74LS05NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS05NSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S05D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S05DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S05DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S05DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S05DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74S05DRG4
ACTIVE
SOIC
D
14
SN74S05N
ACTIVE
PDIP
N
14
SN74S05N3
OBSOLETE
PDIP
N
14
SN74S05NE4
ACTIVE
PDIP
N
14
SN74S05NSR
ACTIVE
SO
NS
14
SN74S05NSRE4
ACTIVE
SO
NS
SN74S05NSRG4
ACTIVE
SO
SNJ54LS05FK
ACTIVE
SNJ54LS05J
ACTIVE
SNJ54LS05W
ACTIVE
SNJ54S05FK
ACTIVE
SNJ54S05J
ACTIVE
SNJ54S05W
ACTIVE
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TBD
Call TI
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LCCC
FK
20
1
TBD
CDIP
J
14
1
TBD
CFP
W
14
1
TBD
LCCC
FK
20
1
TBD
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
CFP
W
14
1
TBD
A42
N / A for Pkg Type
25
25
Call TI
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LS05DBR
DB
14
SITE 41
330
16
8.2
6.6
2.5
12
16
Q1
SN74LS05DR
D
14
SITE 41
330
16
6.5
9.0
2.1
8
16
Q1
SN74LS05NSR
NS
14
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
SN74S05DR
D
14
SITE 41
330
16
6.5
9.0
2.1
8
16
Q1
SN74S05NSR
NS
14
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LS05DBR
DB
14
SITE 41
346.0
346.0
33.0
SN74LS05DR
D
14
SITE 41
346.0
346.0
33.0
SN74LS05NSR
NS
14
SITE 41
346.0
346.0
33.0
SN74S05DR
D
14
SITE 41
346.0
346.0
33.0
SN74S05NSR
NS
14
SITE 41
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated