[ /Title (CD74 HC259 , CD74 HCT25 9) /Subject (High Speed CMOS Logic 8-Bit Addres sable Latch) CD54HC259, CD74HC259, CD54HCT259, CD74HCT259 Data sheet acquired from Harris Semiconductor SCHS173C High-Speed CMOS Logic 8-Bit Addressable Latch November 1997 - Revised October 2003 Features Description • Buffered Inputs and Outputs The ’HC259 and ’HCT259 Addressable Latch features the low-power consumption associated with CMOS circuitry and has speeds comparable to low-power Schottky. • Four Operating Modes • Typical Propagation Delay of 15ns at VCC = 5V, CL = 15pF, TA = 25oC This latches three active modes and one reset mode. When both the Latch Enable (LE) and Master Reset (MR) inputs are low (8-line Demultiplexer mode) the output of the addressed latch follows the Data input and all other outputs are forced low. When both MR and LE are high (Memory Mode), all outputs are isolated from the Data input, i.e., all latches hold the last data presented before the LE transition from low to high. A condition of LE low and MR high (Addressable Latch mode) allows the addressed latch’s output to follow the data input; all other latches are unaffected. The Reset mode (all outputs low) results when LE is high and MR is low. • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times • Significant Power Reduction Compared to LSTTL Logic ICs • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V Ordering Information PART NUMBER • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH TEMP. RANGE (oC) PACKAGE CD54HC259F3A -55 to 125 16 Ld CERDIP CD54HCT259F3A -55 to 125 16 Ld CERDIP CD74HC259E -55 to 125 16 Ld PDIP CD74HC259M -55 to 125 16 Ld SOIC CD74HC259MT -55 to 125 16 Ld SOIC CD74HC259M96 -55 to 125 16 Ld SOIC CD74HCT259E -55 to 125 16 Ld PDIP CD74HCT259M -55 to 125 16 Ld SOIC CD74HCT259MT -55 to 125 16 Ld SOIC CD74HCT259M96 -55 to 125 16 Ld SOIC NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54HC259, CD74HC259, CD54HCT259, CD74HCT259 Pinout CD54HC259, CD54HCT259 (CERDIP) CD74HC259, CD74HCT259 (PDIP, SOIC) TOP VIEW A0 1 16 VCC A1 2 15 MR A2 3 14 LE Q0 4 13 D Q1 5 12 Q7 Q2 6 11 Q6 Q3 7 10 Q5 GND 8 9 Q4 Functional Diagram 4 1 5 A0 2 A1 A2 LE 8 LATCHES 1-OF-8 DECODER 6 7 3 9 10 14 11 15 MR 12 13 D Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 GND = 8 VCC = 16 TRUTH TABLE INPUTS MR LE OUTPUT OF ADDRESS LATCH H L D LATCH SELECTION TABLE SELECT INPUTS EACH OTHER OUTPUT Qio FUNCTION Addressable Latch H H Qio Qio Memory L L D L 8-Line Demultiplexer L H L L Reset H = High Voltage Level L = Low Voltage Level D = The level at the data input Qio = The level of Qi (i = 0, 1...7, as appropriate) before the indicated steady-state input conditions were established. 2 A2 A1 A0 LATCH ADDRESSED L L L 0 L L H 1 L H L 2 L H H 3 H L L 4 H L H 5 H H L 6 H H H 7 CD54HC259, CD74HC259, CD54HCT259, CD74HCT259 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1) θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) VIH - - 2 1.5 - - 1.5 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V MIN TYP MAX MIN MAX MIN MAX UNITS - 1.5 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current II VCC or GND - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V - 6 - - ±0.1 - ±1 - ±1 µA 3 CD54HC259, CD74HC259, CD54HCT259, CD74HCT259 DC Electrical Specifications (Continued) TEST CONDITIONS 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) ICC VCC or GND 0 6 - - 8 - 80 - 160 µA High Level Input Voltage VIH - - 4.5 to 5.5 2 - - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V High Level Output Voltage CMOS Loads VOH VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V ±0.1 - ±1 - ±1 µA PARAMETER Quiescent Device Current MIN TYP MAX MIN MAX MIN MAX UNITS HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC and GND 0 5.5 - ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC (Note 2) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS A0 - A2, LE 1.5 D 1.2 MR 0.75 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g., 360µA max at 25oC. Prerequisite for Switching Specifications 25oC PARAMETER SYMBOL -40oC TO 85oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS 2 70 - - 90 - - 105 - - ns 4.5 14 - - 18 - - 21 - - ns 6 12 - - 15 - - 18 - - ns HC TYPES Pulse Width LE tWL 4 CD54HC259, CD74HC259, CD54HCT259, CD74HCT259 Prerequisite for Switching Specifications (Continued) 25oC PARAMETER MR Setup Time -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS tWL 2 70 - - 90 - - 105 - - ns 4.5 14 - - 18 - - 21 - - ns 6 12 - - 15 - - 18 - - ns 2 80 - - 100 - - 120 - - ns 4.5 16 - - 20 - - 24 - - ns 6 14 - - 17 - - 20 - - ns 2 0 - - 0 - - 0 - - ns 4.5 0 - - 0 - - 0 - - ns 6 0 - - 0 - - 0 - - ns tSU D to LE A to LE Hold Time -40oC TO 85oC tH D to LE A to LE HCT TYPES Pulse Width LE MR tWL 4.5 18 - - 23 - - 27 - - ns Setup Time D to LE A to LE tSU 4.5 17 - - 21 - - 26 - - ns Hold Time D to LE A to LE tH 4.5 0 - - 0 - - 0 - - ns Switching Specifications CL = 50pF, Input tr, tf = 6ns -40oC TO 85oC 25oC PARAMETER SYMBOL TEST CONDITIONS tPHL CL = 50pF -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 185 - 230 - 280 ns 4.5 - - 37 - 46 - 56 ns CL = 15pF 5 - 15 - - - - - ns CL = 50pF 6 - - 31 - 39 - 48 ns CL = 50pF 2 - - 170 - 215 - 255 ns 4.5 - - 34 - 43 - 51 ns CL = 15pF 5 - 14 - - - - - ns CL = 50pF 6 - - 29 - 37 - 43 ns HC TYPES Propagation Delay D to Q LE to Q tPHL 5 CD54HC259, CD74HC259, CD54HCT259, CD74HCT259 Switching Specifications CL = 50pF, Input tr, tf = 6ns (Continued) -40oC TO 85oC 25oC PARAMETER A to Q MR to Q Output Transition Time Power Dissipation Capacitance (Notes 3, 4) Input Capacitance -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tPHL CL = 50pF 2 - - 185 - 230 - 280 ns 4.5 - - 37 - 46 - 56 ns CL = 15pF 5 - 15 - - - - - ns CL = 50pF 6 - - 31 - 39 - 48 ns CL = 50pF 2 - - 155 - 195 - 235 ns 4.5 - - 31 - 39 - 47 ns CL = 15pF 5 - 13 - - - - - ns CL = 50pF 6 - - 26 - 33 - 40 ns CL = 50pF 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns tPHL, tPLH tTHL, tTLH CPD CL = 15pF 5 - 21 - - - - - pF CI CL = 50pF - 10 - 10 - 10 - 10 pF CL = 50pF 4.5 - - 39 - 49 - 59 ns CL = 15pF 5 - 16 - - - - - ns CL = 50pF 4.5 - - 38 - 48 - 57 ns CL = 15pF 5 - 16 - - - - - ns CL = 50pF 4.5 - - 41 - 51 - 61 ns CL = 15pF 5 - 17 - - - - - ns CL = 50pF 4.5 - - 39 - 49 - 59 ns CL = 15pF 5 - 16 - - - - - ns CPD CL = 15pF 5 - 22 - - - - - pF CI CL = 50pF - 10 - 10 - 10 - 10 pF tTHL, tTLH CL = 50pF 4.5 - - 15 - 19 - 22 ns HCT TYPES Propagation Delay tPHL, tPLH D to Q LE to Q A to Q MR to Q Power Dissipation Capacitance (Notes 3, 4) Input Capacitance Output Transition Time NOTES: 3. CPD is used to determine the dynamic power consumption, per package. 4. PD = CPD VCC2 fi + ∑ CL VCC2 fO where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. 6 CD54HC259, CD74HC259, CD54HCT259, CD74HCT259 Test Circuits and Waveforms tWL + tWH = tfCL trCL 50% 10% 10% FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tf = 6ns tr = 6ns GND tTHL tTLH 1.3V 10% INVERTING OUTPUT tPHL FIGURE 3. HC TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC trCL VCC tfCL GND 1.3V 0.3V GND tH(H) tH(L) VCC DATA INPUT 3V 2.7V CLOCK INPUT 50% tH(H) tPLH FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tfCL 10% tTLH 90% tPLH 90% GND tTHL 90% 50% 10% trCL 3V 2.7V 1.3V 0.3V INPUT INVERTING OUTPUT GND tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. VCC 90% 50% 10% 1.3V 1.3V tWL tf = 6ns tPHL 1.3V 0.3V tWH FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH INPUT 2.7V 0.3V GND tr = 6ns DATA INPUT 50% tH(L) 3V 1.3V 1.3V 1.3V GND tSU(H) tSU(H) tSU(L) tTLH 90% OUTPUT tTHL 90% 50% 10% tTLH 90% 1.3V OUTPUT tREM 3V SET, RESET OR PRESET GND tTHL 1.3V 10% FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS tPHL 1.3V GND IC CL 50pF GND 90% tPLH 50% IC tSU(L) tPHL tPLH I fCL 3V NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tREM VCC SET, RESET OR PRESET tfCL = 6ns CLOCK 50% 50% tWL CLOCK INPUT tWL + tWH = trCL = 6ns VCC 90% CLOCK I fCL CL 50pF FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 7 CD54HC259, CD74HC259, CD54HCT259, CD74HCT259 Test Circuits and Waveforms 6ns (Continued) 6ns OUTPUT DISABLE 90% 50% 10% OUTPUTS ENABLED 2.7 1.3 OUTPUT HIGH TO OFF 50% OUTPUTS DISABLED FIGURE 7. HC THREE-STATE PROPAGATION DELAY WAVEFORM OTHER INPUTS TIED HIGH OR LOW OUTPUT DISABLE IC WITH THREESTATE OUTPUT GND 1.3V tPZH 90% OUTPUTS ENABLED OUTPUTS ENABLED 0.3 10% tPHZ tPZH 90% 3V tPZL tPLZ OUTPUT LOW TO OFF 50% OUTPUT HIGH TO OFF 6ns GND 10% tPHZ tf OUTPUT DISABLE tPZL tPLZ OUTPUT LOW TO OFF 6ns tr VCC 1.3V OUTPUTS DISABLED OUTPUTS ENABLED FIGURE 8. HCT THREE-STATE PROPAGATION DELAY WAVEFORM OUTPUT RL = 1kΩ CL 50pF VCC FOR tPLZ AND tPZL GND FOR tPHZ AND tPZH NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL = 1kΩ to VCC, CL = 50pF. FIGURE 9. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT 8 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-8985201EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type CD54HC259F3A ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type CD54HCT259F3A ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type CD74HC259E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC259EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC259M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC259M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC259M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC259ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC259MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC259MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT259E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT259EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT259M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT259M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT259M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT259ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT259MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT259MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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